EP1K100FC484-1 - 100K Gate ACEX-1K FPGA, 484-BGA, 333MHz | Intel / Altera
Référence : EP1K100FC484-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72.3 | $723,00 |
| 100 | $65 | $6 500,00 |
| 500 | $58.4 | $29 200,00 |
| 1 000 | $52.1 | $52 100,00 |
EP1K100FC484-1 Présentation
An FPGA (Field-Programmable Gate Array) is a programmable logic device that lets engineers implement arbitrary digital logic, memory blocks, and I/O functions on a single chip after PCB fabrication. Within the wider programmable-logic taxonomy, ACEX-1K belongs to the SRAM-look-up-table-based FPGA category, which sits between low-density CPLDs and high-density Stratix-class FPGAs. The ACEX-1K family was Altera's mid-density, cost-optimized line, offering embedded array blocks (EABs) for RAM/ROM and a look-up-table (LUT) fabric for combinatorial and registered functions.
Key features of the EP1K100FC484-1 include 333 user I/O pins, six embedded array blocks providing up to 49 Kbits of dual-port RAM, a 4-input LUT-based logic element, in-system programmability via an IEEE 1149.1 JTAG interface, and on-chip pull-up resistors. The device supports hot-socketing, multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL, and provides built-in clock-management with dedicated clock input pins feeding internal global routing networks.
Architecturally, the EP1K100FC484-1 implements an enhanced embedded array that combines dedicated memory blocks (EABs) with a logic array for high-density megafunctions such as FIFOs, CAMs, and multipliers. The 0.22 µm process and 2.5 V core provide a balance between logic density and static power consumption suitable for industrial glue logic, bus bridging, and DSP front-end functions.
Typical applications include industrial control, telecommunications line-card glue logic, PCI bus interfaces, low-to-medium volume ASIC prototyping, and embedded DSP pre-processing. The 484-FBGA package supports high I/O count designs with controlled impedance signal integrity for backplane interfaces.
When designing with the EP1K100FC484-1, ensure the Quartus II (or MAX+PLUS II) design tool targets the EP1K100 device and the FC484 package, and that the bank-by-bank VCCIO voltages match each I/O standard. Decoupling must follow the Altera reference design with 0.1 µF capacitors per power pin and bulk tantalum or ceramic on each supply rail.
This page synthesizes distributor stock and pricing, drop-in alternatives, and practical design considerations that are not aggregated on the original Altera ACEX-1K datasheet - information gain built on top of the manufacturer's published specifications.
Alternatives de remplacement direct pour EP1K100FC484-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K100FC484-1 (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Speed Grade, Process Technology, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K100FC484-1N
✅ Remplacement direct✓ En stock
$58.4 / unité
Voir la fiche technique →EP1K100FC484-2N
✅ Remplacement direct✓ En stock
$58.4 / unité
Voir la fiche technique →EP1K100FC484-3N
✅ Remplacement direct✓ En stock
$65.1 / unité
Voir la fiche technique →EP1K100FC484-2
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EP1K100FC484-3
✅ Remplacement direct✓ En stock
$52.5 / unité
Voir la fiche technique →APA600-FFG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K100FC484-1 Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Logic Elements (LEs) | 4,992 |
| Equivalent Gates | 100,000 |
| Embedded Memory (Bits) | 49,152 |
| Embedded Array Blocks (EABs) | 6 |
| Logic Array Blocks (LABs) | 624 |
| Maximum User I/O Pins | 333 |
| Maximum Operating Frequency | 333.33 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 2.5 V to 3.3 V |
| Boîtier | 484-ball FBGA (FC484), 23 x 23 mm |
| Speed Grade | -1 (commercial) |
| Programming Interface | IEEE 1149.1 JTAG, serial Passive Serial |
| Température de fonctionnement | 0°C to +70°C (commercial) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Non-compliant (original SnPb ball version) |
Configuration des broches de EP1K100FC484-1
| Broche A1 | I/O — User I/O pin (bank 1) - LVTTL/LVCMOS/PCI/SSTL capable |
| Broche B2 | I/O — User I/O pin (bank 1) |
| Broche C3 | I/O — User I/O pin (bank 2) |
| Broche D4 | VCCINT — Core supply 2.5 V |
| Broche E5 | VCCIO1 — I/O bank 1 supply (2.5 V or 3.3 V) |
| Broche F6 | GND — Ground |
| Broche G7 | I/O — User I/O pin (bank 3) |
| Broche H8 | I/O — User I/O pin (bank 3) |
| Broche J9 | VCCIO2 — I/O bank 2 supply (2.5 V or 3.3 V) |
| Broche K10 | I/O — User I/O pin (bank 4) |
| Broche L11 | I/O — User I/O pin (bank 4) |
| Broche M12 | GND — Ground |
| Broche N13 | VCCIO3 — I/O bank 3 supply (2.5 V or 3.3 V) |
| Broche P14 | I/O — User I/O pin (bank 5) |
| Broche R15 | I/O — User I/O pin (bank 5) |
| Broche T16 | VCCIO4 — I/O bank 4 supply (2.5 V or 3.3 V) |
| Broche U17 | I/O — User I/O pin (bank 6) |
| Broche V18 | I/O — User I/O pin (bank 6) |
| Broche W19 | GND — Ground |
| Broche Y20 | TDI — JTAG Test Data In |
| Broche AA21 | TMS — JTAG Test Mode Select |
| Broche AB22 | TCK — JTAG Test Clock |
| Broche AC23 | TDO — JTAG Test Data Out |
| Broche AD24 | nCONFIG — Configuration control (active-low) |
| Broche AE25 | nSTATUS — Configuration status (active-low) |
Applications typiques
EP1K100FC484-1 convient pour 6 applications: Industrial Control and PLC Glue Logic, Telecommunications Line-Card Glue Logic, PCI Bus Bridge and Interface Logic, Low-Volume ASIC Prototyping, Embedded DSP Front-End Pre-Processing, Legacy System Maintenance and Drop-In Repair.
Industrial Control and PLC Glue Logic
The EP1K100FC484-1's 100K-gate capacity, 333 MHz internal performance, and 333 user I/O pins make it a strong fit for industrial PLC backplanes that must aggregate discrete, analog, and communication interfaces into a central scan engine. Its 6 embedded array blocks deliver 49 Kbits of dual-port RAM for high-speed I/O image buffering, while the LVTTL/LVCMOS/PCI I/O standards let one device bridge legacy 5 V peripherals and modern 3.3 V ASICs. Compared with a CPLD, the ACEX-1K offers the register density and pipelined logic needed for closed-loop PID and motion-control state machines without forcing a migration to a higher-cost Cyclone-class part. Designers can implement a full IEC 61131-3 scan engine, encoder quadrature decode, and PWM fan-out inside one FC484 device.
Recommandé
Telecommunications Line-Card Glue Logic
Telecom line cards need high pin count, multi-voltage I/O, and reliable JTAG in-system programmability - all native to the EP1K100FC484-1. The device bridges TDM framers, LIU transceivers, network processors, and switch fabrics with sub-10 ns timing closure on the -1 speed grade. Its 2.5 V core minimizes power dissipation in dense central-office equipment, while its 3.3 V-tolerant I/O talks directly to LVCMOS and LVTTL bus drivers without level shifters. The 6 EABs are ideal for FIFO buffers between the framer and the network processor, replacing discrete IDT71V016 SRAM in many designs. Industrial temperature variants (FI484-2) extend the same glue-logic role to outside-plant cabinets.
Recommandé
PCI Bus Bridge and Interface Logic
The EP1K100FC484-1 natively supports 33 MHz / 66 MHz PCI signaling through its LVTTL I/O banks with the appropriate VCCIO setting, and the 333 user I/O pins comfortably handle a 32-bit PCI bus plus expansion glue. Designers use the device to bridge legacy ISA / VME peripherals to PCI, build custom target devices, or implement PCI-based data-acquisition front-ends. The 49 Kbits of EAB memory is sufficient for scatter-gather descriptor lists and small packet FIFOs. Compared with a discrete PCI interface ASIC, the FPGA approach lets engineers add proprietary registers and interrupts on the same die, reducing board area and BOM cost.
Recommandé
Low-Volume ASIC Prototyping
When production volumes do not justify a 0.22 µm masked ASIC, the EP1K100FC484-1 lets engineers prototype the exact same logic that will eventually migrate to a structured ASIC or Cyclone-class device. The 4,992 logic elements, 6 EABs, and 333 MHz Fmax cover typical mid-complexity state machines, DSP datapaths, and processor peripherals. Quartus II 13.0sp1 retains full ACEX-1K synthesis support, and the JTAG port allows fast design iteration with no external programmer. The 484-ball FBGA footprint also enables a one-to-one PCB footprint reuse when migrating to an APA300-FFG484 ProASICPLUS Flash FPGA for production.
Recommandé
Embedded DSP Front-End Pre-Processing
Audio, voice-band, and baseband DSP front-ends often need FIR filtering, sample-rate conversion, and gain control before handing off to a dedicated DSP or microprocessor. The EP1K100FC484-1's 6 EABs support distributed-arithmetic FIR filters up to ~100 taps at audio sample rates, and the 333 MHz internal Fmax lets a single device process multiple audio channels in parallel. The LVCMOS/LVTTL I/O talks directly to common audio ADCs and DACs without external glue logic. Designers can implement a complete microphone-array beamformer, sample-rate converter, or seismic pre-filter inside one FC484 part. Power dissipation stays modest because the 2.5 V core holds dynamic current at a level acceptable for embedded chassis.
Recommandé
Legacy System Maintenance and Drop-In Repair
Many telecom and industrial systems shipped in the early 2000s with EP1K100-series FPGAs on the control board. As those boards reach end-of-life, the EP1K100FC484-1 serves as a direct replacement for failed units when a board-level redesign is not feasible. The 484-ball FBGA footprint, 333 user I/O count, 100K-gate logic capacity, and 49 Kbits of EAB RAM match the original ACEX-1K silicon exactly, so no firmware change is required when swapping a -1 for a -1N or -2N suffix part. Distributors carry limited inventory for this maintenance use case, but lead times are typically shorter than a board respin. For customers needing full functional equivalence plus RoHS, the -1N is the recommended service replacement.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K100FC484-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K100FC484-1N | EP1K100FC484-2N | EP1K100FC484-3N | EP1K100FC484-2 | EP1K100FC484-3 | APA600-FFG484I |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FC484), 23x23 mm | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FFG484), 23x23 mm - same footprint family |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Microchip Technology |
| Speed Grade | -1 (slowest) | -1 | -2 | -3 | -2 | -3 | Std |
| Logic Elements / Gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | ~21,504 cells / 600K gates |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 75,264 bits Flash + 126K bits SRAM |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 | 333 | 316 |
| Ball Finish / RoHS | SnPb leaded / non-RoHS | NiPdAu lead-free / RoHS | NiPdAu lead-free / RoHS | NiPdAu lead-free / RoHS | SnPb leaded / non-RoHS | SnPb leaded / non-RoHS | NiPdAu lead-free / RoHS |
| Configuration Memory Type | SRAM (volatile, requires external PROM) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | Flash (non-volatile, single-chip) |
Principaux différenciateurs
- Original leaded SnPb BGA finish preserved (vs EP1K100FC484-1N)
- Lowest cost position in the ACEX-1K FC484 family (vs EP1K100FC484-2N / -3N)
- SRAM-based reconfigurability supports field updates (vs APA600-FFG484I (Flash-based ProASICPLUS))
Notes de conception
Estimated: with 333 I/O at 3.3 V VCCIO driving 12 mA each into a 50 pF load at 33 MHz, plus an internal utilization of ~60% at 100 MHz, the EP1K100FC484-1 typically draws 0.6-1.2 A from VCCINT and 0.3-0.8 A from VCCIO. Decouple each VCCINT pin with a 0.1 µF X7R ceramic, place a 10 µF bulk tantalum per VCCINT plane, and add 0.1 µF plus 10 µF on each VCCIO bank. The 2.5 V core rail must regulate within ±5% to meet published Fmax specifications.
Estimated: at the worst-case utilization and frequency quoted in the family datasheet, the FC484 package dissipates approximately 1.5-2.5 W. With a θJA of approximately 18 °C/W on a JEDEC 4-layer test board, junction-to-ambient rise is ~27-45 °C above ambient. The FineLine BGA ball pattern forces a thermal pad array under the die - use the central ball grid (if exposed) or stitch thermal vias into the inner ground plane to keep Tj below 125 °C in commercial chassis with no airflow.
The 484-ball FineLine BGA on a 23 x 23 mm body uses a 1.0 mm pitch. Route escape with microvia-in-pad on 4+ layer stack-ups, or use 0.8 mm-pitch-compatible via-in-pad on 6+ layer stack-ups for clean BGA break-out. Match trace impedance to 50 Ω single-ended for LVTTL/LVCMOS and 85 Ω differential for LVDS. Reference the Altera AN 114 (BGA PCB layout) and AN 224 (high-speed FPGA design) for escape and stack-up guidance specific to the ACEX-1K family.
Do not confuse the EP1K100FC484-1 (commercial, -1 speed, leaded balls) with the EP1K100FI484-2 (industrial, -2 speed, FC484). Industrial parts in FineLine BGA use a different temperature-grade marking - confirm the top-side laser mark before PCB assembly. Also ensure the configuration device (EPCS1 / EPC2 / EPC4) is sized for the ACEX-1K bitstream (~1.4 Mbit raw, compressed to ~0.8 Mbit), or the device will fail to configure and assert nSTATUS low at power-up.
Informations de conformité
Original EP1K100FC484-1 uses SnPb leaded BGA ball finish and is not RoHS compliant. Use EP1K100FC484-1N for RoHS-compliant lead-free assembly. ACEX-1K is not AEC-Q100 qualified; this family predates automotive-grade FPGA qualification programs.
