MPXV5010GC7U vs MPVZ5010G7U مقایسه
مقایسه دقیق کنار به کنار MPXV5010GC7U توسط NXP Semiconductors و MPVZ5010G7U توسط NXP Semiconductors. مشخصات کلیدی، پارامترهای الکتریکی، بستهبندی، وضعیت چرخه عمر، قیمتگذاری و موجودی را مقایسه کنید تا بهترین قطعه را برای نیازهای طراحی خود تعیین کنید.
NXP Semiconductors
MPVZ5010G7U - 10 kPa Vented Gauge Pressure Sensor, 8-DIP | NXP
MPVZ5010G7U ✓ فعالمقایسه مشخصات
| پارامتر | MPXV5010GC7U | MPVZ5010G7U |
|---|---|---|
| برند | NXP Semiconductors | NXP Semiconductors |
| دستهبندی | Pressure Sensors | Pressure Sensors |
| وضعیت چرخه عمر | فعال | فعال |
| Pressure Type | Differential / Gauge | Vented Gauge |
| Operating Pressure Range | 0 kPa to 10 kPa | 0 kPa to 10 kPa (0 to 1.45 PSI) |
| Maximum Overpressure | [DATA_NEEDED: maximum overpressure rating in kPa] | — |
| ولتاژ تغذیه | 4.75 V to 5.25 V (typ. 5.0 V) | — |
| Full-Scale Output (typ. @10 kPa) | 4.5 V | — |
| Zero-Pressure Offset | 0.2 V to 0.85 V | — |
| Supply Current (typ.) | [DATA_NEEDED: supply current in mA] | — |
| محدوده دمای کاری | 0 °C to +85 °C | 0 °C to +85 °C |
| Storage Temperature Range | -30 °C to +100 °C | -30 °C to +100 °C [DATA_NEEDED: confirm exact storage spec] |
| نوع خروجی | Analog (ratiometric to VCC) | Analog, ratiometric to Vcc |
| Output Impedance | < 50 ohm | — |
| Accuracy (typ.) | ±5 % of V_FSS (0-85 °C) | — |
| Response Time | [DATA_NEEDED: response time in ms] | [DATA_NEEDED: response time ms] |
| بستهبندی / کیس | SOP-8 (Case 1737), Surface Mount | — |
| Port Configuration | Dual axial horizontal ports (gauge) | — |
| Media Compatibility | Non-corrosive, non-ionic media (dry air, dry gases) | — |
| نوع نصب | Surface Mount | Through-Hole (DIP module with vent tube) |
| وضعیت RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Supply Voltage (Vcc) | — | 4.75 V to 5.25 V (5 V typical) |
| جریان تغذیه | — | 10 mA (maximum) |
| Analog Output Range | — | 0.2 V to 4.7 V |
| Accuracy | — | ±1.5 %FS (0 °C to 85 °C) |
| Compensated Temperature Range | — | -10 °C to +60 °C |
| بستهبندی | — | 8-DIP Module (Case 1368-01, through-hole) |
| Sensor Technology | — | Piezoresistive silicon micromachined |
| Signal Conditioning | — | On-chip, temperature compensated, calibrated |
| سطح MSL | — | [DATA_NEEDED: MSL rating] |
| Body Height | — | 5.46 mm |