EP1S25F672C6N - Stratix 25K LEs 672-FBGA FPGA | Intel (Altera)
Référence : EP1S25F672C6N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $281 | $281,00 |
| 10 | $263.4 | $2 634,00 |
| 100 | $238.5 | $23 850,00 |
| 500 | $215.2 | $107 600,00 |
| 1 000 | $192.75 | $192 750,00 |
EP1S25F672C6N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure arbitrary digital circuits after PCB fabrication. FPGAs sit in the broader taxonomy of digital ICs -> programmable logic -> gate array, and they occupy the highest flexibility tier below full-custom ASICs, offering hundreds of thousands of logic gates plus dedicated blocks such as block RAM, DSP multipliers, PLLs, and high-speed transceivers. The Stratix family specifically targets high-performance applications including communications infrastructure, image processing, and ASIC prototyping where logic density and on-chip memory bandwidth dominate the design trade-off.
Key features of the EP1S25F672C6N include 2566 Logic Array Blocks (LABs), embedded TriMatrix memory supporting true dual-port and FIFO modes, DSP blocks for high-speed multiplication, dedicated clock management PLLs, and support for multiple I/O standards including LVTTL, LVCMOS, SSTL, and LVDS. The 672-FBGA package exposes the full I/O count required for memory-rich and parallel-interface designs.
Architecturally, Stratix devices combine a sea-of-LABs fabric with column-based embedded memory, embedded multipliers, and high-speed I/O elements. The 672-FBGA package provides controlled-impedance routing to support DDR SDRAM interfaces and external memory buses typical in networking and signal-processing designs.
Typical applications include networking line cards, DSP co-processing, telecommunications equipment, video and image processing pipelines, and ASIC prototyping. The device is also used in industrial control systems that require parallel DSP throughput and deterministic real-time performance.
When designing with the EP1S25F672C6N, designers should use the Quartus II development tool (or Quartus Prime for newer designs where legacy device support exists) and observe the I/O standard termination guidelines for high-speed memory interfaces. The 672-BGA requires careful PCB stackup planning with matched impedance for DDR traces.
This page synthesizes distributor pricing, package diagrams, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, providing an integrated reference for engineers sourcing the EP1S25F672C6N.
Alternatives de remplacement direct pour EP1S25F672C6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25F672C6N (même facteur de forme et même empreinte) — différant par DSP Blocks, Package, Speed Grade, Operating Temperature, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25F672C5N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1S25F672C6
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP1S25B672C6N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP1S25B672C6
✅ Remplacement direct✓ En stock
$990 / unité
Voir la fiche technique →EP1S25B672C7N
✅ Remplacement direct✓ En stock
$620.15 / unité
Voir la fiche technique →EP1S25F672C6N Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Series | Stratix I |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Maximum User I/O | 473 |
| Boîtier | 672-BBGA / 672-FBGA (FineLine BGA) |
| Package Body Size | 35 mm x 35 mm |
| Ball Pitch | 1.27 mm |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | CMOS |
| Température de fonctionnement | 0 C to +85 C (Commercial) |
| Configuration | SRAM-based, requires configuration device |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP1S25F672C6N 35 mm x 35 mm
Configuration des broches du EP1S25F672C6N (boîtier 35 mm x 35 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25F672C6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25F672C6N convient pour 6 applications: Telecommunications Line Cards, ASIC Prototyping, DSP Co-Processing, Video and Image Processing, Industrial Control Systems, Test and Measurement Instrumentation.
Telecommunications Line Cards
Telecom line cards for SONET/SDH and packet transport demand high logic density, large block RAM for packet buffers, and numerous LVDS/LVTTL I/O for fabric backplane interfaces. The EP1S25F672C6N delivers 25,660 LEs plus 1,944,576 bits of TriMatrix memory, ideal for header processing, queuing, and traffic shaping at line rate. The 472 user I/O support multiple POS/UTOPIA interfaces and external TCAM glue. Its 1.5 V core supply and 672-FBGA package allow compact line-card layouts with controlled-impedance routing for high-speed serdes-side glue.
Recommandé
ASIC Prototyping
ASIC prototyping requires a large FPGA fabric, fast compile cycles, and deep on-chip memory to emulate a multi-million-gate ASIC. The EP1S25F672C6N's combination of 25,660 logic elements and 1,944,576 embedded RAM bits lets designers partition an ASIC into multiple FPGAs with minimal glue logic. Quartus II synthesis provides native ASIC-equivalent timing correlation for Stratix I, easing RTL bring-up. The 672-FBGA package also allows designers to break out hundreds of GPIO for chip-level I/O replication.
Recommandé
DSP Co-Processing
DSP co-processing offloads compute-intensive kernels (FFT, FIR, video codecs) from a host processor. The EP1S25F672C6N's dedicated embedded multipliers plus 1.9 Mbits of block RAM enable multi-tap FIR filters, radix-4 FFT pipelines, and matrix arithmetic at hundreds of MSPS. The device supports concurrent DDR SDRAM interfaces via the I/O banks, allowing streamed data buffering without external memory controllers. Designers map kernels to Stratix DSP blocks and use parallel LVDS pairs for sample-clock distribution.
Recommandé
Video and Image Processing
Video and image processing pipelines operate on multi-megasample frames requiring high memory bandwidth and parallel pixel processing. The EP1S25F672C6N's 1.9 Mbits of embedded RAM acts as line buffers and frame caches, while 25K LEs host pixel pipelines, color-space converters, and motion estimators. The 472 user I/O map cleanly to digital video interfaces (BT.656, BT.1120, parallel RGB) and DDR2 SDRAM for frame buffering. 1.5 V core and 35 mm FBGA fit into typical video-capture card form factors.
Recommandé
Industrial Control Systems
Industrial controllers require deterministic real-time response, multiple serial and parallel I/O channels, and reliable operation in factory-floor environments. The EP1S25F672C6N's high logic capacity hosts multiple soft-CPU cores (Nios II) for distributed control, while its 472 user I/O support RS-485, SPI, I2C, parallel encoder interfaces, and PWM generation. The commercial temperature grade (0C to +85C) suits enclosed control cabinets. Designers also leverage the device's JTAG interface for in-system programming during commissioning.
Recommandé
Test and Measurement Instrumentation
High-end test instruments such as logic analyzers, protocol testers, and digitizers demand deep capture buffers, fast parallel processing, and many synchronized I/O. The EP1S25F672C6N delivers 1.9 Mbits of embedded RAM suitable for capture-state buffering, plus enough logic for inline state machines, trigger detectors, and protocol decoders. The 472 I/O drive LVDS test pods at rates to 1 Gbps. Quartus II's TimeQuest timing analyzer provides deterministic timing closure critical for measurement accuracy.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25F672C6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25F672C5N | EP1S25F672C6 | EP1S25B672C6N | EP1S25B672C6 | EP1S25B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (35x35 mm, 1.27 mm pitch) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C6 (commercial, fastest tier -6) | C5 (slower speed grade) | C6 (same speed grade) | C6 (same speed grade) | C6 (same speed grade) | C7 (faster speed grade) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS Compliance | Compliant (N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) | Compliant (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Same silicon die across the EP1S25 family (vs EP1S25F672C5N)
- RoHS-compliant N suffix (vs EP1S25F672C6)
- 25,660 LEs in the F revision (vs EP1S25B672C6N)
Notes de conception
The 672-FBGA package with 1.27 mm pitch requires a 4 to 6 layer PCB stackup with microvia or via-in-pad construction for reliable BGA assembly. Use the Stratix Device Family Data Sheet's recommended footprint and solder paste stencil guidelines. Ensure escape routing accommodates at least 2 rows of perimeter signals between BGA and inner balls - working with a 1.27 mm pitch this typically requires 4 mil trace and space with microvias to inner layers.
Decouple each VCC and VCCIO power pin pair with 0.1 uF X7R ceramic capacitors placed as close to the BGA balls as the PCB allows. Add bulk decoupling (47 uF to 100 uF tantalum or polymer) near each supply island. The 1.5 V core rail must be sequenced per the Stratix handbook to avoid in-rush current during configuration - use a soft-start controller or follow the power sequencing diagram in the datasheet.
For DDR SDRAM interfaces with the EP1S25F672C6N, route address/command and data signals with matched impedance (typically 50 ohm single-ended) and match trace lengths within the byte lane to the DDR skew budget. Use IBIS models from Altera/Intel for SI simulation in Quartus II. For LVDS inputs, place 100 ohm termination resistors within 7 mm of the FPGA receiver pins to maintain signal integrity.
Do not power the FPGA core before its configuration device is ready, as I/O pins default to tri-stated but can drive indeterminate levels. Always use an EPC configuration device or JTAG-based configuration with proper MSEL[3:0] settings per the datasheet. For prototypes, leave the JTAG header accessible - post-assembly JTAG access often requires board rework if not anticipated.
Informations de conformité
RoHS compliant per N suffix in MPN. REACH and conflict-minerals status not explicitly stated in the verified web data; halogen-free status not stated. Part is obsolete and not recommended for new automotive designs.
