EPM570F256C4N - 570 LEs, 440 Macro, 256-FBGA CPLD | Intel / Altera
Référence : EPM570F256C4N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $40.53 | $40,53 |
| 10 | $38.5 | $385,00 |
| 100 | $34.2 | $3 420,00 |
| 500 | $30.1 | $15 050,00 |
| 1 000 | $26.85 | $26 850,00 |
EPM570F256C4N Présentation
What is a CPLD? A Complex Programmable Logic Device is a non-volatile, instantly-on programmable logic IC that combines the deterministic timing and instant-on characteristics of PAL/PLA arrays with the higher logic density and I/O count of modern FPGAs. MAX II CPLDs sit in the hierarchy: programmable logic → CPLD → non-volatile CPLD → MAX II family, bridging glue-logic and simple state-machine tasks that do not justify the cost or boot-time of an SRAM-based FPGA. The 256-pin FineLine BGA package is the largest pin-count option for the MAX II family, enabling the highest I/O count and supporting vertical migration to EPM1270 and EPM2210 in the same footprint.
Key features include a maximum operating frequency of 304 MHz (internal), 5.4 ns pin-to-pin logic delay, MultiVolt core and I/O support, JTAG-based in-system programmability (ISP), and an 8 Kbit user flash memory block for storing user-defined data such as serial numbers or configuration parameters. The 256-ball FineLine BGA provides a compact 17 mm × 17 mm footprint suitable for space-constrained designs.
Architecturally, the EPM570F256C4N uses a Logic Array Block (LAB) structure of 57 LABs, each containing 10 Logic Elements. The non-volatile flash configuration cell eliminates external boot memory and provides instant-on behavior in < 1 ms, a defining advantage over SRAM FPGAs in power-sequenced and brown-out-sensitive systems. The MultiVolt I/O ring simplifies interfacing with mixed-voltage ASICs, ASSPs, and microcontrollers without level shifters.
Typical applications include I/O expansion and bus bridging in industrial control, glue-logic consolidation in communications infrastructure, power-sequencing and reset-distribution logic, LED display scan drivers, and low-cost state-machine controllers. The combination of high I/O count (160) and instant-on non-volatile configuration makes the EPM570F256C4N ideal for designs where deterministic startup and high pin count are required simultaneously.
Design consideration: vertical migration within the MAX II family is supported in the 256-pin FineLine BGA — EPM570, EPM1270, and EPM2210 share the same ball map, allowing a single PCB layout to serve multiple density points. Decoupling must follow the MAX II pin connection guidelines with multiple VCCINT and VCCIO pins requiring local 0.1 µF + bulk capacitors.
This page consolidates distributor pricing, drop-in same-package alternatives, design notes, and FAQ content that engineers typically need when sourcing the EPM570F256C4N, complementing the manufacturer datasheet with practical selection and replacement context.
Alternatives de remplacement direct pour EPM570F256C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570F256C4N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Programming Interface, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570F256C5N
✅ Remplacement direct✓ En stock
$17.03 / unité
Voir la fiche technique →EPM570F256I5N
✅ Remplacement direct✓ En stock
$19.85 / unité
Voir la fiche technique →EPM570F256C3N
✅ Remplacement direct✓ En stock
$13.75 / unité
Voir la fiche technique →EPM1270F256C5N
✅ Remplacement direct✓ En stock
$16.2 / unité
Voir la fiche technique →EPM2210F256C5N
✅ Remplacement direct✓ En stock
$17.85 / unité
Voir la fiche technique →EPM570F256C4N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Logic Elements | 570 LE |
| Macrocells | 440 |
| Logic Array Blocks (LABs) | 57 |
| User I/O Count | 160 |
| User Flash Memory (UFM) | 8 Kbit |
| Boîtier | 256-ball FineLine BGA (FBGA) |
| Package Size | 17 mm × 17 mm |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Maximum Internal Frequency | 304 MHz |
| Pin-to-Pin Logic Delay | 5.4 ns |
| Operating Supply Voltage (VCCINT) | 2.5 V, 3.3 V |
| MultiVolt I/O Voltages | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Plage de température de fonctionnement | 0 °C to +70 °C (commercial) |
| In-System Programmability (ISP) | Yes (JTAG) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du EPM570F256C4N 17 mm × 17 mm
Configuration des broches du EPM570F256C4N (boîtier 17 mm × 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EPM570F256C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EPM570F256C4N convient pour 6 applications: I/O Expansion and Bus Bridging, Industrial Control Glue Logic, Power Sequencing and Reset Distribution, LED Display Scan and Driver Control, Communication Infrastructure Glue Logic, State Machine Controllers and Protocol Engines.
I/O Expansion and Bus Bridging
The EPM570F256C4N's 160 user I/Os in a 256-ball FineLine BGA package make it a strong fit for I/O expansion and bus-bridging in industrial and embedded systems. With 570 logic elements and a 5.4 ns pin-to-pin delay, it can translate between legacy 5V-tolerant buses and modern 1.8V/2.5V/3.3V microprocessors using its MultiVolt I/O ring without external level shifters. Place the CPLD between a host MCU's GPIO bank and a parallel peripheral bus; the instant-on non-volatile flash configuration means bridge logic is alive within 1 ms of power-up, critical for systems requiring deterministic boot sequencing. The 256-FBGA also provides ample I/O headroom for adding extra peripheral channels beyond the MCU's native count.
Recommandé
Industrial Control Glue Logic
In industrial PLC and motor-control designs, the EPM570F256C4N consolidates scattered 74-series glue logic into a single non-volatile CPLD, reducing PCB area and improving reliability. Its 0.18 µm flash process tolerates industrial vibration and thermal cycling, and the 256-FBGA package's 17 × 17 mm footprint suits compact DIN-rail modules. The 304 MHz internal frequency and 5.4 ns tPD handle encoder quadrature decoding, PWM fanout, and reset distribution in real time without jitter. The 8-Kbit UFM stores device serial numbers and calibration constants, eliminating an external EEPROM and its associated I2C/SPI bus traffic.
Recommandé
Power Sequencing and Reset Distribution
The EPM570F256C4N's instant-on flash configuration makes it ideal for multi-rail power-sequencing and reset-distribution tasks in servers, networking switches, and FPGA-SoC systems. Because the CPLD wakes in < 1 ms with all 160 I/Os functional, it can drive enable signals to downstream DC-DC converters and assert reset lines to ASICs before an SRAM-based FPGA has even loaded its configuration bitstream. The 5.4 ns tPD enables tight sequencing windows, while MultiVolt I/O allows the same CPLD to interface 1.8V, 2.5V, and 3.3V rails without glue logic. The 8-Kbit UFM can store brown-out threshold parameters for adaptive reset behavior.
Recommandé
LED Display Scan and Driver Control
LED video walls, stadium displays, and large-format signage benefit from the EPM570F256C4N's combination of 160 I/Os and deterministic 5.4 ns tPD. The CPLD can scan-row multiplex large LED arrays, generate PWM grayscale modulation, and perform gamma correction with timing accuracy that software bit-banging cannot match. The 256-FBGA's high I/O count supports direct drive of 16-32 bit parallel data buses to LED driver chips without external latches. MultiVolt I/O compatibility means the same design can interface both 5V legacy and 3.3V modern LED driver ICs.
Recommandé
Communication Infrastructure Glue Logic
In telecom and networking hardware, the EPM570F256C4N serves as low-cost glue logic for backplane bridging, clock distribution, and front-panel I/O aggregation. Its 304 MHz internal frequency handles LVDS-style clock buffering and protocol adaptation between line cards and switch fabrics. The 160 I/Os support 8-10 bit parallel datapaths commonly used in serializer/deserializer (SerDes) companion logic. Non-volatile instant-on configuration ensures the CPLD is alive before the host ASIC completes its PCIe link-training sequence, eliminating race conditions during system bring-up. The 256-FBGA package is footprint-compatible with EPM1270 and EPM2210, allowing a single PCB to scale with design complexity.
Recommandé
State Machine Controllers and Protocol Engines
The EPM570F256C4N implements custom state machines and simple protocol engines — UART bridges, SPI-to-I2C converters, SD card controllers, and motor step/direction sequencers — without an MCU. The 570 logic elements and 57 LABs provide ample capacity for 16-32 state FSMs with parallel datapath operations, and the 5.4 ns tPD supports bit-banged serial protocols up to 50 MHz. The 8-Kbit user flash memory can store protocol lookup tables or device descriptors, simplifying firmware upgrades. The 256-FBGA footprint is ideal for space-constrained designs that need both high logic density and 160 I/Os.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570F256C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570F256C5N | EPM570F256I5N | EPM570F256C3N | EPM1270F256C5N | EPM2210F256C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-ball FineLine BGA | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Logic Elements | 570 LE | 570 LE | 570 LE | 570 LE | 1270 LE (+123%) | 2210 LE (+288%) |
| Macrocells | 440 | 440 | 440 | 440 | 980 | 1700 |
| User I/O Count | 160 | 160 | 160 | 160 | 212 | 212 |
| Speed Grade (tPD) | 5.4 ns | ~5.0 ns (faster) | 5.4 ns (same) | ~7.0 ns (slower) | ~6.5 ns | ~7.0 ns |
| Operating Temperature | 0C to +70C (commercial) | 0C to +70C (commercial) | -40C to +85C (industrial) | 0C to +70C (commercial) | 0C to +70C (commercial) | 0C to +70C (commercial) |
| Vertical Migration Support | Yes (with EPM1270, EPM2210) | Yes (same family) | Yes (same family) | Yes (same family) | Yes (upward from EPM570) | Yes (upward from EPM570/EPM1270) |
Principaux différenciateurs
- Highest I/O count in MAX II family within a single footprint (vs EPM570F100C5N)
- Footprint-compatible vertical migration to higher logic densities (vs EPM570F256C5N (same density, faster speed grade))
- Non-volatile instant-on configuration vs SRAM FPGA (vs Equivalent SRAM-based FPGAs (e.g., Cyclone IV))
Notes de conception
The EPM570F256C4N requires both 2.5 V or 3.3 V VCCINT (core) and a separate VCCIO bank supply. Decoupling must follow the MAX II pin connection guidelines: place one 0.1 µF ceramic capacitor adjacent to every VCCINT/VCCIO ball and a 10 µF bulk capacitor near the package. The MultiVolt I/O ring allows VCCIO to be 1.5 V, 1.8 V, 2.5 V, or 3.3 V independently from VCCINT, but unused I/O banks must still have VCCIO supplied to keep I/O buffers in a known state.
Estimated: at typical CPLD toggle activity (~30% I/O utilization, 100 MHz), the EPM570F256C4N in 256-ball FBGA dissipates approximately 0.5–1.0 W. The FineLine BGA has a θJA of approximately 20 °C/W on a 4-layer JEDEC PCB, yielding a junction-temperature rise of 10–20 °C above ambient — well within the 0 °C to +70 °C commercial range. Industrial-temperature variants (EPM570F256I5N) should follow the same thermal design but with extended headroom to -40 °C. No external heatsink is required for typical use.
BGA fanout must use the standard 1.0 mm pitch escape pattern with vias-in-pad recommended for the inner balls. Use a 4-layer stack-up with continuous GND plane directly under the BGA to provide low-inductance returns. JTAG chain signals (TDI/TDO/TMS/TCK) should be routed with 50 Ω controlled impedance and length-matched within 2 inches to avoid programming failures. The 256-FBGA footprint is footprint-compatible with EPM1270F256 and EPM2210F256 — use a single PCB layout to support all three density points via JTAG reprogramming.
Do not leave unused I/O pins floating — configure them as outputs driving '0' or as inputs with internal weak pull-up enabled via Quartus II pin assignment. Failing to supply VCCIO to unused banks triggers indeterminate I/O buffer behavior. The UFM block uses one specific block of flash that consumes ~1.2 mA additional ICCC during writes; ensure the regulator has adequate headroom if the UFM is rewritten at runtime. JTAG chain order matters: if the CPLD shares a JTAG chain with an FPGA or configuration device, ensure the chain order matches the programming file's BYPASS instruction length.
Informations de conformité
RoHS compliant per manufacturer product page. Not AEC-Q100 qualified — the EPM570F256C4N is a commercial-grade CPLD; AEC-Q100 variants are not available in this part number family. For automotive applications, consider the MAX V family or external qualification testing.
