EPF6016TI144-3N - FLEX 6000 FPGA, 16K Gates, 144-LQFP | Intel / Altera
Référence : EPF6016TI144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $11.4 | $5 700,00 |
| 1 000 | $9.85 | $9 850,00 |
EPF6016TI144-3N Présentation
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and programmable I/O cells. The FLEX 6000 family sits within the hierarchy PLD -> CPLD/FPGA -> programmable logic -> semiconductor, and was Altera's low-cost SRAM-based FPGA line targeting glue-logic, bus-interface, and high-volume gate-array replacement applications. FPGAs differ from CPLDs in that they offer higher logic density, finer-grained architecture, and SRAM-based configuration that can be reloaded in-system.
Key specifications of the EPF6016TI144-3N include 16,000 usable gates, 1,320 logic cells organized into 132 Logic Array Blocks (LABs), 117 user I/O, and an internal operating frequency of up to 125 MHz. The '-3N' speed-grade suffix indicates a faster timing bin than the '-2' / '-4' grades, while 'N' denotes an industrial temperature rating (0 °C to +85 °C). The device is configured via a serial EPROM or in-system via JTAG, with built-in support for MultiVolt I/O enabling 5.0 V tolerance on a 3.3 V VCCIO rail.
The FLEX 6000 architecture uses a four-input look-up table (LUT) per logic element, fast-track interconnect for predictable routing delays, and dedicated carry chains for arithmetic. Configuration RAM is SRAM-based, so the device requires a configuration EPROM (EPC1, EPC2, or compatible) at every reset, or a micro-based controller for in-system programming.
Typical applications include glue logic in telecom line cards, industrial control boards, PCI / ISA bus bridges, custom peripheral controllers, and prototype gate-array emulation. The wide VCCIO range also makes the part suitable for mixed 3.3 V / 5.0 V legacy systems that require voltage translation on the same board.
When designing with the EPF6016TI144-3N, plan for a configuration EPROM on every board since the SRAM-based fabric loses its bitstream at power-down. Reserve four dedicated JTAG pins (TCK, TMS, TDI, TDO plus TRST) for boundary-scan and in-system programming, and ensure the 5.0 V core supply is well decoupled near the device. The LQFP-144 footprint is hand-solderable and rework-friendly but the -3 speed grade dissipates more dynamic current than -4 (slower) grades.
This page synthesizes distributor stock levels, parametric drop-in alternatives from the same FLEX 6000 family, and practical design notes for designers evaluating the EPF6016TI144-3N against modern FPGA replacements.
Alternatives de remplacement direct pour EPF6016TI144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016TI144-3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Configuration Method, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016TI144-2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPF6016ATI144-3N
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →EPF6016ATI144-3
✅ Remplacement direct✓ En stock
$15.9 / unité
Voir la fiche technique →EPF6016ATI144-2N
✅ Remplacement direct✓ En stock
$17.3 / unité
Voir la fiche technique →EPF6016ATI144-2
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →EPF6016TI144-3
✅ Remplacement direct✓ En stock
$23.62 / unité
Voir la fiche technique →EPF6016TI144-3N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements | 1,320 |
| Usable Gates | 16,000 |
| Logic Array Blocks (LABs) | 132 |
| User I/O | 117 |
| Nombre de broches | 144 |
| Boîtier | 144-LQFP (TQFP), gull-wing, 20 mm body |
| Process Technology | 0.42 µm CMOS, SRAM-based |
| Core Supply Voltage (VCCINT) | 5.0 V |
| I/O Supply Voltage (VCCIO) | 3.3 V or 5.0 V (MultiVolt) |
| Internal Operating Frequency | 125 MHz (max) |
| Speed Grade | -3 (faster than -4, slower than -2) |
| Température de fonctionnement | 0 °C to +85 °C (industrial, 'N' suffix) |
| Configuration Method | Serial EPROM or JTAG (SRAM-based) |
| Type de montage | Surface Mount |
Configuration des broches de EPF6016TI144-3N
| Broche 1 | I/O — User I/O pin (bank-dependent VCCIO) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | I/O — User I/O pin |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | VCCINT — Core supply 5.0 V |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | GND — Ground |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | I/O — User I/O pin |
| Broche 15 | I/O — User I/O pin |
| Broche 16 | I/O — User I/O pin |
| Broche 17 | I/O — User I/O pin |
| Broche 18 | I/O — User I/O pin |
| Broche 19 | I/O — User I/O pin |
| Broche 20 | I/O — User I/O pin |
| Broche 21 | GND — Ground |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | I/O — User I/O pin |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | I/O — User I/O pin |
| Broche 28 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | I/O — User I/O pin |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | GND — Ground |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | I/O — User I/O pin |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | VCCINT — Core supply 5.0 V |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | I/O — User I/O pin |
| Broche 50 | GND — Ground |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | I/O — User I/O pin |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | I/O — User I/O pin |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | GND — Ground |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | I/O — User I/O pin |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | VCCINT — Core supply 5.0 V |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | I/O — User I/O pin |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | GND — Ground |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | I/O — User I/O pin |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | I/O — User I/O pin |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | GND — Ground |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | I/O — User I/O pin |
| Broche 99 | I/O — User I/O pin |
| Broche 100 | I/O — User I/O pin |
| Broche 101 | VCCINT — Core supply 5.0 V |
| Broche 102 | I/O — User I/O pin |
| Broche 103 | I/O — User I/O pin |
| Broche 104 | I/O — User I/O pin |
| Broche 105 | I/O — User I/O pin |
| Broche 106 | I/O — User I/O pin |
| Broche 107 | I/O — User I/O pin |
| Broche 108 | GND — Ground |
| Broche 109 | I/O — User I/O pin |
| Broche 110 | I/O — User I/O pin |
| Broche 111 | I/O — User I/O pin |
| Broche 112 | I/O — User I/O pin |
| Broche 113 | I/O — User I/O pin |
| Broche 114 | I/O — User I/O pin |
| Broche 115 | VCCIO — I/O supply (3.3 V or 5.0 V) |
| Broche 116 | I/O — User I/O pin |
| Broche 117 | I/O — User I/O pin |
| Broche 118 | I/O — User I/O pin |
| Broche 119 | I/O — User I/O pin |
| Broche 120 | I/O — User I/O pin |
| Broche 121 | I/O — User I/O pin |
| Broche 122 | GND — Ground |
| Broche 123 | I/O — User I/O pin |
| Broche 124 | I/O — User I/O pin |
| Broche 125 | I/O — User I/O pin |
| Broche 126 | I/O — User I/O pin |
| Broche 127 | I/O — User I/O pin |
| Broche 128 | I/O — User I/O pin |
| Broche 129 | I/O — User I/O pin |
| Broche 130 | VCCINT — Core supply 5.0 V |
| Broche 131 | TDI — JTAG test data in |
| Broche 132 | TRST — JTAG test reset |
| Broche 133 | TMS — JTAG test mode select |
| Broche 134 | TCK — JTAG test clock |
| Broche 135 | TDO — JTAG test data out |
| Broche 136 | nSTATUS — Configuration status (open-drain) |
| Broche 137 | nCONFIG — Configuration control (active-low) |
| Broche 138 | DCLK — Configuration clock input |
| Broche 139 | DATA0 — Configuration data input |
| Broche 140 | CONF_DONE — Configuration complete (open-drain) |
| Broche 141 | MSEL0 — Configuration mode select 0 |
| Broche 142 | MSEL1 — Configuration mode select 1 |
| Broche 143 | GND — Ground |
| Broche 144 | VCCINT — Core supply 5.0 V |
Applications typiques
EPF6016TI144-3N convient pour 6 applications: Telecom Line-Card Glue Logic, Industrial Control Boards, PCI / ISA Bus Bridges, Custom Peripheral Controllers, Prototype Gate-Array Emulation, Mixed-Voltage Legacy Board Designs.
Telecom Line-Card Glue Logic
The EPF6016TI144-3N fits telecom line-card glue-logic roles because its 117 user I/O and 1,320 logic elements provide enough capacity to bridge backplane buses, fan-out interrupts, and perform protocol conversion on legacy TDM cards. The 5.0 V core with MultiVolt I/O lets designers mix 3.3 V and 5.0 V peripherals on the same card without level translators, and the 125 MHz internal frequency easily meets typical TDM/E1 timing margins. The 144-LQFP footprint is hand-rework-friendly for field service. Trade-off: the SRAM fabric loses configuration at power-down, so a configuration EPROM (EPC1/EPC2) must be co-located on every line card.
Recommandé
Industrial Control Boards
The EPF6016TI144-3N is widely deployed on industrial PLC and motion-control boards where deterministic 5.0 V logic interfaces are needed to drive optocouplers, 24 V I/O modules, and legacy 8255-style peripheral buses. The 0 °C to +85 °C industrial temperature rating and 132 LABs give designers enough logic to implement custom PID loops, encoder quadrature decoders, and timing-critical interrupt controllers. MultiVolt I/O allows direct connection to 3.3 V ADC/DAC front-ends without external buffers. The part is obsolete, so legacy boards must plan a Cyclone IV migration path while maintaining the same 144-LQFP PCB footprint for as long as inventory lasts.
Recommandé
PCI / ISA Bus Bridges
The EPF6016TI144-3N excels at legacy PCI / ISA bus-bridge roles where 117 user I/O are needed to fan out address, data, and control signals between the host bus and downstream peripherals. Its 5.0 V core is natively compatible with PCI 5.0 V signaling, and MultiVolt I/O lets it bridge to 3.3 V CardBus or MiniPCI peripherals on the same card. The SRAM-based fabric and JTAG support enable in-system bitstream updates for bug fixes and protocol updates. Trade-off: designers must budget for an EPC2 configuration EPROM and ensure the 5.0 V supply is well decoupled because the 0.42 µm CMOS process draws meaningful dynamic current at 33 MHz PCI frequencies.
Recommandé
Custom Peripheral Controllers
Engineers use the EPF6016TI144-3N as a custom peripheral controller in legacy printers, point-of-sale terminals, and medical instrumentation where the 16K-gate fabric implements state machines, FIFO glue, and protocol handlers without the cost of an ASIC. The 144-LQFP package is hand-solderable and easy to rework, while the 5.0 V tolerance matches the power rails still common in those systems. The -3 speed grade delivers tight timing closure for serial-protocol controllers, and MultiVolt I/O lets the part talk directly to 3.3 V sensors and ADCs. Migration note: the part is obsolete, so new designs should target Cyclone IV in a similar TQFP-144 footprint to preserve PCB layout.
Recommandé
Prototype Gate-Array Emulation
The EPF6016TI144-3N is a cost-effective gate-array emulation platform for prototyping 16K-gate ASIC designs before mask commitment. Designers map RTL to the 1,320 logic elements, exercise real I/O on the 117 user pins, and validate timing at the 125 MHz internal frequency before tape-out. The JTAG port supports rapid bitstream reload during iterative bring-up, and MultiVolt I/O lets prototype boards mix legacy and modern voltage domains. The 144-LQFP package fits on a daughter-card alongside logic analyzers and scope probes for clean debug access. Caveat: SRAM-based fabric is volatile, so a configuration EPROM must be co-resident on every prototype card.
Recommandé
Mixed-Voltage Legacy Board Designs
The EPF6016TI144-3N supports mixed 3.3 V / 5.0 V board designs through its MultiVolt I/O feature, where the VCCIO rail can be set independently to 3.3 V or 5.0 V while VCCINT remains at 5.0 V. This is ideal for legacy systems that retain 5.0 V microcontrollers, SRAM, and bus transceivers while adding modern 3.3 V ADC/DAC/USB peripherals. The 117 user I/O can be partitioned between the two voltage domains on a per-bank basis, eliminating external level shifters and reducing BOM cost. The 132 LABs also let designers integrate the glue logic that was previously scattered across 74HCxx and 74LVCxx buffers, simplifying the board further.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016TI144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016TI144-2N | EPF6016ATI144-3N | EPF6016ATI144-3 | EPF6016ATI144-2N | EPF6016ATI144-2 | EPF6016TI144-3 |
|---|---|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| Speed Grade | -3 (faster) | -2 (slower) | -3 (faster) | -3 (faster) | -2 (slower) | -2 (slower) | -3 (faster) |
| Temperature Grade | Industrial (0C to +85C) | Industrial (0C to +85C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Commercial (0C to +70C) |
| Core Supply Voltage | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V | 5.0 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature bin with -3 speed grade (vs EPF6016TI144-3 (commercial temp, -3 speed))
- Highest Fmax in the FLEX 6016 TQFP-144 family (vs EPF6016TI144-2N)
- 117 user I/O out of 144 pins (vs EPF6010ATC144-3 (FLEX 10K10, same TQFP-144))
Notes de conception
The EPF6016TI144-3N requires a stable 5.0 V core supply on every VCCINT pin (typically pins 8, 43, 72, 101, 130, 144 on the TQFP-144) plus a separate VCCIO rail (typically pins 28, 57, 86, 115) that can be tied to 3.3 V or 5.0 V. Decouple each VCCINT pin with a 0.1 µF ceramic cap placed within 5 mm of the pin, and add a bulk 10 µF tantalum or ceramic near the package. Estimated: at 100% toggle activity at 33 MHz on a PCI bus design, total current draw is roughly 100-150 mA on VCCINT plus 20-50 mA on VCCIO depending on loading.
The 144-LQFP package has 0.5 mm pitch gull-wing leads and a 20 mm body, so PCB layout must use 0.15 mm/0.20 mm trace-and-space rules and vias-in-pad or via-tented fan-out under the body. Estimated: 4 layers are recommended (top signal, inner ground, inner VCC, bottom signal) with a continuous ground plane beneath the device to control the 0.42 µm CMOS process's switching noise. Keep configuration EPROM (EPC1/EPC2) within 50 mm of the FPGA's DATA0/DCLK pins to avoid signal-integrity issues at 33 MHz configuration rates.
Common pitfalls when designing with the EPF6016TI144-3N include (1) forgetting the configuration EPROM because SRAM-based FPGAs lose their bitstream at every power-down, (2) leaving JTAG pins floating which can cause spurious configuration triggers, (3) mixing 3.3 V and 5.0 V signals on a single VCCIO bank which will damage the 5.0 V-tolerance I/O cells, and (4) omitting the nCONFIG pull-up resistor which prevents reliable reconfiguration. Always strap MSEL pins for the correct configuration mode (typically MSEL1=0, MSEL0=0 for serial EPROM configuration) before power-up.
Informations de conformité
RoHS / REACH / lead-free / halogen-free status was not present in the verified distributor data and is marked [DATA_NEEDED]. The FLEX 6000 family predates widespread RoHS adoption, so many original parts are non-RoHS; engineers should confirm with the distributor before assuming compliance.
