EPM240GF100C5N - MAX II CPLD, 192 MC, 4.7ns, 100-FBGA | Intel
Référence : EPM240GF100C5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.2 | $132,00 |
| 100 | $11.45 | $1 145,00 |
| 500 | $10.05 | $5 025,00 |
| 1 000 | $8.92 | $8 920,00 |
EPM240GF100C5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL/GAL macro-cell arrays with a programmable interconnect matrix. In the broader taxonomy, a CPLD sits between simple SPLDs (PAL/GAL) and high-density FPGAs, offering deterministic timing, instant-on behavior, and robust I/O drive strength. MAX II devices belong to Intel's low-power, instant-on CPLD family, commonly used for glue logic, bus bridging, power sequencing, and I/O expansion in systems where FPGAs would be over-specified or too expensive.
Key specifications include 192 logic elements (macro cells), 4.7 ns tPD (fastest pin-to-pin delay), 201.1 MHz internal operation, 80 user I/Os, in-system programmability via JTAG, and 1.8 V core with 1.5-3.3 V VCCIO. The device integrates 8 Kbits of user Flash memory, supports hot-socketing, and provides multi-voltage I/O standards including LVCMOS, LVTTL, and PCI compliance. Compared with earlier MAX 7000-series parts, MAX II cuts static power by an order of magnitude.
Architecturally, the EPM240GF100C5N uses a Logic Array Block (LAB) structure of 16 macro cells each, with a fast interconnect matrix and a non-volatile Flash configuration block that eliminates the external boot PROM. The on-board JTAG interface is IEEE 1149.1 compliant and supports the Jam STAPL programming standard for in-field updates. The 100-ball FBGA at 11 x 11 mm, 1.0 mm pitch, supports surface-mount assembly on standard reflow profiles.
Typical applications include power-up sequencing controllers, I/O voltage translation between 3.3 V and 1.8 V logic domains, peripheral bus bridges (for example, legacy parallel buses to SPI or I2C), LED and display multiplexing drivers, and address decoding in microcontroller-based designs. Designers favor MAX II when deterministic timing, instant-on, and low quiescent power are required without the cost or complexity of an FPGA.
When designing with this device, pay attention to the multi-bank VCCIO supply pins: each I/O bank can operate at an independent 1.5/1.8/2.5/3.3 V level, but unused banks must still be tied to a valid supply voltage to keep the inputs in a defined state. Configure the device with Quartus II (legacy) or the Intel Quartus Prime Lite edition toolchain, and verify pin assignments against the FBGA-100 package diagram before PCB layout.
Alternatives de remplacement direct pour EPM240GF100C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240GF100C5N (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Configuration Memory, Operating Temperature, Programming Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240F100I5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM240F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM240F100C4N
✅ Remplacement direct✓ En stock
$7.05 / unité
Voir la fiche technique →EPM240GF100C5
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EPM240F100C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$7.05 / unité
Voir la fiche technique →EPM1270F256C5N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM240GF100C5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Logic Elements / Macro Cells | 192 macro cells |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns |
| Maximum Operating Frequency | 201.1 MHz |
| User I/Os | 80 |
| Logic Family | CMOS |
| Process Technology | 0.18 um |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| User Flash Memory | 8 Kbits |
| Boîtier | 100-ball FBGA (11 x 11 mm, 1.0 mm pitch) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40 C to +125 C |
| Programming Interface | JTAG (IEEE 1149.1) / Jam STAPL |
| Configuration Memory | On-chip non-volatile Flash |
| Statut RoHS | Lead Free, RoHS compliant |
Configuration des broches de EPM240GF100C5N
| Broche A1 | I/O — User I/O bank 1 |
| Broche A2 | I/O — User I/O bank 1 |
| Broche A3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A4 | I/O — User I/O bank 1 |
| Broche A5 | I/O — User I/O bank 1 |
| Broche A6 | GND — Ground |
| Broche A7 | I/O — User I/O bank 2 |
| Broche A8 | I/O — User I/O bank 2 |
| Broche A9 | VCCIO2 — I/O bank 2 supply voltage |
| Broche A10 | I/O — User I/O bank 2 |
| Broche B1 | I/O — User I/O bank 1 |
| Broche B2 | I/O — User I/O bank 1 |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — User I/O bank 1 |
| Broche B5 | I/O — User I/O bank 1 |
| Broche B6 | VCCINT — Core 1.8 V supply |
| Broche B7 | I/O — User I/O bank 2 |
| Broche B8 | I/O — User I/O bank 2 |
| Broche B9 | GND — Ground |
| Broche B10 | I/O — User I/O bank 2 |
| Broche C1 | I/O — User I/O bank 1 |
| Broche C2 | VCCIO1 — I/O bank 1 supply voltage |
| Broche C3 | I/O — User I/O bank 1 |
| Broche C4 | GND — Ground |
| Broche C5 | I/O — User I/O bank 1 |
| Broche C6 | I/O — User I/O bank 2 |
| Broche C7 | GND — Ground |
| Broche C8 | I/O — User I/O bank 2 |
| Broche C9 | VCCIO2 — I/O bank 2 supply voltage |
| Broche C10 | I/O — User I/O bank 2 |
| Broche D1 | I/O — User I/O bank 3 |
| Broche D2 | I/O — User I/O bank 3 |
| Broche D3 | I/O — User I/O bank 3 |
| Broche D4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche D5 | I/O — User I/O bank 3 |
| Broche D6 | I/O — User I/O bank 4 |
| Broche D7 | VCCIO4 — I/O bank 4 supply voltage |
| Broche D8 | I/O — User I/O bank 4 |
| Broche D9 | I/O — User I/O bank 4 |
| Broche D10 | I/O — User I/O bank 4 |
| Broche E1 | I/O — User I/O bank 3 |
| Broche E2 | GND — Ground |
| Broche E3 | I/O — User I/O bank 3 |
| Broche E4 | I/O — User I/O bank 3 |
| Broche E5 | GND — Ground |
| Broche E6 | VCCINT — Core 1.8 V supply |
| Broche E7 | I/O — User I/O bank 4 |
| Broche E8 | I/O — User I/O bank 4 |
| Broche E9 | GND — Ground |
| Broche E10 | I/O — User I/O bank 4 |
| Broche F1 | I/O — User I/O bank 3 |
| Broche F2 | VCCIO3 — I/O bank 3 supply voltage |
| Broche F3 | I/O — User I/O bank 3 |
| Broche F4 | GND — Ground |
| Broche F5 | I/O — User I/O bank 3 |
| Broche F6 | I/O — User I/O bank 4 |
| Broche F7 | GND — Ground |
| Broche F8 | I/O — User I/O bank 4 |
| Broche F9 | VCCIO4 — I/O bank 4 supply voltage |
| Broche F10 | I/O — User I/O bank 4 |
| Broche G1 | I/O — User I/O bank 3 |
| Broche G2 | I/O — User I/O bank 3 |
| Broche G3 | I/O — User I/O bank 3 |
| Broche G4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche G5 | I/O — User I/O bank 3 |
| Broche G6 | I/O — User I/O bank 4 |
| Broche G7 | VCCIO4 — I/O bank 4 supply voltage |
| Broche G8 | I/O — User I/O bank 4 |
| Broche G9 | I/O — User I/O bank 4 |
| Broche G10 | I/O — User I/O bank 4 |
| Broche H1 | I/O — User I/O bank 3 |
| Broche H2 | GND — Ground |
| Broche H3 | I/O — User I/O bank 3 |
| Broche H4 | TDI — JTAG Test Data In |
| Broche H5 | TMS — JTAG Test Mode Select |
| Broche H6 | TCK — JTAG Test Clock |
| Broche H7 | TDO — JTAG Test Data Out |
| Broche H8 | I/O — User I/O bank 4 |
| Broche H9 | GND — Ground |
| Broche H10 | I/O — User I/O bank 4 |
| Broche J1 | I/O — User I/O bank 1 (DEV_OE / CONFIG) |
| Broche J2 | I/O — User I/O bank 1 |
| Broche J3 | nCONFIG — Configuration control (pull low to reconfigure) |
| Broche J4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche J5 | GND — Ground |
| Broche J6 | CONF_DONE — Configuration status output |
| Broche J7 | nSTATUS — Configuration status output |
| Broche J8 | I/O — User I/O bank 2 |
| Broche J9 | VCCIO2 — I/O bank 2 supply voltage |
| Broche J10 | I/O — User I/O bank 2 |
Applications typiques
EPM240GF100C5N convient pour 7 applications: Power-Up Sequencing Controller, Multi-Voltage I/O Voltage Translation Bridge, Address Decoding and Chip-Select Glue Logic, LED Display and Multiplexing Driver, Legacy Bus Bridge (PCI/ISA to Local Bus), Peripheral Expansion in MCU-Based Designs, Industrial Control and IoT Edge Gateways.
Power-Up Sequencing Controller
The EPM240GF100C5N's instant-on Flash configuration boots in microseconds with no external PROM, making it ideal for multi-rail power sequencing in networking switches, servers, and ATCA boards. With 4.7 ns tPD and 80 user I/Os across four independent VCCIO banks (1.5-3.3 V), one CPLD can monitor PG (power-good) signals from 4-6 DC-DC converters and assert enable lines in the correct order. Engineers typically design with a state-machine IP that captures the desired rail-on sequence in less than 50 macro cells, leaving headroom for fault-handling and watchdog logic.
Recommandé
Multi-Voltage I/O Voltage Translation Bridge
Each of the four I/O banks on the EPM240GF100C5N accepts an independent VCCIO of 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling bidirectional voltage translation between legacy 3.3 V MCUs and modern 1.8 V SoCs without external level shifters. Combined with 80 user I/Os and 4.7 ns propagation delay, a single device can bridge an 8-bit parallel bus, an SPI port, and an I2C bus between three different voltage domains simultaneously. The non-volatile configuration means no boot delay when the rail comes up, simplifying system bring-up.
Recommandé
Address Decoding and Chip-Select Glue Logic
In microcontroller-based designs with external SRAM, Flash, and peripherals, the EPM240GF100C5N provides deterministic 4.7 ns address decoding to generate chip-select signals faster than software-driven GPIO toggling. The 192 macro cells comfortably hold 6-8 chip-select decoders plus a wait-state generator for slow peripherals, and the JTAG programmability lets designers iterate on decoding tables without board rework. The industrial -40 to +125 C temperature range supports deployment in automotive under-hood and outdoor industrial enclosures.
Recommandé
LED Display and Multiplexing Driver
The EPM240GF100C5N drives multiplexed LED matrices, seven-segment displays, and Charlieplexed arrays with up to 80 outputs and 201 MHz internal performance, well above the scan-rate needs of typical 100-1000 Hz refresh designs. The deterministic 4.7 ns delay supports bit-banged protocols such as WS2812B, APA102, and DMX512 directly from macro-cell state machines, eliminating a dedicated LED driver IC. Flash-based configuration means the animation pattern is retained across power cycles with zero boot latency.
Recommandé
Legacy Bus Bridge (PCI/ISA to Local Bus)
Industrial PCs and factory automation controllers still rely on legacy parallel buses (PCI, ISA, PC/104), and the EPM240GF100C5N bridges these to modern SPI, I2C, or local-bus peripherals. With 4.7 ns tPD and 80 I/Os, the device can implement a 16-bit PCI target state machine plus dual-port SRAM handshaking in under 100 macro cells. The 3.3 V PCI-compliant I/O bank interfaces directly to legacy backplanes, while a 1.8 V bank connects to a modern SoC, all inside one BGA-100 package.
Recommandé
Peripheral Expansion in MCU-Based Designs
When an 8-bit or 32-bit MCU runs out of GPIO, the EPM240GF100C5N adds 80 individually programmable I/Os with edge-triggered interrupts, PWM generators, and quadrature decoders in firmware-upgradable logic. Designers map up to 16 PWM channels at 100 kHz with 10-bit resolution directly into macro-cell state machines, freeing the MCU's CPU cycles for application code. The non-volatile Flash storage means peripheral personality is preserved across brown-out events with no external boot loader required.
Recommandé
Industrial Control and IoT Edge Gateways
In Industry-4.0 edge gateways, the EPM240GF100C5N aggregates sensor data from Modbus, CAN, and RS-485 networks and presents a unified SPI or I2C interface to the host SoC. The deterministic 4.7 ns logic delay ensures protocol timing compliance on CAN (1 Mbps) and RS-485 (10 Mbps) without software jitter. Its industrial -40 to +125 C temperature range, 1.8 V low-power core, and 8 Kbits user Flash for parameter storage make it a workhorse in compact, fan-less gateway enclosures.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240GF100C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240F100I5N | EPM240F100C5N | EPM240F100C4N | EPM240GF100C5 | EPM1270F256C5N |
|---|---|---|---|---|---|---|
| Package | 100-ball FBGA (11 x 11 mm) | 100-ball FBGA - same | 100-pin TQFP - different | 100-ball FBGA - same | 100-ball FBGA - same (SnPb balls) | 256-ball FBGA - different |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Macro Cells | 192 | 192 | 192 | 192 | 192 | 1270 |
| Pin-to-Pin Delay (tPD) | 4.7 ns | 4.7 ns | 4.7 ns | ~3.7 ns (-4 speed grade) | 4.7 ns | 6.2 ns |
| User I/Os | 80 | 80 | 80 | 80 | 80 | 212 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | -40 C to +125 C | -40 C to +100 C (industrial) | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
Principaux différenciateurs
- Lowest pin-to-pin delay in the MAX II EPM240 family in BGA (vs EPM240F100C4N)
- Compact 11x11 mm FBGA footprint (vs EPM240F100C5N)
- Four independent VCCIO banks in a single 100-ball package (vs EPM1270F256C5N)
- Non-volatile Flash configuration with instant-on (vs Lattice ispMACH 4000 (LC4064ZE))
Notes de conception
The EPM240GF100C5N requires two separate supply rails: a 1.8 V VCCINT for the core logic and one or more VCCIO rails (1.5/1.8/2.5/3.3 V) for the I/O banks. Decouple each VCCINT and VCCIO pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the ball, and add a single 10 uF bulk capacitor near the supply entry point. All four VCCIO banks must be powered even if unused - leaving a VCCIO bank floating causes input-pin leakage and indeterminate I/O behavior on power-up.
The 100-ball FBGA at 1.0 mm pitch requires a 4-layer PCB minimum, with the inner layers acting as ground and power planes directly beneath the BGA. Use 0.5 mm via-pad diameter, 0.25 mm via-drill, and microvia-in-pad if budget allows, to route signals out of the inner rows. Match trace impedance to 50 ohms single-ended for clock and JTAG signals, and provide a continuous ground pour under the BGA for thermal dissipation (~1 W max on this 0.18 um part).
Do not confuse the EPM240GF100C5N (FBGA package) with the EPM240F100C5N (TQFP-100 package). Both share the same die but have completely different PCB footprints. Verify the package code on the incoming-receiving inspection label and on the device top marking. Another common mistake is connecting JTAG pins (TDI, TMS, TCK, TDO) directly to a 3.3 V MCU without a level shifter when VCCIO1 is set to 1.8 V - the 3.3 V signals will exceed absolute-max ratings on the I/O bank. Always tie nCONFIG high through a 10 kohm pull-up and provide a push-button to ground for manual reconfiguration.
Although the MAX II CPLD is a relatively slow device by FPGA standards, the simultaneous-switching output (SSO) limit on each VCCIO bank should still be respected. Bank 1 and Bank 3 each support 24 mA drive strength per pin in PCI mode; avoid driving more than 16 outputs simultaneously at full strength to stay within the GND/VCC bounce budget. For clock outputs, use the dedicated CLK input pin and a global clock buffer to minimize skew - software tools like Quartus' fitter report will flag any timing violations automatically.
Informations de conformité
Lead-free FBGA balls with NiPdAu finish, RoHS compliant per device datasheet. Industrial -40 to +125 C temperature range but not AEC-Q100 qualified for automotive - use automotive-grade MAX V or Cyclone family for AEC-Q100 applications.
