S25FL512SAGBHIA10 - 512Mb Quad SPI NOR Flash 133MHz | Infineon
N.º de pieza: S25FL512SAGBHIA10 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.1 | $510,00 |
| 500 | $4.45 | $2.225,00 |
| 1.000 | $3.95 | $3.950,00 |
S25FL512SAGBHIA10 Descripción general
A NOR flash is a type of non-volatile memory that allows random read access at byte granularity and executes-in-place code directly from the array. In the memory hierarchy, NOR flash sits below SRAM and DRAM but above NAND flash: it is faster to read than NAND, more reliable for code storage, and uses a low-pin-count serial peripheral interface rather than a wide parallel bus. The S25FL512S fits the "serial NOR flash > NOR flash > non-volatile memory > memory IC > semiconductor" hypernymy chain and is most often deployed as the boot or firmware-storage device sitting adjacent to the host MCU/MPU.
Key specifications include a 133 MHz Quad SPI clock (50 MHz single-I/O legacy), an internal 4 KB uniform sector / 256-byte page architecture, dual I/O and Quad I/O read modes, an OTP security register with a 64-byte unique ID, and a deep power-down current below 25 µA. The device supports both standard SPI mode 0/3 and a high-performance Multi-I/O mode that can sustain 80 MB/s read throughput when all four I/O lines are engaged with continuous-wrap burst reads. Program and erase are performed through a standard status-register polling mechanism or via a configurable busy/READY output.
Architecturally, the S25FL512S family uses MirrorBit® charge-trap storage, which places two physically distinct bits per cell to double density without relying on smaller cell geometry. A built-in 1-bit ECC engine detects and corrects single-bit errors during page read, raising effective endurance well above the raw 100 k cycle rating. The part is fully command-set compatible with the legacy S25FL-A family and complies with JEDEC JESD216 SFDP for in-system identification of flash parameters.
Typical applications include industrial gateways and PLC firmware storage, automotive infotainment boot flash, networking router boot and configuration storage, secure IoT edge nodes, and reference designs that require long-term code retention. The 24-BGA package is suited for space-constrained mobile/handheld designs where a Quad SPI interface is required to achieve the boot latency budget. Compared to NAND flash, the part executes XIP code in place and avoids ECC burden at the host.
For design, place the part within 5 mm of the host with short, length-matched traces on CS#, SCK and the four IO lines, and provide a 0.1 µF plus 4.7 µF decoupling pair on VCC. Use the BGA with 0.5 mm pitch and follow standard PCB assembly guidelines for back-to-back via-in-pad if thermal cycling is expected. Hold CS# high during power-up to ensure a clean state-machine reset.
This page synthesizes distributor pricing, drop-in footprint-compatible alternatives, and practical SPI flash design notes not found in the manufacturer datasheet alone.
Alternativas directas para S25FL512SAGBHIA10 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
S25FL512SAGBHIA00
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
S25FL512SAGBHIC10
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MT25QL512ABB8E12-0SIT
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MX25L51273G
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
S25FL512SAGBHIA10 Valores máximos y características eléctricas
| Tipo de memoria | Non-Volatile NOR Flash |
| Memory Density | 512 Mbit (64 MB) |
| Memory Organization | 67,108,864 bytes |
| Technology | MirrorBit® (65 nm charge-trap) |
| Interfaz | SPI (Single, Dual, Quad I/O) |
| Frecuencia de reloj máxima | 133 MHz (Quad SPI) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Sector Size | 4 KB (uniform) |
| Page Size | 256 bytes |
| Program/Erase Cycles | 100,000 minimum per sector |
| Data Retention | 20 years minimum |
| Temperatura de funcionamiento | -40 °C to +85 °C (Industrial) |
| Encapsulado | 24-BGA (TBGA024N, 8 mm × 6 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
| Nivel MSL | MSL3 |
| JEDEC Standard | JESD216 (SFDP compliant) |
Configuración de pines de S25FL512SAGBHIA10
| Pin A1 | NC — No connect (reserved) |
| Pin A2 | CS# — Chip select (active low) |
| Pin A3 | SO/IO1 — Serial output / IO1 in Multi-I/O mode |
| Pin A4 | WP#/IO2 — Write protect (active low) / IO2 in Quad SPI |
| Pin A5 | HOLD#/IO3 — Hold (active low) / IO3 in Quad SPI |
| Pin A6 | VCC — Power supply (2.7 V to 3.6 V) |
| Pin B1 | NC — No connect (reserved) |
| Pin B2 | SI/IO0 — Serial input / IO0 in Multi-I/O mode |
| Pin B3 | NC — No connect (reserved) |
| Pin B4 | GND — Ground reference |
| Pin B5 | NC — No connect (reserved) |
| Pin B6 | SCK — Serial clock |
| Pin C1 | GND — Ground reference |
| Pin C2 | NC — No connect (reserved) |
| Pin C3 | NC — No connect (reserved) |
| Pin C4 | NC — No connect (reserved) |
| Pin C5 | NC — No connect (reserved) |
| Pin C6 | GND — Ground reference |
| Pin D1 | VCC — Power supply (2.7 V to 3.6 V) |
| Pin D2 | NC — No connect (reserved) |
| Pin D3 | GND — Ground reference |
| Pin D4 | NC — No connect (reserved) |
| Pin D5 | NC — No connect (reserved) |
| Pin D6 | VCC — Power supply (2.7 V to 3.6 V) |
Aplicaciones típicas
S25FL512SAGBHIA10 es adecuado para 6 aplicacións: Industrial Gateway Firmware Boot Flash, Networking Router and Switch Configuration Storage, Automotive Infotainment Boot Flash, IoT Edge Node Secure Firmware Storage, Industrial HMI Touch Panels, Server BMC and Boot Record Storage.
Industrial Gateway Firmware Boot Flash
The S25FL512SAGBHIA10 stores the bootloader and full application firmware of an industrial gateway next to the host MPU. Its 64 MB density comfortably fits multi-image OTA slot layouts, and the 133 MHz Quad SPI bus boots a 1 MB image in well under 100 ms. Industrial-grade temperature (-40 °C to +85 °C) and 20-year data retention suit unattended edge equipment that runs unattended for years. The 24-BGA 8×6 mm footprint fits compact Gateway PCB form factors with thermal pads only on the host MCU.
Recomendado
Networking Router and Switch Configuration Storage
Inside networking equipment the S25FL512SAGBHIA10 holds the boot ROM image plus a writable configuration and log region. The Quad SPI bus is natively supported by most networking ASIC reference designs and supplies up to 80 MB/s read bandwidth for fast cold-boot. ECC on page-read and the 100 000 cycle endurance per sector keep the configuration/log rewrite wear budget healthy in constant-throughput equipment. The 24-BGA package sits cleanly on standard 4-layer router PCBs.
Recomendado
Automotive Infotainment Boot Flash
For automotive infotainment and cluster head units the S25FL512SAGBHIA10 provides the XIP boot image and asset region. Although the -IA10 suffix denotes industrial grade, the same 24-BGA footprint is offered in the automotive S25FL512SAGBHIA00/Q1 ordering variants, allowing PCB reuse. Industrial temperature and the JEDEC JESD216 SFDP feature set let the infotainment MCU identify the device at boot without a vendor driver. Drop-in automotive variants are listed in the Infineon S25FL512S family datasheet.
Recomendado
IoT Edge Node Secure Firmware Storage
In an IoT edge node the S25FL512SAGBHIA10 holds signed firmware blobs and 64-byte unique-ID-based secure-root keys. Quad SPI mode minimizes the bus-pin count on small 28-pin MCUs, leaving more GPIO for sensors and edge AI. The 1-bit ECC and 20-year retention give an attractive mean-time-to-data-loss metric for decades-deployed nodes. Pairing with the OTP security registers supports anti-rollback counters common in PSA-certified designs.
Recomendado
Industrial HMI Touch Panels
HMI panels need fast code boot to satisfy cold-start UX requirements. The S25FL512SAGBHIA10's 133 MHz Quad SPI supports rapid display-initialization firmware fetches and the 64 MB density stores locales, fonts and graphics assets without external NAND. The industrial temperature rating suits outdoor panels and the 24-BGA package keeps the display carrier PCB compact. Built-in ECC keeps panel firmware survivable over the 10+ year field life.
Recomendado
Server BMC and Boot Record Storage
Baseboard Management Controllers and server mainboard record-storage ICs rely on NOR flash for crash-dump records and boot ROM retention. The S25FL512SAGBHIA10 gives 64 MB of fast-erase storage ideal for crash-dump rings and current boot-context histories. The Quad SPI bus integrates with most BMC architectures and the high endurance survives constant logging during hardware bring-up. Industrial grade accommodates data-center thermal envelopes.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para S25FL512SAGBHIA10 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | S25FL512SAGBHIA00 | S25FL512SAGBHIC10 | MT25QL512ABB8E12-0SIT | MX25L51273G |
|---|---|---|---|---|---|
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Micron Technology | Macronix |
| Package | 24-BGA (8x6 mm) | 24-BGA (8x6 mm) - same | 24-BGA (8x6 mm) - same | 24-BGA (8x6 mm) - same | 24-BGA (8x6 mm) - same |
| Density | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) | 512 Mbit (64 MB) |
| Max Quad SPI Clock | 133 MHz | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Supply Voltage | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V | 2.7 V to 3.6 V |
| Sector Size | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform | 4 KB uniform |
| Endurance (cycles/sector) | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Data Retention | 20 years | 20 years | 20 years | 20 years | 20 years |
Diferenciadores clave
- MirrorBit® charge-trap technology (frente a MT25QL512ABB8E12-0SIT)
- Industrial-grade 24-BGA footprint (frente a MX25L51273G)
- Family-wide drop-in footprint (frente a S25FL256SAGBHIA00)
Notas de diseño
Place the S25FL512SAGBHIA10 within 5 mm of the host MPU and keep the CS#, SCK, IO0..IO3 traces matched to within +/-100 mil to meet the 133 MHz Quad SPI timing margin. Use length-matching across all four I/O lines plus SCK to avoid clock-data skew. A 0.1 µF X7R plus 4.7 µF bulk decoupling pair should sit within 5 mm of each VCC ball, with a ground return via fence stitching around the perimeter. The BGA 0.5 mm pitch allows 4-layer PCB breakout; use back-to-back microvias under the balls for thermal cycling reliability.
Quad SPI at 133 MHz is sensitive to signal integrity. Series-terminate SCK and CS# with 33 ohm resistors close to the host driver to control overshoot. Keep IO traces short, have no more than two vias per signal, and avoid routing over splits in the VCC plane. Hold CS# high during power-up for at least 100 µs to ensure a clean internal state-machine reset and to avoid spurious page-program false starts.
Do not enable Quad SPI mode (0x38 EBh) until the host has reliably completed the 0x06 (write enable) and 0x04 (write disable) sequence; otherwise the flash may interpret mode bits as a write command. Always read SFDP (0x5A) at boot to verify the device dynamic and the parameter table before issuing vendor-specific OTP/lock commands. For status register access, mask the BUSY bit by polling the WIP field rather than relying on a fixed delay.
Información de cumplimiento
S25FL512SAGBHIA10 is industrial-grade and RoHS compliant. AEC-Q100/PPAP support is offered on the automotive-grade -Q1 variant of the family per Infineon datasheet.
