10AS057H2F34I1HG - Arria 10 SX SoC FPGA 570K LE | Intel
Référence : 10AS057H2F34I1HG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6140.27 | $6 140,27 |
| 5 | $5912.55 | $29 562,75 |
| 10 | $5750.18 | $57 501,80 |
| 25 | $5520.4 | $138 010,00 |
| 50 | $5305.75 | $265 287,50 |
| 100 | $4980.3 | $498 030,00 |
10AS057H2F34I1HG Présentation
An SoC FPGA is a heterogeneous computing device that combines a microprocessor subsystem with programmable fabric on the same silicon die. The Arria 10 SX family specifically targets mid-range, mid-power designs needing hardened floating-point DSP blocks (up to 1.5 TFLOPS), 28 Gbps backplane-capable transceivers, and a tightly coupled ARM subsystem with cache coherent accelerators. Compared to discrete CPU + FPGA solutions, SoC FPGAs reduce board area, latency between the CPU and fabric, BOM cost, and power while simplifying security and boot management.
Key features of the 10AS057H2F34I1HG include 570K logic elements, approximately 43 Mbits of embedded memory, 28 Gbps-capable transceivers, variable-precision DSP blocks with hardened IEEE 754 single- and double-precision floating point, and a 1.5 GHz dual-core ARM Cortex-A9 MPCore with CoreSight. External memory interfaces support DDR4, DDR3, QDR II+, and RLDRAM 3 with hardened PHY, reducing soft logic overhead. The F34 package variant exposes 492 user I/Os across 12 transceiver channels and is rated for industrial temperature operation.
Architecturally, Arria 10 SX uses a heterogeneous Adaptive Logic Module (ALM) fabric with 8-input fracturable look-up tables (LUTs), MLAB memory, and 20 Kbit M20K memory blocks. Transceivers support data rates from 614 Mbps up to 28.05 Gbps with hardened PCIe Gen3 and Gen2 IP, 10 GbE, CPRI, and JESD204B/C. The HPS block contains dual Cortex-A9 cores with NEON SIMD, L1 caches, 512 KB shared L2, system MMU, and dedicated SDRAM controller with ECC.
Typical applications include wireless baseband and radio unit processing, military radar and electronic warfare, high-performance industrial imaging and machine vision, medical imaging acceleration, test and measurement instrumentation, and broadcast video processing. The industrial temperature grade makes the device suitable for outdoor telecom, factory automation, and aerospace platforms where fanless conduction-cooled operation is required.
When designing with the 10AS057H2F34I1HG, designers must follow Altera/Intel PCB layout guidelines for the F34 FCBGA to maintain signal integrity on DDR4 channels and high-speed serial links. Decoupling must include bulk, mid-range, and high-frequency capacitors placed close to the die, and the HPS boot configuration (eFuses / BSEL pins) must be finalized before layout finalization to avoid respins.
This page synthesizes distributor pricing, parametric alternatives, and design considerations not found on the bare manufacturer product page, including a same-package variant matrix that helps engineers qualify drop-in replacements within the Arria 10 SX family without re-laying out the board.
Alternatives de remplacement direct pour 10AS057H2F34I1HG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10AS057H2F34I1HG (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Speed Grade, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10AS057H2F34I1SG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10AS057H1F34I1HG
✅ Remplacement direct✓ En stock
$3500 / unité
Voir la fiche technique →10AS057H2F34E2SG
✅ Remplacement direct✓ En stock
$3250 / unité
Voir la fiche technique →10AS057H2F34E2LG
✅ Remplacement direct✓ En stock
$2524.1 / unité
Voir la fiche technique →10AS057H2F34E1HG
✅ Remplacement direct✓ En stock
$3050 / unité
Voir la fiche technique →10AS048H2F34I1HG
✅ Remplacement direct✓ En stock
$2520 / unité
Voir la fiche technique →10AS057H2F34I1HG Valeurs maximales et caractéristiques électriques
| Series | Arria 10 SX |
| Family | Arria 10 |
| Device Type | SoC FPGA (HPS + FPGA) |
| Logic Elements | 570,000 |
| Hard Processor Subsystem (HPS) | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 1.5 GHz |
| Boîtier | 1152-FCBGA (F34), 35x35 mm |
| User I/O Count | 492 |
| Transceivers | Up to 28.05 Gbps |
| Process Technology | TSMC 20 nm |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead Free | Yes |
| Supply Voltage Core | 0.85 V (typ) |
Guide de configuration des broches du 10AS057H2F34I1HG 1152-fcbga (f34), 35x35 mm
Configuration des broches du 10AS057H2F34I1HG (boîtier 1152-fcbga (f34), 35x35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour 10AS057H2F34I1HG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
10AS057H2F34I1HG convient pour 6 applications: Wireless Baseband and Radio Unit Processing, Military Radar and Electronic Warfare, High-Performance Industrial Imaging and Machine Vision, Medical Imaging Acceleration (CT, MRI, Ultrasound), Test and Measurement Instrumentation, Broadcast Video Processing and IP Media Gateways.
Wireless Baseband and Radio Unit Processing
The 10AS057H2F34I1HG is engineered for wireless baseband processing in 4G LTE, 5G NR, and small-cell radio units where the dual ARM Cortex-A9 HPS runs protocol-stack software while the 570K-logic-element fabric implements PHY-layer DSP. Transceivers up to 28.05 Gbps enable CPRI and JESD204B/C fronthaul to RFICs, while the hardened PCIe Gen3 IP supports accelerator ASICs. The 1.5 GHz HPS frequency comfortably executes L1/L2 scheduling and MAC logic, and the industrial temperature range supports outdoor tower-mounted deployments with conduction cooling.
Recommandé
Military Radar and Electronic Warfare
Arria 10 SX SoC FPGAs including the 10AS057H2F34I1HG serve as the compute backbone for phased-array radar, SIGINT, and electronic-countermeasure systems where deterministic, low-latency signal processing is required. The variable-precision DSP blocks with hardened IEEE 754 floating point accelerate FFTs, beamforming, and pulse-Doppler processing, while the dual ARM Cortex-A9 HPS handles control-plane tasks, target tracking, and operator interfaces. The industrial temperature range and 28 Gbps transceivers support ruggedized, defense-grade platforms where a single SoC replaces a CPU+ASIC+FPGA stack.
Recommandé
High-Performance Industrial Imaging and Machine Vision
The 10AS057H2F34I1HG integrates 570K logic elements with multi-Gbps transceivers ideal for high-line-scan and area-scan machine-vision systems requiring simultaneous sensor aggregation and real-time preprocessing. The Cortex-A9 HPS runs Linux-based vision pipelines (OpenCV, GStreamer) while the FPGA fabric handles Bayer demosaicing, lens distortion correction, and 10/25 GigE Vision packet assembly. The 28 Gbps transceivers support CoaXPress-12 and 25 GigE Vision aggregation at full sensor bandwidth, and the industrial temperature rating suits factory-floor deployment.
Recommandé
Medical Imaging Acceleration (CT, MRI, Ultrasound)
The 10AS057H2F34I1HG accelerates backprojection, beamforming, and image-reconstruction algorithms in CT, MRI, and ultrasound systems where both low-latency DSP and embedded CPU control are required. The hardened floating-point DSP blocks deliver up to 1.5 TFLOPS, suitable for FDK reconstruction and back-end filtering, while the dual ARM Cortex-A9 HPS runs the user interface, DICOM stack, and acquisition control. The 1152-FCBGA F34 package supports dense PCB layouts typical of cart-based and stationary imaging systems.
Recommandé
Test and Measurement Instrumentation
High-end oscilloscopes, protocol analyzers, and arbitrary waveform generators use the 10AS057H2F34I1HG as the central processing element, leveraging the 570K LE fabric for real-time acquisition pipelines and the dual ARM Cortex-A9 HPS for UI, networking, and remote-control software. Transceivers up to 28 Gbps enable 100 GbE aggregation for distributed acquisition systems, while the hardened PCIe Gen3 IP supports high-bandwidth ADC/DAC companion cards. Industrial temperature and the F34 FCBGA footprint suit dense multi-board chassis designs.
Recommandé
Broadcast Video Processing and IP Media Gateways
The 10AS057H2F34I1HG handles real-time HEVC/H.264 codec acceleration, video stitching, and IP-media gateway functions in broadcast production trucks and headend systems. The FPGA fabric implements multi-stream video pipeline stages while the dual Cortex-A9 HPS runs SMPTE ST 2059 / PTP timing, control plane, and web-based management interfaces. Transceivers up to 28 Gbps support 12G-SDI aggregation and SMPTE ST 2022-6 uncompressed IP video at full bandwidth. Industrial temperature supports outdoor broadcast venues and mobile production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10AS057H2F34I1HG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10AS057H2F34I1SG | 10AS057H1F34I1HG | 10AS057H2F34E2SG | 10AS057H2F34E2LG | 10AS057H2F34E1HG | 10AS048H2F34I1HG |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FCBGA (F34, 35x35 mm) | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same | 1152-FCBGA (F34, 35x35 mm) - same |
| Logic Elements | 570,000 | 570,000 - same | 570,000 - same | 570,000 - same | 570,000 - same | 570,000 - same | 480,000 (-16%) |
| Speed Grade | H2 (high-speed) | S (slower, -1 bin) | H1 (lower-power) | S (slower, -1 bin) | L (lowest, -2 bin) | H1 (lower-power) | H2 (high-speed) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Extended (0C to +100C) | Industrial (-40C to +100C) |
| HPS (ARM Cortex-A9) | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz | Dual 1.5 GHz |
| User I/O | 492 | 492 - same | 492 - same | 492 - same | 492 - same | 492 - same | 492 - same |
| Transceivers (max Gbps) | 28.05 Gbps | 28.05 Gbps - same | 17.4 Gbps (reduced channels) | 28.05 Gbps - same | 28.05 Gbps - same | 17.4 Gbps (reduced channels) | 28.05 Gbps - same |
Principaux différenciateurs
- Highest speed grade (H2) in the Arria 10 SX 570K-LE F34 family (vs 10AS057H2F34I1SG)
- Full transceiver count (H2 suffix) vs reduced channel count (vs 10AS057H1F34I1HG)
- Industrial temperature grade for ruggedized deployment (vs 10AS057H2F34E2SG)
- Full 570K logic-element capacity vs 480K in lower-resource siblings (vs 10AS048H2F34I1HG)
Notes de conception
The 1152-FCBGA F34 package (35x35 mm, 1.0 mm ball pitch) requires high-density PCB fabrication with microvia stack-ups, laser-drilled vias, and tight impedance control for the 28 Gbps transceiver channels. Use Intel/Altera-recommended 12-layer stack-ups with dedicated ground planes under the BGA field. Decoupling must follow the Quartus Prime early-pin-out-decoupling-cap-finder results, with bulk, mid-range, and high-frequency capacitors placed as close to the die as the layout allows to meet simultaneous-switching-noise margins.
Estimated: at full utilization (570K LE, 28 Gbps transceivers active, dual HPS cores at 1.5 GHz), the Arria 10 SX 10AS057H2F34I1HG dissipates approximately 20-25 W. With the F34 FCBGA thermal resistance around 0.8 C/W (theta_JB), the junction-to-PCB thermal path is dominant. A thermal-management plan must include a high-performance lid, thermal interface material, and chassis-level heat-spreader or heatsink sized for the industrial 100C junction limit at the worst-case ambient.
The HPS boot configuration (BSEL pins, eFuses, clock source) must be finalized before Quartus Prime pinout assignment, as changing it late in the design cycle forces a re-spin of the PCB. Designers often overlook the need for separate power-rail sequencing (0.85 V core, 1.1 V HPS, 1.8 V/2.5 V/3.3 V I/O, transceiver PLLs), each requiring a dedicated regulator with monotonic startup per Intel power-management recommendations. Skipping proper sequencing can cause inrush failures or HPS boot corruption that is hard to diagnose.
DDR4/3 external memory interfaces must be routed with matched-length, fly-by topology per the Intel EMIF Toolkit guidelines, with each byte group kept within 5 ps of skew. Transceiver channels must preserve 100-ohm differential impedance, with continuous reference planes and minimum via transitions. The HPS SDRAM controller has its own dedicated DQS/DQ routing rules separate from the FPGA fabric EMIF - never reuse routing templates between the two subsystems.
Informations de conformité
RoHS and lead-free confirmed via Altera/Intel trade compliance data. Reach compliance stated on the product ordering page. Halogen-free status should be verified against the latest Intel material declaration. AEC-Q100 is not applicable to FPGAs (automotive qualification follows a separate Q-100 flow if required).
