EPM570T144A5N - MAX II CPLD, 570 LE, 144-TQFP | Altera (Intel)
Référence : EPM570T144A5N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $42.77 | $42,77 |
| 10 | $38.5 | $385,00 |
| 100 | $32.1 | $3 210,00 |
| 500 | $26.45 | $13 225,00 |
| 1 000 | $22.8 | $22 800,00 |
EPM570T144A5N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that sits between simple SPLDs and FPGAs in the programmable logic hierarchy. Unlike SRAM-based FPGAs that require external boot memory, MAX II CPLDs configure themselves in microseconds from internal Flash, providing instant-on behavior at power-up. CPLDs are typically used for glue logic, bus interfacing, power-up sequencing, address decoding, and I/O expansion where deterministic timing and low standby power are required. Within the taxonomy, this device belongs to the chain: MAX II -> MAX family -> CPLD -> programmable logic -> semiconductor IC.
The EPM570T144A5N integrates 440 macro cells distributed across 8 logic array blocks (LABs), with each macro cell containing a programmable AND/OR array and a configurable flip-flop. The device provides 144 user I/O pins (the largest in the MAX II family), 8 Kbits of user Flash memory (UFM), and a JTAG/IEEE 1149.1 interface for in-system programming. Maximum pin-to-pin propagation delay is 5.4 ns, making it well suited for high-speed interface bridging and protocol conversion tasks. Multi-voltage I/O supports interfacing to 1.5 V, 1.8 V, 2.5 V, 3.3 V, and 5 V logic families without external level shifters.
Typical applications include bus interface bridging (e.g., PCI to local bus, microcontroller to parallel port), power-up and power-rail sequencing in multi-supply systems, address decoding and chip-select generation, I/O expansion for microcontrollers and ASSPs, LED display driving, and protocol glue logic in industrial controllers, telecom line cards, and automotive body modules. The automotive temperature grade (denoted by the 'A' suffix) supports -40 °C to +125 °C operation.
Designers should plan for I/O bank grouping to keep voltages compatible on shared banks, and provide adequate decoupling (one 0.1 µF per VCCIO bank is recommended). Quartus II or Quartus Prime design software is required for HDL entry, synthesis, fitting, and programming via the JTAG port using a USB-Blaster or compatible cable.
This page synthesizes distributor pricing, same-family and drop-in alternatives in the TQFP-144 footprint, and practical design considerations not found in the standalone datasheet.
Alternatives de remplacement direct pour EPM570T144A5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM570T144A5N (même facteur de forme et même empreinte) — différant par Package, Programming Interface, Operating Temperature, Process Technology, Configuration Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM570GT144I5N
✅ Remplacement direct✓ En stock
$14.85 / unité
Voir la fiche technique →EPM570GT144C5N
✅ Remplacement direct✓ En stock
$14.2 / unité
Voir la fiche technique →EPM570GF256C5N
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EPM570F256C5N
✅ Remplacement direct✓ En stock
$17.03 / unité
Voir la fiche technique →EPM570GM256C5N
✅ Remplacement direct✓ En stock
$18.6 / unité
Voir la fiche technique →EPM570T100A5N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.72 / unité
Voir la fiche technique →EPM570T144A5N Valeurs maximales et caractéristiques électriques
| Family | MAX II |
| Device | EPM570 |
| Logic Elements (LE) | 570 |
| Macro Cells | 440 |
| Maximum Operating Frequency | 201.1 MHz |
| Propagation Delay (tPD) | 5.4 ns |
| Process Technology | 0.18 µm |
| Core Voltage | 1.8 V |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) |
| User I/O Pins | 144 |
| User Flash Memory (UFM) | 8 Kbits |
| Boîtier | 144-pin TQFP (T144) |
| Type de montage | Surface Mount |
| Operating Temperature Grade | Automotive (-40 °C to +125 °C) |
| Programming Interface | JTAG (IEEE 1149.1) / In-System Programmable |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Statut RoHS | Compliant |
Configuration des broches de EPM570T144A5N
| Broche 1 | I/O — General-purpose user I/O (bank 1) |
| Broche 2 | I/O — General-purpose user I/O (bank 1) |
| Broche 3 | I/O — General-purpose user I/O (bank 1) |
| Broche 4 | I/O — General-purpose user I/O (bank 1) |
| Broche 5 | I/O — General-purpose user I/O (bank 1) |
| Broche 6 | I/O — General-purpose user I/O (bank 1) |
| Broche 7 | I/O — General-purpose user I/O (bank 1) |
| Broche 8 | I/O — General-purpose user I/O (bank 1) |
| Broche 9 | I/O — General-purpose user I/O (bank 1) |
| Broche 10 | I/O — General-purpose user I/O (bank 1) |
| Broche 11 | I/O — General-purpose user I/O (bank 1) |
| Broche 12 | I/O — General-purpose user I/O (bank 1) |
| Broche 13 | GND — Ground reference |
| Broche 14 | I/O — General-purpose user I/O (bank 1) |
| Broche 15 | I/O — General-purpose user I/O (bank 1) |
| Broche 16 | I/O — General-purpose user I/O (bank 1) |
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| Broche 21 | I/O — General-purpose user I/O (bank 1) |
| Broche 22 | I/O — General-purpose user I/O (bank 1) |
| Broche 23 | I/O — General-purpose user I/O (bank 1) |
| Broche 24 | I/O — General-purpose user I/O (bank 1) |
| Broche 25 | I/O — General-purpose user I/O (bank 1) |
| Broche 26 | I/O — General-purpose user I/O (bank 1) |
| Broche 27 | I/O — General-purpose user I/O (bank 1) |
| Broche 28 | I/O — General-purpose user I/O (bank 1) |
| Broche 29 | I/O — General-purpose user I/O (bank 1) |
| Broche 30 | I/O — General-purpose user I/O (bank 1) |
| Broche 31 | I/O — General-purpose user I/O (bank 1) |
| Broche 32 | I/O — General-purpose user I/O (bank 1) |
| Broche 33 | I/O — General-purpose user I/O (bank 1) |
| Broche 34 | I/O — General-purpose user I/O (bank 1) |
| Broche 35 | I/O — General-purpose user I/O (bank 1) |
| Broche 36 | I/O — General-purpose user I/O (bank 1) |
| Broche 37 | GND — Ground reference |
| Broche 38 | VCCINT1 — Core supply (1.8 V) |
| Broche 39 | I/O — General-purpose user I/O (bank 1) |
| Broche 40 | I/O — General-purpose user I/O (bank 1) |
| Broche 41 | I/O — General-purpose user I/O (bank 1) |
| Broche 42 | I/O — General-purpose user I/O (bank 1) |
| Broche 43 | I/O — General-purpose user I/O (bank 1) |
| Broche 44 | I/O — General-purpose user I/O (bank 1) |
| Broche 45 | I/O — General-purpose user I/O (bank 1) |
| Broche 46 | I/O — General-purpose user I/O (bank 1) |
| Broche 47 | I/O — General-purpose user I/O (bank 1) |
| Broche 48 | I/O — General-purpose user I/O (bank 1) |
| Broche 49 | I/O — General-purpose user I/O (bank 1) |
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| Broche 52 | I/O — General-purpose user I/O (bank 1) |
| Broche 53 | I/O — General-purpose user I/O (bank 1) |
| Broche 54 | I/O — General-purpose user I/O (bank 1) |
| Broche 55 | I/O — General-purpose user I/O (bank 1) |
| Broche 56 | I/O — General-purpose user I/O (bank 1) |
| Broche 57 | I/O — General-purpose user I/O (bank 1) |
| Broche 58 | I/O — General-purpose user I/O (bank 1) |
| Broche 59 | I/O — General-purpose user I/O (bank 1) |
| Broche 60 | I/O — General-purpose user I/O (bank 1) |
| Broche 61 | GND — Ground reference |
| Broche 62 | VCCIO1 — I/O supply for bank 1 (1.5/1.8/2.5/3.3 V) |
| Broche 63 | I/O — General-purpose user I/O (bank 2) |
| Broche 64 | I/O — General-purpose user I/O (bank 2) |
| Broche 65 | I/O — General-purpose user I/O (bank 2) |
| Broche 66 | I/O — General-purpose user I/O (bank 2) |
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| Broche 78 | I/O — General-purpose user I/O (bank 2) |
| Broche 79 | I/O — General-purpose user I/O (bank 2) |
| Broche 80 | I/O — General-purpose user I/O (bank 2) |
| Broche 81 | I/O — General-purpose user I/O (bank 2) |
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| Broche 85 | I/O — General-purpose user I/O (bank 2) |
| Broche 86 | I/O — General-purpose user I/O (bank 2) |
| Broche 87 | I/O — General-purpose user I/O (bank 2) |
| Broche 88 | I/O — General-purpose user I/O (bank 2) |
| Broche 89 | I/O — General-purpose user I/O (bank 2) |
| Broche 90 | I/O — General-purpose user I/O (bank 2) |
| Broche 91 | I/O — General-purpose user I/O (bank 2) |
| Broche 92 | I/O — General-purpose user I/O (bank 2) |
| Broche 93 | I/O — General-purpose user I/O (bank 2) |
| Broche 94 | I/O — General-purpose user I/O (bank 2) |
| Broche 95 | I/O — General-purpose user I/O (bank 2) |
| Broche 96 | I/O — General-purpose user I/O (bank 2) |
| Broche 97 | I/O — General-purpose user I/O (bank 2) |
| Broche 98 | I/O — General-purpose user I/O (bank 2) |
| Broche 99 | I/O — General-purpose user I/O (bank 2) |
| Broche 100 | I/O — General-purpose user I/O (bank 2) |
| Broche 101 | I/O — General-purpose user I/O (bank 2) |
| Broche 102 | I/O — General-purpose user I/O (bank 2) |
| Broche 103 | I/O — General-purpose user I/O (bank 2) |
| Broche 104 | I/O — General-purpose user I/O (bank 2) |
| Broche 105 | I/O — General-purpose user I/O (bank 2) |
| Broche 106 | I/O — General-purpose user I/O (bank 2) |
| Broche 107 | I/O — General-purpose user I/O (bank 2) |
| Broche 108 | I/O — General-purpose user I/O (bank 2) |
| Broche 109 | VCCINT2 — Core supply (1.8 V) |
| Broche 110 | GND — Ground reference |
| Broche 111 | I/O — General-purpose user I/O (bank 3) |
| Broche 112 | I/O — General-purpose user I/O (bank 3) |
| Broche 113 | I/O — General-purpose user I/O (bank 3) |
| Broche 114 | I/O — General-purpose user I/O (bank 3) |
| Broche 115 | I/O — General-purpose user I/O (bank 3) |
| Broche 116 | I/O — General-purpose user I/O (bank 3) |
| Broche 117 | I/O — General-purpose user I/O (bank 3) |
| Broche 118 | I/O — General-purpose user I/O (bank 3) |
| Broche 119 | I/O — General-purpose user I/O (bank 3) |
| Broche 120 | I/O — General-purpose user I/O (bank 3) |
| Broche 121 | I/O — General-purpose user I/O (bank 3) |
| Broche 122 | TDI — JTAG Test Data In |
| Broche 123 | TMS — JTAG Test Mode Select |
| Broche 124 | TCK — JTAG Test Clock |
| Broche 125 | TDO — JTAG Test Data Out |
| Broche 126 | nCE — Chip Enable (active low) |
| Broche 127 | nCONFIG — Configuration control (active low) |
| Broche 128 | CONF_DONE — Configuration Done status (open-drain) |
| Broche 129 | nSTATUS — Configuration status (active low) |
| Broche 130 | VCCIO3 — I/O supply for bank 3 (1.5/1.8/2.5/3.3 V) |
| Broche 131 | GND — Ground reference |
| Broche 132 | I/O — General-purpose user I/O (bank 3) |
| Broche 133 | I/O — General-purpose user I/O (bank 3) |
| Broche 134 | I/O — General-purpose user I/O (bank 3) |
| Broche 135 | I/O — General-purpose user I/O (bank 3) |
| Broche 136 | I/O — General-purpose user I/O (bank 3) |
| Broche 137 | I/O — General-purpose user I/O (bank 3) |
| Broche 138 | I/O — General-purpose user I/O (bank 3) |
| Broche 139 | I/O — General-purpose user I/O (bank 3) |
| Broche 140 | I/O — General-purpose user I/O (bank 3) |
| Broche 141 | I/O — General-purpose user I/O (bank 3) |
| Broche 142 | I/O — General-purpose user I/O (bank 3) |
| Broche 143 | I/O — General-purpose user I/O (bank 3) |
| Broche 144 | I/O — General-purpose user I/O (bank 3) |
Applications typiques
EPM570T144A5N convient pour 7 applications: Bus Interface Bridging, Power-Up Power-Rail Sequencing, Address Decoding and Chip-Select Generation, I/O Expansion for Microcontrollers, LED Display and Signage Drivers, Automotive Body and Chassis Modules, Industrial Control and Protocol Glue Logic.
Bus Interface Bridging
The EPM570T144A5N is well suited to bridge mismatched bus widths and voltages between microcontrollers, ASICs, and ASSPs. Its 144 user I/O pins can simultaneously drive a 32-bit local bus and a 16-bit peripheral bus, while multi-voltage VCCIO banks (1.5/1.8/2.5/3.3 V) eliminate external level shifters when connecting to legacy 5 V-tolerant or modern 1.8 V cores. The 5.4 ns pin-to-pin delay supports bus cycles up to ~150 MHz, matching common SDRAM and asynchronous SRAM timings. Place the CPLD between the host processor and the peripheral, route JTAG to a header for in-system programming, and use one global clock pin for synchronous bus operations.
Recommandé
Power-Up Power-Rail Sequencing
Deterministic power-rail sequencing is a classic CPLD use case, and the EPM570T144A5N fits this role with 144 I/O pins that can each control a discrete enable line, and a Flash-based instant-on configuration that begins sequencing within microseconds of VCCINT ramp. Each macro cell can implement a programmable delay timer, allowing the designer to chain enables for FPGA cores, ASICs, DDR memory, and analog subsystems. The 5.4 ns propagation delay is more than fast enough for sequencing tasks where delays are typically measured in milliseconds. Tie all unused I/O to defined logic levels to avoid floating pins during the early power-on window, and place 0.1 uF decoupling capacitors adjacent to each VCCIO pin pair.
Recommandé
Address Decoding and Chip-Select Generation
Address decoding for memory maps and chip-select generation is the original use case for the MAX II CPLD family, and the EPM570T144A5N provides 440 macro cells and 144 I/O to decode wide address buses with combinatorial logic. The device supports fast propagation paths that produce chip-select outputs in a single logic level, ensuring zero wait-state access for memory-mapped peripherals. Its non-volatile Flash configuration means the decoded map is available before any CPU boot ROM executes, simplifying system bring-up. Configure the design in Quartus Prime using schematic entry or VHDL, and verify timing with the TimeQuest timing analyzer.
Recommandé
I/O Expansion for Microcontrollers
Many low-pin-count microcontrollers need additional GPIOs for keypads, LCDs, LEDs, or sensor arrays, and the EPM570T144A5N serves as an I/O expander controlled over SPI or I2C by the host MCU. Each macro cell can be configured as an input, output, or bidirectional pin with programmable pull-up, slew rate, and drive strength. The 201.1 MHz maximum internal frequency supports high-speed SPI peripherals up to 50 MHz. Using a CPLD rather than a discrete I/O expander IC keeps the pinout flexible - designers can change the number of GPIOs and pin assignments without respinning the host PCB, by simply re-programming the Flash.
Recommandé
LED Display and Signage Drivers
The EPM570T144A5N's 144 user I/O and 440 macro cells make it suitable for driving multi-segment LED displays, dot-matrix panels, and DMX-controlled signage. Each macro cell can implement a PWM dimming channel, and the 201.1 MHz internal frequency allows smooth 16-bit PWM at refresh rates above 1 kHz with no visible flicker. Multi-voltage I/O supports both 3.3 V logic-level LEDs and 5 V high-brightness strings. Use the on-chip 8 Kbit User Flash Memory (UFM) to store display fonts, animation frames, or gamma correction tables, accessed via the same JTAG port used for configuration.
Recommandé
Automotive Body and Chassis Modules
The 'A' suffix in EPM570T144A5N denotes the automotive temperature grade (-40 °C to +125 °C), qualifying it for body controllers, gateway modules, instrument cluster logic, and chassis domain controllers. With 144 I/O pins, the device can interface directly to CAN/LIN transceivers, discrete switches, relay drivers, and H-bridge motor pre-drivers. Instant-on Flash configuration ensures the module is operational within microseconds of ignition, a hard requirement for airbag and ABS subsystems. AEC-Q100 qualification is typically inherited at the module level when this part is specified into automotive ECU designs.
Recommandé
Industrial Control and Protocol Glue Logic
In industrial PLCs, motion controllers, and process automation modules, the EPM570T144A5N provides the glue logic that ties microcontrollers, FPGAs, ADCs, and motor pre-drivers together. Industrial protocols such as Modbus RTU, RS-485 half-duplex direction control, SPI-to-parallel ADC interfacing, and quadrature encoder decoding all fit easily within 440 macro cells. The automotive temperature grade gives extra margin for cabinet-mounted equipment that may see elevated ambient temperatures near motors or heaters. JTAG-based in-system programming supports field firmware updates via the same programming port used in production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM570T144A5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM570GT144I5N | EPM570GT144C5N | EPM570GF256C5N | EPM570F256C5N | EPM570GM256C5N | EPM570T100A5N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | TQFP-144 | TQFP-144 - same | TQFP-144 - same | FBGA-256 - different package | FBGA-256 - different package | MBGA-256 - different package | TQFP-100 - smaller footprint |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macro Cells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Propagation Delay (tPD) | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns |
| Temperature Grade | Automotive (-40 to +125 C) | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Automotive (-40 to +125 C) |
| User I/O Count | 144 | 144 | 144 | 160 | 160 | 160 | 76 |
| Process Technology | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) | Internal Flash (non-volatile) |
Principaux différenciateurs
- Largest I/O count in the MAX II CPLD family (vs EPM570T100A5N)
- Automotive temperature grade qualification (vs EPM570GT144I5N)
- Non-volatile Flash configuration (vs SRAM-based FPGA)
- Lowest-power CPLD option in this density class (vs EPM570M256C5N)
Notes de conception
The EPM570T144A5N requires two separate supplies: VCCINT (1.8 V typical) for the core logic and VCCIO (1.5 V, 1.8 V, 2.5 V, or 3.3 V per bank) for the I/O banks. Per the MAX II datasheet power-supply recommendations, place one 0.1 uF decoupling capacitor adjacent to every VCCINT and VCCIO pin pair, plus a bulk 10-47 uF tantalum or ceramic capacitor near each supply rail entry point. Power-on reset (POR) requires both rails to ramp monotonically within datasheet-specified rise times; failure to do so can result in partial Flash configuration and unreliable JTAG access.
The 144-pin TQFP package has 0.5 mm pitch leads and benefits from a 4-layer PCB with a continuous ground plane on the layer directly beneath the device. Route all JTAG signals (TDI, TMS, TCK, TDO) with controlled impedance and keep their total length under 100 mm to avoid signal integrity issues during in-system programming. The exposed thermal pad on the bottom of the TQFP should be soldered to a copper pour connected to GND for best thermal performance.
Multi-voltage I/O banks on the EPM570T144A5N can be configured independently to 1.5/1.8/2.5/3.3 V, allowing direct interface to mixed-voltage buses without external level shifters. However, each bank must use a single VCCIO level - mixing voltages within one bank is not allowed. According to the MAX II datasheet, unused I/O pins should be configured as outputs driving GND or as inputs with the internal weak pull-up enabled to avoid floating-pin supply leakage.
Do not confuse the EPM570 (570 LE, MAX II family) with the older EPM5128, EPM5192, or EPM5064 parts from the classic MAX family - they use different programming files and JTAG instructions, and are not pin-compatible. Also avoid mixing up the EPM570T144A5N (TQFP-144, automotive) with the EPM570F256 (FBGA-256) or EPM570M100 (TQFP-100) variants - the package, pinout, and Quartus pin-assignment files all differ.
Place the JTAG connector or test-points within 50 mm of the EPM570T144A5N package to support USB-Blaster programming in production. Add 4.7 kohm pull-up resistors on TMS, TDI, and nCONFIG per the MAX II JTAG configuration guidelines, and place a 10 kohm pull-up on nSTATUS and CONF_DONE (both are open-drain). For multi-device JTAG chains, daisy-chain TDI to TDO with a 4.7 kohm pull-up on the final TDO.
Informations de conformité
RoHS and REACH compliance per Altera/Intel product declarations. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020. AEC-Q100 is not explicitly stated for this part - the 'A' suffix indicates automotive temperature grade only. Halogen-free status was not listed in the verified web data.