EPM570T100I5 - 570 LEs MAX II CPLD, 5.4ns TQFP-100 | Altera
N.º da peça: EPM570T100I5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.85 | $985,00 |
| 500 | $8.4 | $4.200,00 |
| 1.000 | $7.25 | $7.250,00 |
EPM570T100I5 Visão geral
Background: A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple PLDs and high-density FPGAs in the programmable logic hierarchy. MAX II CPLDs use a flash-based architecture that holds the configuration in the same cells used for logic - hence "instant-on," since the device becomes operational within microseconds of power-up rather than requiring an external boot sequence. They are widely used as glue logic, bus bridges, interface controllers, and state machines where deterministic timing, low power, and non-volatility outweigh the need for very high gate counts.
Key features of the EPM570T100I5 include 76 user I/Os, 5.4 ns tPD (pin-to-pin) propagation delay, a MultiVolt core supporting 1.8V/2.5V/3.3V I/O standards, in-system programmability via JTAG (IEEE Std. 1149.1), and on-chip user flash memory for storing constants, serial numbers, or boot parameters. The 100-pin TQFP (14x14x1 mm) package offers a low-profile footprint with gull-wing leads, suitable for reflow assembly on standard FR-4 PCBs.
The MAX II architecture pairs a Logic Array Block (LAB) fabric with a Flash-based Configuration Flash Memory (CFM) and a User Flash Memory (UFM) block. This dual use of flash cells for both configuration and user storage is unique to MAX II and contributes to its very low standby current (typically <2 mA) compared to SRAM-based FPGAs.
Typical applications include I/O expansion and bus bridging in industrial controllers, glue logic in telecom base-station line cards, configuration control in portable medical devices, state-machine replacement of discrete logic, and address decoding in microprocessor-based systems where non-volatile instant-on behavior is required.
When designing with the EPM570T100I5, observe the recommended decoupling scheme (0.1 uF on each VCCIO/VCCINT pin pair), respect the 3.3V core supply, and use the Quartus II / Quartus Prime toolchain for synthesis, fitting, and JTAG programming. Pin assignments must obey the MAX II TQFP-100 pinout; vertical migration within the same package is supported to EPM1270 and EPM2210 densities.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the same MAX II family, and practical design notes not collated on any single manufacturer or distributor page.
Alternativas drop-in para EPM570T100I5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EPM570T100I5 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Family, Process Technology, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EPM570T100I5N
✅ Drop-In✓ Em estoque
$12.49 / unidade
Ver ficha técnica →EPM570GT100I5
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →EPM570GT100I5N
✅ Drop-In✓ Em estoque
$16.5 / unidade
Ver ficha técnica →EPM570T100C5N
✅ Drop-In✓ Em estoque
$10.2 / unidade
Ver ficha técnica →EPM570T100C4N
✅ Drop-In✓ Em estoque
$9.05 / unidade
Ver ficha técnica →EPM570T100C5RR
✅ Drop-In✓ Em estoque
$7.95 / unidade
Ver ficha técnica →EPM570T100I5 Classificações máximas e características elétricas
| Series | MAX II |
| Family | EPM570 (MAX II) |
| Logic Elements (LEs) | 570 |
| Equivalent Macrocells | 440 |
| User I/Os | 76 |
| Propagation Delay (tPD) | 5.4 ns |
| User Flash Memory (UFM) | 8 Kbits |
| Process Technology | 0.18 micron, 6-layer-metal flash |
| Encapsulamento | TQFP-100 (14x14x1 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +100C (industrial) |
| Core Supply Voltage | 3.0 V to 3.6 V |
| I/O Standards Supported | 1.5V / 1.8V / 2.5V / 3.3V LVCMOS/LVTTL |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable |
| Configuration Method | Non-volatile flash, instant-on |
Configuração de pinos do EPM570T100I5
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 12 | VCCINT — Core supply voltage (3.3V) |
| Pino 13 | GND — Ground |
| Pino 14 | I/O — User I/O pin (bank 2) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | VCCIO2 — I/O bank 2 supply voltage |
| Pino 25 | GND — Ground |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | I/O — User I/O pin (bank 2) |
| Pino 35 | VCCINT — Core supply voltage (3.3V) |
| Pino 36 | I/O — User I/O pin (bank 2) |
| Pino 37 | I/O — User I/O pin (bank 2) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | VCCIO3 — I/O bank 3 supply voltage |
| Pino 45 | GND — Ground |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | VCCINT — Core supply voltage (3.3V) |
| Pino 56 | I/O — User I/O pin (bank 3) |
| Pino 57 | I/O — User I/O pin (bank 3) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | VCCIO4 — I/O bank 4 supply voltage |
| Pino 65 | GND — Ground |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | I/O — User I/O pin (bank 4) |
| Pino 75 | VCCINT — Core supply voltage (3.3V) |
| Pino 76 | TDI — JTAG Test Data In |
| Pino 77 | TMS — JTAG Test Mode Select |
| Pino 78 | TCK — JTAG Test Clock |
| Pino 79 | TDO — JTAG Test Data Out |
| Pino 80 | nCEO — Configuration Chain Output (unused in standalone) |
| Pino 81 | nCE — Chip Enable (active low, tie low for single device) |
| Pino 82 | I/O — User I/O pin (bank 1) |
| Pino 83 | I/O — User I/O pin (bank 1) |
| Pino 84 | I/O — User I/O pin (bank 1) |
| Pino 85 | I/O — User I/O pin (bank 1) |
| Pino 86 | I/O — User I/O pin (bank 1) |
| Pino 87 | I/O — User I/O pin (bank 1) |
| Pino 88 | VCCIO1 — I/O bank 1 supply voltage |
| Pino 89 | GND — Ground |
| Pino 90 | nCONFIG — Configuration control (active low, tie to VCCIO through 10k) |
| Pino 91 | nSTATUS — Configuration status (active low, open-drain) |
| Pino 92 | CONF_DONE — Configuration done (open-drain) |
| Pino 93 | DEV_CLRn — Device-wide clear (optional, tie high) |
| Pino 94 | DEV_OE — Device-wide output enable (optional, tie high) |
| Pino 95 | I/O — User I/O pin (bank 1) |
| Pino 96 | I/O — User I/O pin (bank 1) |
| Pino 97 | I/O — User I/O pin (bank 1) |
| Pino 98 | I/O — User I/O pin (bank 1) |
| Pino 99 | I/O — User I/O pin (bank 1) |
| Pino 100 | GND — Ground |
Aplicações típicas
EPM570T100I5 é adequado para 6 aplicaçãos: Industrial Bus Address Decoding, Telecom Line Card Glue Logic, Portable Medical Device Control, I/O Expansion and Bus Bridging, Automotive Body Electronics, LED Display and Lighting Control.
Industrial Bus Address Decoding
The EPM570T100I5 is well-suited to industrial bus address decoding because its 5.4 ns pin-to-pin propagation delay ensures deterministic address-to-chip-select timing even at the maximum bus frequencies used in modern 32-bit microprocessors. With 570 logic elements it can decode multiple address windows simultaneously and generate chip-enable strobes for memory banks, peripherals, and external bus controllers. The MultiVolt I/O (1.5V-3.3V) lets the CPLD bridge between a 1.8V processor and 3.3V peripherals without external level shifters. Industrial -40C to +100C operation tolerates factory-floor enclosures. Compared with discrete 74-series glue logic, a single EPM570T100I5 replaces dozens of packages, reducing PCB area and BOM cost.
Recomendado
Telecom Line Card Glue Logic
In telecom line cards and base-station equipment, the EPM570T100I5 acts as fast, deterministic glue logic between a framer, SERDES, network processor, and backplane. The 5.4 ns tPD enables protocol-aware signal multiplexing and clock-domain crossing where ASIC gates are too costly. Its instant-on non-volatile flash architecture means line cards become operational within microseconds of card insertion, critical for hot-swap and OAM scenarios. The 76 user I/Os are sufficient to aggregate multiple low-speed control buses, while the 8 Kbit on-chip UFM can store card ID, manufacturing data, or hardware revision codes. Operating from 3.3V core, it interfaces cleanly to legacy 3.3V telecom ASICs.
Recomendado
Portable Medical Device Control
Portable medical devices such as infusion pumps, patient monitors, and handheld diagnostics benefit from the EPM570T100I5's combination of low standby current (<2 mA), instant-on flash-based configuration, and industrial temperature range. With 570 LEs it can implement state-machine-driven user-interface controllers, button debouncers, alarm logic, and LCD segment drivers without waking the main microcontroller. The 8 Kbit User Flash Memory can store calibration constants and device serial numbers, eliminating an external EEPROM. Its TQFP-100 footprint is small enough for handheld enclosures, while still providing 76 I/Os for sensor and actuator interfaces.
Recomendado
I/O Expansion and Bus Bridging
The EPM570T100I5 is widely used as an I/O expansion and bus-bridging device, particularly to expand a microcontroller's GPIO count or to translate between incompatible bus standards (for example, SPI to parallel, I2C to GPIO, or UART to parallel LCD). Its 76 user I/Os allow one CPLD to replace multiple port-expander chips, while MultiVolt support enables direct bridging between 1.8V and 3.3V domains. The 5.4 ns pin-to-pin delay keeps interrupt latency low in real-time systems. Engineers frequently choose it because the Quartus Prime toolchain provides synthesis, fitting, and JTAG programming in a single free flow with predictable timing closure.
Recomendado
Automotive Body Electronics
In automotive body electronics modules - body controllers, lighting modules, HVAC panels, and instrument-cluster peripherals - the EPM570T100I5 provides deterministic logic for PWM generation, CAN/LIN message routing, and sensor conditioning. While the -I5 industrial variant is used in cabin electronics, designers needing AEC-Q100 qualification must select the equivalent Q-grade part. The 570-LE capacity easily handles the multi-channel PWM, debouncing, and fault-detection logic typical in body modules. The non-volatile instant-on behavior eliminates startup delays seen with SRAM FPGAs, which is critical for safety-related subsystems that must be operational immediately after battery reconnect.
Recomendado
LED Display and Lighting Control
The EPM570T100I5 is an effective controller for multi-channel LED drivers and lighting-control systems. With 76 I/Os and 570 LEs it can drive dozens of PWM-controlled LED strings for architectural lighting, stage lighting fixtures, or signage. The 5.4 ns propagation delay supports high-refresh-rate multiplexing for video walls and RGB matrix panels. The on-chip 8 Kbit User Flash Memory is useful for storing color-curve calibration and scene presets, eliminating an external EEPROM. Combined with its instant-on behavior and industrial temperature range, the EPM570T100I5 reduces BOM cost versus an FPGA-plus-PROM solution while retaining deterministic timing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EPM570T100I5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EPM570T100I5N | EPM570GT100I5 | EPM570GT100I5N | EPM570T100C5N | EPM570T100C4N | EPM570T100C5RR |
|---|---|---|---|---|---|---|---|
| Package | TQFP-100 | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same | TQFP-100 - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Equivalent Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Pin-to-Pin Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | <5.4 ns (faster grade) | ~7 ns (slower grade) | <5.4 ns (faster grade) |
| User I/Os | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Principais diferenciais
- Industrial temperature grade with non-volatile instant-on (vs EPM570T100C5N)
- RoHS Revision III compliance for modern supply chains (vs EPM570T100I5 (base))
- Faster speed grade than -C4 siblings (vs EPM570T100C4N)
Notas de projeto
The EPM570T100I5 requires both a 3.3V core supply (VCCINT, 3.0V-3.6V) and one or more VCCIO bank supplies. Place a 0.1 uF decoupling capacitor as close as possible to every VCCINT and VCCIO pin, plus a bulk 10-100 uF tantalum or ceramic capacitor at the supply entry to the chip. Power-up sequencing between VCCINT and VCCIO is not required, but the device holds its JTAG TAP in reset until both rails are stable. Avoid leaving VCCIO pins unconnected - unused banks should still receive a valid supply within the supported 1.5V-3.3V range to keep the I/O buffers in a defined state.
The TQFP-100 package has 0.5 mm pitch gull-wing leads; the recommended land pattern is 14x14 mm with 0.30 mm pad width and 1.50 mm pad length per the MAX II Device Handbook. Use a 4-layer PCB with a continuous ground plane beneath the device for signal integrity and thermal dissipation. Keep all JTAG traces (TCK/TMS/TDI/TDO) short and length-matched to within 25 mm to avoid signal-integrity issues at the JTAG clock rate; route them away from switching signals and add 10k pull-ups on TCK/TMS/TDI to VCCIO.
Do not confuse the EPM570T100I5 (industrial temp) with the EPM570T100C5 (commercial temp) - same package and pinout, but the commercial grade will fail reliability screening outside 0C to +85C. Also be careful with the 'N' suffix: EPM570T100I5N is a newer RoHS Revision III build of the same die and is functionally identical, but mixed BOMs of -I5 and -I5N can confuse incoming-inspection processes. Always tie nCE low and nCONFIG high (through a 10k resistor) for single-device configurations, and ensure CONF_DONE has a 10k pull-up to VCCIO for proper configuration status indication.
Route high-speed I/O signals on the top layer and avoid vias on critical paths; the 5.4 ns tPD budget is tight enough that additional via capacitance (typically 2-4 pF each) can shift timing closure. Keep VCCIO bank-to-bank noise isolated by placing the decoupling capacitors for each bank as close as possible to the corresponding VCCIO pin. JTAG chain routing should keep TCK as a clean point-to-point signal with a maximum stub length; the USB-Blaster or ByteBlaster II cable should be within 150 mm of the device.
Informações de conformidade
RoHS status for the base EPM570T100I5 (without 'N' suffix) is not confirmed in the verified web data; the 'N' suffix variant is documented as RoHS Revision III compliant. AEC-Q100 qualification is not claimed for this industrial-grade part; for AEC-Q100 automotive applications consult Altera/Intel MAX II Q-grade options. REACH, lead-free, halogen-free, and conflict-minerals status were not present in the verified data.
