EPF10K30ETI144-2N - FLEX 10KE FPGA 30K Gates 144-TQFP | Intel
Référence : EPF10K30ETI144-2N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.8 | $2 980,00 |
| 500 | $26.5 | $13 250,00 |
| 1 000 | $23.4 | $23 400,00 |
EPF10K30ETI144-2N Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer after manufacture to implement arbitrary digital logic. Architecturally, an FPGA sits between fixed-function ASICs and general-purpose processors in the design hierarchy: ASIC > FPGA > CPLD > PLD > programmable logic. FPGAs like the FLEX 10KE family extend traditional gate-array logic with on-chip embedded memory blocks, enabling System-on-a-Programmable-Chip (SOPC) integration of megafunctions such as microcontrollers, FIFOs, DSP filters, and custom peripherals.
Key features of the EPF10K30ETI144-2N include 102 user I/O pins, 216 Logic Array Blocks (LABs) in the structured Logic Element array, a MultiVolt I/O interface supporting 2.5 V/3.3 V/5.0 V mixed-voltage operation, PCI-compliant I/O buffers with selectable pull-up clamping diodes, slew-rate control, and open-drain output options configured on a pin-by-pin basis via Altera logic options. The embedded array blocks (EABs) provide synchronous dual-port RAM, ROM, and multiplier implementations without external memory.
The FLEX 10KE architecture combines a fine-grained Logic Element fabric with coarse-grained Embedded Array Blocks, a flexible interconnect (FastTrack), and a continuous I/O ring supporting a variety of single-ended and differential I/O standards. This hybrid fabric allows designers to implement glue logic, state machines, and memory-intensive megafunctions on a single chip while preserving deterministic timing for the FPGA fabric. The 0.22 µm process provides mature, low-power operation with extensive third-party tool support from the legacy Altera MAX+PLUS II and Quartus flows.
Typical applications include industrial control and factory automation, telecommunications line-card glue logic, PCI interface bridging, prototype ASIC replacement, and low-volume embedded systems requiring on-chip memory and flexible I/O voltage. The 144-TQFP footprint supports a hand-solderable, low-cost PCB assembly process that is well suited to industrial and legacy designs.
When designing with this device, ensure the Quartus or MAX+PLUS II toolchain version is matched to the FLEX 10KE device support, because newer Quartus releases have removed legacy FLEX device support. For new designs, consider migrating to the MAX II or Cyclone families, since FLEX 10KE is a mature, last-time-buy product line.
This page synthesizes distributor pricing, drop-in alternatives from the Site MPN catalog, and design considerations not collected in a single place in the manufacturer datasheet.
Alternatives de remplacement direct pour EPF10K30ETI144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF10K30ETI144-2N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Configuration Method, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF10K30ETI144-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$41.5 / unité
Voir la fiche technique →EPF10K30ETC144-2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.25 / unité
Voir la fiche technique →EPF10K30ETC144-2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$37.8 / unité
Voir la fiche technique →EPF10K30ETC144-3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$26.75 / unité
Voir la fiche technique →EPF10K30ETC144-3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$35.2 / unité
Voir la fiche technique →EPF10K30ETI144-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 10KE |
| Series | FLEX 10KE |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded Memory (EAB) | 24,576 bits |
| User I/O Pins | 102 |
| Core Voltage (VCCINT) | 2.5 V |
| I/O Voltage (VCCIO) | 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Process Technology | 0.22 µm CMOS |
| Maximum Internal Frequency | 200 MHz |
| Boîtier | 144-pin TQFP (LQFP-144) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Speed Grade | -2 |
| Lead-Free (N suffix) | Yes |
Configuration des broches de EPF10K30ETI144-2N
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | I/O — User I/O pin (bank 1) |
| Broche 12 | I/O — User I/O pin (bank 1) |
| Broche 13 | I/O — User I/O pin (bank 1) |
| Broche 14 | VCCIO1 — I/O supply for bank 1 (MultiVolt: 2.5/3.3/5.0 V) |
| Broche 15 | I/O — User I/O pin (bank 1) |
| Broche 16 | I/O — User I/O pin (bank 1) |
| Broche 17 | I/O — User I/O pin (bank 1) |
| Broche 18 | I/O — User I/O pin (bank 1) |
| Broche 19 | I/O — User I/O pin (bank 1) |
| Broche 20 | I/O — User I/O pin (bank 1) |
| Broche 21 | I/O — User I/O pin (bank 1) |
| Broche 22 | I/O — User I/O pin (bank 1) |
| Broche 23 | I/O — User I/O pin (bank 1) |
| Broche 24 | I/O — User I/O pin (bank 1) |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | I/O — User I/O pin (bank 2) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | VCCIO2 — I/O supply for bank 2 (MultiVolt: 2.5/3.3/5.0 V) |
| Broche 39 | I/O — User I/O pin (bank 2) |
| Broche 40 | I/O — User I/O pin (bank 2) |
| Broche 41 | I/O — User I/O pin (bank 2) |
| Broche 42 | I/O — User I/O pin (bank 2) |
| Broche 43 | I/O — User I/O pin (bank 2) |
| Broche 44 | I/O — User I/O pin (bank 2) |
| Broche 45 | I/O — User I/O pin (bank 2) |
| Broche 46 | I/O — User I/O pin (bank 2) |
| Broche 47 | I/O — User I/O pin (bank 2) |
| Broche 48 | I/O — User I/O pin (bank 2) |
| Broche 49 | GND — Ground |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | I/O — User I/O pin (bank 3) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 3) |
| Broche 59 | I/O — User I/O pin (bank 3) |
| Broche 60 | I/O — User I/O pin (bank 3) |
| Broche 61 | I/O — User I/O pin (bank 3) |
| Broche 62 | VCCIO3 — I/O supply for bank 3 (MultiVolt: 2.5/3.3/5.0 V) |
| Broche 63 | I/O — User I/O pin (bank 3) |
| Broche 64 | I/O — User I/O pin (bank 3) |
| Broche 65 | I/O — User I/O pin (bank 3) |
| Broche 66 | I/O — User I/O pin (bank 3) |
| Broche 67 | I/O — User I/O pin (bank 3) |
| Broche 68 | I/O — User I/O pin (bank 3) |
| Broche 69 | I/O — User I/O pin (bank 3) |
| Broche 70 | I/O — User I/O pin (bank 3) |
| Broche 71 | I/O — User I/O pin (bank 3) |
| Broche 72 | I/O — User I/O pin (bank 3) |
| Broche 73 | GND — Ground |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | I/O — User I/O pin (bank 4) |
| Broche 76 | I/O — User I/O pin (bank 4) |
| Broche 77 | I/O — User I/O pin (bank 4) |
| Broche 78 | I/O — User I/O pin (bank 4) |
| Broche 79 | I/O — User I/O pin (bank 4) |
| Broche 80 | I/O — User I/O pin (bank 4) |
| Broche 81 | I/O — User I/O pin (bank 4) |
| Broche 82 | I/O — User I/O pin (bank 4) |
| Broche 83 | I/O — User I/O pin (bank 4) |
| Broche 84 | I/O — User I/O pin (bank 4) |
| Broche 85 | I/O — User I/O pin (bank 4) |
| Broche 86 | VCCIO4 — I/O supply for bank 4 (MultiVolt: 2.5/3.3/5.0 V) |
| Broche 87 | I/O — User I/O pin (bank 4) |
| Broche 88 | I/O — User I/O pin (bank 4) |
| Broche 89 | I/O — User I/O pin (bank 4) |
| Broche 90 | I/O — User I/O pin (bank 4) |
| Broche 91 | I/O — User I/O pin (bank 4) |
| Broche 92 | I/O — User I/O pin (bank 4) |
| Broche 93 | I/O — User I/O pin (bank 4) |
| Broche 94 | I/O — User I/O pin (bank 4) |
| Broche 95 | I/O — User I/O pin (bank 4) |
| Broche 96 | I/O — User I/O pin (bank 4) |
| Broche 97 | GND — Ground |
| Broche 98 | TDI — JTAG Test Data In |
| Broche 99 | TMS — JTAG Test Mode Select |
| Broche 100 | TCK — JTAG Test Clock |
| Broche 101 | nCONFIG — Configuration control (active low) |
| Broche 102 | VCCINT — Core supply (2.5 V) |
| Broche 103 | nSTATUS — Configuration status (active low) |
| Broche 104 | CONF_DONE — Configuration done indicator |
| Broche 105 | DCLK — Configuration clock input |
| Broche 106 | DATA0 — Configuration data input (LSB) |
| Broche 107 | GND — Ground |
| Broche 108 | VCCINT — Core supply (2.5 V) |
| Broche 109 | DATA1 — Configuration data input |
| Broche 110 | DATA2 — Configuration data input |
| Broche 111 | DATA3 — Configuration data input |
| Broche 112 | DATA4 — Configuration data input |
| Broche 113 | DATA5 — Configuration data input |
| Broche 114 | DATA6 — Configuration data input |
| Broche 115 | DATA7 — Configuration data input (MSB) |
| Broche 116 | GND — Ground |
| Broche 117 | CLK0 — Clock input 0 |
| Broche 118 | CLK1 — Clock input 1 |
| Broche 119 | CLK2 — Clock input 2 |
| Broche 120 | VCCINT — Core supply (2.5 V) |
| Broche 121 | GND — Ground |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | I/O — User I/O pin (bank 4) |
| Broche 124 | I/O — User I/O pin (bank 1) |
| Broche 125 | I/O — User I/O pin (bank 1) |
| Broche 126 | I/O — User I/O pin (bank 1) |
| Broche 127 | I/O — User I/O pin (bank 1) |
| Broche 128 | I/O — User I/O pin (bank 1) |
| Broche 129 | I/O — User I/O pin (bank 1) |
| Broche 130 | I/O — User I/O pin (bank 1) |
| Broche 131 | I/O — User I/O pin (bank 1) |
| Broche 132 | I/O — User I/O pin (bank 1) |
| Broche 133 | I/O — User I/O pin (bank 1) |
| Broche 134 | I/O — User I/O pin (bank 1) |
| Broche 135 | I/O — User I/O pin (bank 1) |
| Broche 136 | I/O — User I/O pin (bank 1) |
| Broche 137 | I/O — User I/O pin (bank 1) |
| Broche 138 | I/O — User I/O pin (bank 1) |
| Broche 139 | I/O — User I/O pin (bank 1) |
| Broche 140 | I/O — User I/O pin (bank 1) |
| Broche 141 | I/O — User I/O pin (bank 1) |
| Broche 142 | I/O — User I/O pin (bank 1) |
| Broche 143 | I/O — User I/O pin (bank 1) |
| Broche 144 | I/O — User I/O pin (bank 1) |
Applications typiques
EPF10K30ETI144-2N convient pour 6 applications: Industrial Control and Factory Automation, Telecommunications Line-Card Glue Logic, PCI Interface Bridge and Adapter Cards, ASIC Replacement and Prototype Emulation, Legacy Embedded Systems and Long-Lifecycle Industrial Designs, Education, Hobby and Legacy Design Reproduction.
Industrial Control and Factory Automation
The EPF10K30ETI144-2N suits industrial control designs because of its industrial temperature range (-40 °C to +85 °C) and 102 user I/O pins, which can absorb the multiple sensor inputs, relay-driver outputs, and isolated communication links typical of a PLC or machine controller. The FLEX 10KE embedded array blocks (EABs, 24,576 bits of synchronous dual-port RAM) handle FIFOs, control tables, and protocol buffers without external memory, reducing board complexity. The MultiVolt I/O interface supports 5 V tolerant inputs on a 2.5 V core supply, allowing direct connection to legacy 5 V industrial sensors and HMI displays. Designers should budget clock-tree margin and use the JTAG boundary-scan to validate solder joints during factory production.
Recommandé
Telecommunications Line-Card Glue Logic
Telecommunications line cards require deterministic glue logic between a framer, TDM switch, and backplane SERDES. The EPF10K30ETI144-2N provides 1,728 logic elements for cell/packet delineation, alarm monitoring, and watchdog functions, with the embedded EABs implementing small FIFOs that smooth TDM bursts at line rates up to 200 MHz. The PCI-compliant I/O buffers (3.3 V/33 MHz) allow direct connection to a backplane processor through the PCI bus, while the slew-rate-controlled outputs reduce EMI on the densely populated line card. Pair the device with an EPM7128A CPLD for power-up sequencing and an EPC2 configuration PROM for in-system reprogrammability.
Recommandé
PCI Interface Bridge and Adapter Cards
The EPF10K30ETI144-2N is a natural fit for legacy PCI adapter cards, where its PCI-compliant I/O buffers (3.3 V, 33 MHz, 102 user I/O) implement the 32-bit PCI target or master interface, plus local bus glue logic, scatter-gather DMA engines, and on-chip FIFOs. The 24,576 bits of embedded SRAM provide the data-path buffer between PCI bursts and the local bus, while the 0.22 µm CMOS process keeps active power within the PCI 5 V signaling budget. For a 5 V PCI slot, set VCCIO to 5.0 V; for a 3.3 V Universal PCI slot, set VCCIO to 3.3 V. Add a resistive divider on the JTAG chain to allow in-system programming through the PCI backplane.
Recommandé
ASIC Replacement and Prototype Emulation
For ASIC replacement and rapid prototyping, the EPF10K30ETI144-2N provides 30,000 gates of logic plus 24 Kbits of on-chip memory, which is sufficient to emulate most sub-system-level ASICs for low-to-medium volume production. Designers can iterate on the Quartus or MAX+PLUS II netlist, then port the verified logic to an ASIC for cost reduction in high volume. The 144-TQFP package is hand-solderable and breadboard-friendly for prototype builds, while the same die is available in 256-FBGA and 484-FBGA packages for the final production design. The FLEX 10KE embedded array blocks also support megafunctions such as multipliers and microsequencers.
Recommandé
Legacy Embedded Systems and Long-Lifecycle Industrial Designs
Long-lifecycle industrial designs (e.g., medical, aerospace, transportation) that were prototyped in the late 1990s and early 2000s often lock in the FLEX 10KE silicon to avoid re-validation. The EPF10K30ETI144-2N preserves the design's binary compatibility, the JTAG programming flow, and the existing PCB layout. The MultiVolt I/O bank allows direct connection to 5 V and 3.3 V peripherals on the same board, while the industrial temperature range ensures operation in uncontrolled environments. For maintenance and repair, the EPC2 configuration PROM provides in-system programming, and the 144-TQFP package can be reworked with standard hot-air stations.
Recommandé
Education, Hobby and Legacy Design Reproduction
The EPF10K30ETI144-2N is well suited to university FPGA labs, hobby projects, and the reproduction of legacy designs that target the FLEX 10KE family. The 144-TQFP is hand-solderable on a 0.5 mm pitch, and the legacy MAX+PLUS II and Quartus toolchains (older versions) still support the FLEX 10KE device, allowing students to learn first-generation FPGA design flows including Logic Element mapping, EAB megafunction instantiation, and JTAG configuration. The 30,000-gate complexity is large enough for teaching soft-core microcontrollers, simple DSP, and bus architectures but small enough to keep synthesis times short on a laptop.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF10K30ETI144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF10K30ETI144-2 | EPF10K30ETC144-2N | EPF10K30ETC144-2 | EPF10K30ETC144-3N | EPF10K30ETC144-3 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-pin TQFP | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same | 144-pin TQFP - same |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| Embedded Memory (EAB) | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| User I/O | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -3 (faster Fmax) | -3 (faster Fmax) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) |
| Lead-Free (Pb-free) | Yes (N suffix) | No | Yes | No | Yes | No |
| Core Voltage (VCCINT) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process / Family | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE | 0.22 µm FLEX 10KE |
Principaux différenciateurs
- Industrial temperature range with Pb-free packaging (vs EPF10K30ETC144-2N)
- Pb-free (N suffix) for RoHS-compliant reflow assembly (vs EPF10K30ETI144-2)
- Speed grade -2 with stable timing closure margin (vs EPF10K30ETC144-3N)
Notes de conception
The FLEX 10KE family uses a 2.5 V VCCINT core and a separate MultiVolt VCCIO supply per I/O bank (2.5/3.3/5.0 V). Decouple each VCCINT pin with a 0.1 µF X7R ceramic placed within 5 mm of the pin, and add a single 10 µF bulk capacitor per bank. For mixed-voltage designs, set VCCIO independently per bank to allow 5 V peripherals on bank 1 and 3.3 V peripherals on bank 2 without external level shifters.
Newer Quartus versions (15.0 and later) have removed FLEX 10KE device support. Use Quartus II 13.0sp1 or earlier, or the legacy MAX+PLUS II toolchain, to synthesize for this device. For new designs, plan a migration path to the MAX II CPLD or Cyclone FPGA families before committing the PCB layout.
Route the JTAG chain (TCK/TMS/TDO/TDI) as a daisy chain with each device's TDO feeding the next device's TDI; keep the chain length under 6 inches to stay below the 10 MHz TCK limit of the Altera ByteBlaster. Add 4.7 kΩ pull-ups on TMS, TDI, and nCONFIG to VCCIO to ensure a defined idle state during board power-up. Decouple the configuration PROM (EPC2LC20N) with 0.1 µF + 10 µF and route DCLK as a short, impedance-controlled trace to minimize configuration timing violations.
Informations de conformité
The 'N' suffix indicates Pb-free reflow-compatible lead finish per the Altera ordering information. RoHS/REACH/AEC-Q100 explicit status is not stated in the provided data and is marked unknown. FPGAs in this family are not typically AEC-Q100 qualified - this part is intended for industrial (not automotive) designs.
