10M16SCE144A7G - MAX 10 FPGA 16K LE, EQFP-144 | Intel / Altera
Référence : 10M16SCE144A7G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.8 | $3 080,00 |
| 500 | $27.72 | $13 860,00 |
| 1 000 | $24.5 | $24 500,00 |
10M16SCE144A7G Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable routing fabric, and I/O cells, all of which can be redefined by the user after manufacturing. FPGAs sit in the broader programmable-logic taxonomy (FPGA -> programmable logic -> logic IC -> integrated circuit) and are typically chosen over ASICs when time-to-market, low NRE cost, or post-production re-programmability outweigh the absolute lowest unit cost. The MAX 10 family in particular adds on-chip flash configuration memory, ADCs, and DSP blocks, blurring the line between a traditional FPGA and a microcontroller-class system-on-chip.
Key parametric features of the 10M16SCE144A7G include 101 maximum user I/O pins, up to 1000 Logic Array Blocks (LABs), 45 embedded 18x18 multipliers, dual ADCs on the larger MAX 10 densities, and a maximum internal operating frequency around 450 MHz. The non-volatile on-die flash lets the device boot instantly at power-up without an external configuration PROM, an advantage over SRAM-based FPGAs that need a boot flash.
Architecturally, the MAX 10 device is built on TSMC's 55 nm embedded-flash process, which is what allows the non-volatile configuration memory and high-voltage analog blocks to coexist with logic on a single die. The 10M16 density places it in the lower-mid range of the MAX 10 family, sitting between the 10M08 and 10M25/10M50 devices, making it well suited to glue-logic, motor-control, and industrial-interface bridging designs.
Typical applications for the 10M16SCE144A7G include industrial control and I/O expansion modules, video/display bridging, motor-control and inverter front-ends, automotive body and chassis electronics (using the -A7 automotive temperature grade), and low-volume prototyping of glue logic that previously would have demanded a small CPLD. Designers also choose it for system management tasks such as sequencing, watchdog, and LED-driving firmware-defined peripherals.
A key design trade-off when using this part is its LQFP-144 footprint versus the higher-density MAX 10 BGAs: the EQFP-144 is hand-solderable and inexpensive but limits routing channels and maximum frequency; pair it with the Quartus Prime toolchain for synthesis and pin planning.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not aggregated on any single distributor page.
Alternatives de remplacement direct pour 10M16SCE144A7G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 10M16SCE144A7G (même facteur de forme et même empreinte) — différant par Package, Configuration Memory, Process Technology, Logic Elements (LE), Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
10M16SAE144C8G
✅ Remplacement direct✓ En stock
$27.01 / unité
Voir la fiche technique →10M16SAE144C7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M08SCE144A7G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
10M04SCE144A7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$10.1 / unité
Voir la fiche technique →10M16SFE144C7G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
10M16SCE144A7G Valeurs maximales et caractéristiques électriques
| Series | MAX 10 |
| Family | MAX 10 FPGA |
| Logic Elements (LE) | 16,000 |
| Embedded Memory (Kb) | 562 Kb |
| Maximum User I/O | 101 |
| Logic Array Blocks (LABs) | 1000 |
| Embedded 18x18 Multipliers | 45 |
| Supply Variant | Single-supply (S) |
| Speed Grade | -A7 |
| Temperature Grade | Automotive (-A7: -40C to +125C) |
| Boîtier | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch |
| Type de montage | Surface Mount |
| Maximum Operating Frequency | 450 MHz |
| Tension d'alimentation de fonctionnement | 3.0 V / 3.3 V |
| Process Node | 55 nm embedded flash (TSMC) |
| Configuration Memory | On-die non-volatile flash |
| Statut RoHS | Compliant |
| Niveau MSL | Moisture Sensitive (per distributor data) |
| Factory Pack Quantity | 60 |
| Tradename | MAX |
Configuration des broches de 10M16SCE144A7G
| Broche 1 | IO — User I/O (bank 1) |
| Broche 2 | IO — User I/O (bank 1) |
| Broche 3 | IO — User I/O (bank 1) |
| Broche 4 | IO — User I/O (bank 1) |
| Broche 5 | IO — User I/O (bank 1) |
| Broche 6 | IO — User I/O (bank 1) |
| Broche 7 | VCCIO1 — I/O bank 1 supply |
| Broche 8 | IO — User I/O (bank 1) |
| Broche 9 | IO — User I/O (bank 1) |
| Broche 10 | IO — User I/O (bank 1) |
| Broche 11 | GND — Ground |
| Broche 12 | IO — User I/O (bank 2) |
| Broche 13 | IO — User I/O (bank 2) |
| Broche 14 | IO — User I/O (bank 2) |
| Broche 15 | IO — User I/O (bank 2) |
| Broche 16 | IO — User I/O (bank 2) |
| Broche 17 | IO — User I/O (bank 2) |
| Broche 18 | IO — User I/O (bank 2) |
| Broche 19 | VCCIO2 — I/O bank 2 supply |
| Broche 20 | IO — User I/O (bank 2) |
| Broche 21 | IO — User I/O (bank 2) |
| Broche 22 | GND — Ground |
| Broche 23 | IO — User I/O (bank 3) |
| Broche 24 | IO — User I/O (bank 3) |
| Broche 25 | IO — User I/O (bank 3) |
| Broche 26 | IO — User I/O (bank 3) |
| Broche 27 | IO — User I/O (bank 3) |
| Broche 28 | IO — User I/O (bank 3) |
| Broche 29 | VCCIO3 — I/O bank 3 supply |
| Broche 30 | IO — User I/O (bank 3) |
| Broche 31 | IO — User I/O (bank 3) |
| Broche 32 | IO — User I/O (bank 3) |
| Broche 33 | GND — Ground |
| Broche 34 | IO — User I/O (bank 4) |
| Broche 35 | IO — User I/O (bank 4) |
| Broche 36 | IO — User I/O (bank 4) |
| Broche 37 | IO — User I/O (bank 4) |
| Broche 38 | IO — User I/O (bank 4) |
| Broche 39 | IO — User I/O (bank 4) |
| Broche 40 | IO — User I/O (bank 4) |
| Broche 41 | VCCIO4 — I/O bank 4 supply |
| Broche 42 | IO — User I/O (bank 4) |
| Broche 43 | IO — User I/O (bank 4) |
| Broche 44 | GND — Ground |
| Broche 45 | IO — User I/O (bank 5) |
| Broche 46 | IO — User I/O (bank 5) |
| Broche 47 | IO — User I/O (bank 5) |
| Broche 48 | IO — User I/O (bank 5) |
| Broche 49 | IO — User I/O (bank 5) |
| Broche 50 | IO — User I/O (bank 5) |
| Broche 51 | VCCIO5 — I/O bank 5 supply |
| Broche 52 | IO — User I/O (bank 5) |
| Broche 53 | IO — User I/O (bank 5) |
| Broche 54 | IO — User I/O (bank 5) |
| Broche 55 | GND — Ground |
| Broche 56 | IO — User I/O (bank 6) |
| Broche 57 | IO — User I/O (bank 6) |
| Broche 58 | IO — User I/O (bank 6) |
| Broche 59 | IO — User I/O (bank 6) |
| Broche 60 | IO — User I/O (bank 6) |
| Broche 61 | IO — User I/O (bank 6) |
| Broche 62 | VCCIO6 — I/O bank 6 supply |
| Broche 63 | IO — User I/O (bank 6) |
| Broche 64 | IO — User I/O (bank 6) |
| Broche 65 | IO — User I/O (bank 6) |
| Broche 66 | GND — Ground |
| Broche 67 | IO — User I/O (bank 7) |
| Broche 68 | IO — User I/O (bank 7) |
| Broche 69 | IO — User I/O (bank 7) |
| Broche 70 | IO — User I/O (bank 7) |
| Broche 71 | IO — User I/O (bank 7) |
| Broche 72 | IO — User I/O (bank 7) |
| Broche 73 | VCCIO7 — I/O bank 7 supply |
| Broche 74 | IO — User I/O (bank 7) |
| Broche 75 | IO — User I/O (bank 7) |
| Broche 76 | IO — User I/O (bank 7) |
| Broche 77 | GND — Ground |
| Broche 78 | IO — User I/O (bank 8) |
| Broche 79 | IO — User I/O (bank 8) |
| Broche 80 | IO — User I/O (bank 8) |
| Broche 81 | IO — User I/O (bank 8) |
| Broche 82 | IO — User I/O (bank 8) |
| Broche 83 | IO — User I/O (bank 8) |
| Broche 84 | VCCIO8 — I/O bank 8 supply |
| Broche 85 | IO — User I/O (bank 8) |
| Broche 86 | IO — User I/O (bank 8) |
| Broche 87 | IO — User I/O (bank 8) |
| Broche 88 | GND — Ground |
| Broche 89 | TMS — JTAG test mode select |
| Broche 90 | TCK — JTAG test clock |
| Broche 91 | TDO — JTAG test data out |
| Broche 92 | TDI — JTAG test data in |
| Broche 93 | nCONFIG — Configuration active-low reset |
| Broche 94 | nSTATUS — Configuration status |
| Broche 95 | CONF_DONE — Configuration done |
| Broche 96 | DCLK — Configuration clock |
| Broche 97 | DATA0 — Configuration data |
| Broche 98 | VCC — Core supply (single-supply variant) |
| Broche 99 | VCC — Core supply (single-supply variant) |
| Broche 100 | GND — Ground |
| Broche 101 | GND — Ground |
| Broche 102 | IO — User I/O |
| Broche 103 | IO — User I/O |
| Broche 104 | IO — User I/O |
| Broche 105 | IO — User I/O |
| Broche 106 | IO — User I/O |
| Broche 107 | IO — User I/O |
| Broche 108 | VCCIO — I/O supply |
| Broche 109 | IO — User I/O |
| Broche 110 | IO — User I/O |
| Broche 111 | IO — User I/O |
| Broche 112 | GND — Ground |
| Broche 113 | IO — User I/O |
| Broche 114 | IO — User I/O |
| Broche 115 | IO — User I/O |
| Broche 116 | IO — User I/O |
| Broche 117 | IO — User I/O |
| Broche 118 | IO — User I/O |
| Broche 119 | VCCIO — I/O supply |
| Broche 120 | IO — User I/O |
| Broche 121 | IO — User I/O |
| Broche 122 | IO — User I/O |
| Broche 123 | GND — Ground |
| Broche 124 | IO — User I/O |
| Broche 125 | IO — User I/O |
| Broche 126 | IO — User I/O |
| Broche 127 | IO — User I/O |
| Broche 128 | IO — User I/O |
| Broche 129 | IO — User I/O |
| Broche 130 | VCCIO — I/O supply |
| Broche 131 | IO — User I/O |
| Broche 132 | IO — User I/O |
| Broche 133 | IO — User I/O |
| Broche 134 | GND — Ground |
| Broche 135 | IO — User I/O |
| Broche 136 | IO — User I/O |
| Broche 137 | IO — User I/O |
| Broche 138 | IO — User I/O |
| Broche 139 | IO — User I/O |
| Broche 140 | IO — User I/O |
| Broche 141 | VCCIO — I/O supply |
| Broche 142 | IO — User I/O |
| Broche 143 | IO — User I/O |
| Broche 144 | GND — Ground (and EPAD thermal pad) |
Applications typiques
10M16SCE144A7G convient pour 6 applications: Industrial I/O Expansion and Glue Logic, Automotive Body and Chassis Electronics, Motor Control and Inverter Front-Ends, Video Bridging and Display Formatting, System Management and Sequencing, Low-Volume Prototyping of ASIC Glue Logic.
Industrial I/O Expansion and Glue Logic
The 10M16SCE144A7G's 16K LE and 1000 LABs make it a strong fit for industrial I/O expansion modules that aggregate sensors, push-buttons, and field-bus interfaces. With up to 101 user I/O on the EQFP-144 footprint, designers can fan out SPI, I2C, UART, and GPIO buses from a host MCU without paying for a larger FPGA. The on-die configuration flash boots the device instantly at power-up, eliminating the external PROM cost and board area that an SRAM-based FPGA would require. Compared with a discrete CPLD approach, the MAX 10's embedded 18x18 multipliers (45 total) and 562 Kb block RAM also let designers add simple DSP (filtering, PWM generation) and buffering on the same chip. For industrial PLC backplanes and modular I/O cards, this combination of density, I/O count, and single-supply operation is the primary value proposition.
Recommandé
Automotive Body and Chassis Electronics
The -A7 automotive temperature grade (-40C to +125C) qualifies the 10M16SCE144A7G for under-hood and cabin body controllers in vehicles. Typical roles include body control modules (BCMs) that drive lighting, mirror, and seat-position actuators, plus chassis sub-systems such as seatbelt pretensioner logic and HVAC damper control. The 16K LE comfortably fits state-machine-based actuator control plus LIN/CAN bus bridging, while the embedded flash avoids the cold-boot latency of SRAM FPGAs - critical when an ECU must respond within milliseconds of ignition. Engineers targeting ASIL-rated functions should add a watchdog MCU, but for QM-grade body and chassis tasks the MAX 10 is widely deployed.
Recommandé
Motor Control and Inverter Front-Ends
Field-oriented control (FOC) loops for small BLDC and PMSM motors fit comfortably within the 10M16SCE144A7G's 45 embedded 18x18 multipliers and 1000 LABs. Designers implement the current-loop math (Clarke/Park transforms, inverse Park, SVPWM) on the FPGA fabric while a companion MCU handles the slower speed/torque loop and the user interface. The MAX 10's exposed thermal pad (EQFP-144) aids heat extraction when the device runs at high toggle rates near full utilization. Single-supply operation simplifies the power tree - only 3.3 V is needed - which is helpful in space-constrained motor-drive PCBs that already host high-voltage stages. The 450 MHz internal clock is more than sufficient for the kHz-range PWM update rates used in motor control.
Recommandé
Video Bridging and Display Formatting
The 10M16SCE144A7G's 562 Kb of embedded block RAM is enough to line-buffer small video frames, and its high I/O count supports LVDS / RGB / MIPI-style bridging at low resolutions. Designers use the MAX 10 to convert between display interfaces (e.g. RGB888 to LVDS, or MIPI-DSI to parallel RGB) inside industrial HMIs and aftermarket infotainment head units. The non-volatile boot means the bridge firmware is live within microseconds of power-up - a noticeable improvement over SRAM FPGAs that may take tens of milliseconds to configure. For resolutions above 720p, designers typically step up to a larger MAX 10 density or a Cyclone IV/V device, but for small LCDs and segment displays the 10M16 hits a sweet spot.
Recommandé
System Management and Sequencing
System-management tasks on larger boards - power rail sequencing, watchdog supervision, LED control, and slow-speed GPIO aggregation - map naturally onto the 10M16SCE144A7G. With 16K LE, the device has more than enough headroom for arbitrarily complex state machines and I2C/SPI slaves that monitor and control board health. The on-die flash lets the FPGA assert its output rails within microseconds of power-up, which is essential when sequencing supplies for an application processor. Designers often co-locate the MAX 10 with the main SoC to handle glue logic that does not fit comfortably into the SoC's pin-mux options, while keeping the BOM cost much lower than an ASIC.
Recommandé
Low-Volume Prototyping of ASIC Glue Logic
When a design originally targeted a small ASIC but volume does not justify NRE, the 10M16SCE144A7G offers a near-ASIC integration path. 16K LE accommodates complex proprietary bus interfaces, custom peripherals, and board-level state machines that would otherwise force a second supporting CPLD or ASIC. The EQFP-144 package is hand-solderable for prototypes and low-volume production, and the same Quartus Prime toolchain used for development can target higher-density MAX 10 devices if the design grows. For series production below roughly 50k units/year, this MAX 10 density is often more cost-effective than a masked ASIC.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 10M16SCE144A7G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 10M16SAE144C8G | 10M16SAE144C7G | 10M08SCE144A7G | 10M04SCE144A7G | 10M16SFE144C7G |
|---|---|---|---|---|---|---|
| Package | EQFP-144 (144-LQFP Exposed Pad) | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same | EQFP-144 - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 16,000 | 16,000 | 16,000 | 8,000 (-50%) | 4,000 (-75%) | 16,000 |
| Embedded Memory (Kb) | 562 | 562 | 562 | 378 (-33%) | 189 (-66%) | 562 |
| Speed Grade | -7 (A7) | -8 (C8, faster) | -7 (C7) | -7 (A7, same) | -7 (A7, same) | -7 (C7) |
| Temperature Grade | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C | Automotive (same) | Automotive (same) | Commercial 0C to +85C |
| Supply Variant | Single-supply (S) | Single-supply (S) | Single-supply (S) | Single-supply (S) | Single-supply (S) | Dual-supply (D, requires separate core rail) |
| Maximum User I/O | 101 | 101 | 101 | 101 (same pinout) | 101 (same pinout) | 101 |
| Approx Unit Price (qty 1) | $38.50 | $40-45 | $35-40 | $20-25 | $12-18 | $35-42 |
Principaux différenciateurs
- On-die non-volatile configuration flash (vs 10M16SCE144A7G vs SRAM-based FPGAs (Cyclone IV E))
- Single-supply operation (vs 10M16SCE144A7G (single-supply) vs 10M16DCE144 (dual-supply))
- Automotive temperature grade at the slowest speed grade (vs 10M16SCE144A7G vs 10M16SAE144C8G)
Notes de conception
The single-supply 'S' variant of the 10M16SCE144A7G requires only one 3.0/3.3 V rail for both core and I/O. Decouple each VCCIO bank pin with a 100 nF ceramic cap placed within 5 mm of the pin, and add a bulk 10 uF tantalum or polymer cap per bank. Tie all GND pins to a solid ground plane; the exposed thermal pad (EPAD) must be soldered to a thermal via array for heat extraction at high toggle rates.
Estimated: at full logic utilization (~80%) with all I/O toggling at 100 MHz in still air, the EQFP-144 package dissipates approximately 0.5-1.0 W. Solder the EPAD to a 4x4 via array (0.3 mm drill, 0.5 mm pitch) tied to the inner ground plane. Without EPAD soldering, junction temperature can rise above the 125 C automotive limit during continuous operation.
Route JTAG (TMS/TCK/TDO/TDI) as a daisy-chain with 10 kohm pull-ups on TMS and TDI. Use 4-layer PCB stack-up with continuous ground beneath the device for signal integrity and SSN reduction. The 0.5 mm LQFP pitch requires 0.2 mm traces and 0.2 mm spaces; escape routing on inner layers with microvias is acceptable but not required at 100 MHz toggle rates.
Do not assume the 10M16SCE144A7G (single-supply) can be replaced pin-for-pin by a 10M16DF prefix (dual-supply) variant. The dual-supply variants require a separate VCCINT and VCCIO rail; if the board only routes 3.3 V, the dual-supply part will not power the core. Always verify the 'S' vs 'D' supply prefix in the OPN before placing the order.
Informations de conformité
RoHS compliant per datasheet.com listing ('ROHS COMPLIANT, PLASTIC, EQFP-144'). The -A7 suffix denotes the automotive temperature grade per Intel/Altera MAX 10 ordering code conventions, but AEC-Q100 qualification status is not separately listed in the provided data and should be confirmed with Intel FAE for safety-critical automotive deployments.
