EPM570T100I5 - 570 LEs MAX II CPLD, 5.4ns TQFP-100 | Altera
Référence : EPM570T100I5 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.4 | $4 200,00 |
| 1 000 | $7.25 | $7 250,00 |
EPM570T100I5 Présentation
Background: A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PLDs and high-density FPGAs in the programmable logic hierarchy. MAX II CPLDs use a flash-based architecture that holds the configuration in the same cells used for logic - hence "instant-on," since the device becomes operational within microseconds of power-up rather than requiring an external boot sequence. They are widely used as glue logic, bus bridges, interface controllers, and state machines where deterministic timing, low power, and non-volatility outweigh the need for very high gate counts.
Key features of the EPM570T100I5 include 76 user I/Os, 5.4 ns tPD (pin-to-pin) propagation delay, a MultiVolt core supporting 1.8V/2.5V/3.3V I/O standards, in-system programmability via JTAG (IEEE Std. 1149.1), and on-chip user flash memory for storing constants, serial numbers, or boot parameters. The 100-pin TQFP (14x14x1 mm) package offers a low-profile footprint with gull-wing leads, suitable for reflow assembly on standard FR-4 PCBs.
The MAX II architecture pairs a Logic Array Block (LAB) fabric with a Flash-based Configuration Flash Memory (CFM) and a User Flash Memory (UFM) block. This dual use of flash cells for both configuration and user storage is unique to MAX II and contributes to its very low standby current (typically <2 mA) compared to SRAM-based FPGAs.
Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic in telecom base-station line cards, configuration control in portable medical devices, state-machine replacement of discrete logic, and address decoding in microprocessor-based systems where non-volatile instant-on behavior is required.
When designing with the EPM570T100I5, observe the recommended decoupling scheme (0.1 uF on each VCCIO/VCCINT pin pair), respect the 3.3V core supply, and use the Quartus II / Quartus Prime toolchain for synthesis, fitting, and JTAG programming. Pin assignments must obey the MAX II TQFP-100 pinout; vertical migration within the same package is supported to EPM1270 and EPM2210 densities.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the same MAX II family, and practical design notes not collated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EPM570T100I5 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T100I5 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Family, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570T100I5N
✅ Remplacement direct✓ En stock
$12.49 / unité
Voir la fiche technique →EPM570GT100I5
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →EPM570GT100I5N
✅ Remplacement direct✓ En stock
$16.5 / unité
Voir la fiche technique →EPM570T100C5N
✅ Remplacement direct✓ En stock
$10.2 / unité
Voir la fiche technique →EPM570T100C4N
✅ Remplacement direct✓ En stock
$9.05 / unité
Voir la fiche technique →EPM570T100C5RR
✅ Remplacement direct✓ En stock
$7.95 / unité
Voir la fiche technique →EPM570T100I5 Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | EPM570 (MAX II) |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 micron, 6-layer-metal flash |
| Boîtier | TQFP-100 (14x14x1 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (industrial) |
| Core Supply Voltage | 3.0 V to 3.6 V |
| I/O Standards Supported | 1.5V / 1.8V / 2.5V / 3.3V LVCMOS/LVTTL |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Configuration Method | Non-volatile flash, instant-on |
Configuration des broches de EPM570T100I5
| Broche 1 | I/O — User I/O pin (bank 1) |
| Broche 2 | I/O — User I/O pin (bank 1) |
| Broche 3 | I/O — User I/O pin (bank 1) |
| Broche 4 | I/O — User I/O pin (bank 1) |
| Broche 5 | I/O — User I/O pin (bank 1) |
| Broche 6 | I/O — User I/O pin (bank 1) |
| Broche 7 | I/O — User I/O pin (bank 1) |
| Broche 8 | I/O — User I/O pin (bank 1) |
| Broche 9 | I/O — User I/O pin (bank 1) |
| Broche 10 | I/O — User I/O pin (bank 1) |
| Broche 11 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 12 | VCCINT — Core supply voltage (3.3V) |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O pin (bank 2) |
| Broche 15 | I/O — User I/O pin (bank 2) |
| Broche 16 | I/O — User I/O pin (bank 2) |
| Broche 17 | I/O — User I/O pin (bank 2) |
| Broche 18 | I/O — User I/O pin (bank 2) |
| Broche 19 | I/O — User I/O pin (bank 2) |
| Broche 20 | I/O — User I/O pin (bank 2) |
| Broche 21 | I/O — User I/O pin (bank 2) |
| Broche 22 | I/O — User I/O pin (bank 2) |
| Broche 23 | I/O — User I/O pin (bank 2) |
| Broche 24 | VCCIO2 — I/O bank 2 supply voltage |
| Broche 25 | GND — Ground |
| Broche 26 | I/O — User I/O pin (bank 2) |
| Broche 27 | I/O — User I/O pin (bank 2) |
| Broche 28 | I/O — User I/O pin (bank 2) |
| Broche 29 | I/O — User I/O pin (bank 2) |
| Broche 30 | I/O — User I/O pin (bank 2) |
| Broche 31 | I/O — User I/O pin (bank 2) |
| Broche 32 | I/O — User I/O pin (bank 2) |
| Broche 33 | I/O — User I/O pin (bank 2) |
| Broche 34 | I/O — User I/O pin (bank 2) |
| Broche 35 | VCCINT — Core supply voltage (3.3V) |
| Broche 36 | I/O — User I/O pin (bank 2) |
| Broche 37 | I/O — User I/O pin (bank 2) |
| Broche 38 | I/O — User I/O pin (bank 3) |
| Broche 39 | I/O — User I/O pin (bank 3) |
| Broche 40 | I/O — User I/O pin (bank 3) |
| Broche 41 | I/O — User I/O pin (bank 3) |
| Broche 42 | I/O — User I/O pin (bank 3) |
| Broche 43 | I/O — User I/O pin (bank 3) |
| Broche 44 | VCCIO3 — I/O bank 3 supply voltage |
| Broche 45 | GND — Ground |
| Broche 46 | I/O — User I/O pin (bank 3) |
| Broche 47 | I/O — User I/O pin (bank 3) |
| Broche 48 | I/O — User I/O pin (bank 3) |
| Broche 49 | I/O — User I/O pin (bank 3) |
| Broche 50 | I/O — User I/O pin (bank 3) |
| Broche 51 | I/O — User I/O pin (bank 3) |
| Broche 52 | I/O — User I/O pin (bank 3) |
| Broche 53 | I/O — User I/O pin (bank 3) |
| Broche 54 | I/O — User I/O pin (bank 3) |
| Broche 55 | VCCINT — Core supply voltage (3.3V) |
| Broche 56 | I/O — User I/O pin (bank 3) |
| Broche 57 | I/O — User I/O pin (bank 3) |
| Broche 58 | I/O — User I/O pin (bank 4) |
| Broche 59 | I/O — User I/O pin (bank 4) |
| Broche 60 | I/O — User I/O pin (bank 4) |
| Broche 61 | I/O — User I/O pin (bank 4) |
| Broche 62 | I/O — User I/O pin (bank 4) |
| Broche 63 | I/O — User I/O pin (bank 4) |
| Broche 64 | VCCIO4 — I/O bank 4 supply voltage |
| Broche 65 | GND — Ground |
| Broche 66 | I/O — User I/O pin (bank 4) |
| Broche 67 | I/O — User I/O pin (bank 4) |
| Broche 68 | I/O — User I/O pin (bank 4) |
| Broche 69 | I/O — User I/O pin (bank 4) |
| Broche 70 | I/O — User I/O pin (bank 4) |
| Broche 71 | I/O — User I/O pin (bank 4) |
| Broche 72 | I/O — User I/O pin (bank 4) |
| Broche 73 | I/O — User I/O pin (bank 4) |
| Broche 74 | I/O — User I/O pin (bank 4) |
| Broche 75 | VCCINT — Core supply voltage (3.3V) |
| Broche 76 | TDI — JTAG Test Data In |
| Broche 77 | TMS — JTAG Test Mode Select |
| Broche 78 | TCK — JTAG Test Clock |
| Broche 79 | TDO — JTAG Test Data Out |
| Broche 80 | nCEO — Configuration Chain Output (unused in standalone) |
| Broche 81 | nCE — Chip Enable (active low, tie low for single device) |
| Broche 82 | I/O — User I/O pin (bank 1) |
| Broche 83 | I/O — User I/O pin (bank 1) |
| Broche 84 | I/O — User I/O pin (bank 1) |
| Broche 85 | I/O — User I/O pin (bank 1) |
| Broche 86 | I/O — User I/O pin (bank 1) |
| Broche 87 | I/O — User I/O pin (bank 1) |
| Broche 88 | VCCIO1 — I/O bank 1 supply voltage |
| Broche 89 | GND — Ground |
| Broche 90 | nCONFIG — Configuration control (active low, tie to VCCIO through 10k) |
| Broche 91 | nSTATUS — Configuration status (active low, open-drain) |
| Broche 92 | CONF_DONE — Configuration done (open-drain) |
| Broche 93 | DEV_CLRn — Device-wide clear (optional, tie high) |
| Broche 94 | DEV_OE — Device-wide output enable (optional, tie high) |
| Broche 95 | I/O — User I/O pin (bank 1) |
| Broche 96 | I/O — User I/O pin (bank 1) |
| Broche 97 | I/O — User I/O pin (bank 1) |
| Broche 98 | I/O — User I/O pin (bank 1) |
| Broche 99 | I/O — User I/O pin (bank 1) |
| Broche 100 | GND — Ground |
Applications typiques
EPM570T100I5 convient pour 6 applications: Industrial Bus Address Decoding, Telecom Line Card Glue Logic, Portable Medical Device Control, I/O Expansion and Bus Bridging, Automotive Body Electronics, LED Display and Lighting Control.
Industrial Bus Address Decoding
The EPM570T100I5 is well-suited to industrial bus address decoding because its 5.4 ns pin-to-pin propagation delay ensures deterministic address-to-chip-select timing even at the maximum bus frequencies used in modern 32-bit microprocessors. With 570 logic elements it can decode multiple address windows simultaneously and generate chip-enable strobes for memory banks, peripherals, and external bus controllers. The MultiVolt I/O (1.5V-3.3V) lets the CPLD bridge between a 1.8V processor and 3.3V peripherals without external level shifters. Industrial -40C to +100C operation tolerates factory-floor enclosures. Compared with discrete 74-series glue logic, a single EPM570T100I5 replaces dozens of packages, reducing PCB area and BOM cost.
Recommandé
Telecom Line Card Glue Logic
In telecom line cards and base-station equipment, the EPM570T100I5 acts as fast, deterministic glue logic between a framer, SERDES, network processor, and backplane. The 5.4 ns tPD enables protocol-aware signal multiplexing and clock-domain crossing where ASIC gates are too costly. Its instant-on non-volatile flash architecture means line cards become operational within microseconds of card insertion, critical for hot-swap and OAM scenarios. The 76 user I/Os are sufficient to aggregate multiple low-speed control buses, while the 8 Kbit on-chip UFM can store card ID, manufacturing data, or hardware revision codes. Operating from 3.3V core, it interfaces cleanly to legacy 3.3V telecom ASICs.
Recommandé
Portable Medical Device Control
Portable medical devices such as infusion pumps, patient monitors, and handheld diagnostics benefit from the EPM570T100I5's combination of low standby current (<2 mA), instant-on flash-based configuration, and industrial temperature range. With 570 LEs it can implement state-machine-driven user-interface controllers, button debouncers, alarm logic, and LCD segment drivers without waking the main microcontroller. The 8 Kbit User Flash Memory can store calibration constants and device serial numbers, eliminating an external EEPROM. Its TQFP-100 footprint is small enough for handheld enclosures, while still providing 76 I/Os for sensor and actuator interfaces.
Recommandé
I/O Expansion and Bus Bridging
The EPM570T100I5 is widely used as an I/O expansion and bus-bridging device, particularly to expand a microcontroller's GPIO count or to translate between incompatible bus standards (for example, SPI to parallel, I2C to GPIO, or UART to parallel LCD). Its 76 user I/Os allow one CPLD to replace multiple port-expander chips, while MultiVolt support enables direct bridging between 1.8V and 3.3V domains. The 5.4 ns pin-to-pin delay keeps interrupt latency low in real-time systems. Engineers frequently choose it because the Quartus Prime toolchain provides synthesis, fitting, and JTAG programming in a single free flow with predictable timing closure.
Recommandé
Automotive Body Electronics
In automotive body electronics modules - body controllers, lighting modules, HVAC panels, and instrument-cluster peripherals - the EPM570T100I5 provides deterministic logic for PWM generation, CAN/LIN message routing, and sensor conditioning. While the -I5 industrial variant is used in cabin electronics, designers needing AEC-Q100 qualification must select the equivalent Q-grade part. The 570-LE capacity easily handles the multi-channel PWM, debouncing, and fault-detection logic typical in body modules. The non-volatile instant-on behavior eliminates startup delays seen with SRAM FPGAs, which is critical for safety-related subsystems that must be operational immediately after battery reconnect.
Recommandé
LED Display and Lighting Control
The EPM570T100I5 is an effective controller for multi-channel LED drivers and lighting-control systems. With 76 I/Os and 570 LEs it can drive dozens of PWM-controlled LED strings for architectural lighting, stage lighting fixtures, or signage. The 5.4 ns propagation delay supports high-refresh-rate multiplexing for video walls and RGB matrix panels. The on-chip 8 Kbit User Flash Memory is useful for storing color-curve calibration and scene presets, eliminating an external EEPROM. Combined with its instant-on behavior and industrial temperature range, the EPM570T100I5 reduces BOM cost versus an FPGA-plus-PROM solution while retaining deterministic timing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T100I5 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570T100I5N | EPM570GT100I5 | EPM570GT100I5N | EPM570T100C5N | EPM570T100C4N | EPM570T100C5RR |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | <5.4 ns (faster grade) | ~7 ns (slower grade) | <5.4 ns (faster grade) |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principaux différenciateurs
- Industrial temperature grade with non-volatile instant-on (vs EPM570T100C5N)
- RoHS Revision III compliance for modern supply chains (vs EPM570T100I5 (base))
- Faster speed grade than -C4 siblings (vs EPM570T100C4N)
Notes de conception
The EPM570T100I5 requires both a 3.3V core supply (VCCINT, 3.0V-3.6V) and one or more VCCIO bank supplies. Place a 0.1 uF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, plus a bulk 10-100 uF tantalum or ceramic capacitor at the supply entry to the chip. Power-up sequencing between VCCINT and VCCIO is not required, but the device holds its JTAG TAP in reset until both rails are stable. Avoid leaving VCCIO pins unconnected - unused banks should still receive a valid supply within the supported 1.5V-3.3V range to keep the I/O buffers in a defined state.
The TQFP-100 package has 0.5 mm pitch gull-wing leads; the recommended land pattern is 14x14 mm with 0.30 mm pad width and 1.50 mm pad length per the MAX II Device Handbook. Use a 4-layer PCB with a continuous ground plane beneath the device for signal integrity and thermal dissipation. Keep all JTAG traces (TCK/TMS/TDI/TDO) short and length-matched to within 25 mm to avoid signal-integrity issues at the JTAG clock rate; route them away from switching signals and add 10k pull-ups on TCK/TMS/TDI to VCCIO.
Do not confuse the EPM570T100I5 (industrial temp) with the EPM570T100C5 (commercial temp) - same package and pinout, but the commercial grade will fail reliability screening outside 0C to +85C. Also be careful with the 'N' suffix: EPM570T100I5N is a newer RoHS Revision III build of the same die and is functionally identical, but mixed BOMs of -I5 and -I5N can confuse incoming-inspection processes. Always tie nCE low and nCONFIG high (through a 10k resistor) for single-device configurations, and ensure CONF_DONE has a 10k pull-up to VCCIO for proper configuration status indication.
Route high-speed I/O signals on the top layer and avoid vias on critical paths; the 5.4 ns tPD budget is tight enough that additional via capacitance (typically 2-4 pF each) can shift timing closure. Keep VCCIO bank-to-bank noise isolated by placing the decoupling capacitors for each bank as close as possible to the corresponding VCCIO pin. JTAG chain routing should keep TCK as a clean point-to-point signal with a maximum stub length; the USB-Blaster or ByteBlaster II cable should be within 150 mm of the device.
Informations de conformité
RoHS status for the base EPM570T100I5 (without 'N' suffix) is not confirmed in the verified web data; the 'N' suffix variant is documented as RoHS Revision III compliant. AEC-Q100 qualification is not claimed for this industrial-grade part; for AEC-Q100 automotive applications consult Altera/Intel MAX II Q-grade options. REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified data.
