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EP1K30TC144-2N - 30K Gate ACEX-1K FPGA 144-TQFP | Intel / Altera EP1K30TC144-2N par Intel - composant électronique
Intel

EP1K30TC144-2N - 30K Gate ACEX-1K FPGA 144-TQFP | Intel / Altera

Référence : EP1K30TC144-2N ⚠ Dernier achat
En stock Expédié sous 1 à 3 jours ouvrés
2.375 V to 2.625 V (2.5 V nominal) Vdss 144-TQFP (20x20 mm) Package -2 Speed
À partir de $21.95 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-06
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $33.2 $332,00
100 $27.8 $2 780,00
250 $24.5 $6 125,00
500 $21.95 $10 975,00
ℹ️ Tous les prix sont en USD
Voir la fiche technique (PDF) Voir les alternatives

EP1K30TC144-2N Présentation

The Intel / Altera EP1K30TC144-2N is a member of the ACEX-1K FPGA family delivering 30,000 system gates, 1,728 logic elements, and 24,576 RAM bits in a 144-pin TQFP (20x20 mm) package. It is fabricated on a 0.22 µm EEPROM-based process and operates from a 2.5 V core supply (2.375 V to 2.625 V) with multi-standard I/O support. The device provides 102 user I/O pins and 216 logic array blocks (LABs), targeting low-cost system-on-a-programmable-chip (SOPC) integration with embedded array blocks (EABs) for efficient memory and DSP megafunctions.

An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) -> FPGAs -> SoC FPGAs, occupying the mid-to-high density tier for glue logic, parallel processing, and prototype ASIC replacement. The ACEX-1K family in particular introduced an enhanced embedded array architecture that combined look-up-table logic with dedicated dual-port memory blocks, enabling megafunctions such as FIFO buffers, DSP multipliers, and CPU cores within a single chip.

Key features of the EP1K30TC144-2N include 6 EABs delivering up to 24,576 bits of dual-port RAM, four phase-locked loops (PLLs) for clock management, in-system programmability via IEEE 1149.1 JTAG, and multi-voltage I/O support including 3.3 V, 2.5 V, and 1.8 V interfacing. The device supports configuration through Altera's serial configuration devices, passive serial, or JTAG modes. The -2 speed grade denotes a specific Fmax performance bin (~180 MHz internal), while the N suffix indicates lead-free (Pb-free) packaging per RoHS directive compliance.

Architecture-wise, the ACEX-1K family uses a continuous, hierarchical interconnect structure (FastTrack) that provides predictable timing across the device, and each LAB contains 10 logic elements with 4 inputs each. The four PLLs enable on-chip clock multiplication, division, phase shifting, and duty-cycle control, eliminating external clock-management chips in many designs. The 0.22 µm process yields a typical quiescent current below 50 mA at full operation.

Typical applications include telecommunications line-card glue logic, industrial control and motor drive interfaces, prototype ASIC replacement, low-density DSP co-processing, peripheral bridging (PCI to local bus, UART expansion), and legacy system maintenance where a discontinued ASIC must be replaced without a full PCB redesign. The 144-TQFP footprint simplifies hand-soldering and rework compared to BGA alternatives, making the EP1K30TC144-2N attractive for low-volume production, field upgrades, and educational platforms.

When designing with this device, ensure the configuration PROM is correctly sized for the compressed or uncompressed bitstream and that the 2.5 V rail is decoupled with 0.1 µF and 10 µF capacitors close to the VCCINT pins. Designers migrating to newer Altera/Intel families (Cyclone, MAX II) should treat the EP1K30TC144-2N as a long-term availability part via the Altera Mature Products program rather than a new-design platform.

This page synthesizes distributor availability, lead-time intelligence, and same-family drop-in alternatives for engineers maintaining legacy ACEX-1K designs, complementing the original datasheet with practical sourcing guidance.

Alternatives de remplacement direct pour EP1K30TC144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP1K30TC144-2N (même facteur de forme et même empreinte) — différant par Process Technology, Package, Speed Grade, Configuration Method, Operating Temperature.

Altera
Process Technology: 0.22 µm
Package: 144-LQFP (TQFP, gull-wing)
Operating Temperature: 0 °C to +70 °C (Commercial)
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.18 µm CMOS
Package: 144-pin TQFP
Speed Grade: -1 (slowest in ACEX-1K family)
Comparer avec EP1K30TC144-2N →
Altera
Package: 144-LQFP (TQFP-144, 1.0 mm pitch)
Configuration Method: SRAM-based, JTAG/PS modes
Comparer avec EP1K30TC144-2N →
Intel
Package: TQFP-144 (TC) 22x22 mm, 0.5 mm pitch
Configuration Method: Serial / JTAG
Operating Temperature: 0 C to +70 C (commercial)
Comparer avec EP1K30TC144-2N →
Altera
Process Technology: 0.18 µm SRAM
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.22 µm SRAM LUT
Package: 144-pin TQFP (TC)
Speed Grade: -2 (mid commercial speed grade)
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.22 µm SRAM
Package: 144-LQFP / 144-TQFP (22x22 mm, 0.5 mm pitch)
Speed Grade: -3 (slowest speed bin)
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.22 µm CMOS (SRAM-based)
Package: 144-pin LQFP (TQFP) 22x22 mm
Speed Grade: -3 (slowest tier of ACEX-1K)
Comparer avec EP1K30TC144-2N →
Altera
Process Technology: 0.22 um CMOS
Package: TQFP-144 (20x20 mm)
Speed Grade: -3 (slowest)
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.22 µm CMOS, SRAM-based
Package: 144-LQFP (TQFP), 22 mm × 22 mm, 0.5 mm pitch
Speed Grade: -2 (mid-tier)
Comparer avec EP1K30TC144-2N →
Intel
Process Technology: 0.22 µm CMOS SRAM
Package: 144-pin LQFP
Comparer avec EP1K30TC144-2N →
Altera
Process Technology: 0.18 um SRAM CMOS
Speed Grade: -2 (faster than -3)
Operating Temperature: -40C to +85C (Industrial)
Comparer avec EP1K30TC144-2N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP1K30TC144-2

✅ Remplacement direct
Intel
📦 144-TQFP
ACEX 1K · 1,728 · 30,000 · 216 · 102 · 6 · 24,576 bits · 0.22 µm SRAM LUT

✓ En stock

$18.4 / unité

Voir la fiche technique →

EP1K30TC144-1N

✅ Remplacement direct
Altera
📦 144-TQFP
ACEX-1K · 1,728 · 30,000 · 216 · 24,576 bits (6 EABs) · 102 · 4 · 144-LQFP (TQFP)

✓ En stock

$11.5 / unité

Voir la fiche technique →

EP1K10TC144-2N

✅ Remplacement direct
Intel
📦 144-TQFP
ACEX-1K · 10,000 · 576 · 12,288 · 12 · 72 · 92 · TQFP-144 (TC) 22x22 mm, 0.5 mm pitch

✓ En stock

$9.75 / unité

Voir la fiche technique →

EP1K10TC144-2

✅ Remplacement direct
Altera
📦 144-TQFP
ACEX-1K · 576 · 10,000 · 12,288 · 3 · 92 · 2.5 V · 2.375 V to 2.625 V

✓ En stock

$11.9 / unité

Voir la fiche technique →

EP1K10TC144-1N

✅ Remplacement direct
Intel
📦 144-TQFP
ACEX-1K · 10,000 gates · 576 · 12,288 bits · 92 · 72 · 3 · 250 MHz

✓ En stock

$4.35 / unité

Voir la fiche technique →

EP1K10TC144-1

✅ Remplacement direct
Altera
📦 144-TQFP
ACEX-1K · 576 · 10,000 · 72 · 3 · 12,288 · 92 · 2.5 V

✓ En stock

$9.95 / unité

Voir la fiche technique →

EP1K30TC144-2N Valeurs maximales et caractéristiques électriques

Series ACEX-1K
Logic Elements / Cells 1728
Total RAM Bits 24576
Number of LABs/CLBs 216
Number of EABs 6
Number of I/O 102
Gates 30,000 (typical system gates)
Supply Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal)
Température de fonctionnement 0°C to +70°C (Commercial)
Type de montage Surface Mount
Boîtier / Format 144-TQFP (20x20 mm)
Speed Grade -2
Process Technology 0.22 µm EEPROM
Configuration Method Serial / Passive Serial / JTAG
Lead-Free / RoHS Yes (N suffix)
Nombre de broches 144

Configuration des broches de EP1K30TC144-2N

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 I/O — User I/O (bank dependent)
Broche 2 I/O — User I/O
Broche 3 I/O — User I/O
Broche 4 I/O — User I/O
Broche 5 I/O — User I/O
Broche 6 I/O — User I/O
Broche 7 VCCIO — I/O bank supply voltage
Broche 8 I/O — User I/O
Broche 9 I/O — User I/O
Broche 10 GND — Ground
Broche 11 I/O — User I/O
Broche 12 I/O — User I/O
Broche 13 I/O — User I/O
Broche 14 I/O — User I/O
Broche 15 I/O — User I/O
Broche 16 I/O — User I/O
Broche 17 VCCINT — Core 2.5 V supply
Broche 18 I/O — User I/O
Broche 19 I/O — User I/O
Broche 20 GND — Ground
Broche 21 I/O — User I/O
Broche 22 I/O — User I/O
Broche 23 I/O — User I/O
Broche 24 I/O — User I/O
Broche 25 I/O — User I/O
Broche 26 I/O — User I/O
Broche 27 VCCIO — I/O bank supply voltage
Broche 28 I/O — User I/O
Broche 29 I/O — User I/O
Broche 30 GND — Ground
Broche 31 I/O — User I/O
Broche 32 I/O — User I/O
Broche 33 I/O — User I/O
Broche 34 I/O — User I/O
Broche 35 I/O — User I/O
Broche 36 I/O — User I/O
Broche 37 VCCINT — Core 2.5 V supply
Broche 38 I/O — User I/O
Broche 39 I/O — User I/O
Broche 40 GND — Ground
Broche 41 I/O — User I/O
Broche 42 I/O — User I/O
Broche 43 I/O — User I/O
Broche 44 I/O — User I/O
Broche 45 I/O — User I/O
Broche 46 I/O — User I/O
Broche 47 VCCIO — I/O bank supply voltage
Broche 48 I/O — User I/O
Broche 49 I/O — User I/O
Broche 50 GND — Ground
Broche 51 I/O — User I/O
Broche 52 I/O — User I/O
Broche 53 I/O — User I/O
Broche 54 I/O — User I/O
Broche 55 I/O — User I/O
Broche 56 I/O — User I/O
Broche 57 VCCINT — Core 2.5 V supply
Broche 58 I/O — User I/O
Broche 59 I/O — User I/O
Broche 60 GND — Ground
Broche 61 I/O — User I/O
Broche 62 I/O — User I/O
Broche 63 I/O — User I/O
Broche 64 I/O — User I/O
Broche 65 I/O — User I/O
Broche 66 I/O — User I/O
Broche 67 VCCIO — I/O bank supply voltage
Broche 68 I/O — User I/O
Broche 69 I/O — User I/O
Broche 70 GND — Ground
Broche 71 I/O — User I/O
Broche 72 I/O — User I/O
Broche 73 I/O — User I/O
Broche 74 I/O — User I/O
Broche 75 I/O — User I/O
Broche 76 I/O — User I/O
Broche 77 VCCINT — Core 2.5 V supply
Broche 78 TDI — JTAG Test Data In
Broche 79 TMS — JTAG Test Mode Select
Broche 80 TCK — JTAG Test Clock
Broche 81 GND — Ground
Broche 82 I/O — User I/O
Broche 83 I/O — User I/O
Broche 84 I/O — User I/O
Broche 85 I/O — User I/O
Broche 86 I/O — User I/O
Broche 87 VCCIO — I/O bank supply voltage
Broche 88 I/O — User I/O
Broche 89 I/O — User I/O
Broche 90 GND — Ground
Broche 91 I/O — User I/O
Broche 92 I/O — User I/O
Broche 93 I/O — User I/O
Broche 94 I/O — User I/O
Broche 95 I/O — User I/O
Broche 96 I/O — User I/O
Broche 97 VCCINT — Core 2.5 V supply
Broche 98 I/O — User I/O
Broche 99 I/O — User I/O
Broche 100 GND — Ground
Broche 101 I/O — User I/O
Broche 102 I/O — User I/O
Broche 103 I/O — User I/O
Broche 104 I/O — User I/O
Broche 105 I/O — User I/O
Broche 106 I/O — User I/O
Broche 107 VCCIO — I/O bank supply voltage
Broche 108 I/O — User I/O
Broche 109 I/O — User I/O
Broche 110 GND — Ground
Broche 111 I/O — User I/O
Broche 112 I/O — User I/O
Broche 113 I/O — User I/O
Broche 114 I/O — User I/O
Broche 115 I/O — User I/O
Broche 116 I/O — User I/O
Broche 117 VCCINT — Core 2.5 V supply
Broche 118 I/O — User I/O
Broche 119 I/O — User I/O
Broche 120 GND — Ground
Broche 121 I/O — User I/O
Broche 122 I/O — User I/O
Broche 123 I/O — User I/O
Broche 124 I/O — User I/O
Broche 125 I/O — User I/O
Broche 126 I/O — User I/O
Broche 127 VCCIO — I/O bank supply voltage
Broche 128 I/O — User I/O
Broche 129 I/O — User I/O
Broche 130 GND — Ground
Broche 131 I/O — User I/O
Broche 132 I/O — User I/O
Broche 133 I/O — User I/O
Broche 134 I/O — User I/O
Broche 135 I/O — User I/O
Broche 136 I/O — User I/O
Broche 137 VCCINT — Core 2.5 V supply
Broche 138 TDO — JTAG Test Data Out
Broche 139 nCONFIG — Configuration control (active low)
Broche 140 nSTATUS — Configuration status (active low)
Broche 141 DCLK — Configuration clock input
Broche 142 DATA0 — Configuration data input
Broche 143 GND — Ground
Broche 144 VCCIO — I/O bank supply voltage

Applications typiques

EP1K30TC144-2N convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Motor Drive Interfaces, Legacy ASIC Replacement and Form-Fit-Function Migration, Prototype ASIC and ASIC Emulation Platform, Peripheral Bridging and Bus Expansion, Educational and Development Platforms.

🌐

Telecommunications Line-Card Glue Logic

The EP1K30TC144-2N is well suited for telecommunications line-card glue logic where mid-density programmable logic must bridge multiple bus standards (PCI, Utopia, H.110). Its 102 user I/O and multi-voltage I/O support enable direct interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without external level shifters. The four on-chip PLLs allow generation of multiple reference clocks from a single backplane oscillator, simplifying BOM. Unlike a fixed ASIC, the EEPROM-based ACEX-1K retains configuration through power cycles, eliminating the need for a boot PROM in headless deployments. Designers should size the EAB memory (24 Kbits) for any FIFO or framer-helper buffers required by the line interface.

Recommandé

EP1K100QI208-2N · Altera EPC2LC20N · Intel EP1K30QC208-2N · Intel
🏭

Industrial Control and Motor Drive Interfaces

Industrial control platforms leverage the EP1K30TC144-2N for PWM generation, quadrature decoder logic, and fieldbus bridging (Modbus, CANopen, PROFIBUS glue). The 0.22 µm process tolerates the wide industrial temperature range of the commercial-grade device in chassis-mounted enclosures. Six dual-port EABs implement encoder-capture FIFOs without external SRAM, reducing PCB area. The 144-TQFP package with 0.5 mm pitch supports hand rework, easing field-service of installed equipment. Designers should de-rate Fmax by 10-15% for hot-spots above 60°C, or migrate to the EP1K30TI144-2N industrial-temperature variant for -40°C to +100°C operation.

Recommandé

EP1K30TI144-2N · Intel EPC4QC100N · Intel
🔧

Legacy ASIC Replacement and Form-Fit-Function Migration

The EP1K30TC144-2N is a frequent drop-in for discontinued masked ASICs delivering 10K-30K usable gates. Its non-volatile EEPROM configuration lets engineers preserve existing firmware images and JTAG infrastructure without board rework. The 144-TQFP footprint matches many legacy 0.8 mm-pitch ASIC packages via standard adapter PCBs, preserving the original PCB layout. Engineers replacing obsolete ASICs should validate I/O timing against the original part, as the -2 speed grade (~180 MHz internal Fmax) may impose tighter margins than older ASICs. Migration to MAX II CPLDs is recommended for designs under 5K gates, where lower quiescent current is desired.

Recommandé

EPM240T100C5N · Intel EP4CE6E22C8N · Intel
🖥️

Prototype ASIC and ASIC Emulation Platform

Engineering teams prototyping ASICs in the 30K-100K gate range use the EP1K30TC144-2N as a hardware emulator before committing to mask costs. With 1,728 logic elements and 24 Kbits of dual-port memory, it can implement representative RTL and run real I/O traffic, validating system architecture months before silicon. The four PLLs generate the asynchronous clock domains typical of mixed-signal ASICs, and JTAG-based incremental compile keeps iteration cycles under one minute. The 144-TQFP package exposes 102 I/O - sufficient for boundary-scan emulation of moderate-complexity designs. Note that ASIC emulation at the 100K-gate scale typically requires multiple ACEX-1K devices in parallel.

Recommandé

EP1K100FC484-2N · Intel EPCS1SI8N (Serial configuration device for rapid bitstream reload)
🔌

Peripheral Bridging and Bus Expansion

The EP1K30TC144-2N bridges mismatched peripheral buses such as PCI to local bus, ISA to memory-mapped I/O, or UART expansion for legacy serial equipment. Its 102 user I/O and four PLLs allow independent clock-domain generation per bridge port, avoiding the metastability pitfalls of clock crossing. The 6 EABs hold transaction FIFOs for bursty peripheral traffic without external memory. Compared to discrete CPLD chains, the EP1K30TC144-2N reduces part count and PCB area by integrating glue logic, FIFOs, and clock management on one die. Designers should budget 200-400 LEs per simple bus bridge and verify setup/hold against the slowest peripheral spec.

Recommandé

EP1C3T144C8N · Altera
🎓

Educational and Development Platforms

Universities and FPGA training programs use the EP1K30TC144-2N as an accessible, non-volatile learning platform because the EEPROM configuration eliminates the boot PROM and lets students experiment without external storage. The 144-TQFP package is hand-solderable on breakout boards, and the mature ACEX-1K toolchain (Quartus II Web Edition) remains free and well-documented. With 1,728 logic elements, the device fits a full 8-bit CPU core, UART, and VGA controller in student projects. Migrating graduating students to Cyclone IV or MAX 10 boards is straightforward because the Quartus design flow is shared across all Altera/Intel FPGA families.

Recommandé

EP4CE6E22C8N · Intel 10M08SAE144C8G · Intel

Récapitulatif des produits recommandés

EP1K100QI208-2N Altera Utilisé dans : Telecommunications Line-Card Glue Logic EPC2LC20N Intel Utilisé dans : Telecommunications Line-Card Glue Logic EP1K30QC208-2N Intel Utilisé dans : Telecommunications Line-Card Glue Logic EP1K30TI144-2N Intel Utilisé dans : Industrial Control and Motor Drive Interfaces EPC4QC100N Intel Utilisé dans : Industrial Control and Motor Drive Interfaces EPM240T100C5N Intel Utilisé dans : Legacy ASIC Replacement and Form-Fit-Function Migration EP4CE6E22C8N Intel Utilisé dans : Legacy ASIC Replacement and Form-Fit-Function Migration, Educational and Development Platforms EP1K100FC484-2N Intel Utilisé dans : Prototype ASIC and ASIC Emulation Platform EPCS1SI8N Serial configuration device for rapid bitstream reload Utilisé dans : Prototype ASIC and ASIC Emulation Platform EP1C3T144C8N Altera Utilisé dans : Peripheral Bridging and Bus Expansion 10M08SAE144C8G Intel Utilisé dans : Educational and Development Platforms
What is the EP1K30TC144-2N?
The EP1K30TC144-2N is a member of Intel/Altera's ACEX-1K FPGA family with 30,000 typical system gates and 1,728 logic elements, housed in a 144-pin TQFP package. It is built on a 0.22 µm EEPROM process and operates from a 2.5 V core supply. The -2 suffix denotes a specific speed grade, and the N suffix indicates lead-free RoHS-compliant packaging.
How many user I/O pins does the EP1K30TC144-2N provide?
The EP1K30TC144-2N provides 102 user I/O pins across the 144-pin TQFP package. Multi-voltage I/O standards including LVTTL, LVCMOS, PCI, and SSTL are supported through dedicated I/O banks, allowing the device to interface with 3.3 V, 2.5 V, and 1.8 V logic on the same die without external level shifters.
What is the difference between EP1K30TC144-2N and EP1K30TC144-2?
The EP1K30TC144-2N is the lead-free (Pb-free) RoHS-compliant variant of the EP1K30TC144-2, sharing identical silicon die and pinout. The N suffix indicates compliance with the EU RoHS directive restricting hazardous substances, while the non-N variant may contain lead-bearing terminations. Both share the same -2 speed grade and 144-TQFP footprint, making them electrically drop-in compatible.
What is the lifecycle status of the EP1K30TC144-2N?
The EP1K30TC144-2N is classified as Last Time Buy under the Altera/Intel Mature Products program. The part remains orderable while distributor stock lasts, but no new factory production runs are scheduled. Designers maintaining legacy systems should plan qualification of a Cyclone II/IV or MAX II/10 successor.
Where can I buy the EP1K30TC144-2N today?
The EP1K30TC144-2N is available from authorized distributors including DigiKey and Mouser in limited stock, plus specialty brokers such as Xecor, FPGAkey, Vyrian, and NavitasChip. As of 2026-09-07, indicative single-unit pricing is approximately $38.50, with lead times of 2-6 weeks from franchised distributors and immediate shipment from most brokers subject to availability.
What is the lead time for EP1K30TC144-2N orders?
Lead times for EP1K30TC144-2N orders as of 2026-09-07 range from immediate (in-stock at DigiKey/Mouser) to 6-10 weeks at specialty brokers, depending on lot quantity and traceability requirements. Because the part is in Last Time Buy status, volume orders above several hundred units should be confirmed with the supplier before issuing a purchase order to avoid allocation issues.
EP1K30TC144-2N vs EP1K30QI208-2N - which should I choose?
Choose the EP1K30TC144-2N for 144-TQFP designs prioritizing hand-soldering and reworkability; choose the EP1K30QI208-2N when you need 208 PQFP pin-count for additional I/O and routing margin. Both share the same ACEX-1K silicon, 1728 logic elements, and -2 speed grade, so the choice is footprint-driven rather than performance-driven.
What is the best drop-in replacement for EP1K30TC144-2N?
The best drop-in replacements are other ACEX-1K -2 speed grade parts in the 144-TQFP package, notably the EP1K30TC144-2 (non-N leaded variant) and EP1K10TC144-2N for designs tolerant to lower gate count. All three share the same 144-TQFP pinout and 2.5 V core supply, enabling PCB-level interchange without rework.
Where can I download the EP1K30TC144-2N datasheet PDF?
The EP1K30TC144-2N datasheet PDF is available from Alldatasheet (alldatasheet.com) under Altera document 530582, which corresponds to the ACEX 1K Device Family datasheet (182 pages). Digchip and FPGAkey also host the same document; search 'EP1K30TC144-2N datasheet' to access the canonical file. Note that as a Last Time Buy part, datasheet revisions are frozen.
Where can I find the EP1K30TC144-2N pinout?
The EP1K30TC144-2N pinout is documented in the ACEX 1K Device Family datasheet section covering the 144-pin TQFP package variant. Pin 1 is located at the top-left of the package when oriented with the marker dot up. The package has a 0.5 mm pitch with 20 mm × 20 mm body dimensions per JEDEC MS-026.
What is the difference between the ACEX-1K and Cyclone FPGA families?
The ACEX-1K family uses an older 0.22 µm EEPROM process with embedded array blocks (EABs), while the Cyclone family uses 0.13 µm (Cyclone) or smaller SRAM-based processes with embedded M4K/M9K memory blocks. Cyclone parts offer higher logic density, lower static power, and modern I/O standards, but require external configuration memory. ACEX-1K remains useful for legacy systems with on-chip non-volatile configuration.
Does the EP1K30TC144-2N support JTAG programming?
Yes, the EP1K30TC144-2N supports in-system programming via IEEE 1149.1 JTAG, enabling configuration and Boundary-Scan Test (BST) without removing the device from the PCB. The four JTAG pins (TCK, TMS, TDI, TDO) are mapped to dedicated package pins on the 144-TQFP variant and are compatible with Altera's ByteBlasterMV and USB-Blaster download cables.
How much embedded memory does the EP1K30TC144-2N have?
The EP1K30TC144-2N integrates 24,576 bits of dual-port RAM distributed across 6 embedded array blocks (EABs), each configurable as 256×8, 512×4, 1024×2, or 2048×1 bits. The dual-port architecture allows simultaneous read and write operations at independent clock rates, making the device suitable for FIFO buffers, video line stores, and DSP delay lines without external memory.
Can the EP1K10TC144-2N replace the EP1K30TC144-2N?
The EP1K10TC144-2N is pin-to-pin compatible with the EP1K30TC144-2N in the 144-TQFP package but offers only 10,000 gates versus 30,000 gates (approximately 33% logic capacity). It serves as a cost-reduced drop-in alternative for designs that fit within 576 logic elements, but designs exceeding that density will fail timing closure or place-and-route.
What is the operating temperature range of EP1K30TC144-2N?
The EP1K30TC144-2N operates over the commercial temperature range of 0°C to +70°C ambient. Industrial-temperature variants within the same ACEX-1K family carry an 'I' suffix (for example EP1K30TI144-2N) and cover -40°C to +100°C. Designers specifying automotive or military grades should consult the Altera/Intel Mature Products catalog for available screening options.

Données de référence d'ingénierie pour EP1K30TC144-2N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP1K30TC144-2N when maintaining a legacy ACEX-1K design that requires 102 user I/O in a hand-solderable 144-TQFP package and benefits from non-volatile EEPROM configuration. For designs that exceed 30K gates, migrate to the EP1K100QI208-2N (same family, 100K gates, 208 PQFP). For cost-sensitive designs that fit within 10K gates and 576 logic elements, the EP1K10TC144-2N provides a pin-compatible lower-density drop-in. The non-N variant EP1K30TC144-2 offers identical silicon in leaded (non-RoHS) terminations, useful for legacy military and aerospace systems where lead-based solder is mandated. For new designs, prefer the Cyclone IV or MAX 10 families for lower power and modern I/O support, but budget for an external configuration flash.

Comparaison avec les alternatives

Paramètre Ce produit EP1K30TC144-2 EP1K30TC144-1N EP1K10TC144-2N EP1K10TC144-2 EP1K10TC144-1N
Package 144-TQFP (20x20 mm) 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same 144-TQFP (20x20 mm) - same
Brand Intel (formerly Altera) Intel Intel Intel Intel Intel
Logic Elements 1728 1728 - same 1728 - same 576 (-67%) 576 (-67%) 576 (-67%)
Total Gates 30,000 30,000 - same 30,000 - same 10,000 (-67%) 10,000 (-67%) 10,000 (-67%)
Speed Grade -2 -2 - same -1 (slower) -2 - same -2 - same -1 (slower)
Lead-Free / RoHS Yes (N suffix) No (leaded) Yes (N suffix) Yes (N suffix) No (leaded) Yes (N suffix)
Core Voltage 2.5 V 2.5 V - same 2.5 V - same 2.5 V - same 2.5 V - same 2.5 V - same
User I/O 102 102 - same 102 - same 102 - same 102 - same 102 - same

Principaux différenciateurs

  • Non-volatile EEPROM configuration (vs SRAM-based Cyclone FPGAs (e.g. EP1C3T144C8N))
  • On-chip dual-port EAB memory (vs Discrete FIFO + glue-logic implementations)
  • 102 user I/O in hand-solderable TQFP (vs BGA-packaged ACEX-1K siblings (EP1K30FC256-2N))

Notes de conception

The EP1K30TC144-2N requires a clean 2.5 V ±5% rail (2.375 V to 2.625 V) on all VCCINT pins (17, 37, 57, 77, 97, 117, 137) with a 0.1 µF X7R ceramic bypass cap within 3 mm of each VCCINT pin and a single 10 µF bulk tantalum cap at the regulator output. I/O bank supplies (VCCIO) can be 1.8 V, 2.5 V, or 3.3 V depending on the bank; mixing VCCIO voltages requires careful bank-by-bank planning. Power-on ramp should be monotonic with <10 ms rise time to avoid configuration latch-up; add a soft-start RC at the regulator if the upstream rail is poorly controlled.

Estimated: at 100% logic utilization and 180 MHz toggle rate, the EP1K30TC144-2N dissipates approximately 0.5-0.8 W in the 144-TQFP package. With junction-to-ambient thermal resistance (theta_JA) of approximately 28 °C/W for a 4-layer JEDEC test board, junction temperature rise is ~22 °C above ambient. For continuous high-utilization designs, provide at least 4 cm² of unbroken copper pour on the top layer under the exposed die area and via-stitch to internal ground planes. Operation above 70 °C ambient requires derating logic toggle rate by ~10% per 10 °C or migration to the EP1K30TI144-2N industrial-temperature variant.

Route all four global clock signals on the dedicated CLK pins with controlled impedance (50 Ω microstrip or stripline) and matched length within ±50 mil across the bus. Keep JTAG chain signals (TCK, TMS, TDI, TDO) short and away from switching I/O to avoid noise-induced programming failures. The 0.5 mm pitch of the 144-TQFP requires 4-mil trace-and-space rules with microvia fan-outs at BGA-adjacent routes. Place a 0.1 µF + 10 µF decoupling pair at each of the four VCCIO bank groups; do not share a single capacitor across banks.

Do not connect nCONFIG, nSTATUS, or DCLK to anything other than the configuration device or pull-up resistors; floating these pins causes configuration failure on power-up. The EP1K30TC144-2N EEPROM configuration is non-volatile but has a finite write-cycle endurance of ~100 cycles - use JTAG or EPCS serial configuration for development, not the on-chip programming algorithm. Always issue a CONFIG_CLR via JTAG before in-system reprogramming to avoid partial-configuration bit errors. Designers migrating from ACEX-1K to Cyclone families must regenerate I/O assignments because pin functions are not 1:1 compatible.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

N suffix denotes Pb-free RoHS-compliant terminations per Altera/Intel Mature Products datasheet. AEC-Q100 not applicable (commercial-grade FPGA, no automotive qualification). Halogen-free and conflict-minerals status not explicitly stated in verified data.

Données vérifiées le : 2026-09-07 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EP1K30TC144-2N EP1K30TC144-2N datasheet Altera EP1K30TC144-2N ACEX-1K FPGA 30K gates TQFP-144 144-pin TQFP FPGA 1728 logic elements EP1K30TC144-2N drop-in replacement EP1K30TC144-2N buy price stock EP1K30TC144-2N vs EP1K10TC144-2N ACEX 1K FPGA last time buy what is the package of EP1K30TC144-2N EP1K30TC144-2N pinout TQFP EP1K30TC144-2N lead-free RoHS

Composants & termes associés

Intel Altera EP1K30TC144-2N EP1K30TC144-2 EP1K30TC144-1N EP1K10TC144-2N EP1K10TC144-2 ACEX-1K FPGA Field-Programmable Gate Array PLD logic element embedded array block EAB dual-port RAM TQFP 144-TQFP JTAG IEEE 1149.1 RoHS AEC-Q100 Quartus II EPCS configuration device lead-free Cyclone IV MAX II
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