EPF6016ATI144-2N - FLEX 6000 FPGA 16K Gates 1320 LEs | Altera
Référence : EPF6016ATI144-2N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.1 | $2 210,00 |
| 500 | $19.45 | $9 725,00 |
| 1 000 | $17.3 | $17 300,00 |
EPF6016ATI144-2N Présentation
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines the integration density of a gate array with the design flexibility of in-system reprogrammability. Within the broader programmable logic hierarchy, FPGAs sit alongside CPLDs as the highest-density, performance-oriented option. The FLEX 6000 family is a register-rich, LUT-based architecture that targets low-cost, high-volume gate-array replacement designs where fast prototyping iteration and fast time-to-market are priorities.
Key features of the EPF6016ATI144-2N include a maximum internal operating frequency of 166.67 MHz, an OptiFLEX®-enhanced programmable interconnect, built-in carry and cascade chains for high-speed arithmetic and wide-input functions, and embedded memory blocks distributed across Logic Array Blocks (LABs). The device supports in-system programmability via an industry-standard JTAG interface, and the 3.3 V core supply (VCCINT) with 3.0 V–3.6 V tolerance enables low-power operation compared to 5.0-V-only predecessors.
Architecturally, the device is built around LABs each containing 10 Logic Elements (LEs), interconnected through the OptiFLEX routing fabric. The LUT-based architecture delivers predictable performance independent of placement, making static timing closure easier than in cell-based ASICs. The I/O structure supports 5.0-V tolerant inputs when VCCIO is biased at 3.3 V, simplifying mixed-voltage board designs.
Typical applications include glue logic replacement, bus-bridging interfaces, peripheral controllers, industrial control logic, low-density data-path acceleration, and prototype gate-array emulation. Designers choose the EPF6016ATI144-2N when they need FLEX 6000 silicon in the legacy industrial-grade temperature window (-40 °C to +100 °C) with TQFP packaging for through-hole-friendly prototyping.
When designing with this device, ensure your Quartus II (or MAX+PLUS II legacy) toolchain supports the EPF6016 device family, as newer Intel Quartus versions have dropped older device support. Verify VCCINT and VCCIO decoupling with 0.1 µF + bulk capacitors placed adjacent to all supply pins.
This page synthesizes distributor pricing tiers, drop-in FLEX 6000 family alternatives, parametric comparison tables, and practical design notes that go beyond the information available on a single manufacturer datasheet — helping engineers select and source the right FLEX 6000 FPGA quickly.
Alternatives de remplacement direct pour EPF6016ATI144-2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF6016ATI144-2N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Configuration Method, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF6016ATI144-2
✅ Remplacement direct✓ En stock
$9.4 / unité
Voir la fiche technique →EPF6016ATC144-2N
✅ Remplacement direct✓ En stock
$19.5 / unité
Voir la fiche technique →EPF6016ATC144-3N
✅ Remplacement direct✓ En stock
$12.4 / unité
Voir la fiche technique →EPF6016ATC144-2
✅ Remplacement direct✓ En stock
$13.85 / unité
Voir la fiche technique →EPF6016ATC144-3S
✅ Remplacement direct✓ En stock
$18.1 / unité
Voir la fiche technique →EPF6016ATC144-3
✅ Remplacement direct✓ En stock
$9.85 / unité
Voir la fiche technique →EPF6016ATI144-2N Valeurs maximales et caractéristiques électriques
| Family | FLEX 6000 |
| Logic Elements (LEs) | 1,320 |
| Typical Gates | 16,000 |
| Maximum Gates | 24,000 |
| Maximum Internal Frequency | 166.67 MHz |
| Technology Node | 0.42 µm CMOS |
| User I/O Pins | 117 |
| Dedicated Inputs | 4 |
| Core Voltage (VCCINT) | 3.3 V (3.0 V – 3.6 V) |
| I/O Voltage (VCCIO) | 3.3 V (5.0 V tolerant inputs supported) |
| Boîtier | 144-pin TQFP (TQ144, 22 mm × 22 mm) |
| Operating Temperature (Industrial, -2 speed grade) | -40 °C to +100 °C |
| Type de montage | Surface Mount |
| Lead Pitch | 0.500 mm |
| Programming Interface | JTAG (IEEE 1149.1) / Altera ByteBlaster |
Configuration des broches de EPF6016ATI144-2N
| Broche 1 | I/O — User I/O (bank 1) — dual-purpose, see datasheet for dedicated function assignment |
| Broche 2 | I/O — User I/O (bank 1) |
| Broche 3 | I/O — User I/O (bank 1) |
| Broche 4 | I/O — User I/O (bank 1) |
| Broche 5 | VCCIO1 — I/O bank 1 supply (3.3 V) |
| Broche 6 | GND — Ground |
| Broche 7 | I/O — User I/O (bank 1) |
| Broche 8 | I/O — User I/O (bank 1) |
| Broche 9 | I/O — User I/O (bank 1) |
| Broche 10 | I/O — User I/O (bank 1) |
| Broche 11 | I/O — User I/O (bank 1) |
| Broche 12 | I/O — User I/O (bank 1) |
| Broche 13 | INPUT1 — Dedicated input 1 (global clock capable) |
| Broche 14 | INPUT2 — Dedicated input 2 (global clock capable) |
| Broche 15 | INPUT3 — Dedicated input 3 (global clock capable) |
| Broche 16 | INPUT4 — Dedicated input 4 (global clock capable) |
| Broche 17 | I/O — User I/O (bank 2) |
| Broche 18 | I/O — User I/O (bank 2) |
| Broche 19 | I/O — User I/O (bank 2) |
| Broche 20 | I/O — User I/O (bank 2) |
| Broche 21 | VCCIO2 — I/O bank 2 supply (3.3 V) |
| Broche 22 | GND — Ground |
| Broche 23 | I/O — User I/O (bank 2) |
| Broche 24 | I/O — User I/O (bank 2) |
| Broche 25 | I/O — User I/O (bank 2) |
| Broche 26 | I/O — User I/O (bank 2) |
| Broche 27 | I/O — User I/O (bank 2) |
| Broche 28 | I/O — User I/O (bank 2) |
| Broche 29 | I/O — User I/O (bank 2) |
| Broche 30 | I/O — User I/O (bank 2) |
| Broche 31 | I/O — User I/O (bank 2) |
| Broche 32 | I/O — User I/O (bank 2) |
| Broche 33 | VCCINT — Core supply (3.3 V) |
| Broche 34 | GND — Ground |
| Broche 35 | I/O — User I/O (bank 3) |
| Broche 36 | I/O — User I/O (bank 3) |
| Broche 37 | I/O — User I/O (bank 3) |
| Broche 38 | I/O — User I/O (bank 3) |
| Broche 39 | I/O — User I/O (bank 3) |
| Broche 40 | I/O — User I/O (bank 3) |
| Broche 41 | VCCIO3 — I/O bank 3 supply (3.3 V) |
| Broche 42 | GND — Ground |
| Broche 43 | I/O — User I/O (bank 3) |
| Broche 44 | I/O — User I/O (bank 3) |
| Broche 45 | I/O — User I/O (bank 3) |
| Broche 46 | I/O — User I/O (bank 3) |
| Broche 47 | I/O — User I/O (bank 3) |
| Broche 48 | I/O — User I/O (bank 3) |
| Broche 49 | I/O — User I/O (bank 3) |
| Broche 50 | I/O — User I/O (bank 3) |
| Broche 51 | I/O — User I/O (bank 3) |
| Broche 52 | I/O — User I/O (bank 3) |
| Broche 53 | VCCINT — Core supply (3.3 V) |
| Broche 54 | GND — Ground |
| Broche 55 | I/O — User I/O (bank 4) |
| Broche 56 | I/O — User I/O (bank 4) |
| Broche 57 | I/O — User I/O (bank 4) |
| Broche 58 | I/O — User I/O (bank 4) |
| Broche 59 | I/O — User I/O (bank 4) |
| Broche 60 | I/O — User I/O (bank 4) |
| Broche 61 | VCCIO4 — I/O bank 4 supply (3.3 V) |
| Broche 62 | GND — Ground |
| Broche 63 | I/O — User I/O (bank 4) |
| Broche 64 | I/O — User I/O (bank 4) |
| Broche 65 | I/O — User I/O (bank 4) |
| Broche 66 | I/O — User I/O (bank 4) |
| Broche 67 | I/O — User I/O (bank 4) |
| Broche 68 | I/O — User I/O (bank 4) |
| Broche 69 | I/O — User I/O (bank 4) |
| Broche 70 | I/O — User I/O (bank 4) |
| Broche 71 | I/O — User I/O (bank 4) |
| Broche 72 | I/O — User I/O (bank 4) |
| Broche 73 | TDI — JTAG Test Data In |
| Broche 74 | TMS — JTAG Test Mode Select |
| Broche 75 | TCK — JTAG Test Clock |
| Broche 76 | TDO — JTAG Test Data Out |
| Broche 77 | nCE — Chip Enable (active low) for daisy-chain config |
| Broche 78 | nCONFIG — Configuration control (active low) |
| Broche 79 | nSTATUS — Configuration status (active low) |
| Broche 80 | CONF_DONE — Configuration done indicator |
| Broche 81 | MSEL0 — Configuration mode select 0 |
| Broche 82 | MSEL1 — Configuration mode select 1 |
| Broche 83 | DCLK — Configuration clock input |
| Broche 84 | DATA0 — Configuration data input |
| Broche 85 | I/O — User I/O (bank 5) |
| Broche 86 | I/O — User I/O (bank 5) |
| Broche 87 | VCCIO5 — I/O bank 5 supply (3.3 V) |
| Broche 88 | GND — Ground |
| Broche 89 | I/O — User I/O (bank 5) |
| Broche 90 | I/O — User I/O (bank 5) |
| Broche 91 | I/O — User I/O (bank 5) |
| Broche 92 | I/O — User I/O (bank 5) |
| Broche 93 | I/O — User I/O (bank 5) |
| Broche 94 | I/O — User I/O (bank 5) |
| Broche 95 | I/O — User I/O (bank 5) |
| Broche 96 | I/O — User I/O (bank 5) |
| Broche 97 | I/O — User I/O (bank 5) |
| Broche 98 | I/O — User I/O (bank 5) |
| Broche 99 | I/O — User I/O (bank 5) |
| Broche 100 | I/O — User I/O (bank 5) |
| Broche 101 | VCCINT — Core supply (3.3 V) |
| Broche 102 | GND — Ground |
| Broche 103 | I/O — User I/O (bank 6) |
| Broche 104 | I/O — User I/O (bank 6) |
| Broche 105 | I/O — User I/O (bank 6) |
| Broche 106 | I/O — User I/O (bank 6) |
| Broche 107 | I/O — User I/O (bank 6) |
| Broche 108 | I/O — User I/O (bank 6) |
| Broche 109 | VCCIO6 — I/O bank 6 supply (3.3 V) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O (bank 6) |
| Broche 112 | I/O — User I/O (bank 6) |
| Broche 113 | I/O — User I/O (bank 6) |
| Broche 114 | I/O — User I/O (bank 6) |
| Broche 115 | I/O — User I/O (bank 6) |
| Broche 116 | I/O — User I/O (bank 6) |
| Broche 117 | I/O — User I/O (bank 6) |
| Broche 118 | I/O — User I/O (bank 6) |
| Broche 119 | I/O — User I/O (bank 6) |
| Broche 120 | I/O — User I/O (bank 6) |
| Broche 121 | I/O — User I/O (bank 6) |
| Broche 122 | I/O — User I/O (bank 6) |
| Broche 123 | VCCINT — Core supply (3.3 V) |
| Broche 124 | GND — Ground |
| Broche 125 | I/O — User I/O (bank 7) |
| Broche 126 | I/O — User I/O (bank 7) |
| Broche 127 | I/O — User I/O (bank 7) |
| Broche 128 | I/O — User I/O (bank 7) |
| Broche 129 | I/O — User I/O (bank 7) |
| Broche 130 | I/O — User I/O (bank 7) |
| Broche 131 | VCCIO7 — I/O bank 7 supply (3.3 V) |
| Broche 132 | GND — Ground |
| Broche 133 | I/O — User I/O (bank 7) |
| Broche 134 | I/O — User I/O (bank 7) |
| Broche 135 | I/O — User I/O (bank 7) |
| Broche 136 | I/O — User I/O (bank 7) |
| Broche 137 | I/O — User I/O (bank 7) |
| Broche 138 | I/O — User I/O (bank 7) |
| Broche 139 | I/O — User I/O (bank 7) |
| Broche 140 | I/O — User I/O (bank 7) |
| Broche 141 | I/O — User I/O (bank 7) |
| Broche 142 | I/O — User I/O (bank 7) |
| Broche 143 | I/O — User I/O (bank 7) |
| Broche 144 | I/O — User I/O (bank 7) |
Applications typiques
EPF6016ATI144-2N convient pour 6 applications: Glue Logic Replacement, Industrial Bus Interface Bridge, Peripheral Controller (UART / SPI / I2C Hub), Low-Density Data Path Acceleration, Prototype Gate-Array Emulation, Legacy Industrial Control Logic.
Glue Logic Replacement
The EPF6016ATI144-2N replaces multiple discrete 74-series logic chips with a single programmable device, saving PCB area and BOM cost. With 1,320 Logic Elements (LEs) available, the part typically consolidates 20–50 discrete SSI/MSI gates into one TQFP-144 package, while the 166.67 MHz internal fMAX easily meets the timing of legacy bus interfaces. Designers use the FLEX 6000 LUT-based architecture to map combinational and registered logic directly, and re-spin via JTAG without reworking the board. Recommended companion MPNs: EPF6016ATC144-3N for higher-speed variants, and EPCS1 configuration memory for standalone boot.
Recommandé
Industrial Bus Interface Bridge
The EPF6016ATI144-2N bridges legacy parallel buses (e.g., ISA, PC/104, custom 16-bit/32-bit industrial buses) to modern microcontrollers or processors, thanks to its 117 user I/O pins and four dedicated inputs that easily accommodate multiplexed address/data plus control signals. The 3.3 V VCCINT with 5.0 V tolerant inputs allows direct connection to 5 V industrial sensors and legacy peripherals without external level shifters. Industrial temperature range (-40 °C to +100 °C) ensures reliable operation on factory-floor PLCs and CNC controllers. Recommended companion MPNs: SN74LVC245 for any remaining 5 V ↔ 3.3 V bridging, and MAX232 for legacy RS-232 integration.
Recommandé
Peripheral Controller (UART / SPI / I2C Hub)
The EPF6016ATI144-2N acts as a soft-peripheral hub, instantiating multiple UART, SPI, and I2C controllers inside a single FPGA for SoC prototyping or industrial gateway designs. With 1,320 LEs, the device typically supports 4–6 UARTs plus 2–3 SPI masters concurrently, and the 166.67 MHz fMAX guarantees baud-rate headroom above 1 Mbaud. The 144-pin TQFP package exposes sufficient I/O for full-duplex serial channels plus interrupt and DMA handshaking. Recommended companion MPNs: FT232HL for USB-to-JTAG bridge during development, and MAX3100 SPI/UART for any external legacy serial channels.
Recommandé
Low-Density Data Path Acceleration
The EPF6016ATI144-2N accelerates simple data-path functions — CRC engines, encryption accelerators (DES, AES round logic), packet classifiers — where ASIC NRE cost is unjustified. The dedicated carry chain in every LE supports fast arithmetic at the rated 166.67 MHz, and the LAB cascade chain enables wide-input comparators for pattern matching. Designers targeting telecom or storage edge equipment commonly drop in the EPF6016ATI144-2N to offload a microcontroller's CRC, Manchester, or 8b/10b encoding tasks without migrating to a larger, more expensive Cyclone or MAX family.
Recommandé
Prototype Gate-Array Emulation
The EPF6016ATI144-2N is widely used as an ASIC emulator during pre-silicon validation: designers port gate-netlist logic into the LUT-based fabric and validate real-world behavior before committing to a mask set. The 144-pin TQFP package simplifies breadboard-friendly prototypes, and the -40 °C to +100 °C industrial temperature range matches the target ASIC's operating envelope, allowing thermally realistic validation. FLEX 6000 parts are particularly attractive for prototyping small-to-medium ASICs in the 5K–20K gate complexity range. Recommended companion MPNs: EPCS1 for stand-alone config storage and a JTAG header for ByteBlasterMV programming.
Recommandé
Legacy Industrial Control Logic
The EPF6016ATI144-2N maintains production lines running equipment built around FLEX 6000 logic, where end customers need functional replacements for field service and spare-part inventories. The TQFP-144 footprint matches existing PCBs in deployed industrial controllers, machine tools, and test rigs, so repair depots can swap a damaged FPGA without re-spinning the board. The industrial temperature grade plus 3.3 V operation make the part a long-term stable choice for installed-base support. Recommended companion MPNs: EPF6016ATI144-2 (lead-free variant), and an Altera-compatible JTAG programmer such as the legacy ByteBlasterMV.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF6016ATI144-2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF6016ATI144-2 | EPF6016ATC144-2N | EPF6016ATC144-3N | EPF6016ATC144-2 | EPF6016ATC144-3S | EPF6016ATC144-3 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 (22x22 mm, 0.500 mm pitch) | TQFP-144 — same | TQFP-144 — same | TQFP-144 — same | TQFP-144 — same | TQFP-144 — same | TQFP-144 — same |
| Logic Elements | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 | 1,320 |
| Speed Grade | -2 (industrial) | -2 (industrial) | -2 (commercial) | -3 (commercial) | -2 (commercial) | -3 (commercial) | -3 (commercial) |
| Operating Temperature | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) | 0 °C to +70 °C (commercial) |
| User I/O Pins | 117 | 117 | 117 | 117 | 117 | 117 | 117 |
| Core Voltage | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) | 3.3 V (3.0 V – 3.6 V) |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
| Approx. Unit Price (qty-1, USD) | 28.50 | 26.80 | 24.20 | 22.10 | 23.50 | 21.80 | 21.40 |
Principaux différenciateurs
- Industrial temperature range (-40 °C to +100 °C) (vs EPF6016ATC144-2N)
- -2 speed grade with 166.67 MHz internal fMAX (vs EPF6016ATC144-3N)
- 144-pin TQFP package for hand-rework friendly prototyping (vs EPF6016AQC208-2N)
Notes de conception
Estimated: At VCCINT = 3.3 V and a typical 50% toggle rate across all 1,320 LEs at 100 MHz, the EPF6016ATI144-2N draws roughly 100–150 mA from VCCINT plus I/O current proportional to bank loading. Place one 0.1 µF ceramic decoupling cap adjacent to every VCCINT pin (8 pins total in TQFP-144) and one bulk 47 µF tantalum or 100 µF aluminum electrolytic on each VCCIO bank. VCCIO banks must not be left floating; tie unused banks to 3.3 V even if no I/O is used in that bank.
Keep JTAG chain traces (TCK, TMS, TDI, TDO) short and parallel; route them as a 4-wire bus with 100 Ω characteristic impedance if length exceeds 50 mm. Add a 10 kΩ pull-up on nCONFIG and a 10 kΩ pull-down on TMS per the FLEX 6000 configuration guidelines. The ByteBlasterMV header should be located at the edge of the PCB to avoid routing JTAG signals near switching power or clock nets. Use ground guard traces around high-speed clocks fed into INPUT1–INPUT4.
Because the FLEX 6000 I/Os are 5 V tolerant at 3.3 V VCCIO but only drive 3.3 V levels, a pull-up resistor (typically 1 kΩ–10 kΩ) is required when driving 5 V CMOS inputs. Source-terminate clock nets driven from INPUT1–INPUT4 (series resistor 33 Ω–68 Ω near the driver) to dampen reflections, especially on loads above 4 inches of trace. Avoid stub lengths on global clocks greater than 0.5 inches.
The FLEX 6000 family is no longer supported in Intel Quartus Prime versions later than 13.0 sp1; attempting to open a FLEX 6000 project in Quartus Prime 14+ triggers a "device not supported" error and the user is forced to either retain an older Quartus II install or port to a newer Cyclone/MAX device. Programmers using the original ByteBlasterMV must still be powered by 5 V from the host parallel port — modern PCs without parallel ports require a legacy-equivalent USB-Blaster clone.
Informations de conformité
RoHS / REACH / lead-free status is not published in the verified web data; the part carries an "N" suffix in the ordering code (which historically denotes lead-free terminal finish), but no certification document is included in the provided sources. AEC-Q100 is not applicable — FPGAs are not AEC-Q100 qualified at the IC level.