MTA18ASF4G72PZ-3G2E1 - 32GB DDR4-3200 ECC RDIMM | Micron
N.º de pieza: MTA18ASF4G72PZ-3G2E1 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $314.18 | $314,18 |
| 10 | $285 | $2.850,00 |
| 50 | $260 | $13.000,00 |
| 100 | $235 | $23.500,00 |
| 500 | $210 | $105.000,00 |
MTA18ASF4G72PZ-3G2E1 Descripción general
A Registered DIMM (RDIMM) is a type of computer memory module that adds a register buffer between the DRAM chips and the memory controller. This buffer reduces the electrical load on the memory controller, allowing more DIMM slots per channel and higher memory density in enterprise servers. RDIMMs belong to the broader category of DDR4 SDRAM modules, which themselves are a generation of double data rate synchronous DRAM used as system main memory. DDR4 RDIMMs are the workhorse memory form factor for rack-mount servers, workstations, and high-end computing platforms.
The key specifications that define this module are: 32 GB total capacity in a single-rank configuration (1Rx4), 3200 MT/s data rate (PC4-25600, CL22), 1.2 V supply voltage (per JEDEC DDR4 standard), and ECC support enabled by an on-module register and parity. The module uses standard 288-pin gold-finger edge contacts and is populated in the Micron server-memory line that drops into Intel Xeon Scalable and AMD EPYC server platforms.
In practice, the module integrates a register clock driver (RCD) that buffers command, address, and control signals to the DRAM devices, reducing the capacitive load seen by the host CPU's memory controller. This buffering is what enables four-, six-, and eight-DIMM-per-channel configurations that are typical of dual-socket servers. The ECC capability detects and corrects single-bit errors on-the-fly, which is essential for virtualization, in-memory databases, and other workloads where silent memory corruption would cause data loss.
Typical applications for the MTA18ASF4G72PZ-3G2E1 include enterprise servers (Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem), high-performance workstations (single and dual-CPU), virtualization hosts running VMware vSphere or Hyper-V, and in-memory analytics platforms such as SAP HANA. The 32 GB capacity strikes a balance between per-DIMM density and cost, making it a popular choice for memory upgrades and for replacing failed modules in legacy DDR4 server fleets.
When deploying this module, verify that the host platform's memory controller supports DDR4-3200 (or falls back gracefully to a lower speed). Mixed-rank or mixed-capacity populations across channels are supported by JEDEC but should follow the platform's population guidelines for best performance. The module is hot-swap-friendly on most server backplanes but should be inserted only with full power removed to avoid damaging the gold-finger contacts.
This page synthesizes distributor pricing, drop-in alternatives from the same Micron OEM family, and practical design notes not found on a single manufacturer datasheet, giving engineers a complete sourcing reference for the MTA18ASF4G72PZ-3G2E1.
Alternativas directas para MTA18ASF4G72PZ-3G2E1 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MTA18ASF4G72PZ-3G2F1
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MTA18ASF4G72PZ-3G2
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MTA18ASF4G72PDZ-3G2E1
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MTA18ASF2G72PZ-3G2E1
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M393A4K40DB3-CWE
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HMAA4GR7AJR8N-XN
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MTA18ASF4G72PZ-3G2E1 Valores máximos y características eléctricas
| Tipo de memoria | DDR4 SDRAM |
| Module Type | RDIMM (Registered DIMM) |
| Capacity | 32 GB |
| Module Rank Configuration | 1Rx4 (Single-Rank x4) |
| Velocidad de datos | 3200 MT/s (PC4-25600) |
| Latencia CAS | CL22 |
| Supply Voltage (VDD) | 1.2 V |
| Recuento de pines | 288-pin |
| ECC Support | Yes (ECC Registered) |
| Temperatura de funcionamiento | 0C to +85C (server grade) |
| Form Factor | DIMM (133.35 mm x 31.25 mm typical) |
| Module Height | Standard height (1U-compatible) |
| Register Clock Driver | On-module RCD (per JEDEC DDR4 RDIMM) |
| Speed Grade Identifier | -3G2 (DDR4-3200) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de MTA18ASF4G72PZ-3G2E1 standard
Configuración de pines para MTA18ASF4G72PZ-3G2E1 (encapsulado standard). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MTA18ASF4G72PZ-3G2E1.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MTA18ASF4G72PZ-3G2E1 es adecuado para 6 aplicacións: Enterprise Rack Servers, Virtualization Hosts (VMware / Hyper-V), In-Memory Database and Analytics (SAP HANA), AI Training and Inference Nodes, High-Performance Workstations (Dual-Socket Xeon/EPYC), Cloud and Hyperscale Server Memory Upgrades.
Enterprise Rack Servers
The MTA18ASF4G72PZ-3G2E1's 32 GB DDR4-3200 1Rx4 RDIMM profile fits mainstream 1U and 2U rack servers such as Dell PowerEdge R750, HPE ProLiant DL380 Gen10, and Lenovo ThinkSystem SR650. Its on-module register clock driver reduces the capacitive load on the host memory controller, allowing the platform to populate all DIMM slots per channel (typically 6 or 8) without signal-integrity degradation. ECC support detects and corrects single-bit errors on-the-fly, which is essential for virtualization clusters and database workloads where silent memory corruption would propagate across the entire host. Compared with LRDIMMs, this RDIMM delivers lower latency and is the preferred choice when channel density requirements stay below 256 GB per channel.
Recomendado
Virtualization Hosts (VMware / Hyper-V)
Virtualization hosts running VMware vSphere or Microsoft Hyper-V benefit from the MTA18ASF4G72PZ-3G2E1's ECC-protected 32 GB density, which directly determines the consolidation ratio of VMs per physical host. The DDR4-3200 data rate (PC4-25600, CL22) provides 25.6 GB/s peak per module bandwidth, sufficient for memory-throughput-intensive workloads such as vSAN, virtualized databases, and VDI pools. ECC is mandatory in production virtualization, and this module's JEDEC-standard 1.2 V operation minimizes power per slot, helping dense 2P and 4P servers stay within thermal envelopes. A typical dual-socket server populated with 16 of these modules yields 512 GB of ECC memory, a common starting configuration for mid-range virtualization clusters.
Recomendado
In-Memory Database and Analytics (SAP HANA)
In-memory databases such as SAP HANA, Redis Enterprise, and Apache Ignite rely on large memory pools with predictable latency. The MTA18ASF4G72PZ-3G2E1's 1Rx4 rank configuration delivers lower access latency than 2Rx4 equivalents at the same capacity, which directly translates to faster query response times. Its DDR4-3200 speed grade provides the bandwidth headroom needed for analytical scans across multi-terabyte datasets, and ECC protection eliminates the silent-corruption risk that would otherwise corrupt persistent state. SAP-certified servers typically populate 256 GB to 1 TB of this module class per node, with each module deployed in matched pairs across memory channels for optimal interleaving.
Recomendado
AI Training and Inference Nodes
AI training and inference nodes using DDR4-based CPU servers (pre-HBM transition or cost-optimized deployments) leverage the MTA18ASF4G72PZ-3G2E1 as host-side memory for orchestration, dataset caching, and CPU-side preprocessing. The 32 GB density allows large batch sizes for transformer-based inference, while the 3200 MT/s data rate provides adequate bandwidth for dataloader throughput when paired with NVMe SSD arrays. ECC is critical because GPU clusters performing multi-day training runs cannot tolerate uncorrected memory errors that would silently corrupt model weights. The module's standard 288-pin RDIMM form factor drops into widely available GPU server platforms (Dell PowerEdge XE8545, HPE Apollo 6500, Supermicro SYS-420GP-TNAR).
Recomendado
High-Performance Workstations (Dual-Socket Xeon/EPYC)
Dual-socket workstation platforms built on Intel Xeon W-3400 or AMD Threadripper PRO 7000WX benefit from the MTA18ASF4G72PZ-3G2E1's ECC registered operation, which is required for professional workloads such as CAD, simulation (Ansys, COMSOL), video editing (DaVinci Resolve), and 3D rendering. The 32 GB density allows 64 GB to 256 GB configurations in a single workstation, sufficient for most simulation meshes and 8K video timelines. Registered buffering keeps the memory controller stable across 8-channel topologies, while DDR4-3200 speed provides responsive interactivity for viewport navigation and timeline scrubbing. ECC prevents the silent data corruption that would otherwise produce misleading simulation results or corrupt rendered frames over long production runs.
Recomendado
Cloud and Hyperscale Server Memory Upgrades
Hyperscale operators and cloud tenants use the MTA18ASF4G72PZ-3G2E1 to upgrade or repair existing DDR4 server fleets, where 32 GB RDIMMs are the highest-volume density tier. Its JEDEC-compliant DDR4-3200 operation ensures compatibility across mixed-vendor server pools (Dell, HPE, Supermicro, Cisco UCS), and the standard 1.2 V power envelope keeps incremental power per DIMM low enough for hyperscale capacity planning. ECC support meets the strict data-integrity SLAs that hyperscale operators advertise to enterprise customers, while the registered buffering allows per-channel populations of 6 to 8 DIMMs needed for high-density virtual machine hosts. The module is typically procured through OEM channels or authorized Micron distributors and managed under RMA pooling programs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MTA18ASF4G72PZ-3G2E1 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MTA18ASF4G72PZ-3G2F1 | MTA18ASF4G72PZ-3G2 | MTA18ASF4G72PDZ-3G2E1 | MTA18ASF2G72PZ-3G2E1 | M393A4K40DB3-CWE | HMAA4GR7AJR8N-XN |
|---|---|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | SK Hynix |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 16 GB | 32 GB | 32 GB |
| Data Rate | 3200 MT/s (PC4-25600) | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Rank Configuration | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 2Rx4 | 2Rx4 |
| Supply Voltage (VDD) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 |
| ECC Support | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) |
Diferenciadores clave
- Single-rank (1Rx4) configuration delivers lower latency than 2Rx4 equivalents (frente a Samsung M393A4K40DB3-CWE)
- OEM-validated speed bin for direct OEM warranty channels (frente a MTA18ASF4G72PDZ-3G2E1)
- Compatible with 8-channel server topologies via registered buffering (frente a MTA18ASF2G72PZ-3G2E1)
Notas de diseño
Always populate memory channels following the platform vendor's population guidelines (Dell, HPE, Lenovo, Supermicro) rather than assuming generic JEDEC rules. Mixing 1Rx4 and 2Rx4 modules across the same channel can disable interleaving and force the memory controller to operate at the lowest common speed. The MTA18ASF4G72PZ-3G2E1 is a 1Rx4 module, so pairing it with 2Rx4 modules (e.g., Samsung M393A4K40DB3-CWE which is 2Rx4) is generally not recommended on the same channel unless explicitly supported by the platform QVL.
DDR4 RDIMMs operating at 3200 MT/s dissipate approximately 4-6 W per module under sustained load. In densely populated 2U servers with 24 DIMM slots, this translates to roughly 100-150 W of memory subsystem heat per chassis. Ensure the server's airflow path provides adequate cooling (typically 35-40 CFM per DIMM bank) and that DIMM slot blanks are installed in empty slots to maintain proper front-to-back airflow, as missing blanks cause memory thermal throttling or unexpected failures.
When inserting the MTA18ASF4G72PZ-3G2E1, ensure full power is removed from the server before handling. The 288-pin gold-finger contacts are designed for approximately 25 insertion cycles; excessive re-insertion wears the plating and increases contact resistance. After insertion, verify the DIMM latches are fully engaged on both ends - partial engagement causes intermittent contact failures that present as random ECC errors in the system event log rather than obvious POST failures.
Información de cumplimiento
JEDEC DDR4 standard compliance. RoHS and REACH compliant per Micron product page. Not AEC-Q100 (automotive) qualified - this is a server-grade module. Halogen-free per Micron server memory product line compliance statements.
