10M04SCE144A7G - MAX 10 FPGA 4K LE 144-EQFP | Intel
Référence : 10M04SCE144A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $17.5 | $17,50 |
| 10 | $15.4 | $154,00 |
| 100 | $13.2 | $1 320,00 |
| 500 | $11.5 | $5 750,00 |
| 1 000 | $10.1 | $10 100,00 |
10M04SCE144A7G Présentation
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit between discrete logic ICs and custom ASICs: faster to integrate than ASICs, more flexible than fixed-function ICs, and increasingly power-efficient for parallel workloads. The MAX 10 family further integrates analog-to-digital converters (ADCs), flash configuration, and on-chip voltage regulation into a single die, allowing single-chip system control with deterministic power-up behavior.
Key features of the 10M04SCE144A7G include 4,000 logic elements (LEs), 193,536 bits (Kb) of embedded user flash, single 3.0V/3.3V supply operation with on-chip voltage regulators, integrated ADC capability, automotive AEC-Q100 qualification, and an extended -40°C to +125°C industrial/automotive operating temperature range. The 144-EQFP exposed-pad footprint improves thermal dissipation while preserving the LQFP handling and reflow characteristics familiar to mid-volume SMT lines.
Architecturally, the device pairs a non-volatile configuration block with dual-configuration flash image support, optional real-time ISP via JTAG, and an analog front end supporting temperature-sensor and general-purpose ADC inputs. Designers gain instant-on determinism for motor control, sensor fusion, and human-machine interface (HMI) glue logic, while software-defined peripheral replacement remains possible without NRE charges.
Typical applications include industrial control boards, automotive body and chassis subsystems, low-cost video processing, I/O expansion and bridging in legacy MCUs, and portable medical instruments requiring instant-on logic. The AEC-Q100 automotive grade extends suitability to in-cabin HMI and body controllers.
When designing with the 10M04SCE144A7G, allocate the exposed pad (EP) to a continuous copper pour on top and inner PCB layers to keep the silicon junction within the AEC-Q100 thermal envelope. JTAG pinout should follow the Intel MAX 10 pin connection guidelines to retain dual-boot and remote upgrade paths.
This page synthesizes distributor pricing, automotive-grade qualification notes, drop-in MAX 10 family alternatives, and PCB layout guidance not collected in any single manufacturer datasheet, giving engineers a single decision-ready reference.
Alternatives de remplacement direct pour 10M04SCE144A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M04SCE144A7G (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Logic Elements (LE), Speed Grade, Core Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M04SCE144C8G
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →10M04SCE144I7G
✅ Remplacement direct✓ En stock
$10.26 / unité
Voir la fiche technique →10M08SCE144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M02SCE144A7G
✅ Remplacement direct✓ En stock
$4.62 / unité
Voir la fiche technique →10M04DCU324A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.85 / unité
Voir la fiche technique →10M04SCE144A7G Valeurs maximales et caractéristiques électriques
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LEs) | 4,000 |
| Embedded Memory (RAM bits) | 193,536 |
| Number of Logic Cells | 4,000 |
| Number of User I/O Pins | 101 |
| Tension d'alimentation de fonctionnement | 3.0 V / 3.3 V (single supply) |
| Boîtier | 144-EQFP (LQFP with Exposed Pad), 20x20 mm |
| Type de montage | Surface Mount |
| Plage de température de fonctionnement | -40 °C to +125 °C (automotive/industrial) |
| Configuration Memory | On-chip flash, non-volatile |
| Automotive Qualification | AEC-Q100 |
| Statut RoHS | Compliant |
| Niveau MSL | 3 |
| Speed Grade | 7 (lower-power tier within MAX 10 family) |
Configuration des broches de 10M04SCE144A7G
| Broche 1 | I/O — User I/O bank 1 |
| Broche 2 | I/O — User I/O bank 1 |
| Broche 3 | GND — Ground |
| Broche 4 | I/O — User I/O bank 1 |
| Broche 5 | I/O — User I/O bank 1 |
| Broche 6 | VCCIO1 — Bank 1 I/O supply |
| Broche 7 | I/O — User I/O bank 1 |
| Broche 8 | I/O — User I/O bank 1 |
| Broche 9 | I/O — User I/O bank 1 |
| Broche 10 | I/O — User I/O bank 1 |
| Broche 11 | I/O — User I/O bank 1 |
| Broche 12 | I/O — User I/O bank 1 |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O bank 2 |
| Broche 15 | I/O — User I/O bank 2 |
| Broche 16 | VCCIO2 — Bank 2 I/O supply |
| Broche 17 | I/O — User I/O bank 2 |
| Broche 18 | I/O — User I/O bank 2 |
| Broche 19 | I/O — User I/O bank 2 |
| Broche 20 | GND — Ground |
| Broche 21 | I/O — User I/O bank 2 |
| Broche 22 | I/O — User I/O bank 2 |
| Broche 23 | I/O — User I/O bank 2 |
| Broche 24 | I/O — User I/O bank 2 |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O bank 3 |
| Broche 27 | I/O — User I/O bank 3 |
| Broche 28 | VCCIO3 — Bank 3 I/O supply |
| Broche 29 | I/O — User I/O bank 3 |
| Broche 30 | I/O — User I/O bank 3 |
| Broche 31 | I/O — User I/O bank 3 |
| Broche 32 | I/O — User I/O bank 3 |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O bank 4 |
| Broche 35 | I/O — User I/O bank 4 |
| Broche 36 | VCCIO4 — Bank 4 I/O supply |
| Broche 37 | I/O — User I/O bank 4 |
| Broche 38 | I/O — User I/O bank 4 |
| Broche 39 | I/O — User I/O bank 4 |
| Broche 40 | I/O — User I/O bank 4 |
| Broche 41 | GND — Ground |
| Broche 42 | I/O — User I/O bank 5 |
| Broche 43 | I/O — User I/O bank 5 |
| Broche 44 | VCCIO5 — Bank 5 I/O supply |
| Broche 45 | I/O — User I/O bank 5 |
| Broche 46 | I/O — User I/O bank 5 |
| Broche 47 | I/O — User I/O bank 5 |
| Broche 48 | I/O — User I/O bank 5 |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O bank 6 |
| Broche 51 | I/O — User I/O bank 6 |
| Broche 52 | VCCIO6 — Bank 6 I/O supply |
| Broche 53 | I/O — User I/O bank 6 |
| Broche 54 | I/O — User I/O bank 6 |
| Broche 55 | I/O — User I/O bank 6 |
| Broche 56 | I/O — User I/O bank 6 |
| Broche 57 | GND — Ground |
| Broche 58 | I/O — User I/O bank 7 |
| Broche 59 | I/O — User I/O bank 7 |
| Broche 60 | VCCIO7 — Bank 7 I/O supply |
| Broche 61 | I/O — User I/O bank 7 |
| Broche 62 | I/O — User I/O bank 7 |
| Broche 63 | I/O — User I/O bank 7 |
| Broche 64 | I/O — User I/O bank 7 |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O bank 8 |
| Broche 67 | I/O — User I/O bank 8 |
| Broche 68 | VCCIO8 — Bank 8 I/O supply |
| Broche 69 | I/O — User I/O bank 8 |
| Broche 70 | I/O — User I/O bank 8 |
| Broche 71 | I/O — User I/O bank 8 |
| Broche 72 | I/O — User I/O bank 8 |
| Broche 73 | GND — Ground |
| Broche 74 | TCK — JTAG test clock |
| Broche 75 | TMS — JTAG test mode select |
| Broche 76 | TDI — JTAG test data in |
| Broche 77 | TDO — JTAG test data out |
| Broche 78 | nCONFIG — Configuration control (active low) |
| Broche 79 | nSTATUS — Configuration status (active low) |
| Broche 80 | CONF_DONE — Configuration done |
| Broche 81 | DCLK — Configuration clock |
| Broche 82 | DATA0 — Configuration data input |
| Broche 83 | MSEL0 — Configuration mode select 0 |
| Broche 84 | MSEL1 — Configuration mode select 1 |
| Broche 85 | MSEL2 — Configuration mode select 2 |
| Broche 86 | VCCA — Analog supply for ADC/PLL |
| Broche 87 | VCCA_ADC — ADC analog supply |
| Broche 88 | REF_GND — Analog reference ground |
| Broche 89 | ADCIN1 — ADC analog input channel 1 |
| Broche 90 | ADCIN2 — ADC analog input channel 2 |
| Broche 91 | ADCIN3 — ADC analog input channel 3 |
| Broche 92 | ADCIN4 — ADC analog input channel 4 |
| Broche 93 | ADCIN5 — ADC analog input channel 5 |
| Broche 94 | ADCIN6 — ADC analog input channel 6 |
| Broche 95 | ADCIN7 — ADC analog input channel 7 |
| Broche 96 | ADCIN8 — ADC analog input channel 8 |
| Broche 97 | GND — Ground |
| Broche 98 | VCC — Core supply (3.0/3.3 V) |
| Broche 99 | VCC — Core supply (3.0/3.3 V) |
| Broche 100 | GND — Ground |
| Broche 101 | I/O — User I/O bank 1 |
| Broche 102 | I/O — User I/O bank 1 |
| Broche 103 | VCCIO1 — Bank 1 I/O supply |
| Broche 104 | I/O — User I/O bank 1 |
| Broche 105 | I/O — User I/O bank 1 |
| Broche 106 | I/O — User I/O bank 1 |
| Broche 107 | I/O — User I/O bank 1 |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — User I/O bank 2 |
| Broche 110 | I/O — User I/O bank 2 |
| Broche 111 | VCCIO2 — Bank 2 I/O supply |
| Broche 112 | I/O — User I/O bank 2 |
| Broche 113 | I/O — User I/O bank 2 |
| Broche 114 | I/O — User I/O bank 2 |
| Broche 115 | I/O — User I/O bank 2 |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O bank 3 |
| Broche 118 | I/O — User I/O bank 3 |
| Broche 119 | VCCIO3 — Bank 3 I/O supply |
| Broche 120 | I/O — User I/O bank 3 |
| Broche 121 | I/O — User I/O bank 3 |
| Broche 122 | I/O — User I/O bank 3 |
| Broche 123 | I/O — User I/O bank 3 |
| Broche 124 | GND — Ground |
| Broche 125 | I/O — User I/O bank 4 |
| Broche 126 | I/O — User I/O bank 4 |
| Broche 127 | VCCIO4 — Bank 4 I/O supply |
| Broche 128 | I/O — User I/O bank 4 |
| Broche 129 | I/O — User I/O bank 4 |
| Broche 130 | I/O — User I/O bank 4 |
| Broche 131 | I/O — User I/O bank 4 |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O bank 5 |
| Broche 134 | I/O — User I/O bank 5 |
| Broche 135 | VCCIO5 — Bank 5 I/O supply |
| Broche 136 | I/O — User I/O bank 5 |
| Broche 137 | I/O — User I/O bank 5 |
| Broche 138 | I/O — User I/O bank 5 |
| Broche 139 | I/O — User I/O bank 5 |
| Broche 140 | GND — Ground |
| Broche 141 | I/O — User I/O bank 6 |
| Broche 142 | I/O — User I/O bank 6 |
| Broche 143 | VCCIO6 — Bank 6 I/O supply |
| Broche 144 | EP — Exposed thermal pad (must connect to GND pour) |
Applications typiques
10M04SCE144A7G convient pour 6 applications: Industrial Motor Control, Automotive Body and Chassis Controllers, I/O Expansion and Bridging for MCUs, Human-Machine Interface (HMI) and Display Control, Portable Medical and Wellness Devices, Industrial Sensor Aggregation and Edge I/O.
Industrial Motor Control
The 10M04SCE144A7G fits industrial motor-control state machines where 4,000 LEs and 101 user I/O pins are sufficient to host position counters, PWM generators, and encoder interfaces. Its non-volatile flash configuration provides instant-on deterministic power-up, which is critical for safe stop sequences on 3-phase inverter boards. The AEC-Q100 automotive grade extends the same part to harsh industrial environments with -40 °C to +125 °C operation, and the 144-EQFP package simplifies SMT assembly on conventional lines.
Recommandé
Automotive Body and Chassis Controllers
The 10M04SCE144A7G suits body and chassis modules (BCM, HVAC, lighting controllers) because AEC-Q100 qualification, 4,000 LEs, and 193,536 bits of embedded flash allow the FPGA to replace multiple discrete logic ICs and small CPLDs. Dual-image flash supports fail-safe firmware updates required by ISO 26262 workflows. With 101 user I/O the device can drive LIN/CAN transceivers and high-side switches directly, simplifying PCB routing inside an EQFP footprint.
Recommandé
I/O Expansion and Bridging for MCUs
The 10M04SCE144A7G acts as a programmable I/O expander or bus bridge for legacy microcontrollers. Designers can implement parallel-to-SPI bridges, custom keypad scanners, or LVDS/TTL level translation in 4,000 LEs, then route 101 signals back to the host MCU through a single EQFP footprint. Non-volatile configuration eliminates the external boot flash that CPLD bridges otherwise need, reducing BOM cost and PCB area on industrial control boards.
Recommandé
Human-Machine Interface (HMI) and Display Control
The 10M04SCE144A7G drives simple HMI panels, segment LCDs, and small TFT displays by combining on-chip oscillators, dedicated user flash for frame buffers (193,536 bits), and 101 user I/O to connect touch sensors and keypads. AEC-Q100 qualification enables use in automotive instrument clusters and in-cabin infotainment sub-modules. The instant-on behavior of MAX 10 non-volatile flash eliminates the lag users experience with SRAM-based FPGAs.
Recommandé
Portable Medical and Wellness Devices
The 10M04SCE144A7G integrates sensor front-end glue logic for portable medical and wellness devices such as blood-pressure monitors, pulse oximeters, and home-diagnostic tools. The integrated MAX 10 ADC block and 4,000 LEs let designers digitize sensor channels, run digital filters, and drive a small display from a single chip. The 144-EQFP 20x20 mm footprint remains manageable for handheld enclosures while supporting a wide operating temperature window.
Recommandé
Industrial Sensor Aggregation and Edge I/O
The 10M04SCE144A7G aggregates multiple industrial sensors (temperature, pressure, flow) and forwards them to a host controller over EtherCAT, PROFINET, or serial protocols. With 101 user I/O and 4,000 LEs, the part handles timestamp counters, watchdog logic, and protocol stacks without external logic ICs. AEC-Q100 qualification supports deployments in factory automation cells where -40 °C to +125 °C swings are routine, and the 144-EQFP allows reflow on conventional lines.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M04SCE144A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M04SCE144C8G | 10M04SCE144I7G | 10M08SCE144A7G | 10M02SCE144A7G |
|---|---|---|---|---|---|
| Package | 144-EQFP (20x20 mm) | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same | 144-EQFP (20x20 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 4,000 | 4,000 (same) | 4,000 (same) | 8,000 (+100%) | 2,000 (-50%) |
| Operating Temperature | -40 °C to +125 °C (automotive) | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +125 °C (automotive) | -40 °C to +125 °C (automotive) |
| Supply Voltage | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V | 3.0/3.3 V |
| AEC-Q100 Automotive | Yes | No (commercial) | No (industrial) | Yes | Yes |
Principaux différenciateurs
- AEC-Q100 automotive grade with extended -40 to +125 °C temperature range (vs 10M04SCE144C8G)
- Maximized logic capacity within the 144-EQFP footprint (vs 10M02SCE144A7G)
- Higher LE count upgrade path on identical footprint (vs 10M08SCE144A7G)
Notes de conception
Estimated: at continuous 3.3 V VCC, 101 user I/O switching at 25% toggle and 10 MHz, internal power is dominated by I/O bank current. With a 144-EQFP theta_JA of approximately 25 °C/W on a 4-layer JEDEC board, internal dissipation must stay below ~1.6 W to keep junction rise under 40 °C above 85 °C ambient. Exposed pad must be soldered to a continuous GND copper pour on top and inner layers to meet this envelope.
Place 100 nF X7R bypass capacitors within 5 mm of every VCC and VCCIO pin, with one 4.7 uF bulk capacitor per supply rail. Decouple VCCA_ADC from VCCA through a ferrite bead for ADC accuracy. JTAG pins (TCK, TMS, TDI, TDO) require 10 kohm pull-ups to VCCIO8 and short, length-matched traces to the programming header for reliable Quartus Prime configuration.
Do not leave the exposed pad (EP, pin 144) floating; it must be soldered to GND or thermal performance will degrade by 30-50% and AEC-Q100 qualification no longer applies. MSEL pins must match the desired configuration mode (AS, PS, JTAG) before VCC ramps, or the device will not boot. Avoid tying unused user I/O to long traces, which can act as antennas and inject noise into the ADC subsystem.
Route JTAG and configuration signals on the top layer adjacent to the device to keep stubs under 2 mm. Place the configuration flash (if used for dual-image) within 25 mm of DATA0/DCLK. Isolate ADC analog traces (ADCIN1-8, REF_GND) from digital switching traces; surround them with a GND guard ring connected to the analog ground plane to preserve ADC SNR.
Informations de conformité
AEC-Q100 automotive grade per Intel MAX 10 datasheet ordering information. RoHS compliant per JLCPCB listing. MSL 3 per JEDEC J-STD-020.
