EPM570GM256C5N - 440 Macrocell MAX II CPLD | Altera / Intel
Référence : EPM570GM256C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $26.8 | $26,80 |
| 10 | $24.5 | $245,00 |
| 25 | $23.2 | $580,00 |
| 100 | $21.4 | $2 140,00 |
| 250 | $19.75 | $4 937,50 |
| 500 | $18.6 | $9 300,00 |
EPM570GM256C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines the instant-on, deterministic timing of traditional PAL/GAL architectures with the high logic density of modern FPGAs. Within the broader taxonomy, the EPM570 belongs to the hierarchy: macrocell -> logic array block (LAB) -> CPLD -> programmable logic device (PLD) -> digital IC -> semiconductor. MAX II devices are positioned as low-power, non-volatile glue-logic replacements for discrete MSI/SSI logic and small FPGAs.
Key features of the EPM570GM256C5N include 440 macrocells organized into 57 logic array blocks (LABs), 160 user I/O pins, a maximum internal operating frequency of 304 MHz (per distributor listings) with the published data sheet fMAX of 201.1 MHz, and the multiVolt I/O interface that allows the device to interface with 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic without external level shifters. The C5 speed grade corresponds to a 5 ns pin-to-pin logic delay.
The MAX II architecture is built around a flash-based configuration memory that eliminates the external boot PROM required by SRAM-based FPGAs. This gives EPM570 designs instant-on behavior in less than 200 µs and deterministic power-on state, which is critical for system-level control, bus-interface, and power-sequencing logic. The 57 LAB structure provides wide fan-in control for decoding and state-machine applications.
Typical applications for the EPM570GM256C5N include I/O expansion and bus bridging in industrial controllers, glue-logic consolidation in telecom and networking line cards, state-machine and interface logic in medical instrumentation, motor-control timing in factory automation, and display-panel timing generation in consumer electronics. The 160-I/O count and 256-ball BGA package make it suitable for high-pin-count designs that exceed the capability of smaller TQFP-packaged MAX II devices.
When designing with the EPM570GM256C5N, the 11x11 mm Micro FineLine BGA package requires careful PCB layout: a 0.8 mm ball pitch demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing, and four PCB layers are recommended for clean power delivery. The 1.8 V core requires a local 0.1 µF + 1 µF decoupling pair per supply pin pair, and JTAG chain length should be validated for multi-device boards.
This page synthesizes distributor stock and pricing, drop-in pin-compatible alternatives, and practical BGA layout/design notes not found on a single datasheet page.
Alternatives de remplacement direct pour EPM570GM256C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GM256C5N (même facteur de forme et même empreinte) — différant par Operating Temperature, Process Technology, Package, Series, Lead-Free / RoHS.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GF256C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.95 / unité
Voir la fiche technique →EPM1270GM256C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM2210GM256C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EPM570GM100C5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.4 / unité
Voir la fiche technique →EPM570GM256C5N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | CPLD - Complex Programmable Logic Device |
| Macro Cells | 440 |
| Logic Array Blocks (LABs) | 57 |
| Number of I/Os | 160 |
| Maximum Operating Frequency | 304 MHz |
| Maximum Internal Frequency (datasheet fMAX) | 201.1 MHz |
| Pin-to-Pin Logic Delay (Speed Grade C5) | 5 ns |
| Operating Supply Voltage (Core VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) |
| I/O Bank Supply Voltages | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Process Technology | 0.18 um flash-based CMOS |
| Programmable Type | In System Programmable (ISP) via JTAG |
| Boîtier / Format | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch |
| Température de fonctionnement | 0 °C to +85 °C (commercial) |
| Style de montage | SMD/SMT |
| Packaging | Tray |
| Lead Free / RoHS Status | See manufacturer page; legacy part - verify per lot |
| Configuration Memory | Internal flash (non-volatile, instant-on) |
| JTAG Support | Yes (IEEE 1149.1 / 1532) |
| Vertical Migration | Pin-compatible with EPM1270 and EPM2210 in the 256-MBGA package |
Guide de configuration des broches du EPM570GM256C5N 256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch
Configuration des broches du EPM570GM256C5N (boîtier 256-ball micro fineline bga, 11x11 mm, 0.8 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM570GM256C5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM570GM256C5N convient pour 6 applications: Industrial Control Glue Logic, Bus Bridging and Protocol Conversion, Telecom Line-Card Interface Logic, Motor-Control Timing and PWM Generation, Medical Instrumentation Glue Logic, Display Panel Timing Generator.
Industrial Control Glue Logic
The EPM570GM256C5N is well suited to industrial control boards as a glue-logic consolidator that replaces 5-10 discrete MSI/SSI packages with a single non-volatile device. Its 440 macrocells and 160 user I/Os comfortably handle address-latch, chip-select, bus-arbitration, and watchdog logic around a microcontroller or SoC. The instant-on flash-based configuration (under 200 µs) ensures deterministic power-up state for safety-critical interlocks, while the multiVolt I/O banks interface directly to 3.3 V MCUs and 5 V legacy peripherals. The 256-MBGA package keeps board area compact for DIN-rail PLC form factors.
Recommandé
Bus Bridging and Protocol Conversion
Designers use the EPM570GM256C5N as a flexible bus bridge between mismatched interfaces - for example, converting a parallel Local Bus to SPI/I2C, or implementing a custom memory-mapped register decoder. The 57 LAB structure delivers wide fan-in for address decoding, and the 5 ns pin-to-pin delay (C5 grade) keeps glue-logic latency low enough that the CPLD does not bottleneck the bus. Its 160 I/Os handle full 16-bit data + 24-bit address + control bus implementations in a single device. The MAX II flash memory stores the bridge configuration non-volatility, so power-cycling does not require re-programming.
Recommandé
Telecom Line-Card Interface Logic
In telecom line cards the EPM570GM256C5N implements TDM/timeslot switching, frame-alignment detection, and clock-domain crossing between the framer, mapper, and backplane SERDES. Its 1.8 V core plus multiVolt I/Os interface directly to 2.5 V and 3.3 V framers and to 1.5 V LVCMOS backplane logic without external level shifters, reducing BOM and board area. The JTAG (IEEE 1149.1/1532) interface supports in-system boundary-scan tests across the line-card population, simplifying manufacturing test and field diagnostics. The 256-ball Micro FineLine BGA fits the dense backplane real-estate typical of ATCA/AMC line cards.
Recommandé
Motor-Control Timing and PWM Generation
Factory-automation motor drives rely on the EPM570GM256C5N for deterministic PWM generation, dead-time insertion, Hall-sensor decoding, and protection logic. The 5 ns pin-to-pin logic delay gives sub-microsecond response to over-current and over-temperature faults, critical for IGBT/SiC inverter safety. The 160 I/Os allow direct interface to three-phase gate drivers, encoders, and the host DSP/FPGA without external muxes. The instant-on behavior ensures the motor drive boots into a safe state (gates low) within 200 µs of power-up, eliminating dangerous transient pulses during power-on sequencing.
Recommandé
Medical Instrumentation Glue Logic
In medical imaging carts, patient monitors, and bench-top analyzers, the EPM570GM256C5N serves as a low-power glue-logic hub between ADCs, DACs, displays, and a host processor. Its 0.18-um flash CMOS process yields low quiescent current, helping battery-powered portable monitors meet IEC 60601-1 energy budgets. The 160 user I/Os handle parallel TFT-LCD bridges, keypad scanners, audio CODEC interfaces, and SD-card multiplexers within a single device. Non-volatile instant-on configuration eliminates boot-time variability, important for clinical workflows where power-cycle-to-ready time must be reproducible.
Recommandé
Display Panel Timing Generator
Large LCD/OLED panels in industrial HMIs, point-of-sale terminals, and digital signage require a dedicated timing controller (TCON) that generates row/column driver waveforms, gamma correction tables, and backlight PWM. The EPM570GM256C5N provides the 160 I/Os and 5 ns logic delay needed to drive LVDS/FPD-Link bridges and to implement per-panel color-depth conversion in real time. Its multiVolt I/O banks interface to 1.8 V, 2.5 V, and 3.3 V source drivers without level shifters. The instant-on flash memory stores per-panel calibration coefficients, removing the need for an external EEPROM.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GM256C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GF256C5N | EPM1270GM256C5N | EPM2210GM256C5N | EPM570GM100C5N |
|---|---|---|---|---|---|
| Package | 256-ball Micro FineLine BGA, 11x11 mm, 0.8 mm pitch | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 256-ball Micro FineLine BGA, 11x11 mm - same | 100-ball Micro FBGA - different |
| Brand | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) | Altera (now part of Intel) |
| Macro Cells | 440 | 440 | 1270 | 2210 | 440 |
| Logic Array Blocks (LABs) | 57 | 57 | 127 | 221 | 57 |
| Maximum User I/Os | 160 | 160 | 212 | 212 | 76 |
| Operating Voltage (VCCINT) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) | 1.8 V (1.71-1.89 V) |
| Pin-to-Pin Delay (Speed Grade C5) | 5 ns | 5 ns | 6 ns (C6 grade standard, C5 on request) | 7 ns (C7 grade standard) | 5 ns |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) |
| Configuration Memory | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) | Internal flash (non-volatile) |
| Approx. Unit Price (qty 1, USD) | 26.80 | 26.00 | 40.00 | 62.00 | 20.00 |
Principaux différenciateurs
- Highest-density non-volatile CPLD with 160 I/Os in 11x11 mm BGA (vs EPM570GM100C5N (100-ball Micro FBGA))
- Instant-on non-volatile flash configuration (vs SRAM-based FPGAs (e.g., Cyclone IV))
- Pin-compatible vertical-migration to higher densities (vs EPM1270GM256C5N / EPM2210GM256C5N)
Notes de conception
The 256-ball Micro FineLine BGA uses a 0.8 mm ball pitch, which demands NSMD (non-solder mask defined) pads with via-in-pad or microvia escape routing. Use at least 4 PCB layers with a continuous ground plane directly under the BGA. Stitching vias around the BGA perimeter at 1 mm spacing suppress ground bounce. For prototype builds, request gold-wire-ball or SAC305 lead-free balls from the distributor; non-leaded solder spheres require precise reflow profiling between 245 °C and 260 °C peak.
The MAX II family requires a clean 1.8 V VCCINT rail. Place a 0.1 µF X7R ceramic bypass capacitor directly at every VCCINT/GND pair (8 pairs in the 256-MBGA), plus one 4.7 µF bulk decoupling capacitor at the package entry point. Each I/O bank should have its own VCCIO rail and its own 0.1 µF + 1 µF decoupling pair; mixing bank supplies on a single ferrite risks simultaneous-switching-noise (SSN) coupling. Power-on ramp should be monotonic between 0 V and 1.89 V in less than 100 ms to satisfy MAX II configuration timing.
Do not confuse the EPM570GM256C5N ('GM' = Micro FineLine BGA, 11x11 mm, 0.8 mm pitch) with the EPM570F256C5N ('F' = FineLine BGA, 17x17 mm, 1.0 mm pitch). The two share the same die but have different ball maps and are NOT drop-in replacements. Also confirm the speed grade suffix - C5N specifies commercial temperature and 5 ns pin-to-pin delay, whereas C4N or C3N denote slower grades. Mixing speed grades in a JTAG chain can produce timing violations on TDO-to-TDI paths longer than 50 MHz; use a buffered JTAG chain for multi-device boards.
Long 160-I/O buses on the 256-MBGA benefit from series-damping resistors (22-33 Ω) on high-edge-rate outputs to control overshoot. The MAX II I/O slew-rate should be set to 'Slow' on buses longer than 50 mm to reduce SSN. For LVDS or LVPECL interfacing, use external resistor networks near the CPLD pin; the MAX II does not include true LVDS drivers. Always route the JTAG TCK signal as a 50 Ω microstrip with a 33 Ω source-termination resistor if the chain exceeds 100 mm.
Informations de conformité
RoHS / REACH / lead-free status not explicitly stated in the verified distributor snippets. Altera/Intel MAX II parts are typically RoHS-compliant but lot-by-lot verification with the manufacturer is recommended for new designs.
