A3PE600-1FG484I - 600K-Gate Flash FPGA, 270 I/O | Microchip
부품 번호: A3PE600-1FG484I ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $62.3 | $623.00 |
| 100 | $56.8 | $5,680.00 |
| 500 | $52.1 | $26,050.00 |
| 1,000 | $48.6 | $48,600.00 |
A3PE600-1FG484I 개요
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that the designer programs after manufacturing. The ProASIC3E family belongs to the nonvolatile flash FPGA class within the broader FPGA -> programmable logic -> digital IC hierarchy, meaning configuration data is stored on-chip in flash cells rather than an external configuration PROM.
Key features include Live-at-Power-Up (Level 0) operation for single-chip solutions, true dual-port SRAM of up to 504 kbits across the family, and a 130-nm, 7-layer metal (6 copper) flash-based CMOS process. The -1 speed grade supports system performance up to 231 MHz, and the industrial-grade -I suffix supports extended temperature operation for harsh environments.
Architecturally, the A3PE600 uses VersaTiles - fine-grained logic modules that implement both combinational and sequential functions - plus embedded block RAM and flash-based switch routing that eliminates the configuration time and volatility of SRAM FPGAs. The E variant of ProASIC3 adds a higher effective system-gate density and abundant embedded memory versus base ProASIC3.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense systems requiring instant-on operation, and test equipment glue-logic consolidation.
A key design consideration: the FBGA-484 footprint requires careful PCB escape routing at 1.0 mm pitch, and core supply (1.5 V) versus I/O bank supplies must be decoupled per the Microchip power guidelines in the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in same-footprint alternatives, practical design notes, and comparison data not consolidated in the manufacturer datasheet.
드롭인 대체품: A3PE600-1FG484I — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: A3PE600-1FG484I (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Configuration Memory, RoHS Status, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
A3PE600-FG484I
✅ 드롭인✓ 재고 있음
$86.1 / 개
데이터시트 보기 →A3PE600-1FGG484I
✅ 드롭인✓ 재고 있음
$42.4 / 개
데이터시트 보기 →A3PE600-FGG484I
✅ 드롭인✓ 재고 있음
$44.03 / 개
데이터시트 보기 →A3PE600-2FG484I
✅ 드롭인✓ 재고 있음
$79.9 / 개
데이터시트 보기 →A3PE600-2FGG484I
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →A3PE600-1FG484
✅ 드롭인✓ 재고 있음
$48.1 / 개
데이터시트 보기 →A3PE600-1FG484I 최대 정격 & 전기적 특성
| Family | ProASIC3E |
| System Gates | 600000 |
| Logic Cells (CLBs) | 13824 |
| User I/O | 270 |
| Speed Grade | -1 |
| Maximum System Frequency | 231 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm, 7-layer metal (6 copper), flash-based CMOS |
| Configuration Memory | Flash-based (nonvolatile, Live-at-Power-Up Level 0) |
| Embedded Memory (family max) | Up to 504 kbits True Dual-Port SRAM |
| 패키지 | 484-ball FBGA (PBGA484), 1.0 mm pitch |
| Package Dimensions | 23 x 23 mm, 2.23 mm height |
| Logic Family | CMOS |
| 실장 유형 | Surface Mount |
| Single-Chip Solution | Yes (no external configuration device required) |
A3PE600-1FG484I 23 x 23 mm, 2.23 mm height 핀 구성 가이드
A3PE600-1FG484I(23 x 23 mm, 2.23 mm height 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: A3PE600-1FG484I.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
A3PE600-1FG484I 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Communications and Networking Line Cards, Medical Instrumentation, Aerospace and Defense Systems, Test and Measurement Equipment, Battery-Powered and Handheld Systems.
Industrial Automation Controllers
The A3PE600-1FG484I fits industrial automation controllers because its nonvolatile flash fabric powers up live (Level 0) with zero configuration delay - critical for machines that must resume deterministic operation immediately after power cycles. With 600K system gates, 13,824 logic cells, and 270 user I/Os, it consolidates motor-interface glue logic, encoder decoding, and fieldbus interfaces into one chip. The industrial -I temperature rating covers harsh factory-floor environments, and the 1.5 V core keeps power consumption manageable in sealed enclosures. Used between sensor terminals and a host CPU, the FPGA offloads real-time PWM generation and pulse counting; unlike SRAM FPGAs it needs no boot PROM, removing one failure point and roughly 100 ms of startup latency.
추천
Communications and Networking Line Cards
The A3PE600-1FG484I suits communications and networking line cards where moderate gate density and abundant I/O outweigh raw fabric speed. The 270 user I/Os in the 484-ball FBGA support parallel PHY interfaces, backplane signaling, and status aggregation, while up to 504 kbits of true dual-port SRAM (family capability) implements FIFOs and packet buffers. The -1 speed grade supports system performance up to 231 MHz, adequate for many framing and bridging functions, and the single-chip flash solution simplifies hot-swap power sequencing. Placed between MAC/PHY devices and a control CPU, it manages register access and data path muxing; the trade-off versus SRAM FPGAs is lower top-end fabric speed, so use the -2 grade variant for sub-5 ns critical paths.
추천
Medical Instrumentation
The A3PE600-1FG484I is a strong fit for medical instrumentation such as patient monitors, diagnostic analyzers, and imaging front ends, where instant-on behavior and deterministic logic improve both safety and user experience. Flash-based configuration means the logic is active the moment power is applied - essential for safety interlocks and front-end calibration circuits that must be operational before a host processor boots. The 600K-gate fabric with 270 I/Os integrates sensor-interface state machines, ADC sequencing, and display-control glue logic, while the true dual-port SRAM buffers sample streams. In a typical design it sits between analog front-end converters and an embedded CPU; the nonvolatile fabric also resists single-event configuration upset, improving long-term reliability in always-on monitoring equipment.
추천
Aerospace and Defense Systems
The A3PE600-1FG484I fits aerospace and defense applications because the ProASIC3E flash fabric offers inherent single-event upset immunity at the configuration level - unlike SRAM FPGAs, whose configuration must be continuously scrubbed. Live-at-Power-Up operation supports immediate radar-trigger, telemetry, and weapon-system arming logic on power application without boot delay. The 600K-gate capacity with 270 I/Os handles interface bridging, protocol translation, and redundancy voting logic, and the industrial -I grade tolerates extended environments. Deployed between mission computers and sensor payloads, it provides trusted single-chip logic with no external configuration memory to corrupt or intercept; designers should verify microelectronics sourcing and screening requirements with their program office beyond the standard flow.
추천
Test and Measurement Equipment
The A3PE600-1FG484I serves test and measurement equipment such as bench instruments, data-acquisition chassis, and protocol analyzers, where reprogrammability, instant-on logic, and rich I/O are decisive. The flash fabric permits field updates of stimulus/response logic without external programming hardware at the customer site, and 270 user I/Os handle multi-channel trigger lines, bus sniffing interfaces, and instrument backplanes. Up to 504 kbits of true dual-port SRAM supports capture buffers and pattern generators, while the 231 MHz -1 timing envelope covers most counter and formatter functions. Integrated between analog capture circuitry and a host controller, it timestamp-stamps events deterministically; the FBGA-484's 1.0 mm pitch enables dense multilayer routing in portable instruments where board area is constrained.
추천
Battery-Powered and Handheld Systems
The A3PE600-1FG484I is attractive for battery-powered and handheld systems that need programmable logic without the standby cost of an external configuration flash re-reading cycle. The flash fabric is nonvolatile, so the device can reside in a low-leakage state and resume instantly, and the single-chip solution saves board area and BOM versus SRAM FPGA plus PROM combinations. The compact 23 x 23 mm FBGA-484 with 1.0 mm pitch fits dense portable layouts while still exposing 270 user I/Os for keypads, displays, and sensor buses. Placed as a co-processor beside a low-power MCU, it accelerates fixed-function datapaths; the trade-off is the 1.5 V core supply requirement, so designers should budget an efficient point-of-load regulator and verify power-down sequencing per the Microchip power application notes.
추천
추천 제품 요약
엔지니어링 참조 데이터: A3PE600-1FG484I — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | A3PE600-FG484I | A3PE600-1FGG484I | A3PE600-2FG484I | A3PE600-1FG484 |
|---|---|---|---|---|---|
| Package | FBGA-484 (1.0 mm pitch, 23 x 23 mm) | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600000 | 600000 | 600000 | 600000 | 600000 |
| User I/O | 270 | 270 | 270 | 270 | 270 |
| Speed Grade | -1 (up to 231 MHz) | default grade | -1 | -2 (faster) | -1 |
| Temperature Grade | Industrial (-I) | Industrial (-I) | Industrial (-I) | Industrial (-I) | Commercial |
| Configuration Memory | On-chip flash (single-chip, Live-at-Power-Up) | On-chip flash | On-chip flash | On-chip flash | On-chip flash |
주요 차별점
- Nonvolatile flash fabric - true single-chip solution (vs SRAM-based FPGAs (Xilinx/Altera equivalents))
- Faster timing margin option within same footprint (vs A3PE600-2FG484I)
- Industrial temperature rating at this density (vs A3PE600-1FG484)
설계 노트
The A3PE600-1FG484I requires a 1.5 V core supply with separate I/O bank supplies. Provide independent, sequenced rails and follow the Microchip ProASIC3E power-up requirements: core voltage must reach its operating window before or with the I/O banks to avoid latch-up risk during configuration. Estimated: at 600K gates with moderate toggling activity, core current typically ranges in the tens-to-low-hundreds of milliamps - perform a Libero power analysis for your specific design before sizing the point-of-load regulator. Place bulk 10 uF plus 0.1 uF decoupling at each VCC/VCCI pin group.
The 1.0 mm-pitch FBGA-484 requires via-in-pad or dog-bone escape routing; a 4-layer board minimum is recommended, with dedicated inner layers for the 1.5 V core plane and a solid ground plane directly under the die for return-current integrity. Assign I/O banks before routing so bank voltage domains (VCCI) group compatible I/O standards together - mixed-standard placement across bank boundaries is a common re-spin cause. Follow Microchip's ProASIC3E PCB layout application notes for ball-map breakout patterns.
Do not assume timing closure portability: a design that closed on the -1 grade will likely close on the -2 grade (A3PE600-2FG484I drop-in), but designs migrated from other packages or grades must be re-implemented and re-verified in Libero SoC. Also confirm the temperature suffix against your environment - the commercial A3PE600-1FG484 is NOT a substitute for the industrial -I part in extended-temperature deployments, even though it is pin-identical.
규정 준수 정보
FindIC describes the A3PE600-FG484 family packaging as GREEN, and FGG variants denote green/lead-free packaging; verify the exact A3PE600-1FG484I material declaration on the Microchip compliance portal before regulatory sign-off.
