EP1S25F672C6N - Stratix 25K LEs 672-FBGA FPGA | Intel (Altera)
MPN: EP1S25F672C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $281 | $281.00 |
| 10 | $263.4 | $2,634.00 |
| 100 | $238.5 | $23,850.00 |
| 500 | $215.2 | $107,600.00 |
| 1,000 | $192.75 | $192,750.00 |
Drop-in alternatives for EP1S25F672C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1S25F672C5N
✅ Drop-In✓ In Stock
$142 / Unit
View Datasheet →EP1S25F672C6
✅ Drop-In✓ In Stock
$125 / Unit
View Datasheet →EP1S25B672C6N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP1S25B672C6
✅ Drop-In✓ In Stock
$990 / Unit
View Datasheet →EP1S25B672C7N
✅ Drop-In✓ In Stock
$620.15 / Unit
View Datasheet →EP1S25F672C6N Maximum Ratings & Electrical Characteristics
| Family | Stratix |
| Series | Stratix I |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| Embedded Memory (bits) | 1,944,576 |
| Maximum User I/O | 473 |
| Package | 672-BBGA / 672-FBGA (FineLine BGA) |
| Package Body Size | 35 mm x 35 mm |
| Ball Pitch | 1.27 mm |
| Supply Voltage (Core) | 1.5 V |
| Process Technology | CMOS |
| Operating Temperature | 0 C to +85 C (Commercial) |
| Configuration | SRAM-based, requires configuration device |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP1S25F672C6N 35 mm x 35 mm Pin Configuration Guide
Complete pinout information for EP1S25F672C6N (35 mm x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1S25F672C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1S25F672C6N is suitable for 6 applications: Telecommunications Line Cards, ASIC Prototyping, DSP Co-Processing, Video and Image Processing, Industrial Control Systems, Test and Measurement Instrumentation.
Telecommunications Line Cards
Telecom line cards for SONET/SDH and packet transport demand high logic density, large block RAM for packet buffers, and numerous LVDS/LVTTL I/O for fabric backplane interfaces. The EP1S25F672C6N delivers 25,660 LEs plus 1,944,576 bits of TriMatrix memory, ideal for header processing, queuing, and traffic shaping at line rate. The 472 user I/O support multiple POS/UTOPIA interfaces and external TCAM glue. Its 1.5 V core supply and 672-FBGA package allow compact line-card layouts with controlled-impedance routing for high-speed serdes-side glue.
Recommended
ASIC Prototyping
ASIC prototyping requires a large FPGA fabric, fast compile cycles, and deep on-chip memory to emulate a multi-million-gate ASIC. The EP1S25F672C6N's combination of 25,660 logic elements and 1,944,576 embedded RAM bits lets designers partition an ASIC into multiple FPGAs with minimal glue logic. Quartus II synthesis provides native ASIC-equivalent timing correlation for Stratix I, easing RTL bring-up. The 672-FBGA package also allows designers to break out hundreds of GPIO for chip-level I/O replication.
Recommended
DSP Co-Processing
DSP co-processing offloads compute-intensive kernels (FFT, FIR, video codecs) from a host processor. The EP1S25F672C6N's dedicated embedded multipliers plus 1.9 Mbits of block RAM enable multi-tap FIR filters, radix-4 FFT pipelines, and matrix arithmetic at hundreds of MSPS. The device supports concurrent DDR SDRAM interfaces via the I/O banks, allowing streamed data buffering without external memory controllers. Designers map kernels to Stratix DSP blocks and use parallel LVDS pairs for sample-clock distribution.
Recommended
Video and Image Processing
Video and image processing pipelines operate on multi-megasample frames requiring high memory bandwidth and parallel pixel processing. The EP1S25F672C6N's 1.9 Mbits of embedded RAM acts as line buffers and frame caches, while 25K LEs host pixel pipelines, color-space converters, and motion estimators. The 472 user I/O map cleanly to digital video interfaces (BT.656, BT.1120, parallel RGB) and DDR2 SDRAM for frame buffering. 1.5 V core and 35 mm FBGA fit into typical video-capture card form factors.
Recommended
Industrial Control Systems
Industrial controllers require deterministic real-time response, multiple serial and parallel I/O channels, and reliable operation in factory-floor environments. The EP1S25F672C6N's high logic capacity hosts multiple soft-CPU cores (Nios II) for distributed control, while its 472 user I/O support RS-485, SPI, I2C, parallel encoder interfaces, and PWM generation. The commercial temperature grade (0C to +85C) suits enclosed control cabinets. Designers also leverage the device's JTAG interface for in-system programming during commissioning.
Recommended
Test and Measurement Instrumentation
High-end test instruments such as logic analyzers, protocol testers, and digitizers demand deep capture buffers, fast parallel processing, and many synchronized I/O. The EP1S25F672C6N delivers 1.9 Mbits of embedded RAM suitable for capture-state buffering, plus enough logic for inline state machines, trigger detectors, and protocol decoders. The 472 I/O drive LVDS test pods at rates to 1 Gbps. Quartus II's TimeQuest timing analyzer provides deterministic timing closure critical for measurement accuracy.
Recommended
Recommended Products Summary
Engineering reference data for EP1S25F672C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1S25F672C5N | EP1S25F672C6 | EP1S25B672C6N | EP1S25B672C6 | EP1S25B672C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (35x35 mm, 1.27 mm pitch) | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same | 672-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Embedded Memory (bits) | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | C6 (commercial, fastest tier -6) | C5 (slower speed grade) | C6 (same speed grade) | C6 (same speed grade) | C6 (same speed grade) | C7 (faster speed grade) |
| Operating Temperature | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS Compliance | Compliant (N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) | Compliant (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (qty-1) | $281.00 (secondary market) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same silicon die across the EP1S25 family (vs EP1S25F672C5N)
- RoHS-compliant N suffix (vs EP1S25F672C6)
- 25,660 LEs in the F revision (vs EP1S25B672C6N)
Design Notes
The 672-FBGA package with 1.27 mm pitch requires a 4 to 6 layer PCB stackup with microvia or via-in-pad construction for reliable BGA assembly. Use the Stratix Device Family Data Sheet's recommended footprint and solder paste stencil guidelines. Ensure escape routing accommodates at least 2 rows of perimeter signals between BGA and inner balls - working with a 1.27 mm pitch this typically requires 4 mil trace and space with microvias to inner layers.
Decouple each VCC and VCCIO power pin pair with 0.1 uF X7R ceramic capacitors placed as close to the BGA balls as the PCB allows. Add bulk decoupling (47 uF to 100 uF tantalum or polymer) near each supply island. The 1.5 V core rail must be sequenced per the Stratix handbook to avoid in-rush current during configuration - use a soft-start controller or follow the power sequencing diagram in the datasheet.
For DDR SDRAM interfaces with the EP1S25F672C6N, route address/command and data signals with matched impedance (typically 50 ohm single-ended) and match trace lengths within the byte lane to the DDR skew budget. Use IBIS models from Altera/Intel for SI simulation in Quartus II. For LVDS inputs, place 100 ohm termination resistors within 7 mm of the FPGA receiver pins to maintain signal integrity.
Do not power the FPGA core before its configuration device is ready, as I/O pins default to tri-stated but can drive indeterminate levels. Always use an EPC configuration device or JTAG-based configuration with proper MSEL[3:0] settings per the datasheet. For prototypes, leave the JTAG header accessible - post-assembly JTAG access often requires board rework if not anticipated.
Compliance Information
RoHS compliant per N suffix in MPN. REACH and conflict-minerals status not explicitly stated in the verified web data; halogen-free status not stated. Part is obsolete and not recommended for new automotive designs.
