10AS032H3F35E2SG - Arria 10 SX SoC FPGA 320K LE | Altera
Référence : 10AS032H3F35E2SG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2750 | $27 500,00 |
| 100 | $2650 | $265 000,00 |
| 500 | $2550 | $1 275 000,00 |
| 1 000 | $2450 | $2 450 000,00 |
10AS032H3F35E2SG Présentation
An SoC FPGA (System-on-Chip Field-Programmable Gate Array) is a class of programmable logic device that integrates a microprocessor subsystem (HPS) with traditional FPGA fabric on a single die. The hardened ARM Cortex-A9 subsystem runs operating systems such as Linux or real-time OS, while the FPGA fabric accelerates custom datapath logic. This combination enables deterministic hardware processing, software flexibility, and significant board-area reduction versus separate processor-plus-FPGA designs, making SoC FPGAs the dominant choice for embedded vision, industrial control, and communication infrastructure.
Key features of the 10AS032H3F35E2SG include 320K logic elements, embedded hard memory blocks, DSP blocks for high-throughput arithmetic, and high-speed serial transceivers supporting multi-gigabit data rates. The 0.9 V core operating voltage and 20 nm process node provide a strong performance-per-watt profile. The dual-core Cortex-A9 HPS includes NEON media engine, L1/L2 caches, and a rich set of peripherals (EMAC, USB, NAND, SD/MMC, SPI, UART) accessed via AXI bridges.
The Arria 10 SX architecture enables simultaneous hardware-accelerated DSP and software-defined control, with the FPGA fabric and HPS sharing access to a high-bandwidth multi-ported SDRAM controller. This makes the device ideal for designs that require both deterministic real-time data processing (in FPGA fabric) and high-level application stack, networking, or user-interface code (in the HPS).
Typical applications include radar and lidar signal processing in aerospace/defense, motor control and machine vision in industrial automation, 4K video processing and broadcast equipment, software-defined radio base stations, and medical imaging systems. The combination of ARM Cortex-A9 OS support and FPGA compute density enables single-chip implementations of systems that previously required separate ASSP plus FPGA solutions.
When designing with this device, allocate sufficient PCB area for the 1152-ball FC-BGA package and use a multi-layer PCB stack-up with continuous GND planes for power delivery and signal integrity. The HPS and FPGA core require separate power rails; sequence them according to the manufacturer power management guidelines. JTAG and SDM (Secure Device Manager) connections are required for configuration and debug.
This page synthesizes distributor pricing, drop-in alternatives from the Arria 10 SX family, comparison tables, and practical design notes not found on any single manufacturer or distributor page, giving engineers a one-stop reference for evaluating the 10AS032H3F35E2SG.
Alternatives de remplacement direct pour 10AS032H3F35E2SG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS032H3F35E2SG (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Grade, Mounting Type, RoHS Status, Hard Processor System.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS032H3F35E2LG
✅ Remplacement direct✓ En stock
$3650 / unité
Voir la fiche technique →10AS032H3F35I2SG
✅ Remplacement direct✓ En stock
$2120 / unité
Voir la fiche technique →10AS032H3F35E3SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS032H3F34E2SG
✅ Remplacement direct✓ En stock
$2120 / unité
Voir la fiche technique →10AS032H3F35E1HG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10AS032H3F35E2SG Valeurs maximales et caractéristiques électriques
| Family | Arria 10 SX SoC FPGA |
| Series | 10AS032 |
| Logic Elements | 320,000 |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Hard Processor System | Yes (integrated) |
| Boîtier | 1152-FBGA, FC (35x35 mm) |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Extended (E2 suffix) |
| Statut RoHS | Compliant |
Guide de configuration des broches du 10AS032H3F35E2SG 1152-fbga, fc (35x35 mm)
Configuration des broches du 10AS032H3F35E2SG (boîtier 1152-fbga, fc (35x35 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS032H3F35E2SG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS032H3F35E2SG convient pour 6 applications: Radar and Lidar Signal Processing, Industrial Machine Vision and Inspection, Software-Defined Radio and Wireless Baseband, 4K Video Processing and Broadcast Equipment, Medical Imaging Systems, Automotive ADAS Sensor Fusion.
Radar and Lidar Signal Processing
The 10AS032H3F35E2SG is purpose-built for radar and lidar processing where deterministic hardware DSP must coexist with high-level object-tracking software. The 320K logic elements and DSP blocks deliver real-time FFT, pulse compression, and beamforming at multi-hundred-MHz sample rates, while the dual ARM Cortex-A9 HPS runs the Linux-based tracker, classifier, and networking stack. Multi-gigabit transceivers accept raw ADC data from RF front-ends (typical 4-10 Gbps LVDS or JESD204B), and the 1.5 GHz HPS clock enables responsive control loops. Compared with a discrete FPGA + external ARM SoC design, the integrated HPS eliminates one chip and reduces board area by ~30%, critical for airborne and vehicle-mounted platforms where size, weight, and power dominate the bill of materials.
Recommandé
Industrial Machine Vision and Inspection
For high-throughput machine vision (e.g., AOI, semiconductor inspection, robotic pick-and-place), the 10AS032H3F35E2SG combines FPGA fabric parallelism with HPS flexibility. The fabric handles real-time image preprocessing (filtering, edge detection, color conversion) at line-rate from MIPI CSI-2 or parallel LVDS camera inputs, while the HPS runs the Linux-based inference engine and PLC communication. With 320K logic elements, multiple image-processing pipelines can run in parallel without CPU intervention. The extended commercial temperature grade (E2) covers factory-floor environments; for harsher installations choose the industrial-grade I2 variant. Compared to GPU-based vision systems, this SoC FPGA delivers deterministic latency (critical for inline inspection) at lower power and without active cooling.
Recommandé
Software-Defined Radio and Wireless Baseband
In SDR and wireless baseband designs (small-cell, military radio, public-safety), the 10AS032H3F35E2SG splits work between FPGA and HPS efficiently. The FPGA fabric handles PHY-layer DSP (channelization, crest-factor reduction, digital predistortion) at sample rates up to several hundred MSPS, while the dual ARM Cortex-A9 cores run the MAC layer, encryption, and networking stack on a real-time Linux distribution. Multi-gigabit transceivers connect directly to RF ADC/DAC devices (e.g., AD9361, AD9371) via JESD204B, eliminating external PHY chips. Compared with pure FPGA + external CPU designs, the integrated HPS reduces BOM cost and PCB area while providing OS-level networking (TCP/IP, DPDK) out of the box.
Recommandé
4K Video Processing and Broadcast Equipment
Broadcast and professional video equipment (video switchers, format converters, multi-viewers) leverages the 10AS032H3F35E2SG's HPS + fabric split for 4K/UHD workflows. The FPGA fabric handles real-time pixel-rate operations (scaling, deinterlacing, color-space conversion, HDR mapping) at 4K60 rates, while the HPS runs the control UI, network protocol stack (SMPTE 2110, NDI), and storage I/O. With 320K logic elements, multiple 4K pipelines can be processed simultaneously without external memory bottlenecks. Transceivers support 12G-SDI (SMPTE 2082) and quad-link 3G-SDI aggregation. Compared with ASIC-based broadcast processors, the SoC FPGA enables post-deployment format upgrades and feature additions, dramatically extending product lifecycle.
Recommandé
Medical Imaging Systems
Medical imaging modalities (ultrasound, CT, MRI front-end processing, endoscopy) require deterministic hardware pipelines for signal acquisition and reconstruction. The 10AS032H3F35E2SG handles beamforming in ultrasound or back-projection in CT/MRI on the FPGA fabric, achieving the precise timing and low latency required for diagnostic accuracy. The HPS runs the operator UI, DICOM network stack, image archival, and database on Linux. Compared with general-purpose CPU servers, the SoC FPGA form factor fits in cart-based or portable systems with limited thermal envelope. For medical device compliance, design with IEC 62304 software lifecycle processes; the SoC separation of safety-critical fabric code from non-safety HPS code simplifies certification.
Recommandé
Automotive ADAS Sensor Fusion
Although not AEC-Q100 qualified, the 10AS032H3F35E2SG is used in development and pre-production ADAS platforms (sensor fusion ECUs for camera + radar + lidar fusion). The FPGA fabric fuses and preprocesses raw sensor data at line rate; the dual ARM Cortex-A9 HPS runs perception algorithms (object detection, tracking) on Linux or QNX. Multi-gigabit transceivers aggregate automotive Ethernet (100BASE-T1, 1000BASE-T1) and connect to GMSL/FPD-Link camera serializers. For production automotive deployments, migrate to the automotive-grade Cyclone V SoC or Arria 10 AS variant. Compared with discrete DSP + MCU architectures, the SoC FPGA approach accelerates time-to-prototype and enables late-stage algorithm tuning in the fabric without board respins.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS032H3F35E2SG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS032H3F35E2LG | 10AS032H3F35I2SG | 10AS032H3F35E3SG | 10AS032H3F34E2SG | 10AS032H3F35E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 780-FBGA, FC (29x29 mm) - smaller | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Speed Grade | H3 (-3, fastest) | H3 (-3) | H3 (-3) | H3 (-3) | H3 (-3) | H1 (-1, slowest) |
| Temperature Grade | E2 (Extended Commercial) | E2 (Extended Commercial) | I2 (Industrial, -40C to +100C) | E3 (Extended Commercial) | E2 (Extended Commercial) | E1 (Extended Commercial) |
| HPS | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Solder Ball Finish | Lead-free (SAC) | Leaded (SnPb) | Lead-free (SAC) | Lead-free (SAC) | Lead-free (SAC) | Lead-free (SAC) |
| Unit Price (qty 1, approx.) | $2,850 | $2,900 (leaded premium) | $2,950 (industrial premium) | $2,850 | $2,700 (smaller package) | $2,500 (slowest speed) |
Principaux différenciateurs
- Same 1152-ball 35x35 mm package across the entire 10AS032H3F35x2SG family (vs 10AS032H3F34E2SG)
- Extended commercial temperature grade (E2) covers most industrial use cases at lower cost than I2 (vs 10AS032H3F35I2SG)
- Highest speed grade H3 maximizes Fmax for high-performance DSP and transceiver designs (vs 10AS032H3F35E1HG)
Notes de conception
The 1152-ball FC-BGA (35x35 mm) package requires a high-density PCB with microvia (HDI) stack-up. Use 1 oz copper outer layers with 0.5 oz inner layers, and design stack-up with continuous GND planes for signal integrity and power delivery. Estimated: for a 1-oz copper top layer with 1 square inch of pour, the FPGA core can dissipate ~2-3 W before requiring additional thermal relief. For higher dissipation, attach a heatsink via the top-side thermal pad. Ball pitch is 1.0 mm; follow IPC-7093 design rules for BGA breakout routing.
The 10AS032H3F35E2SG requires multiple power rails: 0.9 V core, 1.1 V HPS, 1.8 V/2.5 V/3.3 V I/O and transceiver PLLs, and 1.2 V transceiver. Power-on sequence per Altera/Intel guidelines: VCC, VCCPT, VCCA_FPLL, VCC_HPS, VCCAUX, VCCAUX_HPS, VCCIO - each rail must ramp in order to prevent latch-up. Use a dedicated FPGA power sequencer IC or PMIC (e.g., Altera Enpirion EM11x series). Estimated quiescent power at typical 70% utilization: 8-12 W; peak power with high transceiver utilization can reach 25 W.
Place decoupling capacitors as close as possible to BGA balls: 0402 size preferred. Each VCC/VCCIO ball requires at least one 0.1 uF decoupling cap; bulk 10-47 uF caps per voltage plane. For transceiver channels, follow Altera Arria 10 SX transceiver layout guidelines - AC-coupling caps, 100-ohm differential routing, and length matching within 5 mils. The HPS boot configuration (MSEL pins) must be set correctly to select boot source (QSPI flash, SD card, NAND). SDM (Secure Device Manager) signals require dedicated routing to JTAG header for debug access.
The 35x35 mm FC-BGA package has a typical theta_JA of approximately 8-12 C/W with proper PCB thermal design (top-side thermal pad with thermal vias to internal copper plane). For applications with >15 W total power dissipation or extended temperature operation, use a heatsink with thermal interface material (TIM). In enclosed industrial enclosures, ensure airflow or use the top of the BGA thermal pad as a heat-spreader surface. Always validate with thermal simulation tools before committing to PCB layout.
Common pitfalls when designing with this SoC FPGA: (1) forgetting to configure boot mode pins (MSEL) before POR - device will not boot; (2) inadequate power sequencing causing latch-up or permanent damage; (3) transceiver reference clock jitter exceeding the datasheet spec, causing link failures; (4) HPS EMAC PHY reset sequencing issues causing Linux boot hang; (5) not connecting JTAG/SDM signals properly blocks configuration; (6) using the wrong Quartus device family library causing bitstream errors. Always validate the design with the official Arria 10 SX development kit reference design before custom PCB.
Informations de conformité
RoHS compliant per Altera/Intel product page. Lead-free solder balls (SAC) by default; LG variants provide leaded (SnPb) finish. Not AEC-Q100 qualified - choose automotive-grade Altera Cyclone V SoC variants for automotive deployments. REACH compliance per EU declaration.