MTA18ASF4G72PZ-3G2E1 - 32GB DDR4-3200 ECC RDIMM | Micron
料号： MTA18ASF4G72PZ-3G2E1 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $314.18 | $314.18 |
| 10 | $285 | $2,850.00 |
| 50 | $260 | $13,000.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
MTA18ASF4G72PZ-3G2E1 概述
A Registered DIMM (RDIMM) is a type of computer memory module that adds a register buffer between the DRAM chips and the memory controller. This buffer reduces the electrical load on the memory controller, allowing more DIMM slots per channel and higher memory density in enterprise servers. RDIMMs belong to the broader category of DDR4 SDRAM modules, which themselves are a generation of double data rate synchronous DRAM used as system main memory. DDR4 RDIMMs are the workhorse memory form factor for rack-mount servers, workstations, and high-end computing platforms.
The key specifications that define this module are: 32 GB total capacity in a single-rank configuration (1Rx4), 3200 MT/s data rate (PC4-25600, CL22), 1.2 V supply voltage (per JEDEC DDR4 standard), and ECC support enabled by an on-module register and parity. The module uses standard 288-pin gold-finger edge contacts and is populated in the Micron server-memory line that drops into Intel Xeon Scalable and AMD EPYC server platforms.
In practice, the module integrates a register clock driver (RCD) that buffers command, address, and control signals to the DRAM devices, reducing the capacitive load seen by the host CPU's memory controller. This buffering is what enables four-, six-, and eight-DIMM-per-channel configurations that are typical of dual-socket servers. The ECC capability detects and corrects single-bit errors on-the-fly, which is essential for virtualization, in-memory databases, and other workloads where silent memory corruption would cause data loss.
Typical applications for the MTA18ASF4G72PZ-3G2E1 include enterprise servers (Dell PowerEdge, HPE ProLiant, Lenovo ThinkSystem), high-performance workstations (single and dual-CPU), virtualization hosts running VMware vSphere or Hyper-V, and in-memory analytics platforms such as SAP HANA. The 32 GB capacity strikes a balance between per-DIMM density and cost, making it a popular choice for memory upgrades and for replacing failed modules in legacy DDR4 server fleets.
When deploying this module, verify that the host platform's memory controller supports DDR4-3200 (or falls back gracefully to a lower speed). Mixed-rank or mixed-capacity populations across channels are supported by JEDEC but should follow the platform's population guidelines for best performance. The module is hot-swap-friendly on most server backplanes but should be inserted only with full power removed to avoid damaging the gold-finger contacts.
This page synthesizes distributor pricing, drop-in alternatives from the same Micron OEM family, and practical design notes not found on a single manufacturer datasheet, giving engineers a complete sourcing reference for the MTA18ASF4G72PZ-3G2E1.
直接替换替代料： MTA18ASF4G72PZ-3G2E1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MTA18ASF4G72PZ-3G2F1
✅ 直接替换📋 参考替代料（不在目录中）
MTA18ASF4G72PZ-3G2
✅ 直接替换📋 参考替代料（不在目录中）
MTA18ASF4G72PDZ-3G2E1
✅ 直接替换📋 参考替代料（不在目录中）
MTA18ASF2G72PZ-3G2E1
✅ 直接替换📋 参考替代料（不在目录中）
M393A4K40DB3-CWE
✅ 直接替换📋 参考替代料（不在目录中）
HMAA4GR7AJR8N-XN
✅ 直接替换📋 参考替代料（不在目录中）
MTA18ASF4G72PZ-3G2E1 最大额定值与电气特性
| 存储器类型 | DDR4 SDRAM |
| Module Type | RDIMM (Registered DIMM) |
| Capacity | 32 GB |
| Module Rank Configuration | 1Rx4 (Single-Rank x4) |
| 数据速率 | 3200 MT/s (PC4-25600) |
| CAS 延迟 | CL22 |
| Supply Voltage (VDD) | 1.2 V |
| 引脚数量 | 288-pin |
| ECC Support | Yes (ECC Registered) |
| 工作温度 | 0C to +85C (server grade) |
| Form Factor | DIMM (133.35 mm x 31.25 mm typical) |
| Module Height | Standard height (1U-compatible) |
| Register Clock Driver | On-module RCD (per JEDEC DDR4 RDIMM) |
| Speed Grade Identifier | -3G2 (DDR4-3200) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
MTA18ASF4G72PZ-3G2E1 standard 引脚配置指南
MTA18ASF4G72PZ-3G2E1（standard 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MTA18ASF4G72PZ-3G2E1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MTA18ASF4G72PZ-3G2E1 适用于 6 应用s: Enterprise Rack Servers, Virtualization Hosts (VMware / Hyper-V), In-Memory Database and Analytics (SAP HANA), AI Training and Inference Nodes, High-Performance Workstations (Dual-Socket Xeon/EPYC), Cloud and Hyperscale Server Memory Upgrades.
Enterprise Rack Servers
The MTA18ASF4G72PZ-3G2E1's 32 GB DDR4-3200 1Rx4 RDIMM profile fits mainstream 1U and 2U rack servers such as Dell PowerEdge R750, HPE ProLiant DL380 Gen10, and Lenovo ThinkSystem SR650. Its on-module register clock driver reduces the capacitive load on the host memory controller, allowing the platform to populate all DIMM slots per channel (typically 6 or 8) without signal-integrity degradation. ECC support detects and corrects single-bit errors on-the-fly, which is essential for virtualization clusters and database workloads where silent memory corruption would propagate across the entire host. Compared with LRDIMMs, this RDIMM delivers lower latency and is the preferred choice when channel density requirements stay below 256 GB per channel.
推荐
Virtualization Hosts (VMware / Hyper-V)
Virtualization hosts running VMware vSphere or Microsoft Hyper-V benefit from the MTA18ASF4G72PZ-3G2E1's ECC-protected 32 GB density, which directly determines the consolidation ratio of VMs per physical host. The DDR4-3200 data rate (PC4-25600, CL22) provides 25.6 GB/s peak per module bandwidth, sufficient for memory-throughput-intensive workloads such as vSAN, virtualized databases, and VDI pools. ECC is mandatory in production virtualization, and this module's JEDEC-standard 1.2 V operation minimizes power per slot, helping dense 2P and 4P servers stay within thermal envelopes. A typical dual-socket server populated with 16 of these modules yields 512 GB of ECC memory, a common starting configuration for mid-range virtualization clusters.
推荐
In-Memory Database and Analytics (SAP HANA)
In-memory databases such as SAP HANA, Redis Enterprise, and Apache Ignite rely on large memory pools with predictable latency. The MTA18ASF4G72PZ-3G2E1's 1Rx4 rank configuration delivers lower access latency than 2Rx4 equivalents at the same capacity, which directly translates to faster query response times. Its DDR4-3200 speed grade provides the bandwidth headroom needed for analytical scans across multi-terabyte datasets, and ECC protection eliminates the silent-corruption risk that would otherwise corrupt persistent state. SAP-certified servers typically populate 256 GB to 1 TB of this module class per node, with each module deployed in matched pairs across memory channels for optimal interleaving.
推荐
AI Training and Inference Nodes
AI training and inference nodes using DDR4-based CPU servers (pre-HBM transition or cost-optimized deployments) leverage the MTA18ASF4G72PZ-3G2E1 as host-side memory for orchestration, dataset caching, and CPU-side preprocessing. The 32 GB density allows large batch sizes for transformer-based inference, while the 3200 MT/s data rate provides adequate bandwidth for dataloader throughput when paired with NVMe SSD arrays. ECC is critical because GPU clusters performing multi-day training runs cannot tolerate uncorrected memory errors that would silently corrupt model weights. The module's standard 288-pin RDIMM form factor drops into widely available GPU server platforms (Dell PowerEdge XE8545, HPE Apollo 6500, Supermicro SYS-420GP-TNAR).
推荐
High-Performance Workstations (Dual-Socket Xeon/EPYC)
Dual-socket workstation platforms built on Intel Xeon W-3400 or AMD Threadripper PRO 7000WX benefit from the MTA18ASF4G72PZ-3G2E1's ECC registered operation, which is required for professional workloads such as CAD, simulation (Ansys, COMSOL), video editing (DaVinci Resolve), and 3D rendering. The 32 GB density allows 64 GB to 256 GB configurations in a single workstation, sufficient for most simulation meshes and 8K video timelines. Registered buffering keeps the memory controller stable across 8-channel topologies, while DDR4-3200 speed provides responsive interactivity for viewport navigation and timeline scrubbing. ECC prevents the silent data corruption that would otherwise produce misleading simulation results or corrupt rendered frames over long production runs.
推荐
Cloud and Hyperscale Server Memory Upgrades
Hyperscale operators and cloud tenants use the MTA18ASF4G72PZ-3G2E1 to upgrade or repair existing DDR4 server fleets, where 32 GB RDIMMs are the highest-volume density tier. Its JEDEC-compliant DDR4-3200 operation ensures compatibility across mixed-vendor server pools (Dell, HPE, Supermicro, Cisco UCS), and the standard 1.2 V power envelope keeps incremental power per DIMM low enough for hyperscale capacity planning. ECC support meets the strict data-integrity SLAs that hyperscale operators advertise to enterprise customers, while the registered buffering allows per-channel populations of 6 to 8 DIMMs needed for high-density virtual machine hosts. The module is typically procured through OEM channels or authorized Micron distributors and managed under RMA pooling programs.
推荐
推荐产品汇总
工程参考数据： MTA18ASF4G72PZ-3G2E1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MTA18ASF4G72PZ-3G2F1 | MTA18ASF4G72PZ-3G2 | MTA18ASF4G72PDZ-3G2E1 | MTA18ASF2G72PZ-3G2E1 | M393A4K40DB3-CWE | HMAA4GR7AJR8N-XN |
|---|---|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics | SK Hynix |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 16 GB | 32 GB | 32 GB |
| Data Rate | 3200 MT/s (PC4-25600) | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Rank Configuration | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 2Rx4 | 2Rx4 |
| Supply Voltage (VDD) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 | CL22 |
| ECC Support | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) | Yes (Registered ECC) |
关键差异点
- Single-rank (1Rx4) configuration delivers lower latency than 2Rx4 equivalents （对比 Samsung M393A4K40DB3-CWE)
- OEM-validated speed bin for direct OEM warranty channels （对比 MTA18ASF4G72PDZ-3G2E1)
- Compatible with 8-channel server topologies via registered buffering （对比 MTA18ASF2G72PZ-3G2E1)
设计说明
Always populate memory channels following the platform vendor's population guidelines (Dell, HPE, Lenovo, Supermicro) rather than assuming generic JEDEC rules. Mixing 1Rx4 and 2Rx4 modules across the same channel can disable interleaving and force the memory controller to operate at the lowest common speed. The MTA18ASF4G72PZ-3G2E1 is a 1Rx4 module, so pairing it with 2Rx4 modules (e.g., Samsung M393A4K40DB3-CWE which is 2Rx4) is generally not recommended on the same channel unless explicitly supported by the platform QVL.
DDR4 RDIMMs operating at 3200 MT/s dissipate approximately 4-6 W per module under sustained load. In densely populated 2U servers with 24 DIMM slots, this translates to roughly 100-150 W of memory subsystem heat per chassis. Ensure the server's airflow path provides adequate cooling (typically 35-40 CFM per DIMM bank) and that DIMM slot blanks are installed in empty slots to maintain proper front-to-back airflow, as missing blanks cause memory thermal throttling or unexpected failures.
When inserting the MTA18ASF4G72PZ-3G2E1, ensure full power is removed from the server before handling. The 288-pin gold-finger contacts are designed for approximately 25 insertion cycles; excessive re-insertion wears the plating and increases contact resistance. After insertion, verify the DIMM latches are fully engaged on both ends - partial engagement causes intermittent contact failures that present as random ECC errors in the system event log rather than obvious POST failures.
合规信息
JEDEC DDR4 standard compliance. RoHS and REACH compliant per Micron product page. Not AEC-Q100 (automotive) qualified - this is a server-grade module. Halogen-free per Micron server memory product line compliance statements.
