10AS032E4F29I3LG - Arria 10 SX SoC FPGA, 320K LE, 780-FBGA | Altera
MPN: 10AS032E4F29I3LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 500 | $2150 | $1,075,000.00 |
| 1,000 | $1920 | $1,920,000.00 |
Drop-in alternatives for 10AS032E4F29I3LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032E4F29E3LG
✅ Drop-In✓ In Stock
$2295 / Unit
View Datasheet →10AS032E4F29I3SG
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View Datasheet →10AS032E4F27I3LG
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View Datasheet →10AS032E4F27I3SG
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View Datasheet →10AS032E3F29I2LG
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View Datasheet →10AS032E4F29I3LG Maximum Ratings & Electrical Characteristics
| Device Family | Arria 10 SX |
| Logic Elements | 320K |
| Hard Processor Subsystem | Dual ARM Cortex-A9 MPCore with CoreSight |
| Core Frequency | 1.5 GHz |
| Fabric Speed Grade | 4 |
| Temperature Grade | Industrial |
| Package | 780-FBGA, FC (29x29 mm) |
| Mounting Type | Surface Mount |
| Terminal Form | Ball |
| Number of Terminals | 780 |
| Package Code | BGA |
| Package Shape | Square |
| Lead-Free / RoHS | Yes (RoHS compliant) |
10AS032E4F29I3LG square Pin Configuration Guide
Complete pinout information for 10AS032E4F29I3LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032E4F29I3LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032E4F29I3LG is suitable for 6 applications: Industrial Machine Vision, Software-Defined Radio (SDR) Front End, Broadcast Video Processing, Medical Imaging and Diagnostics, Motor Control and Industrial Automation, Defense and Aerospace Secure Compute.
Industrial Machine Vision
The 10AS032E4F29I3LG fits industrial machine vision because the hard ARM Cortex-A9 cores run a Linux-based image processing stack while the 320K logic elements accelerate pixel pipelines, Bayer demosaicing, and object detection at deterministic latency. The integrated DDR4 controller with ECC supports the high-bandwidth memory access required by multi-stream GigE Vision or CoaXPress cameras, and the industrial temperature grade ensures reliable operation on factory floors. The 780-FBGA package provides the I/O density for parallel sensor aggregation, while 1.5 GHz fabric frequency keeps frame-to-frame latency predictable.
Recommended
Software-Defined Radio (SDR) Front End
The 10AS032E4F29I3LG suits SDR front ends because the FPGA fabric executes wideband DDC/DUC, FFTs, and channelization at line rate, while the dual ARM cores handle waveform firmware, synchronization, and network protocol stacks. The device's high-speed transceivers support multi-Gbps data conversion links to ADCs and DACs, and the hard memory controller sustains the buffering required by wide instantaneous bandwidth captures. Compared with pure soft-core implementations, the integrated ARM subsystem reduces latency and BOM in tactical and commercial SDR platforms.
Recommended
Broadcast Video Processing
The 10AS032E4F29I3LG is well-matched to broadcast video processing because 320K logic elements deliver enough capacity for 4K/UHD HEVC/H.265 mezzanine compression, color space conversion, and on-screen graphics compositing in a single device. The dual ARM cores orchestrate transport stream muxing and IP-based delivery, while the FPGA fabric handles pixel-rate operations at deterministic frame delay. The industrial temperature rating and lead-free package suit broadcast equipment deployed in mixed-temperature headends and outdoor OB trucks.
Recommended
Medical Imaging and Diagnostics
The 10AS032E4F29I3LG fits medical imaging systems because the integrated HPS runs the application and UI stack on Linux while the FPGA fabric accelerates CT/MRI back-projection, ultrasound beamforming, or X-ray flat-panel pre-processing at deterministic latency. The hard DDR4 controller with ECC is critical for diagnostic image fidelity, and the security extensions help meet HIPAA-style data-at-rest requirements. Industrial temperature grading allows deployment in controlled but unconditioned clinical environments where commercial-grade parts would be marginal.
Recommended
Motor Control and Industrial Automation
The 10AS032E4F29I3LG suits motor control and industrial automation because the FPGA fabric executes high-resolution field-oriented control (FOC), Sigma-Delta modulation, and deterministic encoder interfaces at sub-microsecond loop times. The hard ARM cores run the PLC runtime, EtherCAT or PROFINET master stacks, and HMI logic. The industrial temperature grade and 780-ball BGA's high I/O count allow aggregation of multiple motor axes, safety I/O, and fieldbus interfaces on a single SoC, reducing bill of materials versus discrete MCU plus FPGA designs.
Recommended
Defense and Aerospace Secure Compute
The 10AS032E4F29I3LG fits secure defense and aerospace compute platforms because the hard ARM cores run trusted execution firmware and crypto libraries while the FPGA fabric accelerates packet processing, secure I/O, and signal conditioning. Security features including secure boot, key storage, and anti-tamper align with defense program requirements. Industrial temperature operation covers many ground-vehicle and sheltered-aerospace deployments, and the lead-free RoHS finish satisfies modern environmental mandates.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032E4F29I3LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032E4F29E3LG | 10AS032E4F29I3SG | 10AS032E4F27I3LG | 10AS032E3F29I2LG |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | 780-FBGA (29x29 mm, F29) | 780-FBGA (29x29 mm, F29) - same | 780-FBGA (27x27 mm, F27) | 780-FBGA (27x27 mm, F27) | 780-FBGA (29x29 mm, F29) - same |
| Logic Elements | 320K | 320K | 320K | 320K | 320K |
| Speed Grade | 4 | 3 | 3 | 4 | 2 |
| Temperature Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
| Hard Processor Subsystem | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| RoHS / Lead-Free | Yes | Yes | Yes | Yes | Yes |
| Drop-in Footprint | Reference | Yes (F29) | No (F27 vs F29) | No (F27 vs F29) | Yes (F29) |
Key Differentiators
- Hard ARM Cortex-A9 HPS integrated on die (vs Cyclone V SX (older SoC FPGA))
- Industrial temperature grade in F29 ballmap (vs 10AS032E4F29I3SG (F27 ballmap, industrial))
- Speed grade 4 for tightest timing margins (vs 10AS032E4F29E3LG (speed grade 3))
Design Notes
The 780-FBGA Arria 10 SX device dissipates significant power under typical industrial workloads, including the HPS subsystem. Estimate: at 1.5 GHz core frequency and mid-utilization fabric, plan for 8-15W dissipation and design the PCB with a thermal via array under the BGA plus a heat spreader for closed-enclosure deployments. Use the Arria 10 power estimator early in the design to validate thermal assumptions before PCB layout freeze.
The 780-FBGA F29 ballmap requires a high-density PCB with microvia stackups and matched-length routing for transceiver and DDR4 signals. Use the Intel/Altera pinout file and Quartus Prime pin planner to assign banks before layout. Place decoupling capacitors on the bottom side of the BGA for shortest return paths and dedicate continuous ground and power planes beneath the device for signal integrity.
Do not confuse the F29 (29x29 mm) ballmap with the F27 (27x27 mm) ballmap: both are 780-pin FBGA but the footprints are not interchangeable. Verify the OPN before PCB fab: 10AS032E4F29xx = F29, 10AS032E4F27xx = F27. Mixing the two ballmaps causes assembly yield loss and unrecoverable rework cost.
Arria 10 SX transceivers are sensitive to reference clock jitter; source the refclk from a low-jitter oscillator and isolate it from noisy digital supplies. For DDR4 interfaces, follow the Intel pinout guideline for write leveling and read deskew; do not relax the matching constraints to ease routing, or you risk intermittent bit errors at temperature corners.
Compliance Information
RoHS compliant per Altera product page; lead-free finish confirmed by 'G' suffix in OPN. AEC-Q100 not applicable - this is an FPGA SoC, not an automotive-grade IC. Halogen-free status not stated in provided data.
