A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
Référence : A3PE3000-2FG484 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $210 | $210,00 |
| 10 | $195 | $1 950,00 |
| 100 | $178 | $17 800,00 |
| 500 | $165 | $82 500,00 |
| 1 000 | $152 | $152 000,00 |
A3PE3000-2FG484 Présentation
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than the SRAM-based configuration used by Xilinx and Altera devices. Within the programmable logic hierarchy, this makes the ProASIC3E a single-chip, instant-on solution: no external boot flash is required, the device is live at power-up, and no configuration bitstream is exposed, which inherently improves system security and simplifies board design.
Key features include the ProASIC3E fabric's VersaTile architecture, where each tile can be configured as a 3-input LUT, a D-flip-flop, or memory, giving extremely flexible logic placement. The -2 speed grade supports system performance up to approximately 310 MHz, and the embedded 516 Kbit SRAM supports dual-port operation for FIFOs and buffering. Optional soft ARM support (via Cortex-M1 soft core licensing) allows a complete system-on-chip integration on one die.
Technical depth: the 130nm flash CMOS process yields low static power compared to SRAM FPGAs, and non-volatile configuration eliminates configuration-time sequencing failures. The FG484 package (0.8mm... ball-pitch PBGA, square) is footprint-compatible with FG256 per the datasheet, easing migration paths.
Typical applications include industrial automation controllers, medical instrumentation, communications line cards, and military/aerospace single-chip designs where instant-on and high security matter.
Design consideration: the commercial-grade (no I suffix) device is rated 0C to +85C; for -40C to +100C use the A3PE3000-2FG484I industrial variant, which shares the same package footprint.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour A3PE3000-2FG484 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec A3PE3000-2FG484 (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Family, Process Technology, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
A3PE3000-2FGG484I
✅ Remplacement direct✓ En stock
$89.4 / unité
Voir la fiche technique →A3PE3000-2FG484I
✅ Remplacement direct✓ En stock
$59.6 / unité
Voir la fiche technique →A3PE3000-FGG484
✅ Remplacement direct✓ En stock
$152.6 / unité
Voir la fiche technique →A3PE3000-FG484
✅ Remplacement direct✓ En stock
$139.75 / unité
Voir la fiche technique →A3PE3000L-FG484
✅ Remplacement direct✓ En stock
$112 / unité
Voir la fiche technique →A3PE3000L-FGG484
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →A3PE3000-2FG484 Valeurs maximales et caractéristiques électriques
| Family | ProASIC3E Flash FPGAs |
| System Gates | 3,000,000 |
| Logic Cells (DFF-equivalent) | 75,264 |
| VersaTiles | 75,264 |
| User I/O | 341 |
| Embedded SRAM | 516,096 bits |
| Core Voltage | 1.5 V |
| Technology | 130 nm CMOS flash process |
| Maximum System Performance | 310 MHz |
| Speed Grade | -2 |
| Configuration | Non-volatile Flash (single-chip, instant-on) |
| Soft ARM Support | Yes (optional Cortex-M1 soft core) |
| Boîtier | 484-ball FBGA (FG484) |
| Type de montage | Surface Mount |
| Operating Temperature (commercial) | 0C to +85C |
| Statut RoHS | Non-G suffix (standard package); G-suffix variants are RoHS-compliant |
| I/O Standards | Voltage-referenced I/O supported (VREF per minibank) |
Guide de configuration des broches du A3PE3000-2FG484 484-ball fbga (fg484)
Configuration des broches du A3PE3000-2FG484 (boîtier 484-ball fbga (fg484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour A3PE3000-2FG484.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
A3PE3000-2FG484 convient pour 6 applications: Industrial Automation and Control, Secure and Instant-On System Control, Medical Instrumentation, Communications Line Cards, Aerospace and Defense Single-Chip Designs, Test and Measurement Equipment.
Industrial Automation and Control
The A3PE3000-2FG484 fits industrial automation controllers because its 75,264 logic cells absorb multiple motor-control state machines, encoder interfaces, and fieldbus protocol logic on one chip, while 341 user I/Os directly drive sensors and actuators. Its flash fabric is live at power-up, so I/O lines are driven deterministically without the 100 ms-plus boot delay of SRAM FPGAs, which matters for safety interlocks. The 516,096-bit embedded SRAM implements FIFOs for PROFIBUS/Modbus frames. Placed on a 24V-isolated industrial board, it replaces glue logic and a separate microcontroller, cutting BOM cost; the -2 speed grade provides ample timing margin for 100 MHz-class PWM and communications clocks.
Recommandé
Secure and Instant-On System Control
For secure boot and system-management FPGA roles, the A3PE3000-2FG484 is a strong fit because the bitstream lives in on-chip flash cells that cannot be read back, unlike SRAM FPGAs whose configuration stream is exposed on the bus at every power cycle. The device is instant-on, allowing it to gate power rails and enforce sequencing before the host processor leaves reset. With 75,264 VersaTiles, engineers implement I2C/SPI masters, board-health monitors, and AES-based authentication blocks concurrently. The 484-ball FG484 package supplies enough I/O banks for multi-rail sequencing across a server blade. The trade-off versus an MCU supervisor is FPGA flexibility: logic can be reprogrammed in the field via JTAG.
Recommandé
Medical Instrumentation
The A3PE3000-2FG484 suits medical diagnostic equipment such as ultrasound front-ends and patient-monitoring bases because it is reprogrammable in the field for regulatory updates while remaining single-chip and instant-on. The 3M-gate fabric processes multi-channel ADC streams with decimation filters, and 516,096 bits of embedded dual-port SRAM buffers waveform segments without external memory. The 484-ball package exposes 341 I/Os, sufficient for 32-to-64-channel probe interfaces. Low static power of the 130nm flash process reduces thermal rise inside enclosed, fanless medical enclosures. For bedside devices requiring commercial 0C to +85C ranges, the FG484 grade is appropriate; hospital-grade sterilization hardware should consider the I-variant for extended margins.
Recommandé
Communications Line Cards
In networking line cards, the A3PE3000-2FG484 implements framing, scrambling, and packet-parsing logic between PHYs and back-end processing. The -2 speed grade supports system clocks up to roughly 310 MHz, adequate for 1G-class datapaths, while the 516,096-bit embedded SRAM builds skid buffers and descriptor FIFOs. Voltage-referenced I/O standards (one VREF pin assigned per minibank per the datasheet) support SSTL/HSTL-class interfaces to memory-mapped PHYs. Because configuration is non-volatile, the card initializes its fabric before the switch ASIC completes reset, removing bring-up race conditions. The 484-ball FBGA with 0.8mm-pitch-class balls suits the dense BGA fanout typical of telecom boards.
Recommandé
Aerospace and Defense Single-Chip Designs
Defense and aerospace subsystems adopt the A3PE3000-2FG484 because flash FPGAs resist configuration readback and survive radiation-sensitive boot scenarios better than SRAM fabrics, which must reload from external memory at every cycle. The 3M-gate capacity integrates bus interfaces (MIL-STD-style serial protocols, ARINC-like links), cryptographic accelerators, and payload sequencing in one instant-on die. The commercial FG484 serves lab and ground equipment; flight programs typically specify the industrial I-variant, A3PE3000-2FG484I, which is footprint-identical, allowing one PCB across environments. Footprint compatibility with FG256 per the datasheet also lets teams shrink form factors without redesigning the fabric, an important path for Size, Weight and Power-constrained platforms.
Recommandé
Test and Measurement Equipment
Bench instruments and automated test equipment benefit from the A3PE3000-2FG484's combination of reprogrammability and instant-on operation. Engineers use the 75,264 VersaTiles to build pattern generators, timing analyzers, and protocol exercisers, while 341 user I/Os probe many device-under-test pins in parallel. The 516,096-bit embedded SRAM captures logic traces on-chip, shortening trigger-to-capture latency versus external memory. Because the fabric is live within microseconds of power application, the instrument can begin supervising DUT power sequencing immediately. The 484-ball FBGA presents plentiful banks for mixed-voltage I/O, and field firmware updates via FlashPro keep instrument capability current across product generations.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour A3PE3000-2FG484 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | A3PE3000-2FGG484I | A3PE3000-FGG484 | A3PE3000-FG484 | A3PE3000L-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade | -2 | -2 | -1 | -1 | -1 |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Embedded SRAM (bits) | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS Package | No (non-G suffix) | Yes (G suffix) | Yes (G suffix) | No (non-G suffix) | No (non-G suffix) |
| Power Characteristic | Standard ProASIC3E power | Standard (same die) | Standard | Standard | Low-power ProASIC3L (lower static/dynamic) |
Principaux différenciateurs
- Fastest speed grade in the FG484 family line-up (vs A3PE3000-FG484)
- Commercial temperature at lower cost (vs A3PE3000-2FGG484I)
- Higher timing performance than low-power variant (vs A3PE3000L-FG484)
Notes de conception
The A3PE3000-2FG484 requires a 1.5V core supply plus 2.5V/3.3V I/O bank supplies depending on the I/O standards used. Estimated: with tens of thousands of toggling tiles at 100 MHz-class activity, core current can reach several amps; size the 1.5V rail with headroom and verify with Libero SmartPower estimates before locking the regulator. Decouple each supply pin pair with 0.1uF ceramics plus bulk 10uF+ capacitance per bank, following the ProASIC3E datasheet power-supply recommendations.
The 484-ball FBGA requires via-in-pad or dogbone fanout with 0.8mm-pitch-class escape routing; plan at least two signal layers plus dedicated planes for 1.5V and ground. Assign one VREF pin per voltage-referenced I/O minibank as required by the datasheet, and route VREF traces quietly with local decoupling. Note the FG256/FG484 footprint compatibility documented by Microsemi: reserving the FG256 ball subset simplifies future package migration without PCB respin.
Order the correct suffix: the non-G FG484 is not the RoHS part - use G-suffix variants (e.g., A3PE3000-2FGG484I) for EU-compliant builds, and the I suffix for -40C to +100C environments. Timing closure differences between -1 and -2 grades are real: designs ported to A3PE3000-FG484 (-1) must be re-verified in Libero SoC. Finally, since configuration is flash-based, program-and-verify via FlashPro on every production unit; JTAG access should be protected for security-sensitive products.
Informations de conformité
Per ProASIC3E datasheet ordering-information notes, the G in the part number indicates RoHS-compliant packages; A3PE3000-2FG484 lacks the G suffix, so the RoHS-compliant equivalent is A3PE3000-2FGG484I. REACH and conflict-minerals status not stated in provided data.