EP1S60F1020I6 - Stratix 57K LEs FPGA 1020-BGA | Intel / Altera
Référence : EP1S60F1020I6 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5413.87 | $5 413,87 |
| 10 | $5008.55 | $50 085,50 |
| 100 | $4310.5 | $431 050,00 |
| 500 | $3845.2 | $1 922 600,00 |
EP1S60F1020I6 Présentation
An FPGA (Field Programmable Gate Array) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware resources such as block RAM, DSP blocks, and high-speed transceivers. FPGAs sit within the programmable logic category of digital ICs, parallel to ASICs but with the advantage of in-system reprogrammability. Stratix devices specifically target high-performance signal processing, communications infrastructure, and ASIC prototyping workloads.
Key features of the EP1S60F1020I6 include 6,570 logic arrays blocks (LABs) organized in a Stratix fabric, embedded multiplier/DSP blocks for high-speed arithmetic, dedicated external memory interfaces supporting DDR/DDR2 SDRAM, and on-chip phase-locked loops (PLLs) for clock management. The -I6 speed grade designates the industrial temperature range of -40C to +100C case with optimized timing closure.
Architecturally, the Stratix family introduced the TriMatrix embedded memory structure (three block RAM sizes per device), embedded DSP blocks with dedicated multiply-accumulate hardware, and high-speed I/O standards including LVDS and HyperTransport. The 1020-ball FC-FBGA package provides ample I/O count for parallel interfaces and high-speed serial links.
Typical applications include high-performance ASIC prototyping, telecom baseband processing, video and image processing pipelines, military and aerospace signal processing, and test & measurement instrumentation. The large logic capacity and rich DSP resources also suit radar, software-defined radio, and high-speed data acquisition designs.
When designing with this device, plan for the 1.5V core supply and multiple I/O voltage rails (1.5V, 1.8V, 2.5V, 3.3V). The 1020-ball BGA requires multi-layer PCB with microvia or via-in-pad technology; signal integrity analysis is mandatory for DDR memory interfaces. Quartus II is the supported development toolchain.
This page synthesizes distributor pricing, drop-in Stratix alternatives, and practical BGA PCB layout notes not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1S60F1020I6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S60F1020I6 (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Family, Operating Temperature, Logic Array Blocks (LABs).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S60F1020I6N
✅ Remplacement direct✓ En stock
$3650 / unité
Voir la fiche technique →EP1S60F1020C7N
✅ Remplacement direct✓ En stock
$1580 / unité
Voir la fiche technique →EP1S60F1020C7
✅ Remplacement direct✓ En stock
$1750 / unité
Voir la fiche technique →EP1S60F1020C6N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1S60F1020C6
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EP1S60F1020C6NAA
✅ Remplacement direct✓ En stock
$145 / unité
Voir la fiche technique →EP1S60F1020C5N
✅ Remplacement direct✓ En stock
$2050 / unité
Voir la fiche technique →EP1S60F1020C5
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP1S60F1020I6 Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements | 57,120 |
| Logic Array Blocks (LABs) | 6,570 |
| Embedded Memory Bits | 5,215,104 bits |
| Maximum User I/O | 773 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Internal Frequency | 450 MHz |
| Boîtier | 1020-ball FC-FBGA (33 x 33 mm, 1 mm pitch) |
| Operating Temperature (I-grade) | -40C to +100C (case) |
| Speed Grade | -6 |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| Niveau MSL | 3 |
Guide de configuration des broches du EP1S60F1020I6 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch)
Configuration des broches du EP1S60F1020I6 (boîtier 1020-ball fc-fbga (33 x 33 mm, 1 mm pitch)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S60F1020I6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S60F1020I6 convient pour 7 applications: High-Performance ASIC Prototyping, Telecom Baseband Processing, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Software-Defined Radio (SDR) Platforms, Industrial Automation Controllers.
High-Performance ASIC Prototyping
The EP1S60F1020I6's 57,120 logic elements and 5,215,104 bits of TriMatrix memory make it well suited for prototyping mid-complexity ASIC designs before tape-out. Its 773 user I/Os and high pin count accommodate full ASIC I/O replication for functional verification at system speed. Engineers mapping an ASIC RTL into the Stratix fabric benefit from dedicated block RAM and DSP blocks that mirror common ASIC macro functions, enabling real-world timing and throughput analysis. Quartus II synthesis supports industry-standard HDL flows, and the -I6 speed grade provides timing margin for iterative debug.
Recommandé
Telecom Baseband Processing
The EP1S60F1020I6's high logic density, embedded DSP blocks, and external memory interface support make it a strong candidate for telecom baseband signal processing. Its 130 nm process and Stratix architecture deliver up to 450 MHz internal performance, sufficient for symbol-rate processing in WCDMA, WiMAX, and early LTE base station designs. The 1020-BGA package exposes enough I/O for parallel ADC/DAC interfaces and backplane connectivity. Industrial temperature grade (-I6) suits outdoor base station enclosures where ambient temperatures fluctuate widely.
Recommandé
Video and Image Processing Pipelines
The EP1S60F1020I6's combination of 6,570 LABs, 5 Mbit embedded memory, and dedicated multiplier blocks makes it suitable for real-time video processing pipelines including scaling, deinterlacing, and color space conversion. The abundant block RAM supports line buffers and frame stores needed for HD video, while DSP blocks accelerate motion estimation and filtering operations. The 773 user I/Os accommodate parallel DVI/HDMI input buses and DDR2 SDRAM frame buffers. Industrial temperature grade enables deployment in surveillance and broadcast equipment.
Recommandé
Military and Aerospace Signal Processing
The EP1S60F1020I6's industrial -40C to +100C temperature range and high logic density suit military and aerospace signal processing applications including radar front-end preprocessing, electronic warfare subsystems, and secure communications. The 1020-BGA package provides the I/O count required for multi-channel ADC arrays and high-speed serial links. Although not fully MIL-PRF-38535 qualified, the industrial temperature screening and Altera's legacy reliability data make it acceptable for non-critical defense subsystems. Conformal coating and vibration-resistant PCB mounting are recommended.
Recommandé
Test and Measurement Instrumentation
The EP1S60F1020I6's high I/O count and embedded memory make it well suited for test and measurement instruments such as logic analyzers, protocol testers, and arbitrary waveform generators. The 773 user I/Os support parallel stimulus/response channels while the 5,215,104 bits of block RAM provide deep capture buffers. Dedicated PLLs generate multiple clock domains required for mixed-signal test patterns. Industrial temperature grade enables bench and field-deployment instrumentation. Quartus II supports integration with standard T&M firmware frameworks.
Recommandé
Software-Defined Radio (SDR) Platforms
The EP1S60F1020I6's high logic capacity, embedded multipliers, and ample memory bandwidth make it a viable platform for software-defined radio implementations including Wi-Fi, GPS, and military waveform processing. Its DSP blocks accelerate FFT and channelization operations, while block RAM buffers I/Q sample streams. The 1020-BGA footprint provides enough I/O for multi-antenna diversity and high-speed ADC interfaces. Engineers targeting legacy SDR designs benefit from Altera's reference designs for digital down-conversion and pulse shaping.
Recommandé
Industrial Automation Controllers
The EP1S60F1020I6's industrial temperature grade and high logic density suit demanding factory automation controllers, motion control systems, and high-speed industrial networking gateways. Its 773 user I/Os accommodate parallel encoder interfaces, multi-axis servo control loops, and high-speed EtherCAT or PROFINET bridging. Embedded block RAM supports fast lookup tables for PID loops, while DSP blocks handle real-time control algorithms. The 1.5V core and multiple I/O voltage rails simplify integration into mixed-voltage industrial designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S60F1020I6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S60F1020I6N | EP1S60F1020C7N | EP1S60F1020C6N | EP1S60F1020C5N |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Logic Elements | 57,120 | 57,120 | 57,120 | 57,120 | 57,120 |
| Speed Grade | -6 | -6 (same) | -7 (slower) | -6 (same) | -5 (faster) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| RoHS Compliance | Compliant (varies by suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) |
| Embedded Memory Bits | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 | 5,215,104 |
| Maximum User I/O | 773 | 773 | 773 | 773 | 773 |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Toolchain | Quartus II | Quartus II | Quartus II | Quartus II | Quartus II |
Principaux différenciateurs
- Industrial temperature grade with -6 speed grade balance (vs EP1S60F1020C7N)
- RoHS and non-RoHS variants in same footprint (vs EP1S60F1020I6N)
- Higher logic density than EP1S40 family (vs EP1S40F1020I6)
Notes de conception
The 1020-ball FC-FBGA package with 1 mm ball pitch requires a multilayer PCB (typically 8-12 layers) with microvia or via-in-pad technology. Standard through-hole vias cannot be reliably placed between the 1 mm pitch balls without violating manufacturing rules. Recommended stack-up: high-density interconnect (HDI) with 1-2-1 or 2-4-2 microvia construction. Maintain a continuous ground plane beneath the BGA to control return paths and provide thermal dissipation. All 1020 balls must be soldered; missing solder joints cause open or intermittent failures that are difficult to diagnose.
The Stratix EP1S60 requires a 1.5V core supply plus multiple I/O voltage rails (1.5V, 1.8V, 2.5V, 3.3V) for its 773 user I/Os. Use a low-impedance power distribution network with decoupling capacitors placed as close to the BGA balls as possible - typically 100 nF ceramic per power pin group and bulk decoupling with 10-47 uF tantalum or polymer capacitors near each voltage rail. The 1.5V core current can exceed several amps during high toggle rates; verify the voltage regulator can handle worst-case inrush during configuration.
At maximum toggle rates with 773 I/Os switching, the Stratix EP1S60 can dissipate 5-8 W within the 33 x 33 mm FC-FBGA package. The industrial temperature grade requires the case temperature to remain below +100C, so thermal management is essential. Use thermal vias in the BGA land pattern to transfer heat to internal copper planes, and consider an external heatsink for high-utilization designs. Estimate: junction-to-ambient thermal resistance is approximately 15-20 C/W with a properly designed thermal via array, giving junction temperature rise of 75-100C above ambient at 5 W dissipation.
DDR/DDR2 external memory interfaces require matched-length routing and impedance-controlled traces. The Quartus II pin planner and board-level signal integrity tools should be used during PCB layout to validate DDR timing margins. Place external memory within 25-50 mm of the FPGA to minimize stub lengths and reflections. Differential pairs (LVDS, HyperTransport) must maintain 100 ohm differential impedance with length matching within 10 mil. Clock inputs should be guarded with a ground fence to reduce crosstalk.
Do not assume the EP1S60F1020I6 is in production - it is in its last-time-buy phase. Engineers designing new products should evaluate Stratix II/III/IV, Cyclone IV/V, or modern Arria/Cyclone 10 families for new designs. Configuration via passive serial, fast passive parallel, or JTAG requires proper MSEL pin strapping - incorrect strapping prevents the device from configuring. Also note that the EP1S60F1020I6 suffix 'I6' denotes industrial temp AND -6 speed grade; do not confuse this with commercial-grade parts with different temperature ranges.
Informations de conformité
RoHS compliance confirmed by Altera/Intel product page; lead-free termination standard for N-suffix variants. Not AEC-Q100 qualified (industrial-grade only). Halogen-free status not explicitly stated in available data.