EP1K100FI256-3 - 100K-Gate ACEX 1K FPGA, 186 I/O, FBGA-256 | Intel
Référence : EP1K100FI256-3 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.3 | $723,00 |
| 100 | $64.1 | $6 410,00 |
| 500 | $57.4 | $28 700,00 |
| 1 000 | $52.9 | $52 900,00 |
EP1K100FI256-3 Présentation
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic function is defined after manufacture by a configuration bitstream loaded into on-chip SRAM. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) > complex PLDs (CPLDs) > FPGAs > SRAM-based LUT FPGAs > ACEX 1K. They are used when designers need high logic density, parallel I/O, and reconfigurability that microcontrollers and ASICs cannot match. The ACEX 1K family was Altera's first SRAM-based family to integrate embedded array blocks for true system-on-chip integration.
Key features of the EP1K100FI256-3 include 100,000 typical gates, 4,992 logic elements, 49,152 RAM bits distributed across EABs, 186 user I/O pins, JTAG-compliant IEEE 1149.1 boundary-scan support, and a dedicated configuration interface. The device is built on a 0.22 micron CMOS process and supports in-system programmability through its SRAM configuration cells, allowing unlimited reconfiguration during development and in-field updates.
The -3 speed grade places this part in the mid-performance tier of the ACEX 1K family, with the family datasheet quoting Fmax in the 180-200 MHz range depending on the speed grade selected. The FineLine BGA-256 (FBGA-256) package provides a compact footprint while supporting high pin counts for parallel buses and high-density I/O expansion. This combination makes the EP1K100FI256-3 suitable for legacy designs, prototyping, and industrial glue logic where form factor and I/O density matter.
Typical applications include industrial control glue logic, communication interface bridging, legacy peripheral expansion, ASIC prototyping emulation, and parallel data acquisition front-ends. The 186 available I/O pins accommodate wide parallel buses and multi-protocol bridging without external muxing.
When designing with this part, plan configuration scheme (JTAG, PS, or AS) early because the configuration interface dictates board layout for the EPC or serial configuration device. Because ACEX 1K is a multi-decade mature family, expect long lead times and verify second-source availability before committing to a new design.
This page synthesizes distributor pricing, drop-in compatible ACEX 1K variants, and practical sourcing notes not consolidated in a single datasheet, helping engineers and buyers evaluate form-fit-function compatibility for legacy and new designs.
Alternatives de remplacement direct pour EP1K100FI256-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K100FI256-3 (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Process Technology, Family, Total RAM Bits.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K100FI256-2
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP1K100FI256-2N
✅ Remplacement direct✓ En stock
$55.8 / unité
Voir la fiche technique →EP1K100FC256-3
✅ Remplacement direct✓ En stock
$30.22 / unité
Voir la fiche technique →EP1K100FC256-3N
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1K100FC256-2
✅ Remplacement direct✓ En stock
$27.6 / unité
Voir la fiche technique →EP1K100FI256-3 Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Device Logic Elements | 4,992 |
| Typical Gate Count | 100,000 gates |
| Maximum RAM Bits | 49,152 bits |
| User I/O Pins | 186 |
| Dedicated Inputs | 6 |
| Speed Grade | -3 |
| Nominal Core Voltage | 2.5 V |
| Core Voltage Range | 2.375 V to 2.625 V |
| Process Technology | 0.22 micron CMOS |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 256-ball FineLine BGA (FBGA-256) |
| Type de montage | Surface Mount |
| Configuration Method | SRAM-based, JTAG / PS / AS supported |
| AEC-Q100 Qualification | Not qualified |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
Configuration des broches de EP1K100FI256-3
| Broche A1 | I/O — User I/O pin (bank assignment per datasheet) |
| Broche A2 | I/O — User I/O pin |
| Broche A3 | I/O — User I/O pin |
| Broche A4 | VCCINT — Core supply voltage 2.5 V |
| Broche B1 | I/O — User I/O pin |
| Broche B2 | I/O — User I/O pin |
| Broche B3 | GND — Ground reference |
| Broche B4 | I/O — User I/O pin |
| Broche C1 | I/O — User I/O pin |
| Broche C2 | I/O — User I/O pin |
| Broche C3 | I/O — User I/O pin |
| Broche C4 | VCCIO — I/O bank supply voltage |
| Broche D1 | I/O — User I/O pin |
| Broche D2 | nSTATUS — Configuration status (open-drain) |
| Broche D3 | nCONFIG — Configuration start (active-low) |
| Broche D4 | I/O — User I/O pin |
| Broche E1 | I/O — User I/O pin |
| Broche E2 | DCLK — Configuration clock input |
| Broche E3 | CONF_DONE — Configuration complete (open-drain) |
| Broche E4 | I/O — User I/O pin |
| Broche F1 | I/O — User I/O pin |
| Broche F2 | DATA0 — Configuration data input |
| Broche F3 | MSEL0 — Configuration mode select |
| Broche F4 | I/O — User I/O pin |
| Broche G1 | I/O — User I/O pin |
| Broche G2 | MSEL1 — Configuration mode select |
| Broche G3 | nCE — Chip enable (active-low) |
| Broche G4 | I/O — User I/O pin |
| Broche H1 | I/O — User I/O pin |
| Broche H2 | TDI — JTAG test data in |
| Broche H3 | TCK — JTAG test clock |
| Broche H4 | I/O — User I/O pin |
| Broche J1 | I/O — User I/O pin |
| Broche J2 | TDO — JTAG test data out |
| Broche J3 | TMS — JTAG test mode select |
| Broche J4 | I/O — User I/O pin |
| Broche K1 | I/O — User I/O pin |
| Broche K2 | VCCINT — Core supply voltage 2.5 V |
| Broche K3 | GND — Ground reference |
| Broche K4 | I/O — User I/O pin |
| Broche L1 | I/O — User I/O pin |
| Broche L2 | I/O — User I/O pin |
| Broche L3 | I/O — User I/O pin |
| Broche L4 | VCCIO — I/O bank supply voltage |
| Broche M1 | I/O — User I/O pin |
| Broche M2 | I/O — User I/O pin |
| Broche M3 | GND — Ground reference |
| Broche M4 | I/O — User I/O pin |
| Broche N1 | I/O — User I/O pin |
| Broche N2 | I/O — User I/O pin |
| Broche N3 | I/O — User I/O pin |
| Broche N4 | I/O — User I/O pin |
Applications typiques
EP1K100FI256-3 convient pour 7 applications: Industrial Glue Logic and Bus Bridging, Communication Interface Expansion, ASIC Prototyping and Emulation, Parallel Data Acquisition Front-End, Legacy Peripheral Expansion, Aerospace and Avionics Interface Bridging, Test and Measurement Instrumentation.
Industrial Glue Logic and Bus Bridging
The EP1K100FI256-3 is well suited to industrial glue logic and bus-bridging applications because its 4,992 logic elements, 49,152 bits of distributed RAM, and 186 user I/O pins let designers replace multiple 74-series logic devices and discrete bus switches with a single programmable device. In a typical application the FPGA sits between a legacy parallel bus (e.g. ISA or a custom 32-bit interface) and a modern MCU, performing protocol translation, address decoding, and timing adjustment on the fly. The 2.5 V core voltage is friendly to mixed 2.5 V / 3.3 V I/O rails when the bank voltage is set appropriately, and the industrial -40 C to +85 C rating supports factory-floor enclosures without additional thermal conditioning.
Recommandé
Communication Interface Expansion
The EP1K100FI256-3 is widely used to add legacy communication interfaces to modern processors that no longer expose them. With 186 I/O pins and 49,152 bits of block RAM, the device can implement UARTs (16550 cores), SPI masters/slaves, I2C controllers, and even custom LVDS links concurrently on the same die. The 256-ball FineLine BGA gives generous signal fan-out for parallel data paths, and the SRAM-based configuration means the same FPGA can be reconfigured in the field to add new protocol support. Industrial-temperature operation enables deployment in outdoor telecom cabinets and industrial Ethernet gateways.
Recommandé
ASIC Prototyping and Emulation
Designers use the EP1K100FI256-3 as an ASIC prototyping vehicle because the ACEX 1K architecture maps cleanly onto RTL synthesized for ASIC flows, with 4,992 LEs accommodating tens of thousands of ASIC gates at typical 4-to-1 utilization. The 49,152 bits of distributed RAM emulate SRAM blocks, FIFOs, and register files at near-real-time speeds, while the 186 I/O pins break out wide data buses for connection to the real ASIC pads. The -3 speed grade yields Fmax values in the 180-200 MHz range (family datasheet), enough to validate RTL timing before tape-out. Industrial temperature rating supports bring-up and validation in thermally aggressive test fixtures.
Recommandé
Parallel Data Acquisition Front-End
In parallel data acquisition systems the EP1K100FI256-3 acts as a programmable front-end that interfaces parallel ADCs, deserializers, or image sensors to a host processor. The 186 available user I/O pins accommodate wide LVCMOS or LVTTL buses from multi-channel ADCs, and the 49,152 bits of distributed RAM implement per-channel FIFOs that absorb sample bursts without host intervention. The ACEX 1K EABs can host small coefficient tables for run-time gain calibration, and the 0.22 micron CMOS process gives predictable timing for deterministic sampling windows at the -3 speed grade.
Recommandé
Legacy Peripheral Expansion
The EP1K100FI256-3 is commonly used to add legacy peripherals (parallel ports, IDE interfaces, ISA-style cards, custom keypad/display controllers) to modern SoCs that no longer expose them. Designers instantiate soft-core peripherals in HDL, compile them into the 4,992 logic elements, and map them onto the 186 I/O pins of the FineLine BGA. The SRAM-based configuration lets a single board ship with multiple personality bitstreams, switchable in the field through JTAG or active-serial configuration. The industrial -40 C to +85 C window supports factory automation and military-grade COTS applications.
Recommandé
Aerospace and Avionics Interface Bridging
Although not AEC-Q100 qualified, the industrial-temperature EP1K100FI256-3 is widely used in commercial aerospace and avionics interface bridging, where it converts between ARINC 429, MIL-STD-1553, and modern Ethernet or PCIe-based avionics buses. The 186 user I/O pins and 4,992 LEs support multiple ARINC 429 channels simultaneously, while the 49,152 bits of RAM stage messages for protocol conversion. Designers appreciate the SRAM-based configuration for in-field updates as DO-178C certification artifacts evolve. The -40 C to +85 C industrial range is sufficient for cockpit and cabin electronics, though not for engine bay applications.
Recommandé
Test and Measurement Instrumentation
The EP1K100FI256-3 finds use in custom test and measurement instruments because its 186 I/O pins can be routed to DUT pins, pattern generators, and comparators in parallel, while the 4,992 LEs run mixed-signal test sequencers. The 49,152 bits of distributed RAM store captured waveforms and pattern vectors, and the SRAM-based configuration means the same hardware can be re-purposed for different DUT families simply by loading a new bitstream. The 0.22 micron CMOS process contributes predictable timing that simplifies timing-budget verification at the -3 speed grade.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K100FI256-3 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K100FI256-2 | EP1K100FI256-2N | EP1K100FC256-3 | EP1K100FC256-3N | EP1K100FC256-2 |
|---|---|---|---|---|---|---|
| Package | FBGA-256 (FineLine BGA) | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same | FBGA-256 (FineLine BGA) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K |
| Speed Grade | -3 | -2 (slower Fmax) | -2 (slower Fmax) | -3 (same Fmax) | -3 (same Fmax) | -2 (slower Fmax) |
| Logic Elements | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 | 4,992 |
| RAM Bits | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 |
| User I/O Pins | 186 | 186 | 186 | 186 | 186 | 186 |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) | 0 C to +70 C (Commercial) |
| Core Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
Principaux différenciateurs
- Highest Fmax speed grade in the EP1K100 industrial FBGA-256 lineup (vs EP1K100FI256-2)
- Industrial temperature grade covers factory and outdoor deployments (vs EP1K100FC256-3)
- FineLine BGA-256 packs 186 I/O in a compact footprint versus QFP options (vs EP1K100FC484-3)
- SRAM-based configuration enables in-field reconfiguration (vs Antifuse-based competitors)
Notes de conception
The EP1K100FI256-3 requires a clean 2.5 V core supply in the 2.375 V to 2.625 V window and a separate VCCIO bank supply (typically 2.5 V, 3.0 V, or 3.3 V depending on bank assignment). Decouple each supply pin with a 0.1 uF ceramic plus a bulk 10-47 uF tantalum or polymer cap. Because ACEX 1K is SRAM-based, it must complete configuration before I/O become valid; a slow-rising VCCINT can leave the device in undefined states, so follow the power-on reset timing in the family datasheet and hold nCONFIG low until the supply rails are stable. Estimated: assuming 186 I/O switching at 20 MHz with 20 pF loads, dynamic current draw is on the order of 200-400 mA in addition to the static IDD.
The FineLine BGA-256 package exposes a thermal pad or thermal balls; reflow that pad to an internal copper pour with a via array to spread heat into inner PCB layers. Without a thermal pad, the junction-to-ambient thermal resistance of the FBGA-256 is high (often 30-40 C/W), so for high-utilization designs (>70% LE toggle) at industrial temperature, include a heatsink or forced-air cooling. Estimated: at 1 W total power dissipation the junction rises 30-40 C above ambient at a typical 30 C/W theta_JA, leaving ~45-55 C of margin to the 85 C industrial ceiling.
FBGA-256 routing demands 0.8 mm ball pitch, which requires microvia (laser-drilled) stack-ups on the PCB. Use a 4-6 layer board with the top layer dedicated to escape routing from the BGA fan-out, a continuous ground plane on layer 2 for return-path integrity, and a power plane on layer 3. Keep all 100 ohm differential pairs length-matched within 150 mil and length-match clock-to-DATA within 100 mil to preserve setup/hold margins during PS/AS configuration. Avoid placing the configuration memory more than 4 inches from DCLK/DATA to keep the configuration clock clean.
Do not confuse ACEX 1K (2.5 V core, SRAM) with APEX or FLEX families that have different voltage and configuration requirements. Confirm MSEL[1:0] strapping for PS (parallel-synchronous) versus AS (active-serial) configuration before laying out the board. A common pitfall is using an EPC2 configuration memory intended for APEX 20K with ACEX 1K - the programming files are not compatible. Use Quartus II 13.0 or earlier for ACEX 1K synthesis; newer Quartus releases dropped support. Finally, watch the I/O bank supply - mixing 3.3 V and 2.5 V on the same bank damages the I/O cells.
Informations de conformité
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status not stated in the verified distributor snippets; consult franchised distributor documentation. The 'N' suffix variants (EP1K100FI256-2N, EP1K100FC256-3N) are explicitly lead-free per Altera part-number convention.
