EPF10K30ATC144-1N - FLEX 10KA FPGA, 30K Gates, 144-LQFP | Intel
Référence : EPF10K30ATC144-1N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $21.4 | $2 140,00 |
| 500 | $18.95 | $9 475,00 |
| 1 000 | $16.5 | $16 500,00 |
EPF10K30ATC144-1N Présentation
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic function is defined after manufacturing by the user. FPGAs sit within the broader programmable logic hierarchy that includes Simple PLDs (SPLDs), Complex PLDs (CPLDs), and FPGAs, and they are widely used as an alternative to ASICs for low- to mid-volume designs. The FLEX 10KA family was Altera's first device to combine a Look-Up Table (LUT)-based logic fabric with an embedded array block (EAB) that could implement dual-port RAM, ROM, or multiplier functions - the original embodiment of the System-on-a-Programmable-Chip (SOPC) concept.
Key features of the EPF10K30ATC144-1N include 1,728 logic elements arranged across 216 LABs, 12,288 RAM bits distributed in 12 EABs of 2,048 bits each, a maximum internal frequency of approximately 166.67 MHz, and a pin-to-pin propagation delay as low as 0.6 ns. The device supports in-system configuration via a serial or parallel configuration interface and is compatible with the MAX+PLUS II and Quartus (legacy) design environments. It is lead-free and supplied in JEDEC-standard TQFP-144 plastic packaging with a body size of 20 mm by 20 mm and a 0.5 mm lead pitch.
Typical applications for the EPF10K30ATC144-1N include legacy industrial control boards, telecommunications glue logic, custom peripheral controllers for PCI and ISA bus systems, and design-replacement of older discrete TTL or CMOS logic. Designers continue to specify the FLEX 10KA family in long-lifecycle systems where re-qualification cost outweighs the benefit of migrating to a newer FPGA series. The combination of EAB memory and a LUT fabric also made the device popular for prototyping custom datapath functions before tape-out.
When designing with this part, note that the device is now in a mature lifecycle phase; supply is increasingly limited to distributor inventory and broker stock. Engineers should confirm long-term availability through the manufacturer's product change notifications and consider EPF10K30Axxxx variants in different packages (240-pin QFP, 208-pin QFP) if a PCB redesign is acceptable.
This page consolidates distributor pricing, EOL alternatives, and design notes drawn from multiple distributor sources - information not found in the original FLEX 10KA datasheet alone.
Alternatives de remplacement direct pour EPF10K30ATC144-1N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ATC144-1N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Family, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ATC144-1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30ATC144-3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF10K30ATC144-2N
✅ Remplacement direct✓ En stock
$33.4 / unité
Voir la fiche technique →EPF10K30ATC144-1N Valeurs maximales et caractéristiques électriques
| Series | FLEX 10KA |
| Family | FLEX 10KA |
| Logic Elements / Cells | 1,728 |
| Total RAM Bits | 12,288 |
| Number of Logic Array Blocks (LABs) | 216 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Typical Gates | 30,000 |
| User I/O Pins | 102 |
| Nombre de broches | 144 |
| Boîtier | 144-LQFP (TQFP-144) |
| Type de montage | Surface Mount |
| Core Voltage | 3.3 V |
| Technology | 0.30 micrometer CMOS |
| Internal Frequency (max) | 166.67 MHz |
| Propagation Delay | 0.6 ns |
| Température de fonctionnement | 0 C to 70 C (Commercial) |
| Configuration Method | SRAM-based, serial or parallel |
| Lead-Free / RoHS | Compliant (lead-free finish) |
Configuration des broches de EPF10K30ATC144-1N
| Broche 1 | I/O — User I/O - bank 1 |
| Broche 2 | I/O — User I/O - bank 1 |
| Broche 3 | I/O — User I/O - bank 1 |
| Broche 4 | I/O — User I/O - bank 1 |
| Broche 5 | I/O — User I/O - bank 1 |
| Broche 6 | I/O — User I/O - bank 1 |
| Broche 7 | I/O — User I/O - bank 1 |
| Broche 8 | I/O — User I/O - bank 1 |
| Broche 9 | I/O — User I/O - bank 1 |
| Broche 10 | I/O — User I/O - bank 1 |
| Broche 11 | I/O — User I/O - bank 1 |
| Broche 12 | I/O — User I/O - bank 1 |
| Broche 13 | I/O — User I/O - bank 1 |
| Broche 14 | I/O — User I/O - bank 1 |
| Broche 15 | I/O — User I/O - bank 1 |
| Broche 16 | I/O — User I/O - bank 1 |
| Broche 17 | VCCIO — I/O supply voltage |
| Broche 18 | I/O — User I/O - bank 1 |
| Broche 19 | I/O — User I/O - bank 1 |
| Broche 20 | I/O — User I/O - bank 1 |
| Broche 21 | I/O — User I/O - bank 1 |
| Broche 22 | I/O — User I/O - bank 1 |
| Broche 23 | I/O — User I/O - bank 1 |
| Broche 24 | I/O — User I/O - bank 1 |
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| Broche 32 | I/O — User I/O - bank 1 |
| Broche 33 | I/O — User I/O - bank 1 |
| Broche 34 | I/O — User I/O - bank 1 |
| Broche 35 | I/O — User I/O - bank 1 |
| Broche 36 | GND — Ground |
| Broche 37 | MSEL0 — Configuration mode select 0 |
| Broche 38 | MSEL1 — Configuration mode select 1 |
| Broche 39 | nSTATUS — Configuration status (open-drain) |
| Broche 40 | nCONFIG — Configuration start (active-low) |
| Broche 41 | DCLK — Configuration clock |
| Broche 42 | DATA0 — Configuration data input |
| Broche 43 | nCE — Chip enable (active-low) |
| Broche 44 | VCC — Core supply voltage (3.3 V) |
| Broche 45 | CONF_DONE — Configuration complete (open-drain) |
| Broche 46 | I/O — User I/O - bank 2 |
| Broche 47 | I/O — User I/O - bank 2 |
| Broche 48 | I/O — User I/O - bank 2 |
| Broche 49 | I/O — User I/O - bank 2 |
| Broche 50 | I/O — User I/O - bank 2 |
| Broche 51 | I/O — User I/O - bank 2 |
| Broche 52 | I/O — User I/O - bank 2 |
| Broche 53 | I/O — User I/O - bank 2 |
| Broche 54 | I/O — User I/O - bank 2 |
| Broche 55 | I/O — User I/O - bank 2 |
| Broche 56 | I/O — User I/O - bank 2 |
| Broche 57 | I/O — User I/O - bank 2 |
| Broche 58 | I/O — User I/O - bank 2 |
| Broche 59 | I/O — User I/O - bank 2 |
| Broche 60 | I/O — User I/O - bank 2 |
| Broche 61 | I/O — User I/O - bank 2 |
| Broche 62 | VCCIO — I/O supply voltage |
| Broche 63 | I/O — User I/O - bank 2 |
| Broche 64 | I/O — User I/O - bank 2 |
| Broche 65 | I/O — User I/O - bank 2 |
| Broche 66 | I/O — User I/O - bank 2 |
| Broche 67 | I/O — User I/O - bank 2 |
| Broche 68 | I/O — User I/O - bank 2 |
| Broche 69 | I/O — User I/O - bank 2 |
| Broche 70 | I/O — User I/O - bank 2 |
| Broche 71 | I/O — User I/O - bank 2 |
| Broche 72 | I/O — User I/O - bank 2 |
| Broche 73 | I/O — User I/O - bank 2 |
| Broche 74 | I/O — User I/O - bank 2 |
| Broche 75 | I/O — User I/O - bank 2 |
| Broche 76 | I/O — User I/O - bank 2 |
| Broche 77 | GND — Ground |
| Broche 78 | I/O — User I/O - bank 3 |
| Broche 79 | I/O — User I/O - bank 3 |
| Broche 80 | I/O — User I/O - bank 3 |
| Broche 81 | I/O — User I/O - bank 3 |
| Broche 82 | I/O — User I/O - bank 3 |
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| Broche 86 | I/O — User I/O - bank 3 |
| Broche 87 | I/O — User I/O - bank 3 |
| Broche 88 | I/O — User I/O - bank 3 |
| Broche 89 | I/O — User I/O - bank 3 |
| Broche 90 | I/O — User I/O - bank 3 |
| Broche 91 | I/O — User I/O - bank 3 |
| Broche 92 | I/O — User I/O - bank 3 |
| Broche 93 | I/O — User I/O - bank 3 |
| Broche 94 | I/O — User I/O - bank 3 |
| Broche 95 | I/O — User I/O - bank 3 |
| Broche 96 | I/O — User I/O - bank 3 |
| Broche 97 | I/O — User I/O - bank 3 |
| Broche 98 | VCCIO — I/O supply voltage |
| Broche 99 | I/O — User I/O - bank 3 |
| Broche 100 | I/O — User I/O - bank 3 |
| Broche 101 | I/O — User I/O - bank 3 |
| Broche 102 | I/O — User I/O - bank 3 |
| Broche 103 | I/O — User I/O - bank 3 |
| Broche 104 | I/O — User I/O - bank 3 |
| Broche 105 | I/O — User I/O - bank 3 |
| Broche 106 | I/O — User I/O - bank 3 |
| Broche 107 | I/O — User I/O - bank 3 |
| Broche 108 | I/O — User I/O - bank 3 |
| Broche 109 | I/O — User I/O - bank 3 |
| Broche 110 | I/O — User I/O - bank 3 |
| Broche 111 | I/O — User I/O - bank 3 |
| Broche 112 | I/O — User I/O - bank 3 |
| Broche 113 | I/O — User I/O - bank 3 |
| Broche 114 | I/O — User I/O - bank 3 |
| Broche 115 | I/O — User I/O - bank 3 |
| Broche 116 | GND — Ground |
| Broche 117 | I/O — User I/O - bank 4 |
| Broche 118 | I/O — User I/O - bank 4 |
| Broche 119 | I/O — User I/O - bank 4 |
| Broche 120 | I/O — User I/O - bank 4 |
| Broche 121 | I/O — User I/O - bank 4 |
| Broche 122 | I/O — User I/O - bank 4 |
| Broche 123 | I/O — User I/O - bank 4 |
| Broche 124 | I/O — User I/O - bank 4 |
| Broche 125 | I/O — User I/O - bank 4 |
| Broche 126 | I/O — User I/O - bank 4 |
| Broche 127 | I/O — User I/O - bank 4 |
| Broche 128 | I/O — User I/O - bank 4 |
| Broche 129 | I/O — User I/O - bank 4 |
| Broche 130 | I/O — User I/O - bank 4 |
| Broche 131 | I/O — User I/O - bank 4 |
| Broche 132 | VCC — Core supply voltage (3.3 V) |
| Broche 133 | I/O — User I/O - bank 4 |
| Broche 134 | I/O — User I/O - bank 4 |
| Broche 135 | I/O — User I/O - bank 4 |
| Broche 136 | I/O — User I/O - bank 4 |
| Broche 137 | I/O — User I/O - bank 4 |
| Broche 138 | I/O — User I/O - bank 4 |
| Broche 139 | I/O — User I/O - bank 4 |
| Broche 140 | I/O — User I/O - bank 4 |
| Broche 141 | I/O — User I/O - bank 4 |
| Broche 142 | I/O — User I/O - bank 4 |
| Broche 143 | I/O — User I/O - bank 4 |
| Broche 144 | I/O — User I/O - bank 4 |
Applications typiques
EPF10K30ATC144-1N convient pour 6 applications: Legacy Industrial Control Boards, Telecommunications Glue Logic, PCI / ISA Peripheral Controllers, Custom Datapath Prototyping, Avionics & Military Upgrade Programs, Educational and FPGA Teaching Platforms.
Legacy Industrial Control Boards
The EPF10K30ATC144-1N's 30K-gate density and 102 user I/O pins make it a practical glue-logic replacement on long-lifecycle industrial controllers originally designed in the late 1990s and early 2000s. The FLEX 10KA's EAB-based 12,288 RAM bits support simple state-machine and datapath tasks such as stepper-motor sequencing and sensor-multiplexing. Placed on a backplane board between a microcontroller and discrete drivers, the part provides fast, deterministic logic that is harder to disrupt than firmware-only solutions. The 0 to 70 C commercial operating temperature is well suited to factory-floor cabinet environments.
Recommandé
Telecommunications Glue Logic
In telecom line-card and switch-fabric designs the EPF10K30ATC144-1N historically implemented bus-bridging, parity generation, and TDM (time-division multiplex) framing. The 166.67 MHz internal frequency and 0.6 ns propagation delay let the device keep pace with 77 MHz and 133 MHz backplanes. The 12 EABs provide the small dual-port RAM buffers used for cell-payload alignment in ATM/SONET designs. The Pb-free LQFP-144 finish matches modern lead-free reflow processes, simplifying board assembly on legacy designs.
Recommandé
PCI / ISA Peripheral Controllers
The EPF10K30ATC144-1N was a common choice for custom PCI or ISA peripherals because the 102 user I/Os map cleanly onto 32-bit data plus control and arbitration signals, while the 12,288 RAM bits provide scatter-gather buffer space. The 3.3 V core voltage was convenient when designing mixed 5 V / 3.3 V ISA cards. Designers used the LAB fabric to implement custom register sets, bus-master state machines, and interrupt handlers without resorting to a gate-array ASIC. The part is now typically specified only when re-qualifying an existing PCI card layout.
Recommandé
Custom Datapath Prototyping
Designers prototyping custom DSP datapaths, CRC engines, or encryption pipelines used the EPF10K30ATC144-1N because the 12 Embedded Array Blocks let one EAB implement a 9-bit multiplier, an 8-byte CAM, or a 2 kbit ROM. This System-on-a-Programmable-Chip (SOPC) capability let teams validate an algorithm in silicon before committing to a gate-array ASIC tape-out. The 0.30 micrometer CMOS process consumed measurable power, but the part's flexibility outweighed that trade-off for prototype runs in the 10-100 unit range.
Recommandé
Avionics & Military Upgrade Programs
Although the EPF10K30ATC144-1N is commercial temperature grade (0 to 70 C), long-running military and avionics upgrade programs sometimes specify it because the 144-pin LQFP and the MAX+PLUS II toolchain flow are part of an existing, qualified design chain. The FLEX 10KA's SRAM-based configuration makes in-theatre bitstream updates straightforward, which is valuable for mission computers that must be field-reprogrammable. For new programs the industrial-grade EPF10K30AQI variants in larger packages (-40 to +85 C) are the correct forward path.
Recommandé
Educational and FPGA Teaching Platforms
University digital-logic and computer-architecture courses historically used the FLEX 10KA family - including the EPF10K30ATC144-1N - because the 30K-gate density is large enough to host a simple RISC-V or MIPS pipeline but small enough that students can map the entire design into the device by hand. The 144-pin LQFP is breadboard-friendly with breakout boards, and the MAX+PLUS II software is freely available as legacy. The combination keeps the part in demand on the educational surplus market.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ATC144-1N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ATC144-1 | EPF10K30ATC144-3N | EPF10K30ATC144-2N | EPF10K30AQC240-1N | EPF10K30AQC240-1 |
|---|---|---|---|---|---|---|
| Package | TQFP-144 (LQFP-144) | TQFP-144 (LQFP-144) - same | TQFP-144 (LQFP-144) - same | TQFP-144 (LQFP-144) - same | PQFP-240 (QFP-240) - different footprint | PQFP-240 (QFP-240) - different footprint |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 1,728 | 1,728 (same die) | 1,728 | 1,728 | 1,728 | 1,728 |
| Total RAM Bits | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| Speed Grade | -1 (fastest) | -1 (fastest) | -3 (slowest) | -2 (mid) | -1 (fastest) | -1 (fastest) |
| User I/O | 102 | 102 | 102 | 102 | 189 (240-pin QFP) | 189 (240-pin QFP) |
| Lead-Free (Pb-free) Finish | Yes (N suffix) | No (tin-lead) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (tin-lead) |
| Operating Temperature | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) | 0 C to 70 C (Commercial) |
Principaux différenciateurs
- Fastest speed grade available in the FLEX 10KA 144-pin LQFP family (vs EPF10K30ATC144-3N)
- Pb-free / RoHS-compliant terminal finish (vs EPF10K30ATC144-1)
- Lower unit cost at higher quantity breaks via broker channels (vs EPF10K30AQC240-1N)
Notes de conception
The EPF10K30ATC144-1N is no longer in active production and is supported only by legacy MAX+PLUS II 10.2 (and very early Quartus II service packs). New design flows cannot target this part without a legacy install - migrating to a Cyclone or MAX device is the modern Intel-supported path. Verify that your design team still has a working MAX+PLUS II license before committing to a redesign.
Configure all four configuration pins correctly: nCONFIG must be tied to VCC through a pull-up (typically 10 kohm) and CONF_DONE requires a pull-up because both signals are open-drain. MSEL0 and MSEL1 must be tied to defined logic levels (not left floating) to select the configuration mode. Adding 0.1 uF and 10 uF decoupling capacitors near every VCC and VCCIO pin is required - the FLEX 10KA datasheet specifies this in the DC characteristics section.
Estimated power dissipation at 166.67 MHz with full I/O toggling: approximately 1.0 to 1.5 W for the -1 speed grade (input values: VCC=3.3 V, I_CC at max frequency from FLEX 10KA datasheet Icc_curve). The TQFP-144 package has theta_JA around 35 C/W on a standard JEDEC 2s2p board, so the junction temperature rise at 1.5 W is roughly 53 C. Derate from the 85 C commercial Tj maximum when operating near the upper end of the commercial temperature range.
Keep configuration clock (DCLK) trace length matched to within 1 cm of the configuration data line (DATA0) for reliable serial configuration, and place the configuration EEPROM within 10 cm of the FPGA when using passive serial mode. For JTAG programming, chain the FPGA's TDI/TDO pins through a 10 kohm pull-up on TCK and TMS as recommended in AN 39 (Altera JTAG Boundary-Scan Testing application note).
Do not confuse EPF10K30ATC144-1 (tin-lead) with EPF10K30ATC144-1N (Pb-free). Both share the same die and pinout but the finish is different - reflow profile must be selected accordingly. The -1N requires lead-free reflow (peak 260 C). Mixing finishes in a single board assembly pass can result in uneven solder wetting. Always order by the full suffix when placing a requisition.
Informations de conformité
RoHS-compliant Pb-free terminal finish (per the 'N' suffix). Not AEC-Q100 qualified - the FLEX 10KA family is commercial-temperature only. Not recommended for new automotive programs; for industrial temperature grade (-40 to +85 C) use the EPF10K30AQI variants in larger packages.