EP1K30TC144-2 - 30K Gate ACEX 1K FPGA, 144-TQFP | Intel
Référence : EP1K30TC144-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.75 | $287,50 |
| 100 | $24.95 | $2 495,00 |
| 500 | $21.2 | $10 600,00 |
| 1 000 | $18.4 | $18 400,00 |
EP1K30TC144-2 Présentation
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device whose logic fabric, routing, and I/O cells are defined by a user-supplied bitstream rather than at the wafer fab. FPGAs sit at the top of the programmable logic hierarchy (PAL -> CPLD -> FPGA) and combine coarse-grained logic blocks, distributed SRAM, and dedicated DSP/memory blocks, allowing one silicon device to emulate anything from a glue-logic bridge to a complete processor subsystem. ACEX 1K is the entry-level low-cost FPGA family from Intel (formerly Altera), positioned between simple CPLDs and high-density Cyclone-series devices, and it implements each logic element as a 4-input LUT with dedicated carry chain.
Key features of the EP1K30TC144-2 include dual-port embedded array blocks (EABs) that can be configured as ROM, single-port RAM, dual-port RAM, or FIFO without consuming logic resources, in-circuit reconfigurability via the passive serial configuration scheme, support for LVTTL, LVCMOS, and PCI I/O standards, and JTAG boundary-scan testability compliant with IEEE 1149.1. The "-2" speed grade corresponds to the faster of the two commercial speed grades offered for this family, and the "TC" package code designates a 144-pin Thin Quad Flat Pack (TQFP) with commercial temperature grading.
From a system-design perspective, the EP1K30TC144-2 architecture combines a continuous interconnect network with predictable routing delays, allowing timing closure on legacy 5 V and 3.3 V boards. Embedded array blocks (EABs) provide dedicated dual-port SRAM up to 16 Kbits each, suitable for small FIFOs and register files. The device supports in-system programming through JTAG or a serial configuration PROM (EPC1/EPC2 family), making it a flexible prototype-to-production bridge.
Typical applications include bridge and glue logic between microprocessors and peripherals, custom I/O expansion for microcontrollers and DSPs, low-volume prototyping of digital designs, industrial control and instrumentation front-ends, and legacy system re-implementation where pin-compatible, low-density FPGAs are required to replace discrete TTL/CMOS logic.
When designing with the EP1K30TC144-2, designers must observe the 2.5 V VCCINT requirement and use of level-translation buffers if interfacing with 3.3 V or 5 V logic, although the I/O banks natively support LVTTL/LVCMOS signalling. Bitstream storage in an external PROM or flash is mandatory because the SRAM-based configuration memory is volatile.
This page synthesizes ACEX 1K family datasheet parameters, drop-in compatible Intel/Altera variants from the same TC144 footprint, and practical design notes not found in the standalone datasheet PDF.
Alternatives de remplacement direct pour EP1K30TC144-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K30TC144-2 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Configuration Method, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K30TC144-1
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EP1K30TC144-3
✅ Remplacement direct✓ En stock
$10.8 / unité
Voir la fiche technique →EP1K30TC144-2N
✅ Remplacement direct✓ En stock
$21.95 / unité
Voir la fiche technique →EP1K10TC144-2
✅ Remplacement direct✓ En stock
$11.9 / unité
Voir la fiche technique →EP1K100QC208-2
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EP1C6T144C8
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →EP1K30TC144-2 Valeurs maximales et caractéristiques électriques
| Family | ACEX 1K |
| Logic Elements / Cells | 1,728 |
| System Gates | 30,000 |
| Logic Array Blocks (LABs) | 216 |
| User I/Os | 102 |
| Embedded Array Blocks (EABs) | 6 |
| Total EAB Memory | 24,576 bits |
| Process Technology | 0.22 µm SRAM LUT |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V - 2.625 V) |
| I/O Supply Voltage (VCCIO) | 3.3 V (LVTTL/LVCMOS), 2.5 V, or PCI |
| Maximum Internal Clock Frequency | 200 MHz |
| Boîtier | 144-pin TQFP (TC) |
| Operating Temperature (Commercial) | 0C to +70C |
| Type de montage | Surface Mount |
| Configuration Method | Passive Serial / JTAG / EPC1/EPC2 PROM |
| Speed Grade | -2 (mid commercial speed grade) |
Guide de configuration des broches du EP1K30TC144-2 144-pin tqfp (tc)
Configuration des broches du EP1K30TC144-2 (boîtier 144-pin tqfp (tc)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1K30TC144-2.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1K30TC144-2 convient pour 6 applications: Bridge and Glue Logic Replacement, Industrial Control Front-End Logic, Legacy ASIC Replacement for Low-Volume Production, Custom I/O Expansion for Microcontrollers/DSPs, Low-Volume Prototype and Educational Platform, Medical Device Interface and Signal Conditioning Logic.
Bridge and Glue Logic Replacement
The EP1K30TC144-2 is well-suited to replacing clusters of discrete 74-series TTL or CMOS glue logic on legacy boards, where its 1,728 logic cells and 24 Kbits of dual-port EAB SRAM let one device absorb address decoding, bus arbitration, register banks, and small FIFOs that previously required a dozen or more SSI/MSI parts. The 144-pin TQFP gives 102 user I/Os - enough to swallow wide address and data buses plus interrupt and control lines - while the 200 MHz -2 speed grade meets the timing budget of legacy 33 MHz-66 MHz peripheral interfaces. Designers migrate glue-logic boards to ACEX 1K to reduce PCB area, cut BOM cost, and gain the ability to iterate logic via in-system JTAG reprogramming instead of wire-wrap rework.
Recommandé
Industrial Control Front-End Logic
In industrial PLC and instrumentation front-ends, the EP1K30TC144-2 is used to consolidate encoder counters, pulse-width modulation, and custom serial protocol handlers into a single reprogrammable part. Its 2.5 V core with 3.3 V-tolerant LVTTL/LVCMOS I/Os interfaces directly to industrial-grade ADCs, optoisolated digital inputs, and RS-485 transceivers, while the 0 to +70 °C commercial operating range matches the typical enclosure ambient of a control cabinet. The 200 MHz internal clock supports fast servo-loop timing and deterministic protocol decoding, and the 102 user I/Os handle many parallel sensor channels without external bus expanders. JTAG-based in-system programming lets the same hardware ship with multiple firmware personalities for different machine variants.
Recommandé
Legacy ASIC Replacement for Low-Volume Production
When a legacy ASIC reaches end-of-life and the production volume does not justify a full mask re-spin, the EP1K30TC144-2 is a frequent substitute. With 30,000 system gates and 24 Kbits of EAB memory, it can emulate the gate-plus-memory content of many late-1990s/early-2000s ASICs, and its 144-pin TQFP footprint is compatible with the pin count of typical 144-pin PQFP ASIC packages. Designers use the Altera/Intel Quartus II toolchain (legacy version supporting ACEX 1K) to retarget the RTL, and the JTAG port enables field upgrades without board rework. The 2.5 V core maps cleanly to the 2.5 V I/O libraries common to ASIC libraries of that era.
Recommandé
Custom I/O Expansion for Microcontrollers/DSPs
The EP1K30TC144-2 commonly expands the limited GPIO count of microcontrollers or DSPs by acting as a programmable peripheral, exposing custom interfaces (PWM generators, quadrature decoder, I2S, parallel camera) over a memory-mapped bus. With 102 user I/Os and LVCMOS-compatible I/O banks, the device can directly fan out to 7-segment displays, keypad matrices, LCD panels, and LED drivers without intermediate buffers. The 6 EABs (24 Kbits total) double as small FIFO buffers between the processor and high-speed data streams, smoothing DMA bursts. The 200 MHz internal clock allows 40 MHz parallel I/O rates when interfacing to mid-speed peripherals.
Recommandé
Low-Volume Prototype and Educational Platform
The EP1K30TC144-2 sits at a friendly complexity point for university digital-logic courses and rapid prototypes: large enough to host a 16-bit CPU soft-core, small enough to fit a single semester lab. Its 30,000-gate capacity supports classic teaching examples such as UART controllers, simple RISC cores, VGA-timing generators, and state-machine demonstrators, while the 102 I/Os provide enough pins for student breadboard-style header arrays. The 2.5 V core voltage teaches important modern-power-rail lessons, and the JTAG-based programming flow exercises the same skills used in professional FPGA design.
Recommandé
Medical Device Interface and Signal Conditioning Logic
In medical instrumentation front-ends (ultrasound beam-formers, patient monitor signal paths, lab analyzers), the EP1K30TC144-2 functions as a customizable logic layer between analog front-end ICs and the host processor. Its dual-port EABs (24 Kbits total) allow simultaneous read/write access from the host and the FPGA logic, which is ideal for sample-rate-conversion FIFOs and digital decimation filters. The 200 MHz clock budget supports decimation/interpolation at audio and low-IF sample rates, while the 144-pin TQFP gives enough I/Os for parallel ADC/DAC buses and trigger lines. Medical designs qualify the device under IEC 60601-1 and use the JTAG port for secure in-field firmware updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K30TC144-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K30TC144-1 | EP1K30TC144-3 | EP1K30TC144-2N | EP1K10TC144-2 | EP1C6T144C8 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-144 | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same) | TQFP-144 (same body, different pinout) |
| Family | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | ACEX 1K | Cyclone |
| Speed Grade | -2 | -1 (slower) | -3 (slowest) | -2 (same) | -2 (same) | -8 (Cyclone grading) |
| Logic Cells | 1,728 | 1,728 | 1,728 | 1,728 | 576 | 5,980 |
| System Gates | 30,000 | 30,000 | 30,000 | 30,000 | 10,000 | ~20,000 |
| User I/Os | 102 | 102 | 102 | 102 | 92 | 98 |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 1.5 V (Cyclone, not drop-in core voltage) |
| Embedded Memory (bits) | 24,576 (6 EABs) | 24,576 | 24,576 | 24,576 | 12,288 | 92,160 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
Principaux différenciateurs
- Mid-range speed grade of the ACEX 1K family (vs EP1K30TC144-1)
- Lead-free factory finish option (vs EP1K30TC144-2 (standard))
- Largest ACEX 1K capacity in TQFP-144 (vs EP1K10TC144-2)
Notes de conception
The EP1K30TC144-2 requires a clean 2.5 V core supply at 2.375 V - 2.625 V. Use a dedicated LDO (TPS7A4525 or equivalent) with at least 200 mA headroom, plus 10 µF + 0.1 µF decoupling placed within 5 mm of each VCCINT pin. VCCIO banks must be tied to 3.3 V for LVTTL/LVCMOS or 2.5 V for 2.5 V I/O standards; mixing VCCIO levels between banks is permitted but unbonded banks must still be powered. Estimated: with 1,728 cells at ~30% utilization, ICCINT ≈ 30-50 mA static and ICCINT ≈ 200-300 mA at 200 MHz toggle.
TQFP-144 has 0.5 mm pitch gull-wing leads - the PCB pad pattern must be per IPC-7351 nominal with 0.27 mm pad width and 1.6 mm pad length. Use microvia-in-pad if the design passes signal-integrity simulation, otherwise standard through-hole pads with tented vias. Route all 8 GND pins to a continuous ground pour directly under the package, and place 4-8 GND vias around the perimeter to stitch the top and bottom ground planes. JTAG TCK should be length-matched within ±25 mm across the four JTAG signals to avoid boundary-scan failures.
Three pitfalls are common on ACEX 1K designs: (1) Bitstream storage is volatile, so a configuration PROM (EPC2LC20 or EPC4) is mandatory - power-up without configuration causes the device to enter high-impedance with all I/Os tristated. (2) The MSEL[2:0] pins must be tied to VCCINT/GND to select configuration mode; floating MSEL pins is undefined and typically causes configuration failure. (3) I/O bank VCCIO must match the LVTTL/LVCMOS/PCI standard used in that bank - mixing 3.3 V and 2.5 V on the same bank damages the I/O cells over time. Always check the device errata document before final layout.
At 200 MHz internal clock, signals leaving the TQFP should be series-terminated at the source with 33 Ω resistors when the trace length exceeds one-quarter of the rise time (typically > 50 mm for 5 ns edges). Use a 4-layer PCB with continuous ground plane beneath the TQFP to control impedance to 50 Ω ±10%. Differential pairs (LVDS, when supported via external resistors) should be length-matched within ±0.5 mm. Keep JTAG traces away from clock edges and add a 4.7 kΩ pull-up on TCK to keep the JTAG state machine in a defined idle condition.
Informations de conformité
ACEX 1K family predates strict RoHS enforcement - exact compliance depends on factory lot date code. The -2N suffix indicates lead-free finish for parts so marked. Reach, halogen, and conflict-minerals status not available in current data sources; consult CoC from distributor.
