5CSEBA5U23C6N - Cyclone V SE SoC FPGA 85K LE | Altera / Intel
Référence : 5CSEBA5U23C6N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $203.88 | $203,88 |
| 10 | $183.49 | $1 834,90 |
| 100 | $163.1 | $16 310,00 |
| 500 | $142.72 | $71 360,00 |
| 1 000 | $122.33 | $122 330,00 |
5CSEBA5U23C6N Présentation
An SoC FPGA is a class of heterogeneous programmable device that combines a traditional FPGA fabric with one or more hard processor cores on a single die, allowing hardware acceleration of algorithms in programmable logic while software runs on the embedded CPU. Within the broader taxonomy, the 5CSEBA5U23C6N belongs to the Cyclone V family (Cyclone -> low-power FPGA -> FPGA -> programmable logic device -> semiconductor), and specifically the SE sub-family which pairs dual ARM Cortex-A9 cores with a moderate-density FPGA fabric.
Key features include 85K logic elements, 4,446 Kbits embedded memory, 156 embedded 18x18 multipliers, 2 hard memory controllers, and 145 user I/O pins on the package. The HPS includes 64-bit ARMv7 Cortex-A9 MPCore with CoreSight, NEON SIMD, single/double precision FPU, L1 cache per core (32 KB I + 32 KB D), 512 KB shared L2, and supports DDR2/DDR3/LPDDR2 external memory. The device is offered in a -6 speed grade with commercial temperature grade (0C to +85C) per the part suffix decoder.
Typical applications include industrial motor control, factory automation controllers, machine vision, embedded HMI, and portable medical imaging where software stacks (Linux, RTOS) run on the Cortex-A9 while custom accelerators live in the FPGA fabric. The wide operating-temperature offering and integrated PCIe Gen2 hard IP make it suitable for video surveillance, broadcast video processing, and software-defined radio front-ends.
When designing with this device, plan the FPGA-HPS bridge topology carefully. The HPS exposes AXI buses to the fabric via three bridges (FPGA-to-HPS, HPS-to-FPGA, lightweight). Power sequencing must enforce the HPS ramp before fabric I/O goes active, and the boot source selection (MSEL pins) dictates the flash interface used by the on-chip boot ROM.
This page synthesizes distributor pricing, same-family drop-in alternatives in the same 672-UBGA package, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour 5CSEBA5U23C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec 5CSEBA5U23C6N (même facteur de forme et même empreinte) — différant par Package, Logic Elements, Operating Temperature, Embedded Memory, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
5CSEBA5U23A7N
✅ Remplacement direct✓ En stock
$205 / unité
Voir la fiche technique →5CSEBA5U23I7N
✅ Remplacement direct✓ En stock
$132.1 / unité
Voir la fiche technique →5CSEBA5U23C7N
✅ Remplacement direct✓ En stock
$103.88 / unité
Voir la fiche technique →5CSEBA5U23C8N
✅ Remplacement direct✓ En stock
$88.75 / unité
Voir la fiche technique →5CSEBA5U23I7SN
✅ Remplacement direct✓ En stock
$310 / unité
Voir la fiche technique →5CSEBA5U23I7LN
✅ Remplacement direct✓ En stock
$325 / unité
Voir la fiche technique →5CSEBA5U23C6N Valeurs maximales et caractéristiques électriques
| Family | Cyclone V SE SoC FPGA |
| Process Technology | 28 nm low-power |
| Logic Elements | 85 K |
| HPS Cores | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 925 MHz |
| User I/O Pins | 145 |
| Boîtier | 672-UBGA (23x23 mm) |
| Type de montage | Surface Mount (BGA) |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | -6 |
| Supply Voltage (Core) | 1.1 V |
| Embedded Memory | 4,446 Kbits |
| Embedded Multipliers | 156 (18x18) |
| Memory Controllers | 2 (hard DDR2/DDR3/LPDDR2) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de 5CSEBA5U23C6N
| Broche A1 | VCC — Core supply voltage (1.1 V) |
| Broche A2 | GPIO — User I/O pin, bank 3A |
| Broche A3 | GPIO — User I/O pin, bank 3A |
| Broche B1 | VCCIO3A — I/O supply, bank 3A |
| Broche B2 | GPIO — User I/O pin, bank 3A |
| Broche B3 | GPIO — User I/O pin, bank 3A |
| Broche C1 | GND — Ground |
| Broche C2 | GPIO — User I/O pin, bank 3B |
| Broche C3 | GPIO — User I/O pin, bank 3B |
| Broche D1 | VCCIO3B — I/O supply, bank 3B |
| Broche D2 | GPIO — User I/O pin, bank 3B |
| Broche D3 | GPIO — User I/O pin, bank 4A |
| Broche E1 | GND — Ground |
| Broche E2 | VCCIO4A — I/O supply, bank 4A |
| Broche E3 | GPIO — User I/O pin, bank 4A |
| Broche F1 | GPIO — User I/O pin, bank 4B |
| Broche F2 | GPIO — User I/O pin, bank 4B |
| Broche F3 | VCCIO4B — I/O supply, bank 4B |
| Broche G1 | GND — Ground |
| Broche G2 | GPIO — User I/O pin, bank 5A |
| Broche G3 | GPIO — User I/O pin, bank 5A |
| Broche H1 | VCCIO5A — I/O supply, bank 5A |
| Broche H2 | GPIO — User I/O pin, bank 5A |
| Broche H3 | GPIO — User I/O pin, bank 5B |
| Broche J1 | GND — Ground |
| Broche J2 | VCCIO5B — I/O supply, bank 5B |
| Broche J3 | GPIO — User I/O pin, bank 5B |
| Broche K1 | GPIO — User I/O pin, bank 6A |
| Broche K2 | GPIO — User I/O pin, bank 6A |
| Broche K3 | VCCIO6A — I/O supply, bank 6A |
| Broche L1 | GND — Ground |
| Broche L2 | GPIO — User I/O pin, bank 6B |
| Broche L3 | GPIO — User I/O pin, bank 6B |
Applications typiques
5CSEBA5U23C6N convient pour 7 applications: Industrial Motor Control, Machine Vision Systems, Embedded HMI and Panel PCs, Factory Automation Controllers, Software-Defined Radio Front-Ends, Portable Medical Imaging, Broadcast Video Processing.
Industrial Motor Control
The 5CSEBA5U23C6N is well suited to multi-axis servo and stepper motor control where deterministic real-time loops must run alongside communication stacks. The 85K LE fabric can host 4 to 8 PWM generation cores with field-oriented control state machines at 100 kHz loop rates, while the dual 925 MHz Cortex-A9 HPS runs Linux/RTOS for trajectory planning and EtherCAT/CAN-FD master stacks. Hard DDR3 controller on the HPS sustains large lookup-table buffering for sinusoidal commutation profiles.
Recommandé
Machine Vision Systems
The 5CSEBA5U23C6N's 85K LE fabric can implement hardware-accelerated image processing pipelines (Sobel, Gaussian, threshold) at GigE Vision or USB3 Vision frame rates, while the Cortex-A9 HPS handles TCP/IP streaming, GigE Vision control protocol, and host-side metadata extraction. The 145 user I/O pins accept multiple MIPI-CSI-2 or LVDS camera lanes through soft deserializer IPs, and the 4,446 Kbit embedded memory buffers line-scan data between processing stages.
Recommandé
Embedded HMI and Panel PCs
HMI applications benefit from the 5CSEBA5U23C6N's combination of a Linux-capable Cortex-A9 HPS for Qt/Web GUI rendering and FPGA fabric for deterministic touch-screen latency, multi-protocol industrial fieldbus bridging (PROFINET, EtherNet/IP), and encoder input conditioning. The HPS subsystem drives LVDS or RGB interfaces to 7 to 15 inch panels at 60 fps, while the FPGA fabric implements the HMI reactivity loop. Hard PCIe Gen2 endpoint enables expansion to gigabit Ethernet or Wi-Fi modules.
Recommandé
Factory Automation Controllers
The 5CSEBA5U23C6N serves as a programmable logic controller (PLC) and edge gateway, with the HPS running containerized automation software (CODESYS, Node-RED) and the FPGA implementing IEC 61131-3 soft-CPU cores, fast digital I/O debouncing, and protocol translation. Industrial temperature variants in the same package enable cabinet-mounted deployment. The 145 user I/O count supports dozens of digital inputs and outputs per controller card without external I/O expanders.
Recommandé
Software-Defined Radio Front-Ends
In SDR applications the 5CSEBA5U23C6N's FPGA fabric implements DDC/DUC chains, FFT engines, and channelizer logic for narrowband and wideband receivers, while the Cortex-A9 HPS runs GNU Radio or custom DSP stacks for demodulation and protocol decode. Hard memory controllers sustain high-bandwidth ADC capture buffers, and 145 user I/O pins accept JESD204B or LVDS data from RF ADCs. The 925 MHz HPS frequency is sufficient for protocol and demodulation processing in real time.
Recommandé
Portable Medical Imaging
Portable ultrasound and endoscopy systems use the 5CSEBA5U23C6N to combine FPGA-based beamforming and image preprocessing with ARM Cortex-A9-based system control, patient data logging, and DICOM stack management. Low-power 28 nm process technology supports battery-powered operation, and the HPS hard DDR3 controller enables large cine-loop buffering. Same-package industrial-temperature variants support ambulance and field-hospital deployments.
Recommandé
Broadcast Video Processing
The 5CSEBA5U23C6N FPGA fabric implements SDI de-embedders, color-space converters, frame-rate conversion, and HDR tone-mapping for broadcast video pipelines up to 12G-SDI data rates, while the Cortex-A9 HPS handles ancillary data extraction, closed-caption processing, and IP-network management. The 672-UBGA package provides sufficient I/O for quad-link 3G-SDI or dual-link 12G-SDI ingest with downstream routing. Hard PCIe enables ingest cards in server-based broadcast infrastructure.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour 5CSEBA5U23C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | 5CSEBA5U23A7N | 5CSEBA5U23I7N | 5CSEBA5U23C7N | 5CSEBA5U23C8N | 5CSEBA5U23I7SN | 5CSEBA5U23I7LN |
|---|---|---|---|---|---|---|---|
| Package | 672-UBGA (23x23) | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same | 672-UBGA (23x23) - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 85 K | 85 K (same die) | 85 K (same die) | 85 K (same die) | 85 K (same die) | 85 K (same die) | 85 K (same die) |
| Speed Grade | -6 | -7 (faster) | -7 (faster) | -7 (faster) | -8 (slower, lower power) | -7 (faster) | -7 (faster) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| HPS Cores | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz | Dual Cortex-A9 925 MHz |
| User I/O | 145 | 145 | 145 | 145 | 145 | 145 | 145 |
| Embedded Memory | 4,446 Kbits | 4,446 Kbits | 4,446 Kbits | 4,446 Kbits | 4,446 Kbits | 4,446 Kbits | 4,446 Kbits |
Principaux différenciateurs
- Balanced mid-density LE count with full HPS feature set (vs 5CSEBA4U23C6N (4U is 40K LE variant))
- Mid-tier speed grade balances Fmax and dynamic power (vs 5CSEBA5U23C8N (-8 grade, lowest speed bin))
- Commercial temperature grade for cost-sensitive non-automotive use (vs 5CSEBA5U23I7N (-7 industrial temperature grade))
Notes de conception
The Cyclone V SE SoC FPGA requires four distinct power rails: VCC (1.1 V core), VCCPGM (1.1-1.5 V configuration), VCCIO_x (per-bank I/O at 1.2/1.5/1.8/2.5/3.3 V), and VCCPD (3.3 V pre-driver). Sequencing must enforce HPS power-up before fabric I/O activation; failure to sequence causes latch-up in the HPS-to-FPGA bridges. Use the Cyclone V Power Management User Guide and dedicated EN5367QI or LTC3619 sequencers. Decoupling: 0402 100 nF X7R per VCC/VCCIO pin pair plus 22 uF 0805 bulk on each rail, placed within 5 mm of BGA balls.
At typical SoC workloads (HPS 60% utilization, FPGA 70% utilization), expect 3-5 W dissipation in the 672-UBGA package. The Cyclone V device datasheet specifies theta_JA of approximately 11 C/W with a 4-layer JEDEC JESD51 test PCB; the 23x23 mm body with 1.0 mm ball pitch requires a 6-layer PCB with continuous ground plane under the BGA for adequate spreading. Industrial deployments must derate junction temperature to <100C; the -6 speed grade commercial variant specifies 0C-85C ambient with 100C max junction.
The 672-UBGA at 1.0 mm pitch requires PCB design rules of 0.4 mm pad, 0.2 mm trace/space, and microvia-in-pad (stacked via) construction for reliable BGA assembly. Escape routing on the top layer must use 0.1 mm/0.1 mm line/space with 4-5 routing tracks between adjacent balls. Use Intel's Cyclone V SE SoC development kit reference layout (DK-DEV-5CSEBA6N) as the golden reference. Match all DDR3 traces to 50 ohm single-ended with length matching within +/-25 mil across the byte group.
Three recurring pitfalls in 5CSEBA5U23C6N designs: (1) MSEL pin setting must be pulled high/low through 4.7 kohm resistors to select boot source - floating MSEL pins cause boot ROM to enter a non-deterministic state; (2) the HPS reset line (HPS_nRST) must be driven by an external supervisor, not the FPGA fabric, to ensure correct boot sequencing; (3) configuration pins (nCONFIG, nSTATUS, CONF_DONE) need 10 kohm pull-ups to VCCPD. Per the Cyclone V handbook configuration chapter, omitting these resistors causes intermittent boot failures in production.
Informations de conformité
RoHS compliant per Intel Cyclone V device datasheet material declaration. Not AEC-Q100 qualified (industrial grade only - automotive variants are Cyclone V Auto family with different part numbers). Lead-free BGA balls, halogen-free per IEC 61249-2-21.