10AS066H4F34I3SG - 660K LE Arria 10 SX SoC FPGA | Intel
부품 번호: 10AS066H4F34I3SG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2808.68 | $2,808.68 |
| 10 | $2735.42 | $27,354.20 |
| 100 | $2580.15 | $258,015.00 |
| 500 | $2425.3 | $1,212,650.00 |
| 1,000 | $2295 | $2,295,000.00 |
10AS066H4F34I3SG 개요
A System on Chip (SoC) FPGA is a single silicon device that merges a programmable logic fabric with one or more hard processor cores, high-speed peripherals, and memory controllers. Within the broader taxonomy, this part sits in the chain SoC FPGA -> FPGA -> Programmable Logic Device (PLD) -> Integrated Circuit. The SoC architecture removes the need for a separate processor chip on the PCB, lowering BOM cost, shrinking board area, and reducing inter-chip latency while retaining full FPGA programmability.
The 10AS066H4F34I3SG delivers 660K logic elements, embedded hardened memory controllers, 28 nm transceivers, fractional PLLs, and PCIe Gen2/Gen3-capable hardened IP blocks. Its hard ARM Cortex-A9 dual-core subsystem supports symmetric multiprocessing with NEON SIMD media engine, ECC L1/L2 caches, and an integrated CoreSight debug and trace fabric. The integrated HPS exposes EMAC, USB 2.0 OTG, NAND/NOR flash controllers, and DDR3/4 memory interfaces with hardware ECC for reliability.
In system architecture the 10AS066H4F34I3SG is typically paired with external DDR3/DDR4 SDRAM, eMMC or NAND boot flash, and high-speed serial links to ASICs, FPGAs, or backplane transceivers. The 1152-FCBGA package enables the highest-pin-count configurations of the Arria 10 SX family, supporting up to 492 user I/Os at the I/O bank limit and multiple 10 Gbps transceiver channels routed from the FPGA side. The Arria 10 architecture is widely deployed in mid-range communications, video broadcast, industrial imaging, and defense applications.
Typical applications include 4K video processing pipelines, 10G/40G Ethernet aggregation, baseband DSP for wireless backhaul, industrial machine vision, and SoC-based control plane processors. The combination of hardened ARM cores and high-density FPGA fabric makes the part a strong fit when deterministic hardware acceleration must coexist with a Linux-class application processor.
When designing with this device, provide at least 0.9 V core and 1.8 V/2.5 V/3.3 V auxiliary rails, follow the Intel Arria 10 pin connection guidelines, and use the Quartus Prime design suite for synthesis, place-and-route, and HPS configuration. The 35 x 35 mm FCBGA requires ENIG surface finish, microvia or HDI PCB stack-up, and a high-current multi-rail power distribution network.
This page synthesizes distributor pricing, drop-in same-family variants, and design considerations that go beyond what a single manufacturer datasheet delivers, helping sourcing engineers and PCB designers compare options without manually cross-checking every part number.
드롭인 대체품: 10AS066H4F34I3SG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 10AS066H4F34I3SG (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Operating Temperature, Logic Elements, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
10AS066H4F34I3LG
✅ 드롭인✓ 재고 있음
$3400 / 개
데이터시트 보기 →10AS066H4F34E3SG
✅ 드롭인✓ 재고 있음
$1920 / 개
데이터시트 보기 →10AS066H4F34E3LG
✅ 드롭인✓ 재고 있음
$2419.49 / 개
데이터시트 보기 →10AS066H4F34I4SGES
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066H3F34I2SG
✅ 드롭인✓ 재고 있음
$3200 / 개
데이터시트 보기 →XC7Z100-2FFG1156
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
10AS066H4F34I3SG 최대 정격 & 전기적 특성
| Manufacturer | Intel (formerly Altera) |
| Series | Arria 10 SX |
| Logic Elements | 660,000 |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Processor Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| Hard Processor System Clock | 1.5 GHz |
| 패키지 | 1152-ball FCBGA (35 mm x 35 mm) |
| User I/Os | 492 |
| 동작 온도 | Industrial (-40 C to +100 C) |
| 실장 유형 | Surface Mount |
| Device Family Tier | H4 (high-performance, mid-density, enhanced DSP and transceiver) |
| Hard Memory Controllers | Yes (DDR3/DDR4 with ECC) |
| Transceivers | 28 nm multi-gigabit transceivers |
| Design Tool | Intel Quartus Prime |
| RoHS | Compliant |
10AS066H4F34I3SG 1152-ball fcbga (35 mm x 35 mm) 핀 구성 가이드
10AS066H4F34I3SG(1152-ball fcbga (35 mm x 35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 10AS066H4F34I3SG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
10AS066H4F34I3SG 적합 용도: 6 애플리케이션s: 4K Video Processing and Broadcast, Wireless Baseband and Backhaul, Industrial Machine Vision, Defense and Avionics Signal Processing, Medical Imaging and Diagnostics, High-Performance Computing Acceleration.
4K Video Processing and Broadcast
The 10AS066H4F34I3SG is well suited to 4K video broadcast pipelines because its 660,000 logic elements and hardened DSP blocks can absorb real-time HEVC/H.264 encode-decode, color space conversion, frame-rate conversion, and deinterlacing workloads. The integrated dual-core ARM Cortex-A9 hard processor system at 1.5 GHz handles transport stream muxing, encryption, and ancillary data processing without burdening the FPGA fabric. The 1152-FCBGA package exposes up to 492 user I/Os and multiple multi-gigabit transceivers, enabling direct interfacing to SDI, HDMI, and 10G Ethernet reference designs. Compared with discrete FPGA + ASSP solutions, the SoC integration reduces board area and inter-chip latency.
추천
Wireless Baseband and Backhaul
The 10AS066H4F34I3SG targets wireless baseband and backhaul designs where the FPGA fabric accelerates FFT/iFFT, channel coding, and crest-factor reduction while the dual ARM Cortex-A9 MPCore runs MAC/PHY scheduling and Linux networking stacks. The 20 nm process and 28 nm transceivers deliver the timing margin required for CPRI/OBSAI fronthaul and 10G/40G Ethernet aggregation. Industrial temperature grade enables deployment in outdoor and sealed enclosures used by mobile network operators. The SoC architecture reduces system bill of materials by combining a control-plane processor and high-throughput DSP accelerator into a single 1152-FCBGA package.
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Industrial Machine Vision
The 10AS066H4F34I3SG is a good fit for industrial machine vision systems that combine high-speed image preprocessing with a Linux-class control plane. The FPGA fabric implements Bayer demosaicing, lens distortion correction, and real-time defect detection at line-scan or area-scan sensor rates, while the hard ARM Cortex-A9 subsystem runs the vision application stack over CoaXPress, Camera Link, or GigE Vision interfaces. The 492 user I/Os allow direct connection to multiple parallel image sensors and motor-control feedback paths. Industrial temperature grade (-40 C to +100 C) and long-life Intel Altera support make this part appropriate for factory-floor deployments.
추천
Defense and Avionics Signal Processing
The 10AS066H4F34I3SG's 660K logic elements and hardened DSP blocks support radar, electronic-warfare, and signal-intelligence front-end processing where deterministic latency and high throughput are mandatory. The integrated ARM Cortex-A9 subsystem handles control-plane command parsing, health monitoring, and secure boot, while the FPGA fabric implements matched filters, beamforming, and pulse compression. The Arria 10 SX family supports anti-tamper and design-security features that defense integrators require. Operating from -40 C to +100 C industrial temperature, this part meets typical avionic environmental requirements when paired with a thermally engineered enclosure.
추천
Medical Imaging and Diagnostics
The 10AS066H4F34I3SG fits medical imaging applications such as ultrasound beamforming, CT reconstruction back-ends, and digital X-ray pre-processors. Its 660K logic elements and DSP blocks implement parallel beamforming and filter-back-projection pipelines at clinical frame rates, while the hard ARM Cortex-A9 double-precision floating-point capable cores run image reconstruction, DICOM stack, and user interfaces. The SoC FPGA reduces the bill of materials compared to a discrete FPGA + external processor approach, important for medical device miniaturization. Industrial temperature grade and lead-free packaging satisfy regulatory requirements for medical equipment.
추천
High-Performance Computing Acceleration
The 10AS066H4F34I3SG serves as a co-processor for high-performance compute appliances where PCIe Gen2/Gen3 connectivity and high-density FPGA acceleration are required. The dual-core ARM Cortex-A9 controls DMA, command queuing, and host communication via PCIe, while the FPGA fabric implements custom compute kernels such as financial Monte Carlo simulations, genomic alignment, or scientific FFTs. The 1152-FCBGA package enables routing of multi-gigabit transceivers for low-latency inter-card links inside accelerator chassis. The industrial operating temperature allows deployment in space-constrained edge-compute cabinets.
추천
추천 제품 요약
엔지니어링 참조 데이터: 10AS066H4F34I3SG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 10AS066H4F34I3LG | 10AS066H4F34E3SG | 10AS066H4F34E3LG | 10AS066H4F34I4SGES | 10AS066H3F34I2SG | XC7Z100-2FFG1156 |
|---|---|---|---|---|---|---|---|
| Package | 1152-FCBGA (35x35) | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1152-FCBGA (35x35) - same | 1156-FCBGA (35x35 class) - close but ball map differs |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | AMD (Xilinx) |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 444,000 |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 28 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 1.0 V |
| HPS Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | ~1 GHz |
| Speed / Temperature Grade | I3 (industrial) | I3L (industrial, lower power) | E3 (extended) | E3L (extended, lower power) | I4 (industrial, faster, ES) | I2 (industrial, slower) | Speed grade -2 industrial |
| User I/Os | 492 | 492 | 492 | 492 | 492 | 492 | 362 |
주요 차별점
- Highest-density Arria 10 SX with I3 speed grade in this footprint (vs 10AS066H3F34I2SG)
- Integrated dual-core ARM Cortex-A9 hard processor system (vs XC7Z100-2FFG1156)
- RoHS-compliant industrial temperature grade F34 package (vs 10AS066H4F34I4SGES)
설계 노트
The 10AS066H4F34I3SG requires at least five separate supply rails: 0.9 V core (VCC, VCCP), 1.8 V/2.5 V/3.3 V auxiliary (VCCIO), dedicated transceiver supply (VCCR/VCCT), and a 1.8 V/3.3 V HPS supply. Estimated: with all logic and transceivers active, total board-level power can reach 20-25 W; the VCC core rail alone can demand 15 A under full utilization. Use a multi-phase controller with output inductors selected to keep ripple under 2% of the rail, and place decoupling capacitors as close as possible to the package balls.
The 1152-FCBGA package requires an HDI PCB stack-up with microvias to escape the 0.8 mm or 1.0 mm ball pitch. Designers should target at least 8-12 layers, an ENIG surface finish, and matched-length impedance-controlled traces for the multi-gigabit transceivers. The thermal pad (if present) must be soldered to the PCB using a via-array thermal relief pattern to ensure proper heat extraction from the high-density FPGA fabric.
Always configure unused transceiver channels per the Intel Arria 10 SX pin connection guidelines - floating or improperly terminated transceiver pins cause additional current draw and may corrupt adjacent channels. Decoupling caps must follow the reference design exactly; do not substitute non-recommended capacitors because the FPGA's power supply rejection is sensitive to ESR/ESL values.
Do not assume the HPS bootloader works without a properly programmed QSPI flash - the 10AS066H4F34I3SG expects a valid boot ROM image at POR. Engineers new to the Arria 10 SX often forget that the HPS and FPGA configuration bitstreams are stored separately; plan for both a golden image and a user image in flash to support fail-safe firmware updates.
규정 준수 정보
RoHS-compliant per the manufacturer product page. Industrial temperature grade is for -40 C to +100 C junction. AEC-Q100 is not applicable (FPGA, not an automotive discrete).
