A3PE3000-2FG484 - 3M-Gate ProASIC3E Flash FPGA | Microchip
부품 번호: A3PE3000-2FG484 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $210 | $210.00 |
| 10 | $195 | $1,950.00 |
| 100 | $178 | $17,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $152 | $152,000.00 |
A3PE3000-2FG484 개요
A flash-based FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash cells rather than the SRAM-based configuration used by Xilinx and Altera devices. Within the programmable logic hierarchy, this makes the ProASIC3E a single-chip, instant-on solution: no external boot flash is required, the device is live at power-up, and no configuration bitstream is exposed, which inherently improves system security and simplifies board design.
Key features include the ProASIC3E fabric's VersaTile architecture, where each tile can be configured as a 3-input LUT, a D-flip-flop, or memory, giving extremely flexible logic placement. The -2 speed grade supports system performance up to approximately 310 MHz, and the embedded 516 Kbit SRAM supports dual-port operation for FIFOs and buffering. Optional soft ARM support (via Cortex-M1 soft core licensing) allows a complete system-on-chip integration on one die.
Technical depth: the 130nm flash CMOS process yields low static power compared to SRAM FPGAs, and non-volatile configuration eliminates configuration-time sequencing failures. The FG484 package (0.8mm... ball-pitch PBGA, square) is footprint-compatible with FG256 per the datasheet, easing migration paths.
Typical applications include industrial automation controllers, medical instrumentation, communications line cards, and military/aerospace single-chip designs where instant-on and high security matter.
Design consideration: the commercial-grade (no I suffix) device is rated 0C to +85C; for -40C to +100C use the A3PE3000-2FG484I industrial variant, which shares the same package footprint.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: A3PE3000-2FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-2FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Family, Process Technology, System Gates.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE3000-2FGG484I
✅ 드롭인✓ 재고 있음
$89.4 / 개
데이터시트 보기 →A3PE3000-2FG484I
✅ 드롭인✓ 재고 있음
$59.6 / 개
데이터시트 보기 →A3PE3000-FGG484
✅ 드롭인✓ 재고 있음
$152.6 / 개
데이터시트 보기 →A3PE3000-FG484
✅ 드롭인✓ 재고 있음
$139.75 / 개
데이터시트 보기 →A3PE3000L-FG484
✅ 드롭인✓ 재고 있음
$112 / 개
데이터시트 보기 →A3PE3000L-FGG484
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE3000-2FG484 최대 정격 & 전기적 특성
| Family | ProASIC3E Flash FPGAs |
| System Gates | 3,000,000 |
| Logic Cells (DFF-equivalent) | 75,264 |
| VersaTiles | 75,264 |
| User I/O | 341 |
| Embedded SRAM | 516,096 bits |
| Core Voltage | 1.5 V |
| Technology | 130 nm CMOS flash process |
| Maximum System Performance | 310 MHz |
| Speed Grade | -2 |
| Configuration | Non-volatile Flash (single-chip, instant-on) |
| Soft ARM Support | Yes (optional Cortex-M1 soft core) |
| 패키지 | 484-ball FBGA (FG484) |
| 실장 유형 | Surface Mount |
| Operating Temperature (commercial) | 0C to +85C |
| RoHS 상태 | Non-G suffix (standard package); G-suffix variants are RoHS-compliant |
| I/O Standards | Voltage-referenced I/O supported (VREF per minibank) |
A3PE3000-2FG484 484-ball fbga (fg484) 핀 구성 가이드
A3PE3000-2FG484(484-ball fbga (fg484) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-2FG484.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE3000-2FG484 적합 용도: 6 애플리케이션s: Industrial Automation and Control, Secure and Instant-On System Control, Medical Instrumentation, Communications Line Cards, Aerospace and Defense Single-Chip Designs, Test and Measurement Equipment.
Industrial Automation and Control
The A3PE3000-2FG484 fits industrial automation controllers because its 75,264 logic cells absorb multiple motor-control state machines, encoder interfaces, and fieldbus protocol logic on one chip, while 341 user I/Os directly drive sensors and actuators. Its flash fabric is live at power-up, so I/O lines are driven deterministically without the 100 ms-plus boot delay of SRAM FPGAs, which matters for safety interlocks. The 516,096-bit embedded SRAM implements FIFOs for PROFIBUS/Modbus frames. Placed on a 24V-isolated industrial board, it replaces glue logic and a separate microcontroller, cutting BOM cost; the -2 speed grade provides ample timing margin for 100 MHz-class PWM and communications clocks.
추천
Secure and Instant-On System Control
For secure boot and system-management FPGA roles, the A3PE3000-2FG484 is a strong fit because the bitstream lives in on-chip flash cells that cannot be read back, unlike SRAM FPGAs whose configuration stream is exposed on the bus at every power cycle. The device is instant-on, allowing it to gate power rails and enforce sequencing before the host processor leaves reset. With 75,264 VersaTiles, engineers implement I2C/SPI masters, board-health monitors, and AES-based authentication blocks concurrently. The 484-ball FG484 package supplies enough I/O banks for multi-rail sequencing across a server blade. The trade-off versus an MCU supervisor is FPGA flexibility: logic can be reprogrammed in the field via JTAG.
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Medical Instrumentation
The A3PE3000-2FG484 suits medical diagnostic equipment such as ultrasound front-ends and patient-monitoring bases because it is reprogrammable in the field for regulatory updates while remaining single-chip and instant-on. The 3M-gate fabric processes multi-channel ADC streams with decimation filters, and 516,096 bits of embedded dual-port SRAM buffers waveform segments without external memory. The 484-ball package exposes 341 I/Os, sufficient for 32-to-64-channel probe interfaces. Low static power of the 130nm flash process reduces thermal rise inside enclosed, fanless medical enclosures. For bedside devices requiring commercial 0C to +85C ranges, the FG484 grade is appropriate; hospital-grade sterilization hardware should consider the I-variant for extended margins.
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Communications Line Cards
In networking line cards, the A3PE3000-2FG484 implements framing, scrambling, and packet-parsing logic between PHYs and back-end processing. The -2 speed grade supports system clocks up to roughly 310 MHz, adequate for 1G-class datapaths, while the 516,096-bit embedded SRAM builds skid buffers and descriptor FIFOs. Voltage-referenced I/O standards (one VREF pin assigned per minibank per the datasheet) support SSTL/HSTL-class interfaces to memory-mapped PHYs. Because configuration is non-volatile, the card initializes its fabric before the switch ASIC completes reset, removing bring-up race conditions. The 484-ball FBGA with 0.8mm-pitch-class balls suits the dense BGA fanout typical of telecom boards.
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Aerospace and Defense Single-Chip Designs
Defense and aerospace subsystems adopt the A3PE3000-2FG484 because flash FPGAs resist configuration readback and survive radiation-sensitive boot scenarios better than SRAM fabrics, which must reload from external memory at every cycle. The 3M-gate capacity integrates bus interfaces (MIL-STD-style serial protocols, ARINC-like links), cryptographic accelerators, and payload sequencing in one instant-on die. The commercial FG484 serves lab and ground equipment; flight programs typically specify the industrial I-variant, A3PE3000-2FG484I, which is footprint-identical, allowing one PCB across environments. Footprint compatibility with FG256 per the datasheet also lets teams shrink form factors without redesigning the fabric, an important path for Size, Weight and Power-constrained platforms.
추천
Test and Measurement Equipment
Bench instruments and automated test equipment benefit from the A3PE3000-2FG484's combination of reprogrammability and instant-on operation. Engineers use the 75,264 VersaTiles to build pattern generators, timing analyzers, and protocol exercisers, while 341 user I/Os probe many device-under-test pins in parallel. The 516,096-bit embedded SRAM captures logic traces on-chip, shortening trigger-to-capture latency versus external memory. Because the fabric is live within microseconds of power application, the instrument can begin supervising DUT power sequencing immediately. The 484-ball FBGA presents plentiful banks for mixed-voltage I/O, and field firmware updates via FlashPro keep instrument capability current across product generations.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE3000-2FG484 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE3000-2FGG484I | A3PE3000-FGG484 | A3PE3000-FG484 | A3PE3000L-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same |
| Brand | Microchip Technology (Microsemi/Actel) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Speed Grade | -2 | -2 | -1 | -1 | -1 |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Embedded SRAM (bits) | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS Package | No (non-G suffix) | Yes (G suffix) | Yes (G suffix) | No (non-G suffix) | No (non-G suffix) |
| Power Characteristic | Standard ProASIC3E power | Standard (same die) | Standard | Standard | Low-power ProASIC3L (lower static/dynamic) |
주요 차별점
- Fastest speed grade in the FG484 family line-up (vs A3PE3000-FG484)
- Commercial temperature at lower cost (vs A3PE3000-2FGG484I)
- Higher timing performance than low-power variant (vs A3PE3000L-FG484)
설계 노트
The A3PE3000-2FG484 requires a 1.5V core supply plus 2.5V/3.3V I/O bank supplies depending on the I/O standards used. Estimated: with tens of thousands of toggling tiles at 100 MHz-class activity, core current can reach several amps; size the 1.5V rail with headroom and verify with Libero SmartPower estimates before locking the regulator. Decouple each supply pin pair with 0.1uF ceramics plus bulk 10uF+ capacitance per bank, following the ProASIC3E datasheet power-supply recommendations.
The 484-ball FBGA requires via-in-pad or dogbone fanout with 0.8mm-pitch-class escape routing; plan at least two signal layers plus dedicated planes for 1.5V and ground. Assign one VREF pin per voltage-referenced I/O minibank as required by the datasheet, and route VREF traces quietly with local decoupling. Note the FG256/FG484 footprint compatibility documented by Microsemi: reserving the FG256 ball subset simplifies future package migration without PCB respin.
Order the correct suffix: the non-G FG484 is not the RoHS part - use G-suffix variants (e.g., A3PE3000-2FGG484I) for EU-compliant builds, and the I suffix for -40C to +100C environments. Timing closure differences between -1 and -2 grades are real: designs ported to A3PE3000-FG484 (-1) must be re-verified in Libero SoC. Finally, since configuration is flash-based, program-and-verify via FlashPro on every production unit; JTAG access should be protected for security-sensitive products.
규정 준수 정보
Per ProASIC3E datasheet ordering-information notes, the G in the part number indicates RoHS-compliant packages; A3PE3000-2FG484 lacks the G suffix, so the RoHS-compliant equivalent is A3PE3000-2FGG484I. REACH and conflict-minerals status not stated in provided data.