EPM570T100I5N - MAX II 570-LE CPLD, TQFP-100, Industrial | Intel
MPN: EPM570T100I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $20.82 | $20.82 |
| 10 | $18.74 | $187.40 |
| 100 | $16.65 | $1,665.00 |
| 500 | $14.57 | $7,285.00 |
| 1,000 | $12.49 | $12,490.00 |
Drop-in alternatives for EPM570T100I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570T100I5
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View Datasheet →EPM570T100C5N
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View Datasheet →EPM570T100C5
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View Datasheet →EPM570GT100I5N
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View Datasheet →EPM570T100I5N Maximum Ratings & Electrical Characteristics
| Series | MAX II |
| Family | EPM570 |
| Logic Elements | 570 |
| Macrocells | 440 |
| User I/Os (max) | 76 |
| User Flash Memory | 8 Kbit |
| Package | TQFP-100 (T100) |
| Mounting Type | Surface Mount |
| Operating Supply Voltage (Core) | 2.5 V / 3.3 V |
| I/O Standards Supported | 1.5 V, 1.8 V, 2.5 V, 3.3 V (MultiVolt) |
| Programmable via JTAG | Yes (IEEE 1149.1) |
| In-System Programmable | Yes |
| Configuration Memory | Internal non-volatile Flash |
| Operating Temperature (Industrial) | -40C to +100C (junction) |
| RoHS Status | Compliant |
EPM570T100I5N Pin Configuration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 20 | VCCIO1 — I/O bank 1 supply voltage |
| Pin 30 | I/O — User I/O bank 2 |
| Pin 40 | GND — Ground |
| Pin 50 | I/O — User I/O bank 3 |
| Pin 60 | VCCINT — Core supply voltage (2.5 V / 3.3 V) |
| Pin 70 | I/O — User I/O bank 4 |
| Pin 80 | GND — Ground |
| Pin 90 | I/O — User I/O bank 4 |
| Pin 100 | I/O — User I/O bank 4 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570T100I5N is suitable for 6 applications: I/O Expansion & Bus Bridging, HVAC & Appliance Controllers, LED Display Multiplexing & Scanning, Power Sequencing in Telecom Line Cards, Industrial Motor Control Glue Logic, Legacy Microcontroller Replacement & Modernization.
I/O Expansion & Bus Bridging
The EPM570T100I5N excels at I/O expansion and bus-bridging tasks in industrial control boards. With 76 user I/Os and MultiVoltage support (1.5 V, 1.8 V, 2.5 V, 3.3 V), it bridges between an MCU's limited native pins and external peripherals (keypads, sensors, LCDs) without external level shifters. The 570-LE / 440-macrocell density comfortably decodes 16- or 32-bit address buses and generates chip-select logic for memory-mapped peripherals. Instant-on non-volatile configuration means peripherals are available immediately at power-up, eliminating boot-PROM latency.
Recommended
HVAC & Appliance Controllers
In HVAC systems and home appliances, the EPM570T100I5N serves as the deterministic glue-logic brain that sequences relays, reads keypad matrices, drives LED/LCD displays, and monitors safety interlocks. Its industrial -40C to +100C junction temperature range handles the thermal stress of sealed compressor compartments. The 8-Kbit user flash stores OEM configuration data and serial numbers, while JTAG ISP enables firmware refresh in the field. Deterministic propagation delays ensure predictable relay timing critical for safety circuits in mid-to-high-end residential AC units.
Recommended
LED Display Multiplexing & Scanning
The EPM570T100I5N drives multiplexed LED matrices, scoreboards, and large-segment displays by generating row/column scan patterns and PWM dimming waveforms in hardware. The 76 user I/Os directly drive 8:8 row/column multiplex arrays up to 64 outputs without external drivers. The deterministic tPD timing ensures flicker-free refresh at >1 kHz rates, while the 440 macrocells provide ample room for character/font decoders. MultiVoltage I/O drives 3.3 V logic directly, simplifying PCB stack-up with modern LED-driver ICs.
Recommended
Power Sequencing in Telecom Line Cards
In telecom line cards and networking switches, the EPM570T100I5N enforces deterministic power-up and power-down sequencing of multiple voltage rails (1.5 V, 1.8 V, 2.5 V, 3.3 V) feeding PHYs, FPGAs, and ASICs. The 570-LE fabric easily implements complex sequencing state machines and fault-monitoring logic, while the 8-Kbit user flash stores board-revision-specific configuration. Its instant-on behavior guarantees rails ramp in the correct order before downstream devices release reset, eliminating inrush or latch-up events.
Recommended
Industrial Motor Control Glue Logic
For industrial motor drives and stepper/servo controllers, the EPM570T100I5N performs encoder decoding, PWM generation, fault detection, and brake control adjacent to a main MCU. The 76 I/Os accommodate Hall-sensor inputs, optocoupler-isolated fault signals, and gate-driver interfaces. Industrial-grade operation supports factory-floor temperatures, while deterministic timing ensures safe commutation in BLDC drives. JTAG ISP allows last-minute firmware updates during commissioning without removing the board.
Recommended
Legacy Microcontroller Replacement & Modernization
Designers use the EPM570T100I5N as a low-cost, low-power replacement for legacy masked-ROM microcontrollers and discrete glue logic in legacy products. With 570 LEs and 440 macrocells it can absorb the equivalent of 30-40 small-scale integration (SSI) packages into a single 100-pin device, reducing board area, BOM count, and assembly cost. The non-volatile instant-on configuration means existing firmware behavior is reproduced exactly, while JTAG ISP permits future field updates without hardware changes.
Recommended
Recommended Products Summary
Engineering reference data for EPM570T100I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570T100I5 | EPM570T100C5N | EPM570T100C5 | EPM570GT100I5N | EPM570GT100I5 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 | TQFP-100 |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V | 1.8 V |
| Series Variant | MAX II standard | MAX II standard | MAX II standard | MAX II standard | MAX II G-series | MAX II G-series |
| User Flash | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| JTAG / ISP | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Industrial temperature grade in TQFP-100 (vs EPM570T100C5N)
- TQFP-100 footprint, not BGA (vs EPM570F100C5N)
- Standard MAX II series with broader Quartus support (vs EPM570GT100I5N)
Design Notes
Place one 0.1 uF decoupling capacitor adjacent to every VCCINT and VCCIO pin of the EPM570T100I5N, plus a single 10 uF bulk tantalum or ceramic capacitor near the package. Use short, wide power traces to minimize inductance. The MAX II core draws transient current during JTAG programming; weak decoupling will cause ISP failures.
The TQFP-100 footprint requires 0.5 mm lead pitch with a land pattern extending 1.5-2.0 mm beyond the package body for reliable solder joints. Use a 4-layer PCB with continuous ground plane beneath the device for signal integrity. Exposed thermal considerations are minimal since the TQFP-100 has no exposed pad, but adequate copper pour on VCCINT/GND pins aids heat dissipation.
Do not confuse the EPM570T100I5N (TQFP-100, industrial) with the EPM570F100C5N (FBGA-100, commercial) or EPM570GT144C5N (TQFP-144, different pin count). Footprints are not interchangeable. Always verify the package code (T100 vs F100 vs GT100/GT144) before PCB fabrication.
MultiVoltage I/O banks must each have their own VCCIO supply; mixing 1.5 V and 3.3 V on the same bank damages the I/O drivers. Configure bank voltages in the Quartus Pin Planner before fitting. JTAG signals (TCK, TMS, TDI, TDO) should be routed with 4.7 kohm pull-ups on TCK/TMS/TDI per IEEE 1149.1 recommendations.
Compliance Information
RoHS compliant per Intel product page. Not AEC-Q100 qualified; for automotive applications consider MAX V or other qualified families. Lead-free reflow compatible up to 260C per JEDEC J-STD-020.
