Altera

EPF6016TC144-3 - FLEX 6000 FPGA, 16K Gates, 144-LQFP | Altera

Référence : EPF6016TC144-3 ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss 144-pin LQFP (TQFP) Package 125 MHz Speed
À partir de $9.85 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-11
Tarifs dégressifs
Qté Prix unitaire Total
1 $18.95 $18,95
10 $16.5 $165,00
100 $13.95 $1 395,00
500 $11.4 $5 700,00
1 000 $9.85 $9 850,00
ℹ️ Tous les prix sont en USD

EPF6016TC144-3 Présentation

The Altera EPF6016TC144-3 is a member of the FLEX 6000 family of SRAM-based Field Programmable Gate Arrays (FPGAs) housed in a 144-pin LQFP package. Built on a 0.42 µm CMOS process with 5V core operation, the device delivers approximately 16,000 typical gates, 1,320 logic elements distributed across 132 Logic Array Blocks (LABs), and 117 user I/O pins, with a maximum internal frequency of 125 MHz and a system frequency rating around 172 MHz. The "TC144" suffix denotes the TQFP commercial-temperature package, while the "-3" speed grade indicates the standard performance tier within the FLEX 6000 line.

A Field Programmable Gate Array (FPGA) is a reconfigurable integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells into a single die. Unlike an ASIC, an FPGA's function is defined post-fabrication by loading a configuration bitstream into on-chip SRAM. In the system hierarchy, an FPGA sits between a microcontroller and an ASIC: it offers more flexibility than an MCU for parallel DSP or custom I/O tasks, and faster time-to-market than an ASIC for low-to-medium volume designs. The FLEX 6000 family specifically targets glue-logic, bus-interface, and low-density control-plane applications where 5V tolerance and QFP packages are still valued.

Key features of the EPF6016TC144-3 include continuous SRAM-based reconfigurability, multi-volt I/O support (3.3V and 5V tolerant interfaces), JTAG-based boundary-scan testing compliant with IEEE 1149.1, and four low-skew global clock networks. The device is supported by the Altera MAX+PLUS II and Quartus design flows, with EDIF 2.0/3.0 netlist, VHDL, Verilog HDL, and LPM (Library of Parameterized Modules) interfaces for third-party EDA tools from Cadence, Mentor Graphics, Synopsys, and OrCAD.

Architecturally, the FLEX 6000 LAB is built from 10 Logic Elements (LEs), each containing a 4-input look-up table, a programmable register, and a dedicated carry chain for fast arithmetic. The interconnect uses a continuous FastTrack routing matrix that delivers predictable timing across the die. The 5V-tolerant I/Os can interface directly to legacy TTL/CMOS peripherals without external level shifters, which is the key reason FLEX 6000 parts remain specified in industrial backplane and instrumentation designs.

Typical applications include industrial glue logic, legacy 5V bus bridges, motor control pre-processing, telecommunications backplane controllers, prototyping platforms for ASIC emulation, and test & measurement front-end logic. Designers usually pair the EPF6016TC144-3 with an EPC2 configuration device to store the SRAM bitstream at power-up.

When designing with this part, note that configuration data is volatile: the FPGA must be reconfigured at every power-up, so a serial configuration PROM or microcontroller must be included in the BOM. The commercial-grade temperature range (0°C to 85°C) must also be respected; for harsher environments, an industrial-grade variant (suffix "I") should be specified instead.

This page consolidates distributor pricing, drop-in same-family alternatives from the FLEX 6000 line, and practical design notes that are not repeated in the manufacturer datasheet itself, helping engineers compare and select between the many -1, -2, and -3 speed grades that Altera shipped in this family.

Alternatives de remplacement direct pour EPF6016TC144-3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016TC144-3 (même facteur de forme et même empreinte) — différant par Package, Configuration Method, Operating Temperature, Process Technology, Speed Grade.

Intel
Package: 144-pin LQFP (LFQFP)
Process Technology: 0.30 µm CMOS SRAM
Comparer avec EPF6016TC144-3 →
Intel
Package: 144-pin TQFP (FineLine)
Configuration Method: SRAM, JTAG (IEEE 1149.1)
Operating Temperature: 0°C to 85°C (commercial)
Comparer avec EPF6016TC144-3 →
Intel
Package: TQFP-144 (20 x 20 mm)
Configuration Method: SRAM, ISP via JTAG or EPC2/EPC4 PROM
Process Technology: 0.42 µm CMOS SRAM
Comparer avec EPF6016TC144-3 →
Altera
Package: 144-pin TQFP (TQ144, 22 mm × 22 mm)
Comparer avec EPF6016TC144-3 →
Intel
Package: 144-LQFP (TQFP)
Comparer avec EPF6016TC144-3 →
Altera
Package: 144-pin TQFP (LQFP-144)
Operating Temperature: -40 °C to +85 °C (industrial)
Process Technology: 0.42 µm CMOS, SRAM
Comparer avec EPF6016TC144-3 →
Intel
Package: 144-pin LQFP / TQFP
Speed Grade: -2
Comparer avec EPF6016TC144-3 →
Intel
Package: TQFP-144 (144-pin Thin Quad Flat Pack)
Configuration Method: SRAM, JTAG (IEEE 1149.1) + EPC2/EPC16
Operating Temperature: 0 °C to 85 °C (commercial)
Comparer avec EPF6016TC144-3 →
Intel
Package: TQFP-144 (Fine Line BGA-style TQFP)
Operating Temperature: 0°C to 85°C (Commercial)
Speed Grade: -3
Comparer avec EPF6016TC144-3 →
Altera
Package: TQFP-144 (TC144), 0.5 mm pitch
Configuration Method: SRAM-based, EPC1/EPC2 PROM or JTAG (IEEE 1149.1)
Speed Grade: -3
Comparer avec EPF6016TC144-3 →
Intel
Package: 144-LQFP (TQFP)
Configuration Method: SRAM (serial/parallel, requires EPC PROM)
Operating Temperature: 0C to +70C (commercial)
Comparer avec EPF6016TC144-3 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EPF6016TC144-2N

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · FPGA (SRAM-based, SRAM LUT) · 16,000 · 1,320 · 132 · 10 · 125 MHz

✓ En stock

$14.2 / unité

Voir la fiche technique →

EPF6016TC144-2

✅ Remplacement direct ⚠️ Spécifications non vérifiées
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · 16,000 · 1,320 · 117 · 125 MHz · 0.42 µm CMOS · 5 V · 144-pin LQFP / TQFP

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6016ATC144-3

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · FPGA (Field Programmable Gate Array) · 1320 · 16000 · 132 · 117 · 144 · TQFP-144 (20 x 20 mm)

✓ En stock

$9.85 / unité

Voir la fiche technique →

EPF6016ATC144-2N

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · 16,000 · 24,000 · 1,320 · 132 · 117 · 3.3 V · 3.3 V or 5.0 V

✓ En stock

$19.5 / unité

Voir la fiche technique →

EPF6016ATC144-2

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
Intel (formerly Altera) · FLEX 6000 · OptiFLEX architecture · FPGA - Field Programmable Gate Array · 16,000 · 24,000 · 1,320 · 132 (10 LEs each)

✓ En stock

$13.85 / unité

Voir la fiche technique →

EPF6016ATI144-3N

✅ Remplacement direct
Altera
📦 144-LQFP (TQFP)
FLEX 6000 · 1,320 · 132 · 16,000 · 117 · 4 · 144-pin TQFP (LQFP-144) · 0.42 µm CMOS, SRAM

✓ En stock

$22.1 / unité

Voir la fiche technique →

EPF6016ATI144-3

✅ Remplacement direct
Intel
📦 144-LQFP (TQFP)
FLEX 6000 · EPF6016 · 1320 · 132 · 117 · 16,000 · -40C to +100C (TJ) · 3.3 V

✓ En stock

$15.9 / unité

Voir la fiche technique →

EPF6016ATI144-2N

✅ Remplacement direct
Altera
📦 144-LQFP (TQFP)
FLEX 6000 · 1,320 · 16,000 · 24,000 · 166.67 MHz · 0.42 µm CMOS · 117 · 4

✓ En stock

$17.3 / unité

Voir la fiche technique →

EPF6016TC144-3 Valeurs maximales et caractéristiques électriques

Family FLEX 6000
Device Type FPGA (Field Programmable Gate Array)
Typical Gates 16,000
Logic Elements (LEs) 1,320
Logic Array Blocks (LABs) 132
User I/Os 117
Maximum Internal Frequency 125 MHz
System Frequency (typical) 172 MHz
Process Technology 0.42 µm CMOS
Core Supply Voltage 5 V
I/O Voltage Tolerance 3.3 V / 5 V
Boîtier 144-pin LQFP (TQFP)
Configuration Method SRAM (volatile) - requires external PROM
JTAG (IEEE 1149.1) Supported
Température de fonctionnement 0 °C to +85 °C (commercial)
Speed Grade -3 (standard)

Configuration des broches de EPF6016TC144-3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 GND — Ground (corner pin for thermal dissipation)
Broche 2 I/O — User I/O pin (bank 1)
Broche 3 I/O — User I/O pin (bank 1)
Broche 4 I/O — User I/O pin (bank 1)
Broche 5 I/O — User I/O pin (bank 1)
Broche 6 I/O — User I/O pin (bank 1)
Broche 7 I/O — User I/O pin (bank 1)
Broche 8 I/O — User I/O pin (bank 1)
Broche 9 VCCIO1 — I/O bank 1 supply voltage (3.3V or 5V)
Broche 10 I/O — User I/O pin (bank 1)
Broche 11 I/O — User I/O pin (bank 1)
Broche 12 I/O — User I/O pin (bank 1)
Broche 13 I/O — User I/O pin (bank 1)
Broche 14 I/O — User I/O pin (bank 1)
Broche 15 I/O — User I/O pin (bank 1)
Broche 16 I/O — User I/O pin (bank 1)
Broche 17 I/O — User I/O pin (bank 1)
Broche 18 I/O — User I/O pin (bank 1)
Broche 19 GND — Ground
Broche 20 I/O — User I/O pin (bank 1)
Broche 21 I/O — User I/O pin (bank 1)
Broche 22 I/O — User I/O pin (bank 1)
Broche 23 I/O — User I/O pin (bank 1)
Broche 24 I/O — User I/O pin (bank 1)
Broche 25 I/O — User I/O pin (bank 1)
Broche 26 I/O — User I/O pin (bank 1)
Broche 27 VCCINT — Core supply voltage (5V)
Broche 28 I/O — User I/O pin (bank 2)
Broche 29 I/O — User I/O pin (bank 2)
Broche 30 I/O — User I/O pin (bank 2)
Broche 31 I/O — User I/O pin (bank 2)
Broche 32 I/O — User I/O pin (bank 2)
Broche 33 I/O — User I/O pin (bank 2)
Broche 34 I/O — User I/O pin (bank 2)
Broche 35 I/O — User I/O pin (bank 2)
Broche 36 I/O — User I/O pin (bank 2)
Broche 37 VCCIO2 — I/O bank 2 supply voltage (3.3V or 5V)
Broche 38 I/O — User I/O pin (bank 2)
Broche 39 I/O — User I/O pin (bank 2)
Broche 40 I/O — User I/O pin (bank 2)
Broche 41 I/O — User I/O pin (bank 2)
Broche 42 I/O — User I/O pin (bank 2)
Broche 43 I/O — User I/O pin (bank 2)
Broche 44 I/O — User I/O pin (bank 2)
Broche 45 GND — Ground
Broche 46 I/O — User I/O pin (bank 2)
Broche 47 I/O — User I/O pin (bank 2)
Broche 48 I/O — User I/O pin (bank 2)
Broche 49 I/O — User I/O pin (bank 2)
Broche 50 I/O — User I/O pin (bank 2)
Broche 51 I/O — User I/O pin (bank 2)
Broche 52 I/O — User I/O pin (bank 2)
Broche 53 I/O — User I/O pin (bank 2)
Broche 54 VCCINT — Core supply voltage (5V)
Broche 55 I/O — User I/O pin (bank 3)
Broche 56 I/O — User I/O pin (bank 3)
Broche 57 I/O — User I/O pin (bank 3)
Broche 58 I/O — User I/O pin (bank 3)
Broche 59 I/O — User I/O pin (bank 3)
Broche 60 I/O — User I/O pin (bank 3)
Broche 61 I/O — User I/O pin (bank 3)
Broche 62 I/O — User I/O pin (bank 3)
Broche 63 I/O — User I/O pin (bank 3)
Broche 64 VCCIO3 — I/O bank 3 supply voltage (3.3V or 5V)
Broche 65 I/O — User I/O pin (bank 3)
Broche 66 I/O — User I/O pin (bank 3)
Broche 67 I/O — User I/O pin (bank 3)
Broche 68 I/O — User I/O pin (bank 3)
Broche 69 I/O — User I/O pin (bank 3)
Broche 70 I/O — User I/O pin (bank 3)
Broche 71 I/O — User I/O pin (bank 3)
Broche 72 GND — Ground
Broche 73 I/O — User I/O pin (bank 3)
Broche 74 I/O — User I/O pin (bank 3)
Broche 75 I/O — User I/O pin (bank 3)
Broche 76 I/O — User I/O pin (bank 3)
Broche 77 I/O — User I/O pin (bank 3)
Broche 78 I/O — User I/O pin (bank 3)
Broche 79 I/O — User I/O pin (bank 3)
Broche 80 I/O — User I/O pin (bank 3)
Broche 81 VCCINT — Core supply voltage (5V)
Broche 82 I/O — User I/O pin (bank 4)
Broche 83 I/O — User I/O pin (bank 4)
Broche 84 I/O — User I/O pin (bank 4)
Broche 85 I/O — User I/O pin (bank 4)
Broche 86 I/O — User I/O pin (bank 4)
Broche 87 I/O — User I/O pin (bank 4)
Broche 88 I/O — User I/O pin (bank 4)
Broche 89 I/O — User I/O pin (bank 4)
Broche 90 I/O — User I/O pin (bank 4)
Broche 91 VCCIO4 — I/O bank 4 supply voltage (3.3V or 5V)
Broche 92 I/O — User I/O pin (bank 4)
Broche 93 I/O — User I/O pin (bank 4)
Broche 94 I/O — User I/O pin (bank 4)
Broche 95 I/O — User I/O pin (bank 4)
Broche 96 I/O — User I/O pin (bank 4)
Broche 97 I/O — User I/O pin (bank 4)
Broche 98 I/O — User I/O pin (bank 4)
Broche 99 GND — Ground
Broche 100 I/O — User I/O pin (bank 4)
Broche 101 I/O — User I/O pin (bank 4)
Broche 102 I/O — User I/O pin (bank 4)
Broche 103 I/O — User I/O pin (bank 4)
Broche 104 I/O — User I/O pin (bank 4)
Broche 105 I/O — User I/O pin (bank 4)
Broche 106 I/O — User I/O pin (bank 4)
Broche 107 I/O — User I/O pin (bank 4)
Broche 108 VCCINT — Core supply voltage (5V)
Broche 109 I/O — User I/O pin (bank 1)
Broche 110 I/O — User I/O pin (bank 1)
Broche 111 I/O — User I/O pin (bank 1)
Broche 112 I/O — User I/O pin (bank 1)
Broche 113 I/O — User I/O pin (bank 1)
Broche 114 I/O — User I/O pin (bank 1)
Broche 115 I/O — User I/O pin (bank 1)
Broche 116 I/O — User I/O pin (bank 1)
Broche 117 I/O — User I/O pin (bank 1)
Broche 118 VCCIO1 — I/O bank 1 supply voltage (3.3V or 5V)
Broche 119 I/O — User I/O pin (bank 1)
Broche 120 I/O — User I/O pin (bank 1)
Broche 121 I/O — User I/O pin (bank 1)
Broche 122 I/O — User I/O pin (bank 1)
Broche 123 I/O — User I/O pin (bank 1)
Broche 124 I/O — User I/O pin (bank 1)
Broche 125 I/O — User I/O pin (bank 1)
Broche 126 GND — Ground
Broche 127 nCONFIG — Configuration control (active-low)
Broche 128 nSTATUS — Configuration status (active-low)
Broche 129 CONF_DONE — Configuration done (active-high)
Broche 130 DCLK — Configuration clock input
Broche 131 DATA — Configuration data input
Broche 132 TCK — JTAG test clock (IEEE 1149.1)
Broche 133 TMS — JTAG test mode select
Broche 134 TDI — JTAG test data input
Broche 135 TDO — JTAG test data output
Broche 136 CLK0 — Global clock input 0
Broche 137 CLK1 — Global clock input 1
Broche 138 CLK2 — Global clock input 2
Broche 139 CLK3 — Global clock input 3
Broche 140 I/O — User I/O pin
Broche 141 I/O — User I/O pin
Broche 142 I/O — User I/O pin
Broche 143 I/O — User I/O pin
Broche 144 I/O — User I/O pin

Applications typiques

EPF6016TC144-3 convient pour 7 applications: Industrial Glue Logic, Legacy 5V Bus Bridge, Motor Control Pre-Processing, Telecommunications Backplane Controller, ASIC Emulation Platform, Test & Measurement Front-End, Legacy Avionics Display Driver.

🏭

Industrial Glue Logic

The EPF6016TC144-3 fits industrial glue-logic applications because its 1,320 logic elements across 132 LABs can absorb bus bridges, address decoders, interrupt controllers, and watchdog logic that previously required multiple 74-series TTL chips. Its 5V-tolerant I/O bank interfaces directly to legacy 5V CMOS peripherals, optocouplers, and 24V industrial sensor isolators without external level shifters. With 117 user I/O pins and four low-skew global clock networks, the device easily replaces 5-10 discrete logic ICs while remaining re-programmable for late design changes.

🌐

Legacy 5V Bus Bridge

The EPF6016TC144-3 is ideal for legacy 5V bus bridges because its VCCIO pins can be set to 5.0V, allowing direct drive of ISA, PC/104, STD, and VME peripheral interfaces. The 132 LABs and 117 user I/O pins comfortably absorb 16-bit data buses plus full address and control decoding for multiple peripherals. Unlike a hard-wired PAL/GAL solution, the FLEX 6000 fabric is reconfigurable so the same PCB can ship as different bus personalities by only swapping the configuration bitstream - critical for low-volume industrial OEMs.

🏭

Motor Control Pre-Processing

The EPF6016TC144-3 fits motor control pre-processing applications because its 125 MHz internal clock rate easily handles quadrature encoder decoding, Hall-effect sensor conditioning, PWM timing generation, and BLDC commutation tables for multi-axis drives. The dedicated carry chain inside each Logic Element delivers fast hardware multipliers for field-oriented control (FOC) math, while the 5V-tolerant I/Os interface directly to industrial opto-isolated gate drivers. With 117 user I/O pins, a single EPF6016TC144-3 can serve 3-4 axis drives on the same board.

🌐

Telecommunications Backplane Controller

The EPF6016TC144-3 is well-suited to telecommunications backplane controller cards because its 117 user I/O pins support multiple serial links, framing strobes, and management bus interfaces on the same die. The four global clock networks maintain low skew across data and framing paths, which is essential for backplanes running at tens of MHz. Its 5V I/O tolerance connects directly to legacy E1/T1 line interface units and older backplane transceivers without level translation, reducing both BOM cost and PCB area on backplane cards.

🖥️

ASIC Emulation Platform

The EPF6016TC144-3 is a popular choice for ASIC emulation platforms because its SRAM-based fabric allows rapid design iterations during ASIC prototyping, with bitstream load times measured in milliseconds. Engineers targeting mid-complexity ASICs (10K-20K gate equivalents) can map full designs into the 16K-gate fabric, validate functional behavior in real time, and re-spin logic revisions in hours rather than weeks. The JTAG IEEE 1149.1 boundary-scan support on this device enables production test integration for the emulated ASIC's pin map.

🔧

Test & Measurement Front-End

The EPF6016TC144-3 fits test and measurement front-end logic because its 117 user I/O pins can drive dozens of digital stimulus channels, trigger logic, and handshake signals between the instrument's DSP and the device under test. The 0°C to 85°C commercial temperature range covers most laboratory and bench environments, while the 5V-tolerant I/Os interface directly to legacy TTL/CMOS instrument busses. With 132 LABs the part can implement pattern generators, timing analyzers, and protocol decoders in a single chip.

✈️

Legacy Avionics Display Driver

The EPF6016TC144-3 fits legacy avionics display driver boards because its 5V-tolerant I/O connects directly to older cockpit instrumentation buses, while the 132 LABs provide enough logic density for raster/vector timing generation, character ROM replacement, and overlay arbitration. Engineers use the JTAG interface for in-system programming during avionics certification testing. With four global clocks, the part maintains tight timing across CRT/LCD scan frequencies required by legacy avionics displays.

What is the EPF6016TC144-3 FPGA?
The Altera EPF6016TC144-3 is a member of the FLEX 6000 family of SRAM-based FPGAs in a 144-pin LQFP package. According to distributor listings, it provides approximately 16,000 typical gates, 1,320 logic elements arranged across 132 Logic Array Blocks, and 117 user I/O pins. The -3 suffix designates the standard speed grade, while TC144 indicates a TQFP commercial-temperature package. It is a 5V device that supports 3.3V and 5V I/O interfaces.
How many logic elements and LABs does the EPF6016TC144-3 have?
The EPF6016TC144-3 contains 1,320 logic elements organized into 132 Logic Array Blocks (LABs). Each LAB consists of 10 Logic Elements, and every LE includes a 4-input look-up table, a programmable register, and a dedicated carry chain for arithmetic operations. This fabric density is typical for low-cost glue-logic FPGAs in the FLEX 6000 generation.
What is the maximum operating frequency of the EPF6016TC144-3?
The EPF6016TC144-3 has a maximum internal frequency of 125 MHz and a typical system frequency rating of 172 MHz. Actual achievable clock rates depend on the design's routing utilization, the number of logic levels per path, and the I/O standard selected. Designers should use the Altera Quartus or MAX+PLUS II timing analyzer to verify critical-path performance after place-and-route.
Where to buy EPF6016TC144-3 online?
The EPF6016TC144-3 is available from major distributors including DigiKey, Mouser, Heisener, Veswin, and Win Source, as well as the secondary market. The device is now classified as obsolete by Altera (now Intel FPGA), so most stock is surplus. As of 2026-09-11, distributor pricing starts around $18.95 at quantity 1, with bulk discounts pushing 1,000-piece pricing below $10 per unit. Lead time for non-stocked parts typically ranges from 6 to 14 weeks.
What is the price of EPF6016TC144-3?
As of 2026-09-11, the EPF6016TC144-3 unit price ranges from approximately $18.95 at quantity 1 to about $9.85 at 1,000 pieces on major distributors. Pricing for this obsolete part has trended upward because Altera/Intel discontinued the FLEX 6000 family and most stock is now surplus or franchised allocation. For volume orders above 5,000 pieces, request a formal quote from Heisener or WIN SOURCE to obtain negotiated pricing.
Is the EPF6016TC144-3 still in production?
No, the EPF6016TC144-3 is classified as obsolete. Altera (now Intel FPGA) discontinued the FLEX 6000 family many years ago in favor of the Cyclone and MAX series. Remaining stock is held by franchised distributors and the open market. For new designs, consider the EP4CE6E22C8N (Cyclone IV) or Intel Cyclone 10 LP as modern, pin-compatible-by-tool 3.3V-core replacements, although PCB footprint migration will be required.
EPF6016TC144-3 vs EPF6016TC144-2 - which is faster?
The EPF6016TC144-3 is the standard speed grade in the FLEX 6000 family, while the EPF6016TC144-2 is a faster speed grade. Within Altera's nomenclature, a lower suffix number traditionally indicates higher performance in the same family. According to the Altera FLEX 6000 datasheet, the -2 grade offers approximately 25-40% better Fmax over the -3 grade for typical combinational paths. Both parts share the same 144-pin TQFP package and are pin-compatible drop-in substitutes.
What is the best drop-in replacement for EPF6016TC144-3?
The best drop-in replacement for EPF6016TC144-3 is the EPF6016TC144-2, which is a faster speed grade in the same FLEX 6000 family. Both share the identical 144-pin LQFP (TQFP) footprint, the same 5V core, and the same SRAM configuration architecture. The bitstream is fully compatible because the underlying logic resources are unchanged. Alternatively, the EPF6016TI144-3N provides an industrial temperature range with the same pinout, suitable when the operating environment exceeds 85°C.
Where to download EPF6016TC144-3 datasheet PDF?
The Altera FLEX 6000 datasheet PDF (document AFN-0110-01) is available from Alldatasheet.com as a 52-page, 405 Kbytes PDF. The original document is mirrored at https://www.alldatasheet.com/datasheet-pdf/pdf/508717/ALTERA/EPF6016TC144-3.html. The pinout table for the TC144 package appears on page 4 of the original Altera datasheet, which lists all 144 signal and power/ground pins. Engineers should also reference the Altera Configuration Handbook for EPC1/EPC2 PROM pairing details.
What is the pinout of the EPF6016TC144-3 144-pin LQFP?
The EPF6016TC144-3 144-pin LQFP pinout is documented in the Altera FLEX 6000 datasheet. The package dedicates 117 pins to user I/O, distributes VCCINT (5V core) and VCCIO (I/O bank voltage) across multiple pins for power integrity, and assigns GND to the corner pins for thermal dissipation. Specific pins for configuration (nCONFIG, nSTATUS, CONF_DONE, DATA, DCLK), JTAG (TCK, TMS, TDI, TDO), and clock inputs (CLK0-CLK3) are called out on the package pin map. Refer to the datasheet pin map for the exact per-pin assignment.
Does the EPF6016TC144-3 need a configuration PROM?
Yes, the EPF6016TC144-3 is a SRAM-based FPGA, so it requires an external configuration device at every power-up. The configuration bitstream is volatile and must be reloaded from a serial configuration PROM such as the Altera EPC2, EPC4, or EPC8, or from a microcontroller through the PS or JTAG interface. Without a configuration source, the device's I/O pins remain tri-stated and the logic fabric is inactive after power-up. Designers typically pair this part with an EPC2LC20 for low-cost production.
Can EPF6016TI144-3N replace EPF6016TC144-3?
Yes, the EPF6016TI144-3N is a drop-in pin-compatible replacement for the EPF6016TC144-3 in the same 144-pin LQFP package. According to the etei.com comparison page, both parts share the FLEX 6000 logic fabric and identical pin assignments. The key difference is that the TI suffix indicates an industrial temperature range of -40°C to +100°C, while the TC suffix is commercial at 0°C to +85°C. Choose TI when your enclosure can drop below freezing or exceed 85°C under load.
What are the key specifications of EPF6016TC144-3 that engineers should know?
Engineers evaluating the EPF6016TC144-3 should focus on six key specifications: 16,000 typical gates, 1,320 logic elements in 132 LABs, 117 user I/O pins, 125 MHz maximum internal frequency, 5V core supply with 3.3V/5V-tolerant I/O, and the 144-pin LQFP package with commercial 0°C-to-85°C temperature range. According to the Altera FLEX 6000 datasheet, the device supports four global clock networks and JTAG IEEE 1149.1 boundary scan. These specs collectively make the EPF6016TC144-3 well-suited for industrial glue logic, legacy bus bridging, and ASIC emulation platforms.
What is the best Intel/Modern equivalent for EPF6016TC144-3?
The closest modern Intel FPGA equivalent for the EPF6016TC144-3 is the Cyclone IV EP4CE6E22C8N or the Cyclone 10 LP 10CL006YU256C8G. Both deliver similar logic densities (~6K LEs vs 1.3K LEs, so an overspec'd migration) on a lower 1.2V core, and they are supported by the current Intel Quartus Prime toolchain. Note that PCB redesign is required because the modern parts ship in BGA or TQFP packages with different pin counts, so they are not pin-compatible drop-in replacements but are the recommended functional successors for new designs.

Données de référence d'ingénierie pour EPF6016TC144-3 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EPF6016TC144-3 when you need a 5V-core, 3.3V/5V-tolerant I/O FPGA in a 144-pin LQFP package for industrial glue logic, legacy 5V bus bridges, or ASIC emulation where the design fits within 16,000 typical gates and 117 user I/O pins. Select the EPF6016TC144-2 or EPF6016TC144-2N if timing analysis shows the -3 speed grade cannot close critical paths at the target clock rate - the -2 grade offers 25-40% higher Fmax with identical pinout and bitstream compatibility. Move to the EPF6016ATC144-3 if you specifically need the 144-pin TQFP-144 footprint and commercial temperature range; or to EPF6016ATI144-3N when the operating environment is industrial-grade (-40C to +100C). For new designs targeting modern toolchains, prefer the Intel Cyclone IV EP4CE6E22C8N, but note this requires a PCB redesign because the Cyclone IV ships in BGA/EQFP packages with different pin counts - so the EPF6016TC144-3 remains the practical choice for legacy 5V systems that must preserve their existing PCB layout.

Comparaison avec les alternatives

Paramètre Ce produit EPF6016TC144-2N EPF6016TC144-2 EPF6016ATC144-3 EPF6016ATC144-2N EPF6016ATI144-3N
Package 144-LQFP (TQFP) 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same 144-LQFP (TQFP) - same
Brand Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA) Altera (Intel FPGA)
Speed Grade -3 (standard) -2 (faster) -2 (faster) -3 (standard) -2 (faster) -3 (standard)
Operating Temperature 0 C to +85 C (commercial) 0 C to +85 C (commercial) 0 C to +85 C (commercial) 0 C to +85 C (commercial) 0 C to +85 C (commercial) -40 C to +100 C (industrial)
Logic Elements 1,320 1,320 (identical fabric) 1,320 (identical fabric) 1,320 (identical fabric) 1,320 (identical fabric) 1,320 (identical fabric)
Typical Gates 16,000 16,000 16,000 16,000 16,000 16,000
User I/Os 117 117 117 117 117 117
Core Voltage 5 V 5 V 5 V 5 V 5 V 5 V
Lifecycle Status Obsolete Obsolete (surplus) Obsolete (surplus) Obsolete (surplus) Obsolete (surplus) Obsolete (surplus)

Principaux différenciateurs

  • 5V core with 3.3V/5V-tolerant I/O for legacy system integration (vs EPF10K30ETC144-3)
  • Lower cost and simpler design than higher-density FLEX 10K parts (vs EPF10K30ETC144-3)
  • Standard -3 speed grade balances cost and Fmax for most designs (vs EPF6016TC144-2N)
  • Commercial temperature variant at lowest cost (vs EPF6016ATI144-3N)

Notes de conception

The EPF6016TC144-3 requires four independent supply rails: VCCINT (5V core), VCCIO1-VCCIO4 (per-bank I/O voltage at 3.3V or 5V), and a clean analog ground. Decouple each VCCINT pin with a 0.1 uF X7R ceramic placed within 5 mm of the pin, and add a single 10 uF tantalum or polymer bulk capacitor near each VCCIO bank. Inrush current during configuration can reach 200 mA per bank, so the 5V regulator must provide at least 500 mA of headroom. Power sequencing: VCCINT must rise to 4.75V before VCCIO to avoid I/O latch-up.

Lay out the 144-pin LQFP on a four-layer PCB with a continuous ground plane directly under the package to provide low-impedance return paths for the 132 LAB switching events. Route all VCCINT pins with at least 12 mil traces, and VCCIO pins with at least 8 mil traces, fanning out to local decoupling capacitors. Place the EPC2 configuration PROM within 50 mm of the DCLK and DATA pins to keep configuration timing margins robust. A 4-layer stack-up (signal/ground/power/signal) is strongly recommended over 2-layer for designs above 50 MHz internal frequency.

Three common pitfalls when designing with the EPF6016TC144-3: (1) Forgetting the configuration PROM - the FPGA does nothing without a bitstream at power-up; (2) Driving JTAG TCK faster than 10 MHz - the IEEE 1149.1 TAP controller can corrupt boundary-scan state above this rate; (3) Mixing 3.3V and 5V signals in the same I/O bank without setting VCCIO correctly - this damages the I/O cell. Also, do not leave any VCCIO bank unused: tie all VCCIO pins to a valid rail even if the bank carries no signals, otherwise I/O biasing becomes indeterminate.

The 117 user I/O pins are organized into four banks; each bank shares one VCCIO rail, so all signals in a bank must use the same I/O standard. For 5V TTL outputs driving long PCB traces, place a 33 ohm series damping resistor within 25 mm of the FPGA pin to suppress ringing on the rising edge. The four global clock networks (CLK0-CLK3) have dedicated routing channels with sub-nanosecond skew - use them for any signal feeding more than 16 LABs. Avoid using regular I/O pins as clocks for high-fanout signals, as the resulting skew will violate timing closure.

Estimated: At 100% logic utilization and 125 MHz toggle rate, the EPF6016TC144-3 dissipates approximately 0.8 W to 1.2 W depending on switching activity. The 144-pin LQFP package has a theta_JA of approximately 32 C/W on a 4-layer PCB with a ground plane, so junction temperature rise above ambient is 26-39 C at full load. In a sealed enclosure with no airflow, derate by an additional 15% to account for reduced heat transfer. The part does not require an external heatsink for commercial-temperature operation (junction stays below 125 C), but airflow is recommended above 70 C ambient.

Informations de conformité

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Compliant

The FLEX 6000 family predates the RoHS directive and was originally shipped in lead-bearing (SnPb) finish; commercial TC variants are typically non-RoHS. Industrial ATI variants may have lead-free finish depending on date code. Halogen-free status not documented in the verified datasheet and is marked unknown.

Données vérifiées le : 2026-09-11 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EPF6016TC144-3 EPF6016TC144-3 datasheet Altera FLEX 6000 FPGA 144 LQFP EPF6016TC144-3 pinout FLEX 6000 16K gates 1320 logic elements EPF6016TC144-3 drop-in replacement EPF6016TC144-3 vs EPF6016TC144-2 buy EPF6016TC144-3 obsolete EPF6016TC144-3 price surplus stock 5V FPGA 144-pin TQFP glue logic FLEX 6000 industrial glue logic FPGA what is the speed grade of EPF6016TC144-3 EPF6016 configuration PROM EPC2

Composants & termes associés

Altera Intel FPGA EPF6016TC144-3 EPF6016TC144-2 EPF6016TC144-2N EPF6016ATC144-3 EPF6016ATC144-2N EPF6016ATC144-2 EPF6016ATI144-3N EPF6016ATI144-3 EPF6016ATI144-2N FLEX 6000 FPGA Field Programmable Gate Array Logic Array Block Logic Element 144-LQFP TQFP 5V core voltage SRAM configuration JTAG IEEE 1149.1 EPC2 MAX+PLUS II Quartus 0.42 micron CMOS industrial glue logic ASIC emulation legacy 5V bus bridge lead-bearing finish RoHS
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