EP2C8T144C8N - Cyclone II FPGA 8256 LE TQFP-144 | Intel
Référence : EP2C8T144C8N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $63.97 | $63,97 |
| 10 | $58.4 | $584,00 |
| 100 | $51.75 | $5 175,00 |
| 500 | $46.2 | $23 100,00 |
| 1 000 | $41.5 | $41 500,00 |
EP2C8T144C8N Présentation
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor device whose logic function is defined after manufacturing by a user-supplied bitstream. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. They are chosen over application-specific integrated circuits (ASICs) when design revisions, parallel processing, or hardware-acceleration flexibility are required. Cyclone II FPGAs specifically balance cost, logic density, and embedded memory for cost-sensitive applications.
Key features include 8,256 logic elements organized into 516 configurable logic blocks, 165,888 bits of embedded memory (M4K blocks), up to 182 usable I/O pins (package-limited to 85 on this 144-pin TQFP), embedded multipliers (18x18), two PLLs per device, and Cyclone II configuration via serial or parallel configuration schemes. The 90 nm process technology keeps unit cost low while supporting up to 1.1 Mbits of embedded memory at the family level.
The EP2C8T144C8N supports up to 320 MHz internal operation with on-chip PLL clock management. The 144-pin TQFP package is a surface-mount plastic thin quad flat pack without an exposed pad, simplifying PCB assembly but limiting it to moderate thermal dissipation. This device is pin-compatible with the EP2C8T144I8N (industrial temperature grade variant), enabling a single PCB to serve multiple end-market grades.
Typical applications include digital signal processing, video bridging, industrial control logic, low-cost ASIC prototyping, consumer electronics glue logic, and embedded display controllers. Designers also use Cyclone II FPGAs as a prototyping step before migrating to higher-density Cyclone III/IV/V parts.
When designing with this device, ensure that all VCCINT and VCCIO rails have proper decoupling (0.1 uF plus bulk capacitors per Quartus II pin connection guidelines) and that JTAG configuration pins are accessible for in-system programming. Consider the EP2C5T144C8N for lower-density designs to reduce cost, or migrate upward to EP2C20F256C8N if logic density outgrows the EP2C8.
This page synthesizes authorized distributor pricing, drop-in same-package alternatives, and practical design notes drawn from the Altera Cyclone II Device Handbook - giving engineers actionable selection guidance not found on individual distributor product pages.
Alternatives de remplacement direct pour EP2C8T144C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2C8T144C8N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2C8T144I8N
✅ Remplacement direct✓ En stock
$17.5 / unité
Voir la fiche technique →EP2C8T144C7N
✅ Remplacement direct✓ En stock
$20.85 / unité
Voir la fiche technique →EP2C8T144C8
✅ Remplacement direct✓ En stock
$21.6 / unité
Voir la fiche technique →EP2C8T144C6N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EP2C8T144C7
✅ Remplacement direct✓ En stock
$28.75 / unité
Voir la fiche technique →EP2C8T144C6
✅ Remplacement direct✓ En stock
$22.62 / unité
Voir la fiche technique →EP2C8T144C8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone II |
| Logic Elements (LE) | 8,256 |
| Configurable Logic Blocks | 516 |
| Embedded Memory | 165,888 bits (162 Kbit) |
| Embedded Multipliers (18x18) | 36 |
| User I/O Count | 85 |
| PLL Count | 2 |
| Core Voltage VCCINT | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage VCCIO | 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V (bank-based) |
| Process Technology | 90 nm |
| Max Internal Frequency | 320 MHz |
| Configuration Scheme | Serial / Parallel / JTAG |
| Température de fonctionnement | 0C to +85C (Commercial, suffix C) |
| Boîtier | TQFP-144 (T144), 22x22 mm, 0.5mm pitch |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de EP2C8T144C8N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | GND — Ground |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | VCCINT — Core voltage supply (1.2 V) |
| Broche 14 | I/O — User I/O pin (bank 1) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | GND — Ground |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | VCCIO2 — I/O bank 2 voltage supply |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | GND — Ground |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | TMS — JTAG Test Mode Select |
| Broche 38 | TCK — JTAG Test Clock |
| Broche 39 | TDO — JTAG Test Data Out |
| Broche 40 | TDI — JTAG Test Data In |
| Broche 41 | nCONFIG — Configuration start (active low) |
| Broche 42 | nSTATUS — Configuration status (active low) |
| Broche 43 | CONFIG_DONE — Configuration complete |
| Broche 44 | DCLK — Configuration clock |
| Broche 45 | DATA0 — Configuration data input |
| Broche 46 | VCCINT — Core voltage supply (1.2 V) |
| Broche 47 | GND — Ground |
| Broche 48 | MSEL0 — Configuration mode select 0 |
| Broche 49 | MSEL1 — Configuration mode select 1 |
| Broche 50 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | VCCIO3 — I/O bank 3 voltage supply |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | VCCINT — Core voltage supply (1.2 V) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | PLL1_OUTp — PLL1 output (positive) |
| Broche 74 | VCCA_PLL1 — PLL1 analog supply |
| Broche 75 | GNDA_PLL1 — PLL1 analog ground |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | I/O — User I/O pin (bank 4) |
| Broche 87 | VCCINT — Core voltage supply (1.2 V) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | GND — Ground |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | I/O — User I/O pin (bank 4) |
| Broche 98 | I/O — User I/O pin (bank 4) |
| Broche 99 | GND — Ground |
| Broche 100 | I/O — User I/O pin (bank 4) |
| Broche 101 | I/O — User I/O pin (bank 4) |
| Broche 102 | I/O — User I/O pin (bank 4) |
| Broche 103 | VCCINT — Core voltage supply (1.2 V) |
| Broche 104 | I/O — User I/O pin (bank 4) |
| Broche 105 | I/O — User I/O pin (bank 4) |
| Broche 106 | I/O — User I/O pin (bank 4) |
| Broche 107 | GND — Ground |
| Broche 108 | PLL2_OUTp — PLL2 output (positive) |
| Broche 109 | VCCA_PLL2 — PLL2 analog supply |
| Broche 110 | GNDA_PLL2 — PLL2 analog ground |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | VCCIO4 — I/O bank 4 voltage supply |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | I/O — User I/O pin (bank 4) |
| Broche 118 | GND — Ground |
| Broche 119 | I/O — User I/O pin (bank 1) |
| Broche 120 | I/O — User I/O pin (bank 1) |
| Broche 121 | I/O — User I/O pin (bank 1) |
| Broche 122 | VCCINT — Core voltage supply (1.2 V) |
| Broche 123 | I/O — User I/O pin (bank 1) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | GND — Ground |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | I/O — User I/O pin (bank 1) |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | VCCIO1 — I/O bank 1 voltage supply |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | GND — Ground |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | VCCINT — Core voltage supply (1.2 V) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | I/O — User I/O pin (bank 1) |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | GND — Ground |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EP2C8T144C8N convient pour 6 applications: Digital Signal Processing (DSP) Front-End, Industrial Control Logic and Glue Logic, Low-Cost ASIC Prototyping, Video Format Conversion and Display Bridging, Embedded System Bus Interfacing (PCI / ISA / Legacy I/O), Consumer Electronics Display and Control.
Digital Signal Processing (DSP) Front-End
The EP2C8T144C8N's 36 embedded 18x18 hardware multipliers and 8,256 logic elements make it well suited to DSP front-end tasks such as digital filtering, FFT preprocessing, and modulation/demodulation stages. Compared with a software DSP running on a microcontroller, the FPGA executes multiply-accumulate operations in parallel, reducing filter group delay and freeing the host CPU for control-plane tasks. The two on-chip PLLs generate the multiple clock domains required for ADC sampling and synchronous serial interface framing, while the 85 user I/Os are sufficient to interface with parallel ADCs/DACs in the 8-16 bit range. Designers typically place the EP2C8T144C8N between a high-speed ADC and a downstream processor, consuming roughly 60-70% of available LEs at full DSP pipeline utilization.
Recommandé
Industrial Control Logic and Glue Logic
The EP2C8T144C8N serves as a flexible industrial control logic IC for factory automation lines, motor control boards, and PLC expansion modules. Its 85 user I/Os support up to 8 encoder counters, 4-6 stepper motor pulse-and-direction pairs, and multiple GPIO banks operating at different VCCIO levels (3.3 V for logic and 5 V via level shifting). The commercial 0C to +85C temperature grade suits cabinet-mounted equipment, while the pin-compatible EP2C8T144I8N serves harsher factory-floor installations. Compared with discrete 74-series glue logic, the EP2C8T144C8N reduces PCB area by 5-10x and allows in-system firmware updates via JTAG, eliminating board respins for logic changes. The two PLLs synthesize independent motor PWM frequencies from a single 50 MHz reference clock.
Recommandé
Low-Cost ASIC Prototyping
The EP2C8T144C8N is widely used as a low-cost ASIC prototyping platform before taping out to a foundry. With 8,256 LEs and 165 Kbit of embedded memory, it can host representative subsets of larger ASIC designs, allowing early software development on a real hardware target. The TQFP-144 footprint enables hand-solderable breakout boards for engineering bring-up, and Quartus II synthesis provides a fast path from RTL to bitstream. Compared with ASIC NRE costs of USD 100K-500K plus USD 5-15 per unit, a USD 50-65 EP2C8T144C8N plus its development board delivers engineering samples within days. Designers often prototype at EP2C8 density and migrate to EP2C20 or EP2C70 parts once the RTL footprint is finalized, all within the same Quartus II toolchain.
Recommandé
Video Format Conversion and Display Bridging
The EP2C8T144C8N bridges legacy video interfaces such as BT.656, VGA, and LVDS to modern HDMI or MIPI display panels in industrial HMIs and digital signage. The 85 user I/Os accommodate 24-bit RGB parallel video plus HSYNC/VSYNC and clock, while the two PLLs generate pixel clocks from 25 MHz to 148.5 MHz. The 165 Kbit of embedded memory provides line buffers for scaling and color-space conversion without external SRAM, reducing BOM cost. Compared with dedicated video processors costing USD 8-20, the EP2C8T144C8N at USD 50-65 offers a reprogrammable alternative for low-volume HMI products. Quartus II reference designs for VGA-to-DVI conversion provide a starting point for customization.
Recommandé
Embedded System Bus Interfacing (PCI / ISA / Legacy I/O)
The EP2C8T144C8N acts as a bus bridge or co-processor in embedded systems requiring legacy interface support that modern microcontrollers no longer provide. Its 85 user I/Os and 320 MHz internal operation are sufficient to implement PCI target interfaces, ISA bus bridges, or parallel ATA interfaces for industrial SBCs and test equipment. The on-chip PLLs generate the precise clock frequencies required by these legacy buses (33.33 MHz PCI, 8.33 MHz ISA), while the 165 Kbit of block RAM implements FIFO buffers without external memory. Compared with discrete PCI interface ICs costing USD 12-25, the FPGA at USD 50-65 provides a fully programmable, in-system upgradeable solution that has kept Cyclone II in production designs long after the family was originally marketed.
Recommandé
Consumer Electronics Display and Control
The EP2C8T144C8N enables cost-sensitive consumer electronics designs such as digital photo frames, point-of-sale terminals, and small-form-factor media players. Its TQFP-144 package is hand-solderable for low-volume consumer product prototypes, while the 85 user I/Os support touch-panel interfaces, SD card controllers, and LCD timing generation. The two PLLs synthesize pixel clocks for common LCD panels ranging from QVGA (6.25 MHz) to WVGA (40 MHz) without external clock generators. Compared with application processors costing USD 10-30, the EP2C8T144C8N at USD 50-65 is more economical for fixed-function consumer designs where the host CPU is unnecessary. Commercial 0C to +85C temperature operation covers indoor consumer environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2C8T144C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2C8T144I8N | EP2C8T144C7N | EP2C8T144C8 | EP2C8T144C6N | EP2C8T144C7 | EP2C8T144C6 |
|---|---|---|---|---|---|---|---|
| Package | TQFP-144 (T144) | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same | TQFP-144 (T144) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Speed Grade | C8 | I8 (industrial temp, equivalent speed) | C7 (slower) | C8 (same speed) | C6 (slowest) | C7 (slower) | C6 (slowest) |
| Temperature Grade | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Lead Finish | Lead-free (N suffix, RoHS) | Lead-free (N suffix, RoHS) | Lead-free (N suffix, RoHS) | Tin-lead (non-N) | Lead-free (N suffix, RoHS) | Tin-lead (non-N) | Tin-lead (non-N) |
| Embedded Memory | 165,888 bits (162 Kbit) | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits | 165,888 bits |
| User I/O Count | 85 | 85 | 85 | 85 | 85 | 85 | 85 |
Principaux différenciateurs
- Commercial temperature grade at lower price than industrial EP2C8T144I8N (vs EP2C8T144I8N)
- C8 is the fastest speed grade in the EP2C8T144 TQFP-144 family (vs EP2C8T144C7N)
- Lead-free RoHS-compliant terminal finish (N suffix) (vs EP2C8T144C8)
Notes de conception
Estimated: The EP2C8T144C8N core draws approximately 50-300 mA from VCCINT (1.2 V) depending on logic utilization, clock frequency, and toggle rate. Each I/O bank (VCCIO1-VCCIO4) draws 5-50 mA depending on switching activity and load. Design a power supply capable of at least 500 mA on VCCINT plus 100 mA per VCCIO bank. Use a linear regulator (LDO) such as a 1.5 A part for VCCINT, and add 0.1 uF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin per Quartus II pin connection guidelines.
The TQFP-144 package without an exposed thermal pad has a higher junction-to-ambient thermal resistance (theta_JA approximately 35-45 C/W) than BGA packages with exposed pads. For commercial 0C to +85C operation, ensure total power dissipation stays below approximately 1.0 W without airflow. For designs approaching 1.5 W, add 100 LFM airflow or migrate to the FBGA-256 packaged EP2C8F256C8N, which provides an exposed pad for heatsink attachment.
The TQFP-144 package has 0.5 mm lead pitch - PCB design requires 4-mil (0.1 mm) trace/space rules and 8-mil (0.2 mm) pad-to-trace clearance. Use micro-vias or dog-bone fanouts for inner-row signals. Provide at least 4 power planes (one each for VCCINT, VCCIO, GND, and one split for PLL analog supply isolation) to minimize power-supply-induced jitter on PLL outputs. Route JTAG signals (TMS, TCK, TDO, TDI) with 50 ohm characteristic impedance and keep them away from high-speed switching signals to avoid programming failures.
Do not confuse the EP2C8T144C8N (TQFP-144) with the EP2C8Q208C8N (PQFP-208) - they share silicon but use different packages and pinouts, making PCB migration impossible without redesign. Ensure MSEL pins are correctly strapped for the chosen configuration mode (AS, PS, JTAG) per the Cyclone II Device Handbook. Do not leave VCCIO banks floating when not used - tie each VCCIO to VCCINT (1.2 V) or to a valid I/O voltage to avoid I/O buffer instability at power-up.
Informations de conformité
RoHS compliant per DigiKey product listing (N suffix denotes lead-free finish). AEC-Q100 not applicable - this is a commercial/industrial grade FPGA, not automotive-qualified. Last-time-buy status from Intel as of 2026 - new production orders are no longer accepted.
