EP1K100FC484-1 - 100K Gate ACEX-1K FPGA, 484-BGA, 333MHz | Intel / Altera
MPN: EP1K100FC484-1 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.3 | $723.00 |
| 100 | $65 | $6,500.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
Drop-in alternatives for EP1K100FC484-1 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP1K100FC484-1N
β Drop-Inβ In Stock
$58.4 / Unit
View Datasheet βEP1K100FC484-2N
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$58.4 / Unit
View Datasheet βEP1K100FC484-3N
β Drop-Inβ In Stock
$65.1 / Unit
View Datasheet βEP1K100FC484-2
β Drop-Inβ In Stock
$33.4 / Unit
View Datasheet βEP1K100FC484-3
β Drop-Inβ In Stock
$52.5 / Unit
View Datasheet βAPA600-FFG484I
β Drop-Inπ Reference alternative (not in catalog)
EP1K100FC484-1 Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Logic Elements (LEs) | 4,992 |
| Equivalent Gates | 100,000 |
| Embedded Memory (Bits) | 49,152 |
| Embedded Array Blocks (EABs) | 6 |
| Logic Array Blocks (LABs) | 624 |
| Maximum User I/O Pins | 333 |
| Maximum Operating Frequency | 333.33 MHz |
| Process Technology | 0.22 Β΅m CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V |
| I/O Supply Voltage (VCCIO) | 2.5 V to 3.3 V |
| Package | 484-ball FBGA (FC484), 23 x 23 mm |
| Speed Grade | -1 (commercial) |
| Programming Interface | IEEE 1149.1 JTAG, serial Passive Serial |
| Operating Temperature | 0Β°C to +70Β°C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Non-compliant (original SnPb ball version) |
EP1K100FC484-1 Pin Configuration
| Pin A1 | I/O β User I/O pin (bank 1) - LVTTL/LVCMOS/PCI/SSTL capable |
| Pin B2 | I/O β User I/O pin (bank 1) |
| Pin C3 | I/O β User I/O pin (bank 2) |
| Pin D4 | VCCINT β Core supply 2.5 V |
| Pin E5 | VCCIO1 β I/O bank 1 supply (2.5 V or 3.3 V) |
| Pin F6 | GND β Ground |
| Pin G7 | I/O β User I/O pin (bank 3) |
| Pin H8 | I/O β User I/O pin (bank 3) |
| Pin J9 | VCCIO2 β I/O bank 2 supply (2.5 V or 3.3 V) |
| Pin K10 | I/O β User I/O pin (bank 4) |
| Pin L11 | I/O β User I/O pin (bank 4) |
| Pin M12 | GND β Ground |
| Pin N13 | VCCIO3 β I/O bank 3 supply (2.5 V or 3.3 V) |
| Pin P14 | I/O β User I/O pin (bank 5) |
| Pin R15 | I/O β User I/O pin (bank 5) |
| Pin T16 | VCCIO4 β I/O bank 4 supply (2.5 V or 3.3 V) |
| Pin U17 | I/O β User I/O pin (bank 6) |
| Pin V18 | I/O β User I/O pin (bank 6) |
| Pin W19 | GND β Ground |
| Pin Y20 | TDI β JTAG Test Data In |
| Pin AA21 | TMS β JTAG Test Mode Select |
| Pin AB22 | TCK β JTAG Test Clock |
| Pin AC23 | TDO β JTAG Test Data Out |
| Pin AD24 | nCONFIG β Configuration control (active-low) |
| Pin AE25 | nSTATUS β Configuration status (active-low) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K100FC484-1 is suitable for 6 applications: Industrial Control and PLC Glue Logic, Telecommunications Line-Card Glue Logic, PCI Bus Bridge and Interface Logic, Low-Volume ASIC Prototyping, Embedded DSP Front-End Pre-Processing, Legacy System Maintenance and Drop-In Repair.
Industrial Control and PLC Glue Logic
The EP1K100FC484-1's 100K-gate capacity, 333 MHz internal performance, and 333 user I/O pins make it a strong fit for industrial PLC backplanes that must aggregate discrete, analog, and communication interfaces into a central scan engine. Its 6 embedded array blocks deliver 49 Kbits of dual-port RAM for high-speed I/O image buffering, while the LVTTL/LVCMOS/PCI I/O standards let one device bridge legacy 5 V peripherals and modern 3.3 V ASICs. Compared with a CPLD, the ACEX-1K offers the register density and pipelined logic needed for closed-loop PID and motion-control state machines without forcing a migration to a higher-cost Cyclone-class part. Designers can implement a full IEC 61131-3 scan engine, encoder quadrature decode, and PWM fan-out inside one FC484 device.
Recommended
Telecommunications Line-Card Glue Logic
Telecom line cards need high pin count, multi-voltage I/O, and reliable JTAG in-system programmability - all native to the EP1K100FC484-1. The device bridges TDM framers, LIU transceivers, network processors, and switch fabrics with sub-10 ns timing closure on the -1 speed grade. Its 2.5 V core minimizes power dissipation in dense central-office equipment, while its 3.3 V-tolerant I/O talks directly to LVCMOS and LVTTL bus drivers without level shifters. The 6 EABs are ideal for FIFO buffers between the framer and the network processor, replacing discrete IDT71V016 SRAM in many designs. Industrial temperature variants (FI484-2) extend the same glue-logic role to outside-plant cabinets.
Recommended
PCI Bus Bridge and Interface Logic
The EP1K100FC484-1 natively supports 33 MHz / 66 MHz PCI signaling through its LVTTL I/O banks with the appropriate VCCIO setting, and the 333 user I/O pins comfortably handle a 32-bit PCI bus plus expansion glue. Designers use the device to bridge legacy ISA / VME peripherals to PCI, build custom target devices, or implement PCI-based data-acquisition front-ends. The 49 Kbits of EAB memory is sufficient for scatter-gather descriptor lists and small packet FIFOs. Compared with a discrete PCI interface ASIC, the FPGA approach lets engineers add proprietary registers and interrupts on the same die, reducing board area and BOM cost.
Recommended
Low-Volume ASIC Prototyping
When production volumes do not justify a 0.22 Β΅m masked ASIC, the EP1K100FC484-1 lets engineers prototype the exact same logic that will eventually migrate to a structured ASIC or Cyclone-class device. The 4,992 logic elements, 6 EABs, and 333 MHz Fmax cover typical mid-complexity state machines, DSP datapaths, and processor peripherals. Quartus II 13.0sp1 retains full ACEX-1K synthesis support, and the JTAG port allows fast design iteration with no external programmer. The 484-ball FBGA footprint also enables a one-to-one PCB footprint reuse when migrating to an APA300-FFG484 ProASICPLUS Flash FPGA for production.
Recommended
Embedded DSP Front-End Pre-Processing
Audio, voice-band, and baseband DSP front-ends often need FIR filtering, sample-rate conversion, and gain control before handing off to a dedicated DSP or microprocessor. The EP1K100FC484-1's 6 EABs support distributed-arithmetic FIR filters up to ~100 taps at audio sample rates, and the 333 MHz internal Fmax lets a single device process multiple audio channels in parallel. The LVCMOS/LVTTL I/O talks directly to common audio ADCs and DACs without external glue logic. Designers can implement a complete microphone-array beamformer, sample-rate converter, or seismic pre-filter inside one FC484 part. Power dissipation stays modest because the 2.5 V core holds dynamic current at a level acceptable for embedded chassis.
Recommended
Legacy System Maintenance and Drop-In Repair
Many telecom and industrial systems shipped in the early 2000s with EP1K100-series FPGAs on the control board. As those boards reach end-of-life, the EP1K100FC484-1 serves as a direct replacement for failed units when a board-level redesign is not feasible. The 484-ball FBGA footprint, 333 user I/O count, 100K-gate logic capacity, and 49 Kbits of EAB RAM match the original ACEX-1K silicon exactly, so no firmware change is required when swapping a -1 for a -1N or -2N suffix part. Distributors carry limited inventory for this maintenance use case, but lead times are typically shorter than a board respin. For customers needing full functional equivalence plus RoHS, the -1N is the recommended service replacement.
Recommended
Recommended Products Summary
Engineering reference data for EP1K100FC484-1 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K100FC484-1N | EP1K100FC484-2N | EP1K100FC484-3N | EP1K100FC484-2 | EP1K100FC484-3 | APA600-FFG484I |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (FC484), 23x23 mm | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FC484), 23x23 mm - same | 484-ball FBGA (FFG484), 23x23 mm - same footprint family |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel | Intel | Microchip Technology |
| Speed Grade | -1 (slowest) | -1 | -2 | -3 | -2 | -3 | Std |
| Logic Elements / Gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | 4,992 LEs / 100K gates | ~21,504 cells / 600K gates |
| Embedded Memory | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 49,152 bits | 75,264 bits Flash + 126K bits SRAM |
| Maximum User I/O | 333 | 333 | 333 | 333 | 333 | 333 | 316 |
| Ball Finish / RoHS | SnPb leaded / non-RoHS | NiPdAu lead-free / RoHS | NiPdAu lead-free / RoHS | NiPdAu lead-free / RoHS | SnPb leaded / non-RoHS | SnPb leaded / non-RoHS | NiPdAu lead-free / RoHS |
| Configuration Memory Type | SRAM (volatile, requires external PROM) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | SRAM (volatile) | Flash (non-volatile, single-chip) |
Key Differentiators
- Original leaded SnPb BGA finish preserved (vs EP1K100FC484-1N)
- Lowest cost position in the ACEX-1K FC484 family (vs EP1K100FC484-2N / -3N)
- SRAM-based reconfigurability supports field updates (vs APA600-FFG484I (Flash-based ProASICPLUS))
Design Notes
Estimated: with 333 I/O at 3.3 V VCCIO driving 12 mA each into a 50 pF load at 33 MHz, plus an internal utilization of ~60% at 100 MHz, the EP1K100FC484-1 typically draws 0.6-1.2 A from VCCINT and 0.3-0.8 A from VCCIO. Decouple each VCCINT pin with a 0.1 Β΅F X7R ceramic, place a 10 Β΅F bulk tantalum per VCCINT plane, and add 0.1 Β΅F plus 10 Β΅F on each VCCIO bank. The 2.5 V core rail must regulate within Β±5% to meet published Fmax specifications.
Estimated: at the worst-case utilization and frequency quoted in the family datasheet, the FC484 package dissipates approximately 1.5-2.5 W. With a ΞΈJA of approximately 18 Β°C/W on a JEDEC 4-layer test board, junction-to-ambient rise is ~27-45 Β°C above ambient. The FineLine BGA ball pattern forces a thermal pad array under the die - use the central ball grid (if exposed) or stitch thermal vias into the inner ground plane to keep Tj below 125 Β°C in commercial chassis with no airflow.
The 484-ball FineLine BGA on a 23 x 23 mm body uses a 1.0 mm pitch. Route escape with microvia-in-pad on 4+ layer stack-ups, or use 0.8 mm-pitch-compatible via-in-pad on 6+ layer stack-ups for clean BGA break-out. Match trace impedance to 50 Ξ© single-ended for LVTTL/LVCMOS and 85 Ξ© differential for LVDS. Reference the Altera AN 114 (BGA PCB layout) and AN 224 (high-speed FPGA design) for escape and stack-up guidance specific to the ACEX-1K family.
Do not confuse the EP1K100FC484-1 (commercial, -1 speed, leaded balls) with the EP1K100FI484-2 (industrial, -2 speed, FC484). Industrial parts in FineLine BGA use a different temperature-grade marking - confirm the top-side laser mark before PCB assembly. Also ensure the configuration device (EPCS1 / EPC2 / EPC4) is sized for the ACEX-1K bitstream (~1.4 Mbit raw, compressed to ~0.8 Mbit), or the device will fail to configure and assert nSTATUS low at power-up.
Compliance Information
Original EP1K100FC484-1 uses SnPb leaded BGA ball finish and is not RoHS compliant. Use EP1K100FC484-1N for RoHS-compliant lead-free assembly. ACEX-1K is not AEC-Q100 qualified; this family predates automotive-grade FPGA qualification programs.
