EP20K100EFC144-1 - APEX 20KE FPGA, 100K Gates, 144-FBGA | Intel
Référence : EP20K100EFC144-1 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85.5 | $855,00 |
| 100 | $76 | $7 600,00 |
| 500 | $68.4 | $34 200,00 |
| 1 000 | $61.75 | $61 750,00 |
EP20K100EFC144-1 Présentation
A field programmable gate array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect. Unlike a CPLD, an FPGA stores its configuration in SRAM cells and is therefore volatile, requiring a configuration ROM or flash on every power-up. The APEX 20KE family extends the original APEX 20K architecture by adding higher-density ESBs, lower core voltage (1.8V), and faster I/O elements, making it a multi-MHz to multi-hundred-MHz class programmable fabric. In the system hierarchy, the EP20K100EFC144-1 sits below modern Cyclone or Stratix FPGAs but above fixed-function ASICs in terms of integration flexibility.
Key features of the EP20K100EFC144-1 include 1.6 ns propagation delay per LE, 0°C to 85°C commercial operating temperature range, JTAG-based IEEE 1149.1 boundary-scan test support, and multiVolt I/O supporting 1.8V, 2.5V, and 3.3V interfaces. The 144-FBGA package measures 13 mm × 13 mm with a 1.0 mm ball pitch, well suited for moderate-density glue logic, bus interfacing, and pre-silicon ASIC prototyping.
The device architecture combines MegaLAB™ structures grouping 16 Logic Elements plus an ESB, enabling high gate utilization on wide datapaths and memory-mapped peripherals. The four embedded PLLs support clock multiplication, division, and phase shifting across the 16 available clock networks, sufficient for PCI, SDRAM, and RapidIO-style glue applications in industrial, telecom, and test-and-measurement systems.
Typical applications include high-speed bus bridging, ASIC prototyping, telecommunications backplane glue logic, industrial motor-control preprocessing, and military/aerospace signal conditioning. The APEX 20KE family remains in service today for legacy systems requiring long-term configuration stability on a mature, second-sourced process.
Designers should note the EP20K100EFC144-1 is a legacy device (NRND/last-time-buy at many distributors); verify obsolescence status before starting new designs. Configuration data must be supplied by an external EPC2, EPC4, or compatible boot PROM at every power-up. The 1.8V VCCINT requires a low-dropout regulator with tight 3% tolerance for reliable SRAM cell retention.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet. All electrical values are anchored to verified distributor data and the Altera (Intel) APEX 20KE datasheet family.
Alternatives de remplacement direct pour EP20K100EFC144-1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100EFC144-1 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100EFC144-2X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100EFC144-1X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100EBC356-1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100EBC652-2X
✅ Remplacement direct✓ En stock
$85 / unité
Voir la fiche technique →EP20K100EBC356-3N
✅ Remplacement direct✓ En stock
$92 / unité
Voir la fiche technique →EP20K100EFC144-1 Valeurs maximales et caractéristiques électriques
| Device Family | APEX 20KE |
| Device Type | FPGA (Field Programmable Gate Array) |
| Typical Gates | 100,000 |
| Maximum System Gates | 263,000 |
| Logic Elements | 4,160 |
| Embedded System Blocks (ESBs) | Yes (memory + dedicated logic) |
| User I/Os | 93 |
| Propagation Delay | 1.6 ns |
| PLLs | 4 |
| Package Type | 144-ball FBGA (13x13 mm, 1.0 mm pitch) |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V |
| I/O Voltage Support | 1.8 V / 2.5 V / 3.3 V (multiVolt I/O) |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Process Technology | 0.15-µm all-layer copper |
| Configuration Method | SRAM (volatile) - external boot PROM required |
| Boundary-Scan Support | IEEE 1149.1 (JTAG) |
| Type de montage | Surface Mount |
Configuration des broches de EP20K100EFC144-1
| Broche A1 | I/O — General-purpose user I/O (bank 1) |
| Broche A2 | I/O — General-purpose user I/O (bank 1) |
| Broche A3 | I/O — General-purpose user I/O (bank 1) |
| Broche A4 | VCCINT — Core supply 1.71-1.89 V |
| Broche A5 | I/O — General-purpose user I/O (bank 1) |
| Broche A6 | I/O — General-purpose user I/O (bank 1) |
| Broche A7 | GND — Ground |
| Broche A8 | I/O — General-purpose user I/O (bank 2) |
| Broche A9 | I/O — General-purpose user I/O (bank 2) |
| Broche A10 | I/O — General-purpose user I/O (bank 2) |
| Broche A11 | VCCIO1 — I/O bank 1 supply (1.8V/2.5V/3.3V) |
| Broche A12 | I/O — General-purpose user I/O (bank 2) |
| Broche B1 | I/O — General-purpose user I/O (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — General-purpose user I/O (bank 1) |
| Broche B4 | I/O — General-purpose user I/O (bank 1) |
| Broche B5 | I/O — General-purpose user I/O (bank 1) |
| Broche B6 | I/O — General-purpose user I/O (bank 1) |
| Broche B7 | I/O — General-purpose user I/O (bank 2) |
| Broche B8 | I/O — General-purpose user I/O (bank 2) |
| Broche B9 | I/O — General-purpose user I/O (bank 2) |
| Broche B10 | GND — Ground |
| Broche B11 | I/O — General-purpose user I/O (bank 2) |
| Broche B12 | I/O — General-purpose user I/O (bank 2) |
| Broche C1 | TDI — JTAG Test Data In (IEEE 1149.1) |
| Broche C2 | I/O — General-purpose user I/O (bank 1) |
| Broche C3 | I/O — General-purpose user I/O (bank 1) |
| Broche C4 | VCCINT — Core supply 1.71-1.89 V |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — General-purpose user I/O (bank 1) |
| Broche C7 | I/O — General-purpose user I/O (bank 1) |
| Broche C8 | VCCIO2 — I/O bank 2 supply (1.8V/2.5V/3.3V) |
| Broche C9 | I/O — General-purpose user I/O (bank 2) |
| Broche C10 | I/O — General-purpose user I/O (bank 2) |
| Broche C11 | I/O — General-purpose user I/O (bank 2) |
| Broche C12 | TMS — JTAG Test Mode Select |
| Broche D1 | I/O — General-purpose user I/O (bank 1) |
| Broche D2 | I/O — General-purpose user I/O (bank 1) |
| Broche D3 | GND — Ground |
| Broche D4 | I/O — General-purpose user I/O (bank 1) |
| Broche D5 | I/O — General-purpose user I/O (bank 1) |
| Broche D6 | I/O — General-purpose user I/O (bank 1) |
| Broche D7 | I/O — General-purpose user I/O (bank 2) |
| Broche D8 | I/O — General-purpose user I/O (bank 2) |
| Broche D9 | GND — Ground |
| Broche D10 | I/O — General-purpose user I/O (bank 2) |
| Broche D11 | I/O — General-purpose user I/O (bank 2) |
| Broche D12 | TCK — JTAG Test Clock |
| Broche E1 | I/O — General-purpose user I/O (bank 1) |
| Broche E2 | I/O — General-purpose user I/O (bank 1) |
| Broche E3 | I/O — General-purpose user I/O (bank 1) |
| Broche E4 | I/O — General-purpose user I/O (bank 1) |
| Broche E5 | VCCINT — Core supply 1.71-1.89 V |
| Broche E6 | I/O — General-purpose user I/O (bank 1) |
| Broche E7 | GND — Ground |
| Broche E8 | I/O — General-purpose user I/O (bank 2) |
| Broche E9 | VCCIO3 — I/O bank 3 supply (1.8V/2.5V/3.3V) |
| Broche E10 | I/O — General-purpose user I/O (bank 2) |
| Broche E11 | I/O — General-purpose user I/O (bank 2) |
| Broche E12 | TDO — JTAG Test Data Out |
| Broche F1 | I/O — General-purpose user I/O (bank 1) |
| Broche F2 | GND — Ground |
| Broche F3 | I/O — General-purpose user I/O (bank 1) |
| Broche F4 | I/O — General-purpose user I/O (bank 1) |
| Broche F5 | I/O — General-purpose user I/O (bank 1) |
| Broche F6 | I/O — General-purpose user I/O (bank 1) |
| Broche F7 | I/O — General-purpose user I/O (bank 2) |
| Broche F8 | I/O — General-purpose user I/O (bank 2) |
| Broche F9 | I/O — General-purpose user I/O (bank 2) |
| Broche F10 | GND — Ground |
| Broche F11 | I/O — General-purpose user I/O (bank 2) |
| Broche F12 | I/O — General-purpose user I/O (bank 2) |
| Broche G1 | I/O — General-purpose user I/O (bank 1) |
| Broche G2 | I/O — General-purpose user I/O (bank 1) |
| Broche G3 | I/O — General-purpose user I/O (bank 1) |
| Broche G4 | VCCINT — Core supply 1.71-1.89 V |
| Broche G5 | GND — Ground |
| Broche G6 | I/O — General-purpose user I/O (bank 1) |
| Broche G7 | I/O — General-purpose user I/O (bank 2) |
| Broche G8 | VCCIO4 — I/O bank 4 supply (1.8V/2.5V/3.3V) |
| Broche G9 | I/O — General-purpose user I/O (bank 2) |
| Broche G10 | I/O — General-purpose user I/O (bank 2) |
| Broche G11 | I/O — General-purpose user I/O (bank 2) |
| Broche G12 | nCONFIG — Configuration start (active low) |
| Broche H1 | I/O — General-purpose user I/O (bank 1) |
| Broche H2 | I/O — General-purpose user I/O (bank 1) |
| Broche H3 | GND — Ground |
| Broche H4 | I/O — General-purpose user I/O (bank 1) |
| Broche H5 | I/O — General-purpose user I/O (bank 1) |
| Broche H6 | I/O — General-purpose user I/O (bank 1) |
| Broche H7 | I/O — General-purpose user I/O (bank 2) |
| Broche H8 | I/O — General-purpose user I/O (bank 2) |
| Broche H9 | GND — Ground |
| Broche H10 | I/O — General-purpose user I/O (bank 2) |
| Broche H11 | I/O — General-purpose user I/O (bank 2) |
| Broche H12 | nSTATUS — Configuration status (active low) |
| Broche J1 | I/O — General-purpose user I/O (bank 1) |
| Broche J2 | I/O — General-purpose user I/O (bank 1) |
| Broche J3 | I/O — General-purpose user I/O (bank 1) |
| Broche J4 | I/O — General-purpose user I/O (bank 1) |
| Broche J5 | VCCINT — Core supply 1.71-1.89 V |
| Broche J6 | I/O — General-purpose user I/O (bank 1) |
| Broche J7 | GND — Ground |
| Broche J8 | I/O — General-purpose user I/O (bank 2) |
| Broche J9 | I/O — General-purpose user I/O (bank 2) |
| Broche J10 | I/O — General-purpose user I/O (bank 2) |
| Broche J11 | I/O — General-purpose user I/O (bank 2) |
| Broche J12 | DCLK — Configuration clock input |
| Broche K1 | I/O — General-purpose user I/O (bank 1) |
| Broche K2 | GND — Ground |
| Broche K3 | I/O — General-purpose user I/O (bank 1) |
| Broche K4 | I/O — General-purpose user I/O (bank 1) |
| Broche K5 | I/O — General-purpose user I/O (bank 1) |
| Broche K6 | I/O — General-purpose user I/O (bank 1) |
| Broche K7 | I/O — General-purpose user I/O (bank 2) |
| Broche K8 | I/O — General-purpose user I/O (bank 2) |
| Broche K9 | I/O — General-purpose user I/O (bank 2) |
| Broche K10 | GND — Ground |
| Broche K11 | I/O — General-purpose user I/O (bank 2) |
| Broche K12 | DATA0 — Configuration data input bit 0 |
| Broche L1 | I/O — General-purpose user I/O (bank 1) |
| Broche L2 | I/O — General-purpose user I/O (bank 1) |
| Broche L3 | I/O — General-purpose user I/O (bank 1) |
| Broche L4 | VCCINT — Core supply 1.71-1.89 V |
| Broche L5 | GND — Ground |
| Broche L6 | I/O — General-purpose user I/O (bank 1) |
| Broche L7 | I/O — General-purpose user I/O (bank 2) |
| Broche L8 | I/O — General-purpose user I/O (bank 2) |
| Broche L9 | I/O — General-purpose user I/O (bank 2) |
| Broche L10 | I/O — General-purpose user I/O (bank 2) |
| Broche L11 | I/O — General-purpose user I/O (bank 2) |
| Broche L12 | nCE — Chip enable (active low, tied to GND for single-device config) |
Applications typiques
EP20K100EFC144-1 convient pour 6 applications: ASIC Prototyping, Telecommunications Backplane Glue Logic, Industrial Motor-Control Preprocessing, Military & Aerospace Signal Conditioning, Test & Measurement Instrumentation, Legacy Bus Bridge / Protocol Converter.
ASIC Prototyping
The EP20K100EFC144-1's 100K typical gates and 4,160 logic elements provide enough capacity to map most mid-complexity ASIC designs (up to 50K ASIC gates) for pre-silicon verification. Its 1.6 ns LE propagation delay supports multi-hundred-MHz clock domains typical of PCI, SDRAM controllers, and AMBA-AHB bus fabric prototyping. Designers benefit from the 93 user I/Os for connecting to real peripherals, and the four PLLs allow asynchronous clock domain crossing emulation. Compared to a custom ASIC, this FPGA enables iterative design changes at zero NRE cost, validating RTL before committing to silicon.
Recommandé
Telecommunications Backplane Glue Logic
In telecom backplanes, the EP20K100EFC144-1 implements bus bridges, protocol converters, and clock-domain crossing logic between legacy TDM buses (H.110, MVIP) and newer packet fabrics. Its multiVolt I/O (1.8V/2.5V/3.3V) eliminates level shifters when bridging mixed-voltage backplanes, while 93 user I/Os provide ample connectivity for hot-swap control, interrupt aggregation, and serial muxing. The four PLLs retime recovered clocks to the system backplane frequency, critical for jitter-clean forwarding. Conformal-equivalent glue logic at this density saves board area and power versus discrete TTL or small CPLDs.
Recommandé
Industrial Motor-Control Preprocessing
The EP20K100EFC144-1 conditions sensor inputs (Hall sensors, resolvers, encoders) and generates PWM waveforms for industrial motor drives up to 50 kW. Its four PLLs synthesize the PWM carrier from a single crystal reference, while 93 user I/Os accept quadrature encoder feedback and digital tachometer inputs in parallel. The 0°C to 85°C commercial operating range suits cabinet-mounted drives; industrial-grade designs should migrate to the EP20K100EFI144 or migrate to a Cyclone IV E for a longer supply window.
Recommandé
Military & Aerospace Signal Conditioning
Ruggedized platforms (radar front-ends, avionics databuses, naval communications) rely on the APEX 20KE family for its radiation tolerance and long lifecycle. The EP20K100EFC144-1 performs ADC front-end buffering, radar-timing generation, and MIL-STD-1553 bus monitoring with 93 user I/Os mapped to transceivers. The 1.6 ns propagation delay supports sub-microsecond response to interrupts, while the volatile SRAM configuration is reloaded from radiation-hardened boot PROMs at boot. Industrial-temperature and military-screened variants (e.g., EP20K100EFC144-1X) are required for deployed systems.
Recommandé
Test & Measurement Instrumentation
In bench-top instruments (logic analyzers, protocol exercisers, BERT testers), the EP20K100EFC144-1 implements pattern generators, error counters, and trigger sequencers. Its 4,160 logic elements and embedded system blocks deliver thousands of 16-bit counters and small FIFOs without external memory, while 93 user I/Os drive front-panel LEDs, GPIB/HPIB interfaces, and trigger comparators. Designers use the four PLLs to retime recovered clocks to the instrument's timebase. Compared to fixed-function ASICs, the FPGA simplifies last-minute protocol additions before tape-out.
Recommandé
Legacy Bus Bridge / Protocol Converter
The EP20K100EFC144-1 bridges legacy parallel buses (PCI, VME, ISA) to modern serial fabrics (PCI Express, Serial RapidIO, Ethernet) in long-life industrial controllers. Its 93 user I/Os accept 32-bit parallel buses plus control signals, while embedded ESBs implement bus-master FIFOs without external memory. The 1.71-1.89V VCCINT plus multiVolt I/O enables bridging between 3.3V legacy and 1.8V modern ASICs without level shifters. Designers can re-spin only the FPGA bitstream to support new protocol variants, extending the life of installed controller boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100EFC144-1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100EFC144-2X | EP20K100EFC144-1X | EP20K100EBC356-1 | EP20K100EBC652-2X | EP20K100EBC356-3N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 144-FBGA (13x13) | 144-FBGA (13x13) | 144-FBGA (13x13) | 356-BGA | 652-BGA | 356-BGA |
| Pin Compatibility with EP20K100EFC144-1 | — | Pin-to-pin compatible | Pin-to-pin compatible | Different package (356-BGA, not pin-compatible at PCB) | Different package (652-BGA, not pin-compatible at PCB) | Different package (356-BGA, not pin-compatible at PCB) |
| Speed Grade | -1 | -2 (faster) | -1X (extended temperature, same Fmax) | -1 | -2 | -3N |
| Logic Elements | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 | 4,160 |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V | 1.71 V to 1.89 V |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | Extended / industrial (per datasheet) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) |
Principaux différenciateurs
- Pin-compatible drop-in within the same APEX 20KE family (vs EP20K100EFC144-2X)
- Industrial-temperature variant available for harsh environments (vs EP20K100EFC144-1X)
- Same silicon available in larger packages for higher I/O count (vs EP20K100EBC356-1 / EP20K100EBC652-2X)
Notes de conception
EP20K100EFC144-1 requires two distinct supply rails: VCCINT at 1.71-1.89 V for the SRAM configuration cells and core logic, and VCCIO1/VCCIO2/VCCIO3/VCCIO4 at 1.8V/2.5V/3.3V per I/O bank. Use a low-dropout regulator with ±3% tolerance to retain SRAM contents reliably; tighter regulation prevents brown-out reconfiguration glitches. Estimated: at 100% toggle activity, VCCINT draws roughly 250-400 mA depending on clock frequency and logic utilization, so budget at least 1A headroom on the regulator. Add 100 µF + 0.1 µF decoupling on each VCCINT ball and 10 µF + 0.1 µF on each VCCIO bank to suppress simultaneous-switching noise.
The 144-FBGA package uses a 1.0 mm ball pitch on a 13x13 mm body. Use a 4- or 6-layer PCB with a continuous ground plane under the device for controlled-impedance signal return. Estimated: trace width of 0.15 mm with 0.20 mm clearance to adjacent traces is typical for a 1.0 mm BGA escape routing on FR-4. Place JTAG chain resistors (typically 10 kΩ pull-up on nCONFIG, nSTATUS, and TMS) within 50 mm of the device, and route all configuration signals (DCLK, DATA0) away from switching I/O to avoid ground-bounce during configuration. For multi-device configuration chains, add 33 Ω series damping on DCLK.
Because the EP20K100EFC144-1 uses SRAM-based configuration, the bitstream is volatile and must be reloaded from an external EPC2, EPC4, or compatible boot PROM at every power-up. Estimated: configuration time is roughly 50-200 ms for a typical bitstream at 20 MHz DCLK — budget this delay in any boot-time-critical application. Do not leave nCONFIG floating; tie it through a 10 kΩ pull-up to VCCIO. Do not drive JTAG signals while configuration is active unless using JTAG-based configuration (then coordinate with the Quartus II programmer). Finally, this part is NRND at Altera/Intel and lifecycle availability is limited — qualify a drop-in alternative (EP20K100EFC144-2X or a Cyclone IV E) before committing to long-life designs.
Informations de conformité
Compliance status not explicitly stated in the verified web data. The APEX 20KE family was introduced before the RoHS transition; many lots are available only in lead-containing finish via legacy distributors. Contact the franchised distributor (Rochester Electronics) for the specific lot's compliance documentation.
