EP20K400GI655-3V vs EP20K400GI655-1V مقایسه
مقایسه دقیق کنار به کنار EP20K400GI655-3V توسط Intel و EP20K400GI655-1V توسط Intel. مشخصات کلیدی، پارامترهای الکتریکی، بسته‌بندی، وضعیت چرخه عمر، قیمت‌گذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
Intel
EP20K400GI655-3V - APEX 20K 400K-Gate FPGA, 16K LE, 655-Pin PGA | Altera (Intel)
EP20K400GI655-3V ObsoleteIntel
EP20K400GI655-1V - APEX 20K 400K Gate FPGA, 655-pin CBGA | Intel
EP20K400GI655-1V ⚠ آخرین فرصت خریدمقایسه مشخصات
| پارامتر | EP20K400GI655-3V | EP20K400GI655-1V |
|---|---|---|
| برند | Intel | Intel |
| دسته‌بندی | FPGA & CPLD | FPGA & CPLD |
| وضعیت چرخه عمر | Obsolete | آخرین فرصت خرید |
| Series | APEX 20K | — |
| Device Family | EP20K400 | — |
| Logic Elements | 16,640 | 16,640 |
| Typical Gate Count | 400,000 gates | — |
| Maximum User I/O | 496 | 502 |
| Dedicated Inputs | 6 | 4 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Total Embedded RAM | [DATA_NEEDED: total RAM bits] | — |
| Technology | CMOS (0.18 µm process) | — |
| Maximum Internal Clock Frequency | 714.2 MHz | — |
| Supply Voltage VCCINT | 2.5 V | — |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V | — |
| بسته‌بندی | 655-pin SPGA (Staggered PGA), 47 x 47 mm | — |
| نوع نصب | Through-Hole (Pin Grid Array) | — |
| دمای کاری | -40 °C to +85 °C (industrial) | [DATA_NEEDED: industrial vs military grade] |
| سطح حساسیت به رطوبت (MSL) | 1 | — |
| Qualification | Not Qualified | — |
| وضعیت RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED] |
| Configuration Interface | IEEE 1149.1 JTAG + serial / parallel passive | — |
| Family | — | APEX 20K |
| Typical Gates | — | 400,000 |
| Package Type | — | CBGA-655 (Ceramic Ball Grid Array) |
| Package Code (JESD-30) | — | S-CPGA-P655 |
| Package Equivalence Code | — | SPGA655, 47x47 |
| Process Technology | — | CMOS |
| Propagation Delay | — | 2.5 ns |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Configuration | — | In-system programmable via JTAG |
| Boundary Scan | — | IEEE 1149.1 JTAG |
| سطح MSL | — | 1 |
| Package Body Material | — | Ceramic |