10AS032H3F35E2SG - Arria 10 SX SoC FPGA 320K LE | Altera
MPN: 10AS032H3F35E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2750 | $27,500.00 |
| 100 | $2650 | $265,000.00 |
| 500 | $2550 | $1,275,000.00 |
| 1,000 | $2450 | $2,450,000.00 |
Drop-in alternatives for 10AS032H3F35E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10AS032H3F35E2LG
✅ Drop-In✓ In Stock
$3650 / Unit
View Datasheet →10AS032H3F35I2SG
✅ Drop-In✓ In Stock
$2120 / Unit
View Datasheet →10AS032H3F35E3SG
✅ Drop-In📋 Reference alternative (not in catalog)
10AS032H3F34E2SG
✅ Drop-In✓ In Stock
$2120 / Unit
View Datasheet →10AS032H3F35E1HG
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
10AS032H3F35E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX SoC FPGA |
| Series | 10AS032 |
| Logic Elements | 320,000 |
| Process Node | 20 nm |
| Core Voltage | 0.9 V |
| HPS Core | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Hard Processor System | Yes (integrated) |
| Package | 1152-FBGA, FC (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Extended (E2 suffix) |
| RoHS Status | Compliant |
10AS032H3F35E2SG 1152-fbga, fc (35x35 mm) Pin Configuration Guide
Complete pinout information for 10AS032H3F35E2SG (1152-fbga, fc (35x35 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS032H3F35E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS032H3F35E2SG is suitable for 6 applications: Radar and Lidar Signal Processing, Industrial Machine Vision and Inspection, Software-Defined Radio and Wireless Baseband, 4K Video Processing and Broadcast Equipment, Medical Imaging Systems, Automotive ADAS Sensor Fusion.
Radar and Lidar Signal Processing
The 10AS032H3F35E2SG is purpose-built for radar and lidar processing where deterministic hardware DSP must coexist with high-level object-tracking software. The 320K logic elements and DSP blocks deliver real-time FFT, pulse compression, and beamforming at multi-hundred-MHz sample rates, while the dual ARM Cortex-A9 HPS runs the Linux-based tracker, classifier, and networking stack. Multi-gigabit transceivers accept raw ADC data from RF front-ends (typical 4-10 Gbps LVDS or JESD204B), and the 1.5 GHz HPS clock enables responsive control loops. Compared with a discrete FPGA + external ARM SoC design, the integrated HPS eliminates one chip and reduces board area by ~30%, critical for airborne and vehicle-mounted platforms where size, weight, and power dominate the bill of materials.
Recommended
Industrial Machine Vision and Inspection
For high-throughput machine vision (e.g., AOI, semiconductor inspection, robotic pick-and-place), the 10AS032H3F35E2SG combines FPGA fabric parallelism with HPS flexibility. The fabric handles real-time image preprocessing (filtering, edge detection, color conversion) at line-rate from MIPI CSI-2 or parallel LVDS camera inputs, while the HPS runs the Linux-based inference engine and PLC communication. With 320K logic elements, multiple image-processing pipelines can run in parallel without CPU intervention. The extended commercial temperature grade (E2) covers factory-floor environments; for harsher installations choose the industrial-grade I2 variant. Compared to GPU-based vision systems, this SoC FPGA delivers deterministic latency (critical for inline inspection) at lower power and without active cooling.
Recommended
Software-Defined Radio and Wireless Baseband
In SDR and wireless baseband designs (small-cell, military radio, public-safety), the 10AS032H3F35E2SG splits work between FPGA and HPS efficiently. The FPGA fabric handles PHY-layer DSP (channelization, crest-factor reduction, digital predistortion) at sample rates up to several hundred MSPS, while the dual ARM Cortex-A9 cores run the MAC layer, encryption, and networking stack on a real-time Linux distribution. Multi-gigabit transceivers connect directly to RF ADC/DAC devices (e.g., AD9361, AD9371) via JESD204B, eliminating external PHY chips. Compared with pure FPGA + external CPU designs, the integrated HPS reduces BOM cost and PCB area while providing OS-level networking (TCP/IP, DPDK) out of the box.
Recommended
4K Video Processing and Broadcast Equipment
Broadcast and professional video equipment (video switchers, format converters, multi-viewers) leverages the 10AS032H3F35E2SG's HPS + fabric split for 4K/UHD workflows. The FPGA fabric handles real-time pixel-rate operations (scaling, deinterlacing, color-space conversion, HDR mapping) at 4K60 rates, while the HPS runs the control UI, network protocol stack (SMPTE 2110, NDI), and storage I/O. With 320K logic elements, multiple 4K pipelines can be processed simultaneously without external memory bottlenecks. Transceivers support 12G-SDI (SMPTE 2082) and quad-link 3G-SDI aggregation. Compared with ASIC-based broadcast processors, the SoC FPGA enables post-deployment format upgrades and feature additions, dramatically extending product lifecycle.
Recommended
Medical Imaging Systems
Medical imaging modalities (ultrasound, CT, MRI front-end processing, endoscopy) require deterministic hardware pipelines for signal acquisition and reconstruction. The 10AS032H3F35E2SG handles beamforming in ultrasound or back-projection in CT/MRI on the FPGA fabric, achieving the precise timing and low latency required for diagnostic accuracy. The HPS runs the operator UI, DICOM network stack, image archival, and database on Linux. Compared with general-purpose CPU servers, the SoC FPGA form factor fits in cart-based or portable systems with limited thermal envelope. For medical device compliance, design with IEC 62304 software lifecycle processes; the SoC separation of safety-critical fabric code from non-safety HPS code simplifies certification.
Recommended
Automotive ADAS Sensor Fusion
Although not AEC-Q100 qualified, the 10AS032H3F35E2SG is used in development and pre-production ADAS platforms (sensor fusion ECUs for camera + radar + lidar fusion). The FPGA fabric fuses and preprocesses raw sensor data at line rate; the dual ARM Cortex-A9 HPS runs perception algorithms (object detection, tracking) on Linux or QNX. Multi-gigabit transceivers aggregate automotive Ethernet (100BASE-T1, 1000BASE-T1) and connect to GMSL/FPD-Link camera serializers. For production automotive deployments, migrate to the automotive-grade Cyclone V SoC or Arria 10 AS variant. Compared with discrete DSP + MCU architectures, the SoC FPGA approach accelerates time-to-prototype and enables late-stage algorithm tuning in the fabric without board respins.
Recommended
Recommended Products Summary
Engineering reference data for 10AS032H3F35E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS032H3F35E2LG | 10AS032H3F35I2SG | 10AS032H3F35E3SG | 10AS032H3F34E2SG | 10AS032H3F35E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FBGA, FC (35x35 mm) | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 1152-FBGA, FC (35x35 mm) - same | 780-FBGA, FC (29x29 mm) - smaller | 1152-FBGA, FC (35x35 mm) - same |
| Logic Elements | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 | 320,000 |
| Speed Grade | H3 (-3, fastest) | H3 (-3) | H3 (-3) | H3 (-3) | H3 (-3) | H1 (-1, slowest) |
| Temperature Grade | E2 (Extended Commercial) | E2 (Extended Commercial) | I2 (Industrial, -40C to +100C) | E3 (Extended Commercial) | E2 (Extended Commercial) | E1 (Extended Commercial) |
| HPS | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Solder Ball Finish | Lead-free (SAC) | Leaded (SnPb) | Lead-free (SAC) | Lead-free (SAC) | Lead-free (SAC) | Lead-free (SAC) |
| Unit Price (qty 1, approx.) | $2,850 | $2,900 (leaded premium) | $2,950 (industrial premium) | $2,850 | $2,700 (smaller package) | $2,500 (slowest speed) |
Key Differentiators
- Same 1152-ball 35x35 mm package across the entire 10AS032H3F35x2SG family (vs 10AS032H3F34E2SG)
- Extended commercial temperature grade (E2) covers most industrial use cases at lower cost than I2 (vs 10AS032H3F35I2SG)
- Highest speed grade H3 maximizes Fmax for high-performance DSP and transceiver designs (vs 10AS032H3F35E1HG)
Design Notes
The 1152-ball FC-BGA (35x35 mm) package requires a high-density PCB with microvia (HDI) stack-up. Use 1 oz copper outer layers with 0.5 oz inner layers, and design stack-up with continuous GND planes for signal integrity and power delivery. Estimated: for a 1-oz copper top layer with 1 square inch of pour, the FPGA core can dissipate ~2-3 W before requiring additional thermal relief. For higher dissipation, attach a heatsink via the top-side thermal pad. Ball pitch is 1.0 mm; follow IPC-7093 design rules for BGA breakout routing.
The 10AS032H3F35E2SG requires multiple power rails: 0.9 V core, 1.1 V HPS, 1.8 V/2.5 V/3.3 V I/O and transceiver PLLs, and 1.2 V transceiver. Power-on sequence per Altera/Intel guidelines: VCC, VCCPT, VCCA_FPLL, VCC_HPS, VCCAUX, VCCAUX_HPS, VCCIO - each rail must ramp in order to prevent latch-up. Use a dedicated FPGA power sequencer IC or PMIC (e.g., Altera Enpirion EM11x series). Estimated quiescent power at typical 70% utilization: 8-12 W; peak power with high transceiver utilization can reach 25 W.
Place decoupling capacitors as close as possible to BGA balls: 0402 size preferred. Each VCC/VCCIO ball requires at least one 0.1 uF decoupling cap; bulk 10-47 uF caps per voltage plane. For transceiver channels, follow Altera Arria 10 SX transceiver layout guidelines - AC-coupling caps, 100-ohm differential routing, and length matching within 5 mils. The HPS boot configuration (MSEL pins) must be set correctly to select boot source (QSPI flash, SD card, NAND). SDM (Secure Device Manager) signals require dedicated routing to JTAG header for debug access.
The 35x35 mm FC-BGA package has a typical theta_JA of approximately 8-12 C/W with proper PCB thermal design (top-side thermal pad with thermal vias to internal copper plane). For applications with >15 W total power dissipation or extended temperature operation, use a heatsink with thermal interface material (TIM). In enclosed industrial enclosures, ensure airflow or use the top of the BGA thermal pad as a heat-spreader surface. Always validate with thermal simulation tools before committing to PCB layout.
Common pitfalls when designing with this SoC FPGA: (1) forgetting to configure boot mode pins (MSEL) before POR - device will not boot; (2) inadequate power sequencing causing latch-up or permanent damage; (3) transceiver reference clock jitter exceeding the datasheet spec, causing link failures; (4) HPS EMAC PHY reset sequencing issues causing Linux boot hang; (5) not connecting JTAG/SDM signals properly blocks configuration; (6) using the wrong Quartus device family library causing bitstream errors. Always validate the design with the official Arria 10 SX development kit reference design before custom PCB.
Compliance Information
RoHS compliant per Altera/Intel product page. Lead-free solder balls (SAC) by default; LG variants provide leaded (SnPb) finish. Not AEC-Q100 qualified - choose automotive-grade Altera Cyclone V SoC variants for automotive deployments. REACH compliance per EU declaration.
