Microchip Technology

A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip

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1.5 V Vdss Voltage-referenced I/O supported (VREF per minibank) Rds(on) 484-ball FBGA (FG484) Package -2 Speed
From $152 USD / Unit
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Price updated: 2026-09-02
Volume Pricing
Qty Unit Price Extended
1 $210 $210.00
10 $195 $1,950.00
100 $178 $17,800.00
500 $165 $82,500.00
1,000 $152 $152,000.00
ℹ️ All prices are in USD

Drop-in alternatives for A3PE3000-2FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

A3PE3000-2FGG484I

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
75264 · 3000000 · 341 · ProASIC3E (Flash) · Nonvolatile on-chip Flash · -2 · 484-Ball FBGA · Surface Mount

✓ In Stock

$89.4 / Unit

View Datasheet →

A3PE3000-2FG484I

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
ProASIC3E · 3,000,000 · 75,264 · 516,096 · 341 · 310 MHz · 1.5 V · 130 nm

✓ In Stock

$59.6 / Unit

View Datasheet →

A3PE3000-FGG484

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
ProASIC3E · 3000000 gates · 75264 · 341 · 516096 · 231 MHz · 130 nm CMOS · 1.5 V

✓ In Stock

$152.6 / Unit

View Datasheet →

A3PE3000-FG484

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
ProASIC3E Flash FPGA · 3000000 · 75264 · 341 · 1.5 V · 231 MHz · 130 nm flash CMOS · On-chip flash (non-volatile, single-chip)

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$139.75 / Unit

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A3PE3000L-FG484

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
ProASIC3L (Low Power Flash FPGA) · 3000000 · 75264 · 341 · 250 MHz · 1.2 V to 1.5 V · 130 nm CMOS flash, nonvolatile · Flash-based, Instant On, single-chip

✓ In Stock

$112 / Unit

View Datasheet →

A3PE3000L-FGG484

✅ Drop-In
Microchip Technology
📦 484-ball FBGA (FG484)
ProASIC3L (Low Power Flash FPGA) · 3,000,000 · 75,264 · 341 · 516,096 bits · 1.2 V to 1.5 V · 130 nm flash · Nonvolatile flash, Instant On

✓ In Stock

Contact for price

View Datasheet →

A3PE3000-2FG484 Maximum Ratings & Electrical Characteristics

Family ProASIC3E Flash FPGAs
System Gates 3,000,000
Logic Cells (DFF-equivalent) 75,264
VersaTiles 75,264
User I/O 341
Embedded SRAM 516,096 bits
Core Voltage 1.5 V
Technology 130 nm CMOS flash process
Maximum System Performance 310 MHz
Speed Grade -2
Configuration Non-volatile Flash (single-chip, instant-on)
Soft ARM Support Yes (optional Cortex-M1 soft core)
Package 484-ball FBGA (FG484)
Mounting Type Surface Mount
Operating Temperature (commercial) 0C to +85C
RoHS Status Non-G suffix (standard package); G-suffix variants are RoHS-compliant
I/O Standards Voltage-referenced I/O supported (VREF per minibank)

A3PE3000-2FG484 484-ball fbga (fg484) Pin Configuration Guide

Complete pinout information for A3PE3000-2FG484 (484-ball fbga (fg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

484-ball fbga (fg484) package pinout diagram for A3PE3000-2FG484

No detailed pinout data available for A3PE3000-2FG484.

Refer to the datasheet for full pin configuration.

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for A3PE3000-2FG484 Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

A3PE3000-2FG484 is suitable for 6 applications: Industrial Automation and Control, Secure and Instant-On System Control, Medical Instrumentation, Communications Line Cards, Aerospace and Defense Single-Chip Designs, Test and Measurement Equipment.

🏭

Industrial Automation and Control

The A3PE3000-2FG484 fits industrial automation controllers because its 75,264 logic cells absorb multiple motor-control state machines, encoder interfaces, and fieldbus protocol logic on one chip, while 341 user I/Os directly drive sensors and actuators. Its flash fabric is live at power-up, so I/O lines are driven deterministically without the 100 ms-plus boot delay of SRAM FPGAs, which matters for safety interlocks. The 516,096-bit embedded SRAM implements FIFOs for PROFIBUS/Modbus frames. Placed on a 24V-isolated industrial board, it replaces glue logic and a separate microcontroller, cutting BOM cost; the -2 speed grade provides ample timing margin for 100 MHz-class PWM and communications clocks.

🖥️

Secure and Instant-On System Control

For secure boot and system-management FPGA roles, the A3PE3000-2FG484 is a strong fit because the bitstream lives in on-chip flash cells that cannot be read back, unlike SRAM FPGAs whose configuration stream is exposed on the bus at every power cycle. The device is instant-on, allowing it to gate power rails and enforce sequencing before the host processor leaves reset. With 75,264 VersaTiles, engineers implement I2C/SPI masters, board-health monitors, and AES-based authentication blocks concurrently. The 484-ball FG484 package supplies enough I/O banks for multi-rail sequencing across a server blade. The trade-off versus an MCU supervisor is FPGA flexibility: logic can be reprogrammed in the field via JTAG.

💊

Medical Instrumentation

The A3PE3000-2FG484 suits medical diagnostic equipment such as ultrasound front-ends and patient-monitoring bases because it is reprogrammable in the field for regulatory updates while remaining single-chip and instant-on. The 3M-gate fabric processes multi-channel ADC streams with decimation filters, and 516,096 bits of embedded dual-port SRAM buffers waveform segments without external memory. The 484-ball package exposes 341 I/Os, sufficient for 32-to-64-channel probe interfaces. Low static power of the 130nm flash process reduces thermal rise inside enclosed, fanless medical enclosures. For bedside devices requiring commercial 0C to +85C ranges, the FG484 grade is appropriate; hospital-grade sterilization hardware should consider the I-variant for extended margins.

🌐

Communications Line Cards

In networking line cards, the A3PE3000-2FG484 implements framing, scrambling, and packet-parsing logic between PHYs and back-end processing. The -2 speed grade supports system clocks up to roughly 310 MHz, adequate for 1G-class datapaths, while the 516,096-bit embedded SRAM builds skid buffers and descriptor FIFOs. Voltage-referenced I/O standards (one VREF pin assigned per minibank per the datasheet) support SSTL/HSTL-class interfaces to memory-mapped PHYs. Because configuration is non-volatile, the card initializes its fabric before the switch ASIC completes reset, removing bring-up race conditions. The 484-ball FBGA with 0.8mm-pitch-class balls suits the dense BGA fanout typical of telecom boards.

✈️

Aerospace and Defense Single-Chip Designs

Defense and aerospace subsystems adopt the A3PE3000-2FG484 because flash FPGAs resist configuration readback and survive radiation-sensitive boot scenarios better than SRAM fabrics, which must reload from external memory at every cycle. The 3M-gate capacity integrates bus interfaces (MIL-STD-style serial protocols, ARINC-like links), cryptographic accelerators, and payload sequencing in one instant-on die. The commercial FG484 serves lab and ground equipment; flight programs typically specify the industrial I-variant, A3PE3000-2FG484I, which is footprint-identical, allowing one PCB across environments. Footprint compatibility with FG256 per the datasheet also lets teams shrink form factors without redesigning the fabric, an important path for Size, Weight and Power-constrained platforms.

🔧

Test and Measurement Equipment

Bench instruments and automated test equipment benefit from the A3PE3000-2FG484's combination of reprogrammability and instant-on operation. Engineers use the 75,264 VersaTiles to build pattern generators, timing analyzers, and protocol exercisers, while 341 user I/Os probe many device-under-test pins in parallel. The 516,096-bit embedded SRAM captures logic traces on-chip, shortening trigger-to-capture latency versus external memory. Because the fabric is live within microseconds of power application, the instrument can begin supervising DUT power sequencing immediately. The 484-ball FBGA presents plentiful banks for mixed-voltage I/O, and field firmware updates via FlashPro keep instrument capability current across product generations.

What is the A3PE3000-2FG484?
The A3PE3000-2FG484 is a Microchip (formerly Microsemi/Actel) ProASIC3E flash-based FPGA with 3 million system gates, 75,264 logic cells, 341 user I/Os, and 516,096 bits of embedded SRAM in a 484-ball FBGA package. It runs from a 1.5V core on a 130nm flash process and configures instantly at power-up because the bitstream is stored in on-chip flash, per the manufacturer product page.
What are the key specifications of A3PE3000-2FG484 that engineers should know?
Key specifications: 3,000,000 system gates and 75,264 VersaTiles of logic capacity; 341 user I/O pins; 516,096 bits (516 Kbit) of embedded SRAM; -2 speed grade with system performance up to 310 MHz; 1.5V core voltage on a 130nm flash CMOS process; 484-ball FBGA (FG484) package; non-volatile flash configuration requiring no external boot device; optional ARM Cortex-M1 soft-core support. These figures come from the Microsemi ProASIC3E datasheet and Microchip product page.
What is the price of A3PE3000-2FG484?
XAIPART lists A3PE3000-2FG484 at approximately $210.00 for single units as of 2026-09-02, with quantity price breaks to roughly $152.00 at 1000 pieces. Distributor pricing across 7 sources aggregated by Octopart varies with stock and volume, so request a quote for firm current pricing on production quantities.
Where can I buy A3PE3000-2FG484 online?
The A3PE3000-2FG484 is available through XAIPART and through major distributors including DigiKey, Mouser, and Octopart-listed suppliers (7 distributors aggregate on Octopart). For the industrial-temperature A3PE3000-2FG484I variant, DigiKey and Mouser list stock that ships same-day. Compare bulk discounts across distributors before placing production orders.
What is the difference between A3PE3000-2FG484 and A3PE3000-2FG484I?
The only difference is the operating temperature grade. The commercial A3PE3000-2FG484 is rated 0C to +85C, while the industrial A3PE3000-2FG484I is rated -40C to +100C. Both share the identical 484-ball FBGA package, pinout, 3M-gate fabric, and -2 speed grade, so the I variant is a full drop-in upgrade for harsh-environment designs per the ProASIC3E datasheet ordering information.
A3PE3000-2FG484 vs A3PE3000L-FG484 - which is better?
Choose the A3PE3000L-FG484 when battery life or static power is the priority: the ProASIC3L variant offers lower static and dynamic power in the same 484-ball footprint. Choose the A3PE3000-2FG484 when maximum performance matters, since the -2 speed grade supports up to 310 MHz system performance. Both are flash-based, single-chip, instant-on devices with the same logic capacity, so migration requires only a speed/power trade-off decision.
What is the best drop-in replacement for A3PE3000-2FG484?
The best drop-in replacement is the A3PE3000-2FGG484I, which offers the identical 484-ball FBGA footprint, the same 3M-gate fabric and -2 speed grade, plus RoHS-compliant (G-suffix) packaging and industrial temperature range. Other same-footprint drop-ins include A3PE3000-FGG484, A3PE3000-FG484, and the low-power A3PE3000L-FG484 family members, all pin-to-pin compatible per the ProASIC3E footprint-compatibility table.
Can A3PE3000-FG484 replace A3PE3000-2FG484?
Yes, physically it is pin-to-pin compatible in the same 484-ball FBGA package, but the -1 speed grade of A3PE3000-FG484 delivers lower timing performance than the -2 grade of the target part. If your design closes timing with margin below 310 MHz-class paths, the FG484 works as a drop-in; verify timing closure in Libero SoC by re-running place-and-route for the -1 speed grade before committing.
Where can I download the A3PE3000-2FG484 datasheet PDF?
Download the ProASIC3E Flash Family FPGAs with Optional Soft ARM Support datasheet PDF from the Microchip product page at microchip.com/en-us/product/A3PE3000, or from datasheet aggregators such as datasheets.com and alldatasheet.com, which host the Microsemi-published document. The same document covers the A3PE3000-2FG484 and its I, G, and L-family variants. Always prefer the Microchip portal for the latest revision.
Where can I find the A3PE3000-2FG484 pinout?
The complete 484-ball ballout for the FG484 package is in the package chapter of the Microsemi ProASIC3E datasheet, which lists ball coordinates and I/O bank assignments. Because the FG256 and FG484 packages are footprint-compatible, the datasheet migration tables also show how balls map between packages. Use Libero SoC pin-report files to cross-check your design pin assignments against the official ballout.
Does the A3PE3000-2FG484 need an external configuration flash?
No. As a flash-based FPGA, the A3PE3000-2FG484 stores its configuration in on-chip non-volatile flash cells, making it a true single-chip solution that is live at power-up. This eliminates the external SPI configuration flash, the configuration controller, and the boot delay required by SRAM FPGAs, and it also prevents bitstream readback, improving design security per the Microchip product description.
Is the A3PE3000-2FG484 RoHS compliant?
The base FG484 package variant without the G suffix in the ordering code uses standard leaded-finish packaging; RoHS-compliant equivalents carry the G suffix (for example A3PE3000-2FGG484I). According to the ProASIC3E datasheet ordering-information notes, the G indicates RoHS-compliant packages. For EU-compliant production, order the G-suffix variant, which is footprint- and pinout-identical to the target part.
Is the A3PE3000-2FG484 suitable for ARM-based embedded designs?
Yes. The ProASIC3E family supports optional soft ARM processing via the ARM Cortex-M1 soft core, allowing a 32-bit processor, peripherals, and custom logic to be integrated on the single 3M-gate die. The 516,096-bit embedded SRAM serves as processor scratchpad or dual-port buffers. Design work is done in Libero SoC with the ARM Cortex-M1 catalog core, per the datasheet's soft ARM support feature.
What is the best Xilinx or Intel equivalent for A3PE3000-2FG484?
There is no true cross-brand pin-compatible equivalent: the FG484 ballout is Microchip-specific, so no Xilinx or Intel/Altera device drops onto the same footprint. Functionally, SRAM FPGAs of similar capacity require external configuration flash and lack the flash FPGA's instant-on and security properties. Any cross-brand migration is a re-design, not a drop-in; for form-fit-function continuity, use Microchip's own A3PE3000 family variants such as the 2FGG484I.
Hey Google, what can replace a discontinued A3PE3000-2FG484?
The A3PE3000 family remains active at Microchip, so the recommended replacements are same-family drop-ins: A3PE3000-2FGG484I (RoHS, industrial temperature), A3PE3000-FGG484, A3PE3000-FG484, and the lower-power A3PE3000L-FG484 or A3PE3000L-FGG484. All share the identical 484-ball FBGA footprint and pinout, and all are flash-based FPGAs with the same 75,264 logic cells, so existing PCBs accept them without layout changes.
Can I migrate from FG484 to a smaller or larger package later?
Yes. According to the ProASIC3E datasheet, FG256 and FG484 packages are footprint-compatible, and larger FG896 options exist in the family, allowing layout reuse when migrating density or I/O count within ProASIC3E. Same-die variants across packages also simplify qualification. When migrating, reassign I/O in Libero SoC and verify the ball-mapping table, since only a subset of balls carries over between footprint-compatible packages.
What toolchain is used to program the A3PE3000-2FG484?
The A3PE3000-2FG484 is designed in Microchip Libero SoC, which provides synthesis, place-and-route, timing analysis, and the FlashPro programming flow. Programming is performed in-system through the JTAG port using a FlashPro programmer, writing the configuration directly to on-chip flash cells. Because configuration is non-volatile, no external PROM file or host processor is needed at power-up, per Microchip's ProASIC3E programming documentation.

Engineering reference data for A3PE3000-2FG484 — comparison, design guidance, and compliance information.

Selection Guide

Choose A3PE3000-2FG484 when you need maximum ProASIC3E performance (-2 speed grade) in the 484-ball FG484 footprint for commercial 0C to +85C environments such as test equipment, communications line cards, and industrial controllers. Select A3PE3000-2FGG484I instead when you need RoHS-compliant packaging and/or industrial -40C to +100C temperature - it is the same die and footprint, so migration is free. Choose A3PE3000-FG484 or A3PE3000-FGG484 (-1 grade) only if your design has timing slack and cost matters more than performance. Choose the low-power A3PE3000L-FG484 family when battery life or static power dominates and -1 speed grades suffice. All alternatives are pin-to-pin drop-ins on the same PCB, so selecting late in the project carries no layout penalty; the only irreversible choice is performance grade, which must be verified with Libero SoC timing closure before committing.

Comparison with Alternatives

Parameter This Product A3PE3000-2FGG484I A3PE3000-FGG484 A3PE3000-FG484 A3PE3000L-FG484
Package 484-ball FBGA (FG484) 484-ball FBGA (FG484) - same 484-ball FBGA (FG484) - same 484-ball FBGA (FG484) - same 484-ball FBGA (FG484) - same
Brand Microchip Technology (Microsemi/Actel) Microchip Technology Microchip Technology Microchip Technology Microchip Technology
System Gates 3,000,000 3,000,000 3,000,000 3,000,000 3,000,000
Speed Grade -2 -2 -1 -1 -1
User I/O 341 341 341 341 341
Embedded SRAM (bits) 516,096 516,096 516,096 516,096 516,096
Operating Temperature 0C to +85C (commercial) -40C to +100C (industrial) 0C to +85C (commercial) 0C to +85C (commercial) 0C to +85C (commercial)
RoHS Package No (non-G suffix) Yes (G suffix) Yes (G suffix) No (non-G suffix) No (non-G suffix)
Power Characteristic Standard ProASIC3E power Standard (same die) Standard Standard Low-power ProASIC3L (lower static/dynamic)

Key Differentiators

  • Fastest speed grade in the FG484 family line-up (vs A3PE3000-FG484)
  • Commercial temperature at lower cost (vs A3PE3000-2FGG484I)
  • Higher timing performance than low-power variant (vs A3PE3000L-FG484)

Design Notes

The A3PE3000-2FG484 requires a 1.5V core supply plus 2.5V/3.3V I/O bank supplies depending on the I/O standards used. Estimated: with tens of thousands of toggling tiles at 100 MHz-class activity, core current can reach several amps; size the 1.5V rail with headroom and verify with Libero SmartPower estimates before locking the regulator. Decouple each supply pin pair with 0.1uF ceramics plus bulk 10uF+ capacitance per bank, following the ProASIC3E datasheet power-supply recommendations.

The 484-ball FBGA requires via-in-pad or dogbone fanout with 0.8mm-pitch-class escape routing; plan at least two signal layers plus dedicated planes for 1.5V and ground. Assign one VREF pin per voltage-referenced I/O minibank as required by the datasheet, and route VREF traces quietly with local decoupling. Note the FG256/FG484 footprint compatibility documented by Microsemi: reserving the FG256 ball subset simplifies future package migration without PCB respin.

Order the correct suffix: the non-G FG484 is not the RoHS part - use G-suffix variants (e.g., A3PE3000-2FGG484I) for EU-compliant builds, and the I suffix for -40C to +100C environments. Timing closure differences between -1 and -2 grades are real: designs ported to A3PE3000-FG484 (-1) must be re-verified in Libero SoC. Finally, since configuration is flash-based, program-and-verify via FlashPro on every production unit; JTAG access should be protected for security-sensitive products.

Compliance Information

RoHS
Non Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Per ProASIC3E datasheet ordering-information notes, the G in the part number indicates RoHS-compliant packages; A3PE3000-2FG484 lacks the G suffix, so the RoHS-compliant equivalent is A3PE3000-2FGG484I. REACH and conflict-minerals status not stated in provided data.

Data verified on: 2026-09-02 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology Microsemi Actel A3PE3000-2FG484 A3PE3000-2FGG484I A3PE3000-FGG484 A3PE3000L-FG484 ProASIC3E FPGA field-programmable gate array flash-based FPGA VersaTile ARM Cortex-M1 Libero SoC FlashPro 484-ball FBGA PBGA484 130nm CMOS RoHS 516,096-bit embedded SRAM instant-on configuration industrial automation aerospace and defense system gates speed grade -2
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