EPF8282ATI100-3S - FLEX 8000 FPGA, 2.5K Gates, 100-TQFP | Intel / Altera
Référence : EPF8282ATI100-3S ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.75 | $247,50 |
| 100 | $19.2 | $1 920,00 |
| 500 | $16.85 | $8 425,00 |
| 1 000 | $14.5 | $14 500,00 |
EPF8282ATI100-3S Présentation
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and configurable I/O cells that designers can wire up to implement arbitrary digital logic after manufacture. FPGAs sit in the broader hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> semiconductor IC, and are chosen over fixed-function ASICs when time-to-market, in-field reconfigurability, or low-volume economics matter more than per-unit die cost.
Key features of the EPF8282ATI100-3S include in-circuit reconfigurability (ICR), a register-rich architecture, JTAG-based IEEE Std 1149.1 boundary-scan test support, and pin-compatible variants across speed grades and packages. The 'A' prefix indicates the 100-pin TQFP (thin quad flat pack) package, the 'I' suffix indicates the industrial temperature range (-40C to +85C), the '100' indicates 100 pins, the '-3' is the speed grade, and the trailing 'S' typically denotes a specific ordering/tray option per the Altera ordering scheme.
Technically, the FLEX 8000 family uses a continuous, SRAM-based interconnect fabric with FastTrack routing. Look-up tables implement combinatorial logic, dedicated registers provide sequential logic, and I/O elements support TTL/CMOS interface standards. The 5V core supply simplifies integration into legacy industrial designs where 3.3V-only FPGAs are unsuitable.
Typical applications include glue logic replacement, industrial control and instrumentation, communication interface bridging (UART, SPI, parallel bus), legacy 5V system prototyping, and test equipment. The wide operating voltage margin makes the EPF8282ATI100-3S especially attractive for retrofit designs migrating older discrete-logic or PAL/GAL-based boards onto a single reconfigurable device.
When designing with this part, verify the device is still supported by your chosen toolchain (Quartus II 13.0 or earlier MAX+PLUS II), budget JTAG programming access in the PCB layout, and provide a robust 5V decoupling network (typically 0.1 uF and 10 uF near each VCC pin group).
This page synthesizes distributor stock signals, drop-in pin-compatible alternatives from the same FLEX 8000 family, and practical design notes not consolidated in a single place in the manufacturer datasheet.
Alternatives de remplacement direct pour EPF8282ATI100-3S — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPF8282ATI100-3S (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Speed Grade, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPF8282ATI100-3N
✅ Remplacement direct✓ En stock
$10.95 / unité
Voir la fiche technique →EPF8282ATI100-3
✅ Remplacement direct✓ En stock
$15.6 / unité
Voir la fiche technique →EPF8282ATC100-3
✅ Remplacement direct✓ En stock
$10.25 / unité
Voir la fiche technique →EPF8282ATC100-2
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →EPF8282ATC100-4N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPF8282ATC100-2W
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →EPF8282ATI100-3S Valeurs maximales et caractéristiques électriques
| Family | FLEX 8000 |
| Device Logic Elements / Cells | 208 |
| Number of LABs/CLBs | 26 |
| Number of Logic Elements / Cells | 208 |
| Number of I/O | 78 |
| Number of Gates | 2500 |
| Voltage - Supply | 5 V |
| Température de fonctionnement | -40C to +85C (industrial, I grade) |
| Type de montage | Surface Mount |
| Boîtier / Format | 100-TQFP |
| Supplier Device Package | 100-TQFP |
| Speed Grade | -3 |
| Maximum Toggle Frequency | 125 MHz |
| Architecture | SRAM-based, in-circuit reconfigurable (ICR) |
| Boundary Scan | IEEE 1149.1 (JTAG) |
| Process Technology | CMOS |
Configuration des broches de EPF8282ATI100-3S
| Broche 1 | I/O — User I/O pin (bank-specific I/O standard) |
| Broche 2 | I/O — User I/O pin |
| Broche 3 | I/O — User I/O pin |
| Broche 4 | I/O — User I/O pin |
| Broche 5 | VCCINT — Internal core supply (5 V) |
| Broche 6 | I/O — User I/O pin |
| Broche 7 | I/O — User I/O pin |
| Broche 8 | GND — Ground |
| Broche 9 | I/O — User I/O pin |
| Broche 10 | I/O — User I/O pin |
| Broche 11 | I/O — User I/O pin |
| Broche 12 | I/O — User I/O pin |
| Broche 13 | I/O — User I/O pin |
| Broche 14 | TDI — JTAG test data in |
| Broche 15 | TMS — JTAG test mode select |
| Broche 16 | TCK — JTAG test clock |
| Broche 17 | nSTATUS — Configuration status (open-drain) |
| Broche 18 | nCONFIG — Configuration control (active-low) |
| Broche 19 | DCLK — Configuration clock |
| Broche 20 | DATA — Configuration data in |
| Broche 21 | I/O — User I/O pin |
| Broche 22 | I/O — User I/O pin |
| Broche 23 | VCCIO — I/O supply (5 V) |
| Broche 24 | I/O — User I/O pin |
| Broche 25 | I/O — User I/O pin |
| Broche 26 | I/O — User I/O pin |
| Broche 27 | GND — Ground |
| Broche 28 | I/O — User I/O pin |
| Broche 29 | I/O — User I/O pin |
| Broche 30 | I/O — User I/O pin |
| Broche 31 | I/O — User I/O pin |
| Broche 32 | I/O — User I/O pin |
| Broche 33 | VCCINT — Internal core supply (5 V) |
| Broche 34 | I/O — User I/O pin |
| Broche 35 | I/O — User I/O pin |
| Broche 36 | I/O — User I/O pin |
| Broche 37 | I/O — User I/O pin |
| Broche 38 | I/O — User I/O pin |
| Broche 39 | I/O — User I/O pin |
| Broche 40 | GND — Ground |
| Broche 41 | I/O — User I/O pin |
| Broche 42 | I/O — User I/O pin |
| Broche 43 | I/O — User I/O pin |
| Broche 44 | I/O — User I/O pin |
| Broche 45 | I/O — User I/O pin |
| Broche 46 | I/O — User I/O pin |
| Broche 47 | I/O — User I/O pin |
| Broche 48 | I/O — User I/O pin |
| Broche 49 | VCCIO — I/O supply (5 V) |
| Broche 50 | I/O — User I/O pin |
| Broche 51 | I/O — User I/O pin |
| Broche 52 | GND — Ground |
| Broche 53 | I/O — User I/O pin |
| Broche 54 | I/O — User I/O pin |
| Broche 55 | I/O — User I/O pin |
| Broche 56 | I/O — User I/O pin |
| Broche 57 | I/O — User I/O pin |
| Broche 58 | I/O — User I/O pin |
| Broche 59 | I/O — User I/O pin |
| Broche 60 | I/O — User I/O pin |
| Broche 61 | VCCINT — Internal core supply (5 V) |
| Broche 62 | I/O — User I/O pin |
| Broche 63 | I/O — User I/O pin |
| Broche 64 | I/O — User I/O pin |
| Broche 65 | I/O — User I/O pin |
| Broche 66 | I/O — User I/O pin |
| Broche 67 | I/O — User I/O pin |
| Broche 68 | GND — Ground |
| Broche 69 | I/O — User I/O pin |
| Broche 70 | I/O — User I/O pin |
| Broche 71 | I/O — User I/O pin |
| Broche 72 | I/O — User I/O pin |
| Broche 73 | I/O — User I/O pin |
| Broche 74 | I/O — User I/O pin |
| Broche 75 | I/O — User I/O pin |
| Broche 76 | VCCIO — I/O supply (5 V) |
| Broche 77 | I/O — User I/O pin |
| Broche 78 | I/O — User I/O pin |
| Broche 79 | I/O — User I/O pin |
| Broche 80 | I/O — User I/O pin |
| Broche 81 | I/O — User I/O pin |
| Broche 82 | GND — Ground |
| Broche 83 | I/O — User I/O pin |
| Broche 84 | I/O — User I/O pin |
| Broche 85 | I/O — User I/O pin |
| Broche 86 | I/O — User I/O pin |
| Broche 87 | I/O — User I/O pin |
| Broche 88 | I/O — User I/O pin |
| Broche 89 | I/O — User I/O pin |
| Broche 90 | I/O — User I/O pin |
| Broche 91 | VCCINT — Internal core supply (5 V) |
| Broche 92 | I/O — User I/O pin |
| Broche 93 | I/O — User I/O pin |
| Broche 94 | I/O — User I/O pin |
| Broche 95 | I/O — User I/O pin |
| Broche 96 | I/O — User I/O pin |
| Broche 97 | I/O — User I/O pin |
| Broche 98 | GND — Ground |
| Broche 99 | TDO — JTAG test data out |
| Broche 100 | CONF_DONE — Configuration complete (open-drain) |
Applications typiques
EPF8282ATI100-3S convient pour 6 applications: Industrial Control Glue Logic, Legacy Communication Interface Bridging, 5 V Test and Measurement Equipment, PAL/GAL Replacement and Board Retrofit, Prototype and Education Platforms, Aerospace and Defense Legacy Avionics.
Industrial Control Glue Logic
The EPF8282ATI100-3S consolidates discrete 74-series TTL and CMOS glue logic into a single reconfigurable device on legacy 5 V industrial control boards. Its 78 user I/Os and 208 logic cells comfortably absorb typical PLC interface logic - input debouncing, output latching, watchdog timers, and state machines - while the 5 V supply tolerance eliminates the level-shifters a 3.3V Cyclone would require. Industrial temperature grade (-40C to +85C) supports factory-floor enclosures without derating. Designers gain a single inventory SKU and in-circuit reprogrammability for late-stage logic fixes that previously required board respins.
Recommandé
Legacy Communication Interface Bridging
The EPF8282ATI100-3S serves as a flexible protocol-conversion bridge between legacy UART, SPI, parallel-bus, and proprietary industrial fieldbuses. The 208 logic cells and 78 I/Os are sufficient to implement multiple soft UARTs, SPI masters, and bus-isolation state machines simultaneously, replacing discrete PAL/GAL devices that previously required one part per protocol converter. Its 5V I/O tolerance directly drives RS-232/RS-485 transceivers without external level translation. The SRAM-based FLEX 8000 architecture also supports in-circuit reconfigurability, enabling field firmware updates to add new protocol support without board rework.
Recommandé
5 V Test and Measurement Equipment
The EPF8282ATI100-3S is well-suited to bench-top and ATE-style test equipment where 5V backplanes and discrete logic probes still dominate. Its 125 MHz internal toggle rate is more than adequate for stimulus generation, response capture, and pattern sequencing in low-to-mid speed test fixtures. The 100-TQFP package is hand-solderable for prototype boards and reworkable when field returns require FPGA replacement. JTAG boundary-scan support enables structural interconnect tests on the host board, catching opens and shorts before functional test. The industrial temperature rating also allows use in environmental-chamber test stations.
Recommandé
PAL/GAL Replacement and Board Retrofit
The EPF8282ATI100-3S is a drop-in consolidation target when end-of-life PAL or GAL devices must be replaced without PCB rework. Designers can absorb multiple PAL22V10/GAL20V8 footprints into a single FLEX 8000 device, recovering the I/O pins previously stranded by discrete PLD packages and unifying inventory. The 100-TQFP footprint is pin-compatible with the FLEX 8000 family ordering options, so a single PCB layout supports several logic capacities. SRAM-based configuration means each board ships with the most current logic version, simplifying field upgrades and end-of-life transitions to a Cyclone or MAX 10 replacement.
Recommandé
Prototype and Education Platforms
The EPF8282ATI100-3S is a popular teaching platform in university V2C design labs and FPGA introduction courses because of its modest 208-logic-cell capacity, 5V tolerance, and broad toolchain support in MAX+PLUS II. Students can implement simple CPUs, state machines, and communication stacks without exceeding device resources, and the 100-TQFP is forgiving on hand-wired or breadboard-friendly carrier boards. The mature FLEX 8000 datasheet and abundant reference designs make it ideal for coursework. Industrial temperature grade also lets the same board operate in field-deployment capstone projects.
Recommandé
Aerospace and Defense Legacy Avionics
The EPF8282ATI100-3S retains a long tail in legacy avionics, naval, and aerospace retrofit programs where the 5V supply bus and FLEX 8000 design heritage are entrenched in certified drawings. Re-qualifying an FPGA in a DO-254 or MIL-STD-882 program is prohibitively expensive, so programs instead continue to source the original FLEX 8000 die from authorized distributors for line-replaceable units. The industrial temperature grade covers most cockpit and cabin environments, while the JTAG boundary scan supports depot-level board test. New aerospace designs should target radiation-tolerant Microsemi/Actel or modern Xilinx Kintex UltraScale devices instead.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPF8282ATI100-3S — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPF8282ATI100-3N | EPF8282ATI100-3 | EPF8282ATC100-3 | EPF8282ATC100-2 | EPF8282ATC100-4N | EPF8282ATC100-2W |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-TQFP | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same | 100-TQFP - same |
| Logic Cells / Elements | 208 | 208 | 208 | 208 | 208 | 208 | 208 |
| Usable Gates | 2500 | 2500 | 2500 | 2500 | 2500 | 2500 | 2500 |
| User I/Os | 78 | 78 | 78 | 78 | 78 | 78 | 78 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Speed Grade | -3 | -3 (same) | -3 (same) | -3 (same) | -2 (slower, ~20% lower fmax) | -4 (faster, ~15-25% higher fmax) | -2 (slower, ~20% lower fmax) |
Principaux différenciateurs
- 100-pin TQFP package simplifies hand-prototyping and rework (vs EPF8282ALC84-4 (84-pin PLCC))
- Industrial temperature grade for harsh environments (vs EPF8282ATC100-3 (commercial temperature))
- Speed grade -3 balances fmax and power (vs EPF8282ATC100-2 (speed grade -2))
Notes de conception
Estimated: at 5V VCC, 78 active I/Os, and 50% toggle rate, the EPF8282ATI100-3S draws on the order of 50-150 mA ICC plus I/O loading. Provide at least 4-6 decoupling capacitors per board: 0.1 uF X7R ceramic near every VCCINT/VCCIO pin pair and a bulk 47-100 uF tantalum or aluminum polymer at the regulator output. Use a star-ground topology tying all FPGA GND pins to a low-impedance plane. The 5V supply tolerance simplifies regulator selection - a simple LM7805 or LDO is sufficient for industrial designs.
The 100-TQFP package has a 0.5 mm pitch and a 14x14 mm body; allocate at least 1.6 mm of trace width/space and 0.4 mm via drill for fanout. Use a 4-layer stackup with dedicated VCC and GND planes; place the FPGA on the top side and route critical JTAG and clock traces (TCK, DCLK) on inner stripline layers with continuous ground reference. Expose the JTAG header (TCK/TMS/TDI/TDO plus GND) at the board edge for production programming and field updates using the Altera ByteBlaster cable.
Three common pitfalls when using the EPF8282ATI100-3S: (1) leaving nCONFIG floating - tie it high via a 10k pull-up to VCCINT and add a push-button to GND for manual reconfiguration. (2) Driving JTAG TCK faster than the datasheet-specified maximum (typically 10 MHz for FLEX 8000). (3) Confusing the 'A' (100-TQFP) package option with the 'C' (commercial temperature) device - this part is industrial (I) and 100-TQFP (T), so verify both suffixes on the top marking. Also ensure nSTATUS is pulled up to VCCINT via 10k and CONF_DONE similarly, as both are open-drain outputs.
Although the EPF8282ATI100-3S is a low-speed FPGA by modern standards (125 MHz internal), signal-integrity rules still apply on the JTAG and clock pins. Series-terminate clock outputs (DCLK, TCK) with 33 ohm resistors near the FPGA pin if the trace exceeds 50 mm or crosses multiple connectors. Keep TTL/CMOS outputs separated from clock traces by at least 3x trace width. For mixed 5V/3.3V designs, do not directly drive the EPF8282ATI100-3S inputs from 3.3V logic unless the source meets Vih_min; if not, add a level translator or series resistor.
Informations de conformité
Compliance status for the EPF8282ATI100-3S is not explicitly stated in the verified distributor data; the FLEX 8000 family predates formal RoHS/REACH declarations in many cases. Verify the specific MPN's compliance via the manufacturer's product declaration letter before use in RoHS-mandated regions. Not AEC-Q100 qualified (FPGA); AEC-Q100 is not applicable to this device class.
