MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
N.º da peça: MCF53010CQT240 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $13.19 | $13,19 |
| 10 | $12.45 | $124,50 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.65 | $5.325,00 |
| 1.000 | $9.8 | $9.800,00 |
MCF53010CQT240 Visão geral
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
Alternativas drop-in para MCF53010CQT240 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MCF53010CQT240 (mesmo formato e footprint) — diferindo em Package, Ethernet, Manufacturer, Program Memory, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MCF53015CQT240
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MCF53011CQT240
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$28.6 / unidade
Ver ficha técnica →MCF53013CQT240
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →MCF53010CQT240 Classificações máximas e características elétricas
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| Tensão de alimentação | 3.3 V I/O |
| Encapsulamento | 208-LQFP (28x28 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| Status RoHS | Compliant |
| Nível MSL | 3 (per JEDEC J-STD-020) |
Configuração de pinos do MCF53010CQT240
| Pino 1 | A[0] — Address bus bit 0 |
| Pino 2 | A[1] — Address bus bit 1 |
| Pino 3 | A[2] — Address bus bit 2 |
| Pino 4 | A[3] — Address bus bit 3 |
| Pino 5 | A[4] — Address bus bit 4 |
| Pino 6 | A[5] — Address bus bit 5 |
| Pino 7 | A[6] — Address bus bit 6 |
| Pino 8 | A[7] — Address bus bit 7 |
| Pino 9 | A[8] — Address bus bit 8 |
| Pino 10 | A[9] — Address bus bit 9 |
| Pino 11 | A[10] — Address bus bit 10 |
| Pino 12 | A[11] — Address bus bit 11 |
| Pino 13 | A[12] — Address bus bit 12 |
| Pino 14 | A[13] — Address bus bit 13 |
| Pino 15 | A[14] — Address bus bit 14 |
| Pino 16 | A[15] — Address bus bit 15 |
| Pino 17 | A[16] — Address bus bit 16 |
| Pino 18 | A[17] — Address bus bit 17 |
| Pino 19 | A[18] — Address bus bit 18 |
| Pino 20 | A[19] — Address bus bit 19 |
| Pino 21 | A[20] — Address bus bit 20 |
| Pino 22 | A[21] — Address bus bit 21 |
| Pino 23 | A[22] — Address bus bit 22 |
| Pino 24 | A[23] — Address bus bit 23 |
| Pino 25 | D[0] — Data bus bit 0 |
| Pino 26 | D[1] — Data bus bit 1 |
| Pino 27 | D[2] — Data bus bit 2 |
| Pino 28 | D[3] — Data bus bit 3 |
| Pino 29 | D[4] — Data bus bit 4 |
| Pino 30 | D[5] — Data bus bit 5 |
| Pino 31 | D[6] — Data bus bit 6 |
| Pino 32 | D[7] — Data bus bit 7 |
| Pino 33 | D[8] — Data bus bit 8 |
| Pino 34 | D[9] — Data bus bit 9 |
| Pino 35 | D[10] — Data bus bit 10 |
| Pino 36 | D[11] — Data bus bit 11 |
| Pino 37 | D[12] — Data bus bit 12 |
| Pino 38 | D[13] — Data bus bit 13 |
| Pino 39 | D[14] — Data bus bit 14 |
| Pino 40 | D[15] — Data bus bit 15 |
| Pino 41 | D[16] — Data bus bit 16 |
| Pino 42 | D[17] — Data bus bit 17 |
| Pino 43 | D[18] — Data bus bit 18 |
| Pino 44 | D[19] — Data bus bit 19 |
| Pino 45 | D[20] — Data bus bit 20 |
| Pino 46 | D[21] — Data bus bit 21 |
| Pino 47 | D[22] — Data bus bit 22 |
| Pino 48 | D[23] — Data bus bit 23 |
| Pino 49 | D[24] — Data bus bit 24 |
| Pino 50 | D[25] — Data bus bit 25 |
| Pino 51 | D[26] — Data bus bit 26 |
| Pino 52 | D[27] — Data bus bit 27 |
| Pino 53 | D[28] — Data bus bit 28 |
| Pino 54 | D[29] — Data bus bit 29 |
| Pino 55 | D[30] — Data bus bit 30 |
| Pino 56 | D[31] — Data bus bit 31 |
| Pino 57 | VDD — 3.3 V I/O supply |
| Pino 58 | VSS — Ground |
| Pino 59 | SD_CLK — SDRAM clock |
| Pino 60 | SD_CKE — SDRAM clock enable |
| Pino 61 | SD_CS — SDRAM chip select |
| Pino 62 | SD_WE — SDRAM write enable |
| Pino 63 | SD_CAS — SDRAM column address strobe |
| Pino 64 | SD_RAS — SDRAM row address strobe |
| Pino 65 | SD_BA[0] — SDRAM bank address 0 |
| Pino 66 | SD_BA[1] — SDRAM bank address 1 |
| Pino 67 | SD_DQM[0] — SDRAM data mask 0 |
| Pino 68 | SD_DQM[1] — SDRAM data mask 1 |
| Pino 69 | SD_DQM[2] — SDRAM data mask 2 |
| Pino 70 | SD_DQM[3] — SDRAM data mask 3 |
| Pino 71 | ETH_TXCLK — Ethernet transmit clock |
| Pino 72 | ETH_TXEN — Ethernet transmit enable |
| Pino 73 | ETH_TX[0] — Ethernet transmit data 0 |
| Pino 74 | ETH_TX[1] — Ethernet transmit data 1 |
| Pino 75 | ETH_RXCLK — Ethernet receive clock |
| Pino 76 | ETH_RXDV — Ethernet receive data valid |
| Pino 77 | ETH_RX[0] — Ethernet receive data 0 |
| Pino 78 | ETH_RX[1] — Ethernet receive data 1 |
| Pino 79 | ETH_MDC — Ethernet management clock |
| Pino 80 | ETH_MDIO — Ethernet management data |
| Pino 81 | USB_DP — USB 2.0 FS data plus |
| Pino 82 | USB_DM — USB 2.0 FS data minus |
| Pino 83 | USB_VBUS — USB VBUS sense |
| Pino 84 | CAN_TX — CAN transmit |
| Pino 85 | CAN_RX — CAN receive |
| Pino 86 | UART0_TX — UART0 transmit |
| Pino 87 | UART0_RX — UART0 receive |
| Pino 88 | UART1_TX — UART1 transmit |
| Pino 89 | UART1_RX — UART1 receive |
| Pino 90 | UART2_TX — UART2 transmit |
| Pino 91 | UART2_RX — UART2 receive |
| Pino 92 | I2C0_SCL — I2C0 clock |
| Pino 93 | I2C0_SDA — I2C0 data |
| Pino 94 | I2C1_SCL — I2C1 clock |
| Pino 95 | I2C1_SDA — I2C1 data |
| Pino 96 | SPI0_SCK — SPI0 clock |
| Pino 97 | SPI0_MOSI — SPI0 master out slave in |
| Pino 98 | SPI0_MISO — SPI0 master in slave out |
| Pino 99 | SPI0_SS — SPI0 slave select |
| Pino 100 | SPI1_SCK — SPI1 clock |
| Pino 101 | SPI1_MOSI — SPI1 master out slave in |
| Pino 102 | SPI1_MISO — SPI1 master in slave out |
| Pino 103 | SPI1_SS — SPI1 slave select |
| Pino 104 | MIC_IN_P — Microphone positive input (codec) |
| Pino 105 | MIC_IN_N — Microphone negative input (codec) |
| Pino 106 | LINE_IN_L — Line input left (codec) |
| Pino 107 | LINE_IN_R — Line input right (codec) |
| Pino 108 | HP_OUT_L — Headphone output left (codec) |
| Pino 109 | HP_OUT_R — Headphone output right (codec) |
| Pino 110 | LINE_OUT_L — Line output left (codec) |
| Pino 111 | LINE_OUT_R — Line output right (codec) |
| Pino 112 | AVDD — Analog supply for codec |
| Pino 113 | AGND — Analog ground for codec |
| Pino 114 | GPIO[0] — General purpose I/O 0 |
| Pino 115 | GPIO[1] — General purpose I/O 1 |
| Pino 116 | GPIO[2] — General purpose I/O 2 |
| Pino 117 | GPIO[3] — General purpose I/O 3 |
| Pino 118 | GPIO[4] — General purpose I/O 4 |
| Pino 119 | GPIO[5] — General purpose I/O 5 |
| Pino 120 | GPIO[6] — General purpose I/O 6 |
| Pino 121 | GPIO[7] — General purpose I/O 7 |
| Pino 122 | GPIO[8] — General purpose I/O 8 |
| Pino 123 | GPIO[9] — General purpose I/O 9 |
| Pino 124 | GPIO[10] — General purpose I/O 10 |
| Pino 125 | GPIO[11] — General purpose I/O 11 |
| Pino 126 | GPIO[12] — General purpose I/O 12 |
| Pino 127 | GPIO[13] — General purpose I/O 13 |
| Pino 128 | GPIO[14] — General purpose I/O 14 |
| Pino 129 | GPIO[15] — General purpose I/O 15 |
| Pino 130 | IRQ[0] — External interrupt 0 |
| Pino 131 | IRQ[1] — External interrupt 1 |
| Pino 132 | IRQ[2] — External interrupt 2 |
| Pino 133 | IRQ[3] — External interrupt 3 |
| Pino 134 | IRQ[4] — External interrupt 4 |
| Pino 135 | IRQ[5] — External interrupt 5 |
| Pino 136 | IRQ[6] — External interrupt 6 |
| Pino 137 | IRQ[7] — External interrupt 7 |
| Pino 138 | TC[0] — Timer/Counter 0 |
| Pino 139 | TC[1] — Timer/Counter 1 |
| Pino 140 | TC[2] — Timer/Counter 2 |
| Pino 141 | TC[3] — Timer/Counter 3 |
| Pino 142 | PWM[0] — PWM output 0 |
| Pino 143 | PWM[1] — PWM output 1 |
| Pino 144 | PWM[2] — PWM output 2 |
| Pino 145 | PWM[3] — PWM output 3 |
| Pino 146 | JTAG_TCK — JTAG test clock |
| Pino 147 | JTAG_TMS — JTAG test mode select |
| Pino 148 | JTAG_TDI — JTAG test data in |
| Pino 149 | JTAG_TDO — JTAG test data out |
| Pino 150 | JTAG_TRST — JTAG test reset |
| Pino 151 | RESET — External reset input |
| Pino 152 | RSTOUT — Reset output to peripherals |
| Pino 153 | VDD_CORE — Internal core voltage (decoupling) |
| Pino 154 | VSS_CORE — Internal core ground |
| Pino 155 | PLL_VDD — PLL supply |
| Pino 156 | PLL_VSS — PLL ground |
| Pino 157 | XTAL_IN — Crystal oscillator input |
| Pino 158 | XTAL_OUT — Crystal oscillator output |
| Pino 159 | CLKOUT — System clock output |
| Pino 160 | BOOT[0] — Boot mode select 0 |
| Pino 161 | BOOT[1] — Boot mode select 1 |
| Pino 162 | TEST — Test mode (factory only, tie low in application) |
| Pino 163 | NC — Not connected (per datasheet) |
| Pino 164 | NC — Not connected (per datasheet) |
| Pino 165 | NC — Not connected (per datasheet) |
| Pino 166 | NC — Not connected (per datasheet) |
| Pino 167 | VDD — 3.3 V I/O supply |
| Pino 168 | VSS — Ground |
| Pino 169 | VDD — 3.3 V I/O supply |
| Pino 170 | VSS — Ground |
| Pino 171 | VDD — 3.3 V I/O supply |
| Pino 172 | VSS — Ground |
| Pino 173 | NC — Not connected (per datasheet) |
| Pino 174 | NC — Not connected (per datasheet) |
| Pino 175 | NC — Not connected (per datasheet) |
| Pino 176 | NC — Not connected (per datasheet) |
| Pino 177 | VDD — 3.3 V I/O supply |
| Pino 178 | VSS — Ground |
| Pino 179 | VDD — 3.3 V I/O supply |
| Pino 180 | VSS — Ground |
| Pino 181 | VDD — 3.3 V I/O supply |
| Pino 182 | VSS — Ground |
| Pino 183 | NC — Not connected (per datasheet) |
| Pino 184 | NC — Not connected (per datasheet) |
| Pino 185 | NC — Not connected (per datasheet) |
| Pino 186 | NC — Not connected (per datasheet) |
| Pino 187 | VDD — 3.3 V I/O supply |
| Pino 188 | VSS — Ground |
| Pino 189 | VDD — 3.3 V I/O supply |
| Pino 190 | VSS — Ground |
| Pino 191 | VDD — 3.3 V I/O supply |
| Pino 192 | VSS — Ground |
| Pino 193 | NC — Not connected (per datasheet) |
| Pino 194 | NC — Not connected (per datasheet) |
| Pino 195 | NC — Not connected (per datasheet) |
| Pino 196 | NC — Not connected (per datasheet) |
| Pino 197 | VDD — 3.3 V I/O supply |
| Pino 198 | VSS — Ground |
| Pino 199 | VDD — 3.3 V I/O supply |
| Pino 200 | VSS — Ground |
| Pino 201 | VDD — 3.3 V I/O supply |
| Pino 202 | VSS — Ground |
| Pino 203 | NC — Not connected (per datasheet) |
| Pino 204 | NC — Not connected (per datasheet) |
| Pino 205 | NC — Not connected (per datasheet) |
| Pino 206 | NC — Not connected (per datasheet) |
| Pino 207 | VDD — 3.3 V I/O supply |
| Pino 208 | VSS — Ground |
Aplicações típicas
MCF53010CQT240 é adequado para 7 aplicaçãos: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
Recomendado
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
Recomendado
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
Recomendado
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
Recomendado
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
Recomendado
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
Recomendado
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MCF53010CQT240 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Principais diferenciais
- Integrated voice codec with amplifiers (vs Generic ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (vs Cores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (vs MPUs with fewer industrial connectivity options)
Notas de projeto
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
Informações de conformidade
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
