EP1K10TC100-3N - 10K-Gate ACEX-1K FPGA, 576 Cells, 66 I/O, 100-TQFP | Intel / Altera
Référence : EP1K10TC100-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $27.8 | $2 780,00 |
| 500 | $23.1 | $11 550,00 |
| 1 000 | $19.95 | $19 950,00 |
EP1K10TC100-3N Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die, enabling the implementation of arbitrary digital circuits without mask or tooling costs. Within the broader taxonomy of integrated circuits, FPGAs sit alongside CPLDs, microcontrollers, and ASICs as a flexible alternative to fixed-function logic. The ACEX-1K family specifically delivers low-cost system-on-a-programmable-chip (SOPC) integration, combining dedicated embedded array blocks (EABs) for memory and specialized logic functions with a general-purpose logic array. This hierarchy makes ACEX-1K parts an intermediate-density choice between small CPLDs and high-density Stratix-class FPGAs.
Key features of the EP1K10TC100-3N include 72 Logic Array Blocks (LABs), built-in Joint Test Action Group (JTAG) boundary-scan test circuitry compliant with IEEE Std. 1149.1-1990, dual-port EAB memory for efficient FIFO and RAM implementation, and PCI Local Bus Specification Revision 2.2 compliance at 5.0 V operation. The device supports in-system programmability via configuration devices or the JTAG port, eliminating the need for external boot PROMs in many designs. The TQFP-100 footprint provides a 14 mm × 14 mm body suitable for cost-sensitive through-hole-style surface-mount assembly.
From an architectural perspective, the EP1K10TC100-3N arranges its 576 logic elements into 72 LABs of 8 elements each, with each element containing a 4-input look-up table, a programmable register, and dedicated carry chain logic for arithmetic functions. The embedded array blocks (EABs) implement dual-port RAM, ROM, or specialized megafunctions, providing up to 12,288 bits of fast on-chip memory. The 0.22 µm CMOS process and 2.5 V core reduce dynamic power relative to older 5 V FPGAs while maintaining TTL-compatible I/O through PCI-compliant drivers.
Typical applications include PCI bus interface glue logic, low-volume prototyping of digital signal processing pipelines, industrial control state machines, glue logic for embedded microprocessor systems, and legacy design maintenance. The 66 user I/Os and 12 Kb of embedded memory are well matched to glue-logic bridges, custom peripheral controllers, and small DSP front-ends.
When designing with this part, engineers should note that the ACEX-1K family has been superseded by Cyclone-series FPGAs in modern designs. The Quartus design tool (versions up to 13.0) supports this device, but new development should consider Cyclone II/III for active lifecycle status and improved power efficiency.
This page synthesizes distributor pricing, drop-in alternatives within the ACEX-1K family, and practical design notes not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1K10TC100-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10TC100-3N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10TC100-3
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K10TC100-2N
✅ Remplacement direct✓ En stock
$8.25 / unité
Voir la fiche technique →EP1K10TC100-1N
✅ Remplacement direct✓ En stock
$9.2 / unité
Voir la fiche technique →EP1K10TC100-2
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EP1K10TC100-2NGZ
✅ Remplacement direct✓ En stock
$17.8 / unité
Voir la fiche technique →EP1K10TC100-3N Valeurs maximales et caractéristiques électriques
| Series | ACEX-1K |
| Family | ACEX 1K |
| Manufacturer | Intel (formerly Altera) |
| Typical Gate Count | 10,000 gates |
| Logic Elements (Cells) | 576 |
| Embedded Memory (EAB) | 12,288 bits |
| Number of LABs | 72 |
| User I/O Count | 66 |
| Operating Voltage (Core) | 2.5 V |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Clock Frequency | 200 MHz |
| Speed Grade | -3 (commercial) |
| Boîtier | 100-pin TQFP |
| JTAG Support | Yes (IEEE 1149.1-1990) |
| PCI Compliance | PCI Local Bus Specification Revision 2.2 (5.0 V) |
| Configuration | JTAG / serial configuration device |
Configuration des broches de EP1K10TC100-3N
| Broche 1 | GND — Ground |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | I/O — User I/O pin |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | GND — Ground |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | VCCINT — Core supply voltage (2.5 V) |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | GND — Ground |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | GND — Ground |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | VCCINT — Core supply voltage (2.5 V) |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | GND — Ground |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | GND — Ground |
| Broche 91 | TDI — JTAG Test Data In |
| Broche 92 | TMS — JTAG Test Mode Select |
| Broche 93 | TCK — JTAG Test Clock |
| Broche 94 | nCONFIG — Configuration control (active low) |
| Broche 95 | nSTATUS — Configuration status (active low) |
| Broche 96 | CONF_DONE — Configuration done indicator |
| Broche 97 | DCLK — Configuration clock input |
| Broche 98 | DATA0 — Configuration data input |
| Broche 99 | TDO — JTAG Test Data Out |
| Broche 100 | VCCIO — I/O supply voltage (3.3 V or 5.0 V) |
Applications typiques
EP1K10TC100-3N convient pour 6 applications: PCI Bus Interface Glue Logic, Industrial Control State Machine, Legacy DSP Front-End Pipeline, Embedded Microprocessor Glue Logic, Telecom Line-Card Interface, Test & Measurement Custom Pattern Generator.
PCI Bus Interface Glue Logic
The EP1K10TC100-3N is purpose-built for PCI Local Bus Specification Revision 2.2 glue logic at 5.0 V operation, where its 66 user I/Os provide enough headroom for 32-bit PCI address/data plus command/byte-enable signals. The device's 200 MHz internal clock and 0.7 ns pin-to-pin logic delay are sufficient to meet PCI 33 MHz timing with comfortable margin. Designers typically implement address decoding, bus arbitration, interrupt steering, and configuration-space register logic in this FPGA, pairing it with a host CPU and PCI bus drivers. Unlike larger FPGAs, the ACEX-1K 10K-gate density is right-sized for PCI bridge glue without burning die cost on unused logic.
Recommandé
Industrial Control State Machine
The EP1K10TC100-3N fits industrial control state-machine applications because its 576 logic elements and 72 LABs comfortably implement multi-state controllers for motor sequencing, conveyor coordination, and sensor-fusion glue logic. The device's 12,288 bits of embedded EAB memory provide dual-port RAM for state-history logging and PID coefficient storage without consuming external SRAM. PCI compliance at 5 V is useful when the controller must handshake with legacy industrial PCs. Designers should note the commercial speed grade -3 supports 0-70 °C operation; for factory-floor temperature ranges the industrial-grade TI variant is recommended.
Recommandé
Legacy DSP Front-End Pipeline
The EP1K10TC100-3N serves as a low-volume DSP front-end pipeline for prototyping custom FIR filters, sample-rate converters, and FFT pre-processors. Its 200 MHz internal clock and embedded multiplier support (via megafunctions) handle audio-bandwidth DSP tasks. The 12 Kb of EAB dual-port RAM acts as a sample buffer between ADC and DSP core, while the 66 user I/Os connect to parallel ADCs/DACs and a host microcontroller. Although modern Cyclone-series FPGAs offer higher DSP density, the EP1K10TC100-3N remains adequate for narrow-bandwidth audio, ultrasonic, and vibration-analysis prototypes.
Recommandé
Embedded Microprocessor Glue Logic
The EP1K10TC100-3N acts as a flexible glue-logic bridge between microprocessors, memory, and peripherals in embedded systems, decoding address ranges, generating wait-states, and arbitrating DMA channels. Its 66 user I/Os handle address, data, and control buses for 8/16-bit MCU integration, and the embedded EABs can implement small FIFOs between UARTs, SPI, and I2C peripherals. PCI compliance is valuable when bridging to PC/104 or CompactPCI embedded stacks. The 0.22 µm CMOS process provides reasonable power efficiency for always-on embedded controllers.
Recommandé
Telecom Line-Card Interface
The EP1K10TC100-3N is well-suited to telecom line-card interfaces where TDM (time-division multiplexed) data streams must be framed, de-framed, and forwarded to a backplane. Its 200 MHz internal clock supports E1/T1 framing at full rate, and the embedded EABs implement small elastic buffers for clock-domain crossing. PCI compliance enables direct connection to telecom backplane processors. The 100-pin TQFP package simplifies thermal management in dense line-card shelves where larger BGA FPGAs would complicate rework.
Recommandé
Test & Measurement Custom Pattern Generator
The EP1K10TC100-3N enables custom digital pattern generators in test-and-measurement equipment, where its 200 MHz clock drives parallel stimulus patterns to DUTs (devices under test) and its 66 I/Os provide enough channels for 32-bit data plus 8-bit control. The embedded EABs store multiple test vectors and the logic array implements algorithmic pattern generators (LFSRs, counting sequences). JTAG boundary-scan support (IEEE 1149.1-1990) allows integration into ATE test programs. For production ATE, modern Cyclone FPGAs offer higher pattern depth, but for legacy ATE racks this part remains a cost-effective controller.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10TC100-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10TC100-3 | EP1K10TC100-2N | EP1K10TC100-1N | EP1K10TC100-2 | EP1K10TC100-2NGZ |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Typical Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Embedded Memory | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
| User I/Os | 66 | 66 | 66 | 66 | 66 | 66 |
| Speed Grade | -3 (fastest) | -3 (same) | -2 (~25% slower) | -1 (~30% slower) | -2 (~25% slower) | -2 (~25% slower) |
| RoHS Compliance | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (GZ suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Fastest speed grade in the ACEX-1K 100-TQFP family (vs EP1K10TC100-2N)
- PCI Local Bus 2.2 compliance at 5.0 V (vs EP1K10QC208-3N)
- RoHS-compliant lead finish (N suffix) (vs EP1K10TC100-3)
Notes de conception
The EP1K10TC100-3N requires two supply rails: VCCINT at 2.5 V for the core logic and VCCIO at 3.3 V or 5.0 V for the I/O banks. PCI 5.0 V compliance requires VCCIO = 5.0 V; for general-purpose 3.3 V logic, set VCCIO = 3.3 V. Per the ACEX-1K datasheet, decoupling requires at least one 0.1 µF ceramic capacitor per VCCINT pin and one 0.1 µF ceramic capacitor per VCCIO pin, plus bulk 100 µF tantalum or 220 µF aluminum polymer caps on each rail. Place all decoupling within 5 mm of the respective supply pin to minimize inductive voltage spikes during simultaneous switching of the 66 I/Os.
The 100-pin TQFP package has a 0.5 mm lead pitch and a 14 mm × 14 mm body. Per ACEX-1K layout guidelines, all signal traces should be 0.15 mm wide with 0.15 mm spacing on a 4-layer PCB with continuous ground and power planes on the inner layers. Pin 1 of the TQFP is identified by the dot marker on the top surface and the chamfered edge of the package; orient the dot toward the board edge for easiest inspection. Keep JTAG traces (TDI, TMS, TCK, TDO) short (< 50 mm) and impedance-matched where possible to avoid boundary-scan test failures.
Three common pitfalls when designing with the EP1K10TC100-3N: (1) Confusing speed grades - the -3 is the FASTEST grade; -2 and -1 are slower. Always specify the suffix correctly, as -1N will not meet timing in designs that require -3 grade. (2) Mixing VCCIO voltages - setting VCCIO = 5.0 V enables PCI compliance but also enables 5 V tolerance on all I/Os; setting VCCIO = 3.3 V disables PCI compliance. Verify your bus voltage before assembly. (3) The non-N suffix variant (EP1K10TC100-3) uses a SnPb lead finish that is NOT RoHS compliant - use EP1K10TC100-3N for RoHS-compliant production.
Informations de conformité
RoHS compliance inferred from 'N' suffix in part number per Altera/Intel part numbering convention. The ACEX 1K family is not AEC-Q100 qualified and is not designed for automotive safety-critical applications. Operating temperature range and REACH compliance are not stated in the retrieved distributor metadata.