EP1SGX25CF672I6N - Stratix GX FPGA 25K LE, 672-FBGA | Intel
Référence : EP1SGX25CF672I6N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2 565,00 |
| 100 | $228 | $22 800,00 |
| 500 | $199.5 | $99 750,00 |
| 1 000 | $171 | $171 000,00 |
EP1SGX25CF672I6N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor logic device whose function is defined by the customer after manufacturing via a configuration bitstream, as opposed to an ASIC whose function is fixed at tape-out. Within the broader taxonomy, FPGAs belong to programmable logic devices (PLD) -> logic IC -> integrated circuit. The Stratix GX sub-family extends the general-purpose Stratix architecture with embedded multi-gigabit transceivers, targeting protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI. This positions the EP1SGX25CF672I6N at the high-end of the Stratix GX lineup, suitable for serial-bandwidth-intensive designs.
Key specifications include 25,660 logic cells, 2,852 CLBs / 2,566 LABs, 455 user I/Os, an operating temperature range of -40 °C to +85 °C (industrial grade, indicated by the I6 suffix), and a lead-free FBGA-672 package. The 'I6' ordering code denotes an industrial-grade temperature range and speed grade 6. The device also integrates dedicated DSP blocks, TriMatrix embedded memory, and a flexible PLL network, giving designers on-chip signal-processing and clock-management resources that eliminate the need for companion logic devices.
Typical applications include high-speed serial interface bridges, custom protocol controllers for telecom and datacom line cards, digital video broadcast equipment, and ASIC prototyping. The integrated transceivers run at multi-gigabit data rates, enabling designs that would otherwise require a separate PHY device.
When designing with this device, ensure the Quartus II toolchain (Stratix GX device support) is used for synthesis, place-and-route, and bitstream generation. Verify the FBGA-672 PCB land pattern matches the 27 x 27 mm, 1 mm pitch footprint and that decoupling and high-speed serial channel routing follow Intel's Stratix GX hardware reference manual guidance.
This page synthesizes distributor pricing, drop-in Stratix GX alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1SGX25CF672I6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25CF672I6N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, RoHS Status, Process Technology, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25CF672I6
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP1SGX25CF672C6N
✅ Remplacement direct✓ En stock
$210 / unité
Voir la fiche technique →EP1SGX25CF672C7N
✅ Remplacement direct✓ En stock
$338.5 / unité
Voir la fiche technique →EP1SGX25-CF672-I6
✅ Remplacement direct✓ En stock
$168 / unité
Voir la fiche technique →EP1SGX10DF672I6N
✅ Remplacement direct✓ En stock
$85.2 / unité
Voir la fiche technique →EP1SGX10CF672C7N
✅ Remplacement direct✓ En stock
$182.1 / unité
Voir la fiche technique →EP1SGX25CF672I6N Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Elements / Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,852 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 455 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Boîtier | 672-ball FBGA (FCBGA), 27 x 27 mm, 1 mm pitch |
| Température de fonctionnement | -40 °C to +85 °C (industrial) |
| Temperature Grade | Industrial |
| Speed Grade | 6 |
| Type de montage | Surface Mount |
| Lead-Free | Yes |
| Statut RoHS | Compliant |
| Toolchain | Quartus II (Stratix GX device support) |
Guide de configuration des broches du EP1SGX25CF672I6N 672-ball fbga (fcbga), 27 x 27 mm, 1 mm pitch
Configuration des broches du EP1SGX25CF672I6N (boîtier 672-ball fbga (fcbga), 27 x 27 mm, 1 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX25CF672I6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX25CF672I6N convient pour 6 applications: Multi-Gigabit Serial Interface Bridge, Telecom Line Card / Datacom Switch, Digital Video Broadcast Equipment, ASIC Prototyping, Industrial Control and Factory Automation, Medical Imaging Equipment.
Multi-Gigabit Serial Interface Bridge
The EP1SGX25CF672I6N's integrated multi-gigabit transceivers and 25,660 logic elements make it ideal for protocol-bridging designs that translate between serial standards such as PCI Express, Serial RapidIO, Gigabit Ethernet, andXAUI on a single board. The 455 user I/Os provide ample parallel-side bandwidth for bridging to local bus interfaces, memory controllers, and high-speed peripherals. Designers typically place the FPGA between a host ASIC and a backplane SERDES, implementing the protocol conversion in RTL with Quartus II. The industrial -40 to +85°C temperature range allows deployment in outdoor telecom cabinets and factory-floor equipment.
Recommandé
Telecom Line Card / Datacom Switch
Telecom line cards and datacom switches require high-density logic with embedded transceivers to handle backplane serialization, packet processing, and fabric interfaces. The EP1SGX25CF672I6N delivers 25,660 LE for packet-classification logic, plus its transceivers support backplane speeds typical of telecom line cards. The 672-ball FCBGA package enables compact line-card layouts where board real-estate is at a premium. The industrial temperature grade supports deployment in central-office equipment with extended thermal envelopes. Power designers should follow the Stratix GX hardware reference manual decoupling scheme for the 1.5 V core and analog supply rails.
Recommandé
Digital Video Broadcast Equipment
Digital video broadcast equipment - including encoders, transcoders, and DVB modulators - benefits from the EP1SGX25CF672I6N's DSP blocks and parallel I/O bandwidth. Designers can implement multi-channel SDI processing, MPEG transport stream parsing, and adaptive filtering inside the FPGA, eliminating the need for a companion DSP processor. The 455 user I/Os support multi-channel parallel video interfaces, while the embedded transceivers handle ASI (asynchronous serial interface) links to upstream modulators. Industrial temperature grade supports outdoor headend enclosures and broadcast tower installations.
Recommandé
ASIC Prototyping
ASIC prototyping is one of the most demanding FPGA use cases, requiring high logic density, abundant I/O, and predictable timing closure. The EP1SGX25CF672I6N with 25,660 LE and 455 I/Os can map mid-complexity ASICs with the Quartus II incremental compilation flow, supporting rapid RTL iteration. The 1 mm pitch FBGA exposes a wide I/O bank fan-out that lets designers route real-world ASIC peripherals. The Stratix GX architecture's dedicated transceivers allow prototype validation of ASIC SerDes macros. Engineering teams typically build multi-FPGA prototyping systems using this family and migrate to the next-density Stratix for full ASIC mapping.
Recommandé
Industrial Control and Factory Automation
Industrial control systems require deterministic logic processing, motor-control interfaces, and fieldbus connectivity - all of which the EP1SGX25CF672I6N can deliver with its 25,660 LE and embedded DSP blocks. Designers can implement EtherCAT, PROFINET, or custom fieldbus MACs alongside motion-control algorithms. The industrial -40 to +85°C temperature range supports deployment in factory-floor cabinets, outdoor enclosures, and process-control rooms. The 455 I/Os provide sufficient fan-in for multi-axis motion-control cards. Designers should verify the device's lifecycle status before committing to long production runs.
Recommandé
Medical Imaging Equipment
Medical imaging systems such as ultrasound carts, MRI receivers, and CT scanners demand precise signal processing and high data throughput. The EP1SGX25CF672I6N's DSP blocks implement beamforming, FIR filtering, and image-reconstruction pipelines in real time, while its transceivers stream digitized RF data to upstream processors. The 455 I/Os support parallel ADC/DAC interfaces typical of medical front-ends. The industrial temperature range accommodates imaging-cart operating conditions. Designers must follow IEC 60601 isolation and EMI/EMC requirements when integrating the FPGA into medical equipment.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25CF672I6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25CF672I6 | EP1SGX25CF672C6N | EP1SGX25CF672C7N | EP1SGX25-CF672-I6 | EP1SGX10DF672I6N | EP1SGX10CF672C7N |
|---|---|---|---|---|---|---|---|
| Package | 672-ball FBGA (27x27 mm) | 672-ball FBGA (27x27 mm) - same | 672-ball FBGA (27x27 mm) - same | 672-ball FBGA (27x27 mm) - same | 672-ball FBGA (27x27 mm) - same | 672-ball FBGA (27x27 mm) - same | 672-ball FBGA (27x27 mm) - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Logic Elements | 25,660 LE | 25,660 LE - same | 25,660 LE - same | 25,660 LE - same | 25,660 LE - same | 10,720 LE (-58%) | 10,570 LE (-59%) |
| User I/Os | 455 | 455 - same | 455 - same | 455 - same | 455 - same | 426 (-6%) | 426 (-6%) |
| Temperature Grade | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +85 C) | Industrial (-40 to +85 C) | Commercial (0 to +85 C) |
| Speed Grade | 6 | 6 | 6 | 7 (faster) | 6 | 6 | 7 (faster) |
| Lead-Free (RoHS) | Yes (N suffix) | No (leaded) | Yes | Yes | Yes | Yes | Yes |
| Integrated Transceivers | Yes (Stratix GX family) | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same family | Yes - same family |
Principaux différenciateurs
- Industrial temperature range with lead-free RoHS compliance (vs EP1SGX25CF672I6 (leaded variant))
- Highest-density member of the 672-ball FCBGA Stratix GX lineup (vs EP1SGX10DF672I6N (10K-LE lower-density variant))
- Industrial -40 to +85 C operating range vs commercial 0-85 C (vs EP1SGX25CF672C6N (commercial grade))
Notes de conception
The Stratix GX EP1SGX25CF672I6N requires a 1.5 V core supply plus separate analog supplies for PLLs and multi-gigabit transceivers. According to the Stratix GX hardware reference manual, the supply-rail sequencing must follow the Altera-defined power-on sequence to avoid latch-up. Designers should provide at least 1 A of headroom on the 1.5 V core for typical 25K-LE utilization, and additional capacity for transceiver channels when active. Decoupling must follow the Stratix GX reference board layout with 0.1 uF and 0.01 uF capacitors placed close to every supply pin.
Estimated: at full 25,660 LE utilization and active transceiver channels, the EP1SGX25CF672I6N can dissipate 5-8 W. The 27 x 27 mm FCBGA has a theta_JA of approximately 8-12 C/W with sufficient PCB thermal vias. Designers should implement a thermal via array under the exposed pad region of the FCBGA and at least 4 thermal vias per supply/ground ball pair to keep junction temperature within the industrial 85 C limit. Heat-spreader copper pours on inner PCB layers are recommended for high-utilization designs.
The 672-ball FCBGA with 1 mm ball pitch demands a PCB fabrication tolerance of +/- 0.05 mm on the land diameter. Designers must use the Intel/Altera-provided land pattern and follow the Stratix GX hardware reference manual for stackup and via-in-pad recommendations. High-speed transceiver channels require 100 ohm differential impedance with length matching to within the budget specified in the transceiver user guide. Layer stackup must provide reference planes for all high-speed signals to control return-path discontinuities.
Do not assume the EP1SGX25CF672I6N is in active production - according to the verified web data, this part is in last-time-buy lifecycle. Designers committing to production BOMs must plan for migration to a current-generation Stratix or Agilex device before supply is depleted. Also, do not confuse the EP1SGX25CF672I6N (industrial, lead-free) with EP1SGX25CF672I6 (industrial, leaded) - the leaded variant will fail RoHS compliance audits in markets requiring lead-free assemblies.
Informations de conformité
RoHS-compliant per the N suffix in the part number. Not AEC-Q100 qualified; industrial temperature grade only. Lead-free FBGA package per Altera datasheet. Halogen-free status not explicitly listed in verified web data - set to unknown per Data Authenticity Rule 1.
