Intel

EPF6016ATC144-3N - FLEX 6000 FPGA 16K Gates 1320 Cells TQFP-144

Référence : EPF6016ATC144-3N ✗ Fin de vie

En stock Expédié sous 1 à 3 jours ouvrés

3.3 V Vdss TQFP-144 Package 142.86 MHz Speed SRAM (volatile) Memory

À partir de $12.4 USD / unité

MOQ : 1 |

Prix mis à jour : 2026-09-11

Tarifs dégressifs

Qté	Prix unitaire	Total
1	$22.5	$22,50
10	$19.8	$198,00
100	$16.95	$1 695,00
500	$14.2	$7 100,00
1 000	$12.4	$12 400,00

ℹ️ Tous les prix sont en USD

Voir la fiche technique (PDF) Voir les alternatives

Quantité

EPF6016ATC144-3N Présentation

The Intel (formerly Altera) EPF6016ATC144-3N is a member of the FLEX 6000 family of Field Programmable Gate Arrays (FPGAs) built on the OptiFLEX architecture, delivering approximately 16,000 gates and 1,320 logic elements in a 144-pin TQFP package. The device operates at a maximum internal frequency of 142.86 MHz, supports 117 user I/O pins, and is fabricated on a 0.42 micron CMOS process running at 3.3 V core supply.

An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) that allows designers to implement custom digital logic circuits by configuring an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells after manufacture. FPGAs sit above CPLDs and gate arrays in the programmable logic hierarchy, offering higher logic density, finer-grained parallelism, and on-chip memory. The FLEX 6000 family specifically targets low-cost, high-volume designs that previously required fixed gate arrays, providing fast design iteration during prototyping.

Key features of the EPF6016ATC144-3N include 1,320 logic elements (132 LABs/Logic Array Blocks), 117 user I/O pins, embedded SRAM configuration memory (SRAM-based, volatile configuration requiring external configuration device), in-system programmability via JTAG, and a speed grade of -3 indicating the commercial high-performance tier. The TQFP-144 package exposes all major interface signals including dedicated clock inputs, JTAG, and configuration pins.

The OptiFLEX architecture minimizes die size through continuous, segmented routing resources interleaved with Logic Array Blocks. Each LAB contains ten logic elements with 4-input look-up tables (LUTs), a carry chain for arithmetic, and a cascade chain for wide fan-in functions. The device supports true dual-port and single-port embedded memory blocks for FIFO and register-file applications, plus dedicated I/O registers for high-speed source-synchronous interfaces.

Typical applications for the EPF6016ATC144-3N include glue logic integration in telecommunications line cards, industrial control and factory automation controllers, low-cost replacement for fixed gate arrays in high-volume consumer products, bridge and protocol conversion between legacy peripherals, and educational or prototyping platforms where designers need a robust, mature, programmable logic fabric. The 117 available I/Os support a wide range of parallel bus widths and mixed-signal interface requirements.

When designing with this device, note that the FLEX 6000 family uses SRAM configuration cells, so the bitstream must be reloaded from an external serial or parallel configuration PROM (such as the EPC2 or EPC8) on every power-up. Plan board layout to keep the 144-pin TQFP decoupling network within the inductance budget and to ensure JTAG chain access for in-system programming.

This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the FLEX 6000 family, and practical design notes not found in the original manufacturer datasheet.

Alternatives de remplacement direct pour EPF6016ATC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EPF6016ATC144-3N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Configuration Method, Speed Grade.

EPF6010ATC144-3N

Intel

Package: 144-pin TQFP (20x20 mm, 1.0 mm pitch)

Operating Temperature: 0 °C to 85 °C

Process Technology: 0.42 µm CMOS, SRAM-based