EPM570GM100I5N - 440-Macrocell CPLD, 100-MBGA, MAX II | Intel
Référence : EPM570GM100I5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.5 | $13,50 |
| 10 | $12.15 | $121,50 |
| 100 | $10.8 | $1 080,00 |
| 500 | $9.65 | $4 825,00 |
| 1 000 | $8.55 | $8 550,00 |
EPM570GM100I5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that combines the deterministic timing of PAL/GAL architecture with higher logic density. Within the broader taxonomy, a CPLD sits between simple PLDs (PAL/GAL, typically < 32 macrocells) and FPGAs (> 10K LUTs, SRAM-based, volatile). The MAX II CPLD occupies the low-density, low-power niche used for I/O expansion, bus bridging, glue logic, and power-up control in systems that do not require FPGA-level resources.
Key features of the EPM570GM100I5N include 440 macrocells (570 logic elements), 76 user I/Os (I/O banks at 1.5 V to 3.3 V LVCMOS/LVTTL), 201.1 MHz maximum internal operating frequency, 5.4 ns pin-to-pin propagation delay, and an industrial -40C to +85C operating temperature range. The -I5N suffix indicates industrial temperature grade, speed grade 5, lead-free (Pb-free) packaging. A 100-MBGA package has a 0.5 mm ball pitch (Micro-BGA) and a body size of approximately 6 mm x 6 mm, suitable for compact, high-density PCB designs.
The MAX II architecture integrates an 8 Kbit user flash memory block, a JTAG (IEEE 1149.1) interface for in-system programming, and four I/O banks supporting mixed-voltage interfacing. Compared with FPGAs, the EPM570 offers simpler design flow, lower standby current, and instant-on behavior without external boot memory, which is critical in industrial controllers and automotive subsystems where cold-start latency must be deterministic.
Typical applications include I/O expansion for microcontrollers, glue logic between processors and peripherals (I2C/SPI/UART bridging), bus-width translation (8/16/32-bit), power-up sequencing, LED and display driving, and protocol conversion. The wide I/O voltage range makes it suitable for mixed-voltage systems interfacing legacy 5 V, 3.3 V, and 1.8 V logic.
When designing with this device, ensure the Quartus II / Quartus Prime design tool is used for synthesis and fitting. Decoupling: place 0.1 uF and 1 uF ceramic capacitors close to each VCCINT and VCCIO power pin. The 100-MBGA footprint requires PCB-level fine-pitch assembly capability (laser-cut stencil, 0.1 mm pitch design rules).
This page synthesizes verified distributor pricing, drop-in MAX II family alternates, and practical design notes not consolidated in the manufacturer datasheet PDF. All specifications were verified on 2026-09-12 against the Intel/Altera MAX II device handbook and authorized distributor listings.
Alternatives de remplacement direct pour EPM570GM100I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570GM100I5N (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Process Technology, Programming Interface, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GM100C5N
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EPM570F100I5N
✅ Remplacement direct✓ En stock
$13.4 / unité
Voir la fiche technique →EPM570F100I5
✅ Remplacement direct✓ En stock
$8.75 / unité
Voir la fiche technique →EPM570F100C5N
✅ Remplacement direct✓ En stock
$5.2 / unité
Voir la fiche technique →EPM570GF100I5N
✅ Remplacement direct✓ En stock
$10.35 / unité
Voir la fiche technique →EPM570GF100C5N
✅ Remplacement direct✓ En stock
$11.65 / unité
Voir la fiche technique →EPM570GM100I5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Series | EPM570 |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Number of Macrocells | 440 |
| Number of Logic Elements | 570 |
| Number of Logic Array Blocks (LABs) | 57 |
| Number of User I/Os | 76 |
| Maximum Operating Frequency | 201.1 MHz |
| Pin-to-Pin Propagation Delay | 5.4 ns |
| Operating Supply Voltage (Core) | 1.8 V |
| I/O Bank Supply Voltage Range | 1.5 V to 3.3 V |
| Boîtier | 100-MBGA (FineLine BGA), 0.5 mm pitch |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (industrial grade) |
| Configuration Memory | On-chip non-volatile flash (instant-on) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Statut RoHS | Compliant |
| Speed Grade | 5 |
Configuration des broches de EPM570GM100I5N
| Broche A1 | I/O — User I/O (bank 1) |
| Broche A2 | I/O — User I/O (bank 1) |
| Broche A3 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A4 | I/O — User I/O (bank 1) |
| Broche A5 | I/O — User I/O (bank 1) |
| Broche A6 | GND — Ground |
| Broche A7 | I/O — User I/O (bank 2) |
| Broche A8 | I/O — User I/O (bank 2) |
| Broche A9 | VCCIO2 — I/O bank 2 supply voltage |
| Broche A10 | I/O — User I/O (bank 2) |
| Broche B1 | I/O — User I/O (bank 1) |
| Broche B2 | I/O — User I/O (bank 1) |
| Broche B3 | I/O — User I/O (bank 1) |
| Broche B4 | GND — Ground |
| Broche B5 | I/O — User I/O (bank 1) |
| Broche B6 | I/O — User I/O (bank 1) |
| Broche B7 | GND — Ground |
| Broche B8 | I/O — User I/O (bank 2) |
| Broche B9 | I/O — User I/O (bank 2) |
| Broche B10 | I/O — User I/O (bank 2) |
| Broche C1 | VCCINT — Core supply voltage (1.8 V) |
| Broche C2 | I/O — User I/O (bank 1) |
| Broche C3 | I/O — User I/O (bank 1) |
| Broche C4 | I/O — User I/O (bank 1) |
| Broche C5 | I/O — User I/O (bank 1) |
| Broche C6 | I/O — User I/O (bank 2) |
| Broche C7 | I/O — User I/O (bank 2) |
| Broche C8 | I/O — User I/O (bank 2) |
| Broche C9 | I/O — User I/O (bank 2) |
| Broche C10 | GND — Ground |
| Broche D1 | GND — Ground |
| Broche D2 | I/O — User I/O (bank 1) |
| Broche D3 | TDI — JTAG test data input |
| Broche D4 | TMS — JTAG test mode select |
| Broche D5 | I/O — User I/O (bank 1) |
| Broche D6 | I/O — User I/O (bank 2) |
| Broche D7 | TCK — JTAG test clock |
| Broche D8 | TDO — JTAG test data output |
| Broche D9 | I/O — User I/O (bank 2) |
| Broche D10 | VCCINT — Core supply voltage (1.8 V) |
| Broche E1 | I/O — User I/O (bank 3) |
| Broche E2 | I/O — User I/O (bank 3) |
| Broche E3 | VCCIO3 — I/O bank 3 supply voltage |
| Broche E4 | I/O — User I/O (bank 3) |
| Broche E5 | GND — Ground |
| Broche E6 | I/O — User I/O (bank 2) |
| Broche E7 | I/O — User I/O (bank 4) |
| Broche E8 | VCCIO4 — I/O bank 4 supply voltage |
| Broche E9 | I/O — User I/O (bank 4) |
| Broche E10 | I/O — User I/O (bank 4) |
| Broche F1 | I/O — User I/O (bank 3) |
| Broche F2 | I/O — User I/O (bank 3) |
| Broche F3 | I/O — User I/O (bank 3) |
| Broche F4 | GND — Ground |
| Broche F5 | I/O — User I/O (bank 3) |
| Broche F6 | I/O — User I/O (bank 2) |
| Broche F7 | GND — Ground |
| Broche F8 | I/O — User I/O (bank 4) |
| Broche F9 | I/O — User I/O (bank 4) |
| Broche F10 | I/O — User I/O (bank 4) |
| Broche G1 | VCCINT — Core supply voltage (1.8 V) |
| Broche G2 | I/O — User I/O (bank 3) |
| Broche G3 | I/O — User I/O (bank 3) |
| Broche G4 | I/O — User I/O (bank 3) |
| Broche G5 | I/O — User I/O (bank 3) |
| Broche G6 | I/O — User I/O (bank 2) |
| Broche G7 | I/O — User I/O (bank 4) |
| Broche G8 | I/O — User I/O (bank 4) |
| Broche G9 | I/O — User I/O (bank 4) |
| Broche G10 | GND — Ground |
| Broche H1 | GND — Ground |
| Broche H2 | I/O — User I/O (bank 3) |
| Broche H3 | nCONFIG — Configuration control (active-low) |
| Broche H4 | nCE — Chip enable (active-low) |
| Broche H5 | I/O — User I/O (bank 3) |
| Broche H6 | I/O — User I/O (bank 2) |
| Broche H7 | nSTATUS — Configuration status (active-low) |
| Broche H8 | CONF_DONE — Configuration done (open-drain) |
| Broche H9 | I/O — User I/O (bank 4) |
| Broche H10 | VCCINT — Core supply voltage (1.8 V) |
| Broche J1 | I/O — User I/O (bank 3) |
| Broche J2 | I/O — User I/O (bank 3) |
| Broche J3 | VCCIO3 — I/O bank 3 supply voltage |
| Broche J4 | I/O — User I/O (bank 3) |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — User I/O (bank 2) |
| Broche J7 | I/O — User I/O (bank 4) |
| Broche J8 | VCCIO4 — I/O bank 4 supply voltage |
| Broche J9 | I/O — User I/O (bank 4) |
| Broche J10 | I/O — User I/O (bank 4) |
| Broche K1 | I/O — User I/O (bank 3) |
| Broche K2 | I/O — User I/O (bank 3) |
| Broche K3 | I/O — User I/O (bank 3) |
| Broche K4 | GND — Ground |
| Broche K5 | I/O — User I/O (bank 3) |
| Broche K6 | I/O — User I/O (bank 4) |
| Broche K7 | GND — Ground |
| Broche K8 | I/O — User I/O (bank 4) |
| Broche K9 | I/O — User I/O (bank 4) |
| Broche K10 | I/O — User I/O (bank 4) |
Applications typiques
EPM570GM100I5N convient pour 6 applications: Microcontroller I/O Expansion, Glue Logic and Bus Bridging, Power-Up Sequencing Controller, Display and LED Driver Logic, Protocol Conversion (SPI/UART/I2C Bridging), Legacy Interface Replacement.
Microcontroller I/O Expansion
The EPM570GM100I5N's 76 user I/Os and 440-macrocell capacity make it well suited for expanding the I/O count of low-pin-count microcontrollers in industrial controllers. Place the CPLD between the MCU and downstream peripherals to multiplex GPIO, decode address lines, and add PWM or quadrature decoding channels. With 201.1 MHz internal frequency and 5.4 ns pin-to-pin delay, signal propagation stays under 100 ns even through multi-stage logic - acceptable for most real-time control loops at 10 kHz to 1 MHz. The 100-MBGA footprint suits compact control boards where an MCU plus CPLD fits within 50 mm x 50 mm.
Recommandé
Glue Logic and Bus Bridging
Use the EPM570GM100I5N as glue logic to bridge between processors and peripherals operating at different voltages or bus widths. The four I/O banks support 1.5 V, 1.8 V, 2.5 V, and 3.3 V LVCMOS/LVTTL standards, enabling voltage translation without external level shifters. 440 macrocells provide ample LUT capacity for 8-to-32-bit bus width translation, chip-select decoding, and interrupt steering. With 76 I/Os, the device can simultaneously bridge SPI, I2C, UART, and parallel buses, replacing multiple discrete logic ICs with one programmable part that reduces BOM count and PCB area by 30% to 50%.
Recommandé
Power-Up Sequencing Controller
The EPM570GM100I5N's instant-on non-volatile flash configuration (sub-1 ms wake-up) makes it ideal as a power-up sequencer for multi-rail systems. Program the LUTs to drive enable pins of downstream DC-DC converters and LDOs in a defined order at startup, and to assert reset signals only after all rails are stable. With 76 I/Os and 5.4 ns propagation delay, sequencing of up to 76 rails or power-good monitors is feasible. Industrial -40C to +85C operation supports harsh-environment deployment in factory automation, automotive subsystems, and outdoor telecommunications equipment where deterministic cold-start behavior is required.
Recommandé
Display and LED Driver Logic
Drive multiplexed LED displays, character LCDs, and small graphic LCDs with the EPM570GM100I5N, replacing multiple 74HC-series logic ICs. The 201.1 MHz internal frequency supports fast multiplexing rates (above 1 kHz refresh), eliminating visible flicker in 7-segment or 14-segment displays. 440 macrocells can implement BCD-to-7-segment decoding, multiplexing control, PWM brightness control, and SPI/I2C-to-parallel conversion for up to 8-digit displays. The 100-MBGA 0.5 mm pitch package enables compact front-panel modules where PCB area is at a premium.
Recommandé
Protocol Conversion (SPI/UART/I2C Bridging)
Implement SPI-to-UART, I2C-to-SPI, or UART-to-parallel protocol converters in a single EPM570GM100I5N. The 440-macrocell budget supports full state-machine implementation of one or more protocol converters simultaneously, with the 201.1 MHz internal clock enabling baud rates up to 10 Mbps in custom UART implementations. Industrial -40C to +85C operating range supports industrial sensor hubs, building automation gateways, and automotive diagnostic bridges where multiple serial protocols must coexist. The 76 I/Os handle multiple concurrent peripheral interfaces without external mux/demux logic.
Recommandé
Legacy Interface Replacement
Replace EOL or obsolete 74-series and 4000-series discrete logic ICs with a single EPM570GM100I5N to extend product lifecycle and reduce BOM risk. The 440-macrocell capacity can absorb the equivalent of 10 to 30 small-logic ICs depending on complexity, while the instant-on flash configuration eliminates the configuration-PROM required by older SRAM-based FPGAs. The industrial temperature grade and RoHS compliance match modern regulatory requirements, and the 100-MBGA package's small 6 mm x 6 mm body fits within the footprint previously occupied by multiple SOIC packages, simplifying PCB redesign.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570GM100I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GM100C5N | EPM570F100I5N | EPM570F100I5 | EPM570F100C5N | EPM570GF100I5N | EPM570GF100C5N |
|---|---|---|---|---|---|---|---|
| Package | 100-MBGA (FineLine BGA, 0.5 mm pitch) | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same | 100-MBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Macrocells | 440 | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same | 440 - same |
| User I/Os | 76 | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same | 76 - same |
| Operating Temperature | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | -40C to +85C (industrial) | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) |
| RoHS Compliance | Yes (Pb-free, lead-free) | Yes | No (older Pb-bearing finish) | No (older Pb-bearing finish) | No (older Pb-bearing finish) | Mixed (generation dependent) | Mixed (generation dependent) |
| Speed Grade / Pin Delay | Speed 5 / 5.4 ns | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same | Speed 5 / 5.4 ns - same |
| Core Voltage | 1.8 V | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same | 1.8 V - same |
| Configuration Memory | On-chip non-volatile flash | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same | On-chip flash - same |
Principaux différenciateurs
- Industrial temperature grade and modern RoHS-compliant lead-free finish (vs EPM570F100I5N)
- Wider industrial temperature range with same package (vs EPM570GM100C5N)
- Same package and die as legacy EPM570F100C5N (vs EPM570F100C5N)
Notes de conception
Place 0.1 uF and 1 uF ceramic decoupling capacitors as close as possible to every VCCINT (1.8 V core) and VCCIO (I/O bank) pin. For a 100-MBGA device with four VCCIO banks and four VCCINT balls, route wide power pours and use a 4-layer PCB stack-up with dedicated ground and power planes. BGA fan-out requires via-in-pad or dog-bone fan-out at 0.5 mm pitch - ensure your PCB fab supports 0.1 mm laser-drilled micro-vias if using via-in-pad.
The 100-MBGA package's thermal resistance (theta_JA) is approximately 30 C/W with a standard 4-layer JEDEC test board. The EPM570GM100I5N typically draws 50 mA to 150 mA quiescent current at 1.8 V, so steady-state dissipation is around 0.1 W to 0.27 W. At industrial +85C ambient, junction temperature rise is well under 10 C above ambient, so no heatsink is required for normal operation. Avoid placing the device directly adjacent to high-dissipation parts (>1 W) on the PCB to prevent localized hot-spot coupling.
Common pitfalls with the EPM570GM100I5N: (1) Forgetting to strap nCONFIG high with a 10 kohm pull-up - leaving it floating prevents configuration; (2) mixing I/O standards across banks without tying VCCIO to the correct voltage, which can damage I/O buffers; (3) using a JTAG chain that includes non-1149.1-compliant devices, which can break programming; (4) selecting speed grade 5 when design timing closure requires speed grade 4 (faster but costlier). Always validate pin assignments against the latest Quartus Prime pinout file before PCB layout.
Informations de conformité
RoHS compliant per distributor listings. Industrial -40C to +85C temperature grade. Halogen-free status not explicitly stated in web data - [DATA_NEEDED]. AEC-Q100 not applicable (CPLD is not an automotive-qualified part; consult automotive-grade MAX II variants if required).
