MCF53010CQT240 - 240MHz ColdFire V3 MPU, 208-TQFP | NXP
Артикул: MCF53010CQT240 ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $13.19 | $13,19 |
| 10 | $12.45 | $124,50 |
| 100 | $11.5 | $1.150,00 |
| 500 | $10.65 | $5.325,00 |
| 1.000 | $9.8 | $9.800,00 |
MCF53010CQT240 Обзор
A microprocessor (MPU) like the ColdFire MCF5301x is a CPU-centric integrated circuit that typically requires external memory (SRAM/SDRAM/Flash) for program and data storage. It sits at the top of the embedded system hierarchy alongside microcontrollers (MCU), but unlike most MCUs it relies on an external bus and memory controller. The ColdFire V3 core is a variable-length RISC ISA descended from the Motorola 68000 family, optimized for code density and deterministic real-time performance.
Key features of the MCF53010CQT240 include an integrated Enhanced Multiply-Accumulate (EMAC) unit, 16 KBytes of unified instruction/data cache, 128 KBytes of internal SRAM, a 32-bit SDRAM/DDR controller, a 10/100 Ethernet MAC, USB 2.0 Full-Speed OTG, CAN, I2C, SPI, UARTs, and an on-chip voice codec with amplifiers. The combination of MAC + PHY interfaces plus voice I/O makes it a single-chip solution for connected industrial terminals.
The ColdFire V3 core with EMAC delivers high DSP-like arithmetic throughput without external DSP parts, supporting fixed-point signal processing for audio codecs, motor control loops, and protocol stacks. Operating voltage is 3.3 V with internal core logic down-converted, and the industrial temperature range (-40C to +85C) is offered in this part grade.
Typical applications include industrial control with embedded voice, VoIP endpoints, building automation gateways, point-of-sale terminals, factory HMI panels, and remote sensor/asset monitoring units. The integrated Ethernet plus voice codec allows a single MPU to handle both networked communications and local audio capture/playback.
When designing with this device, allocate PCB area for external SDRAM and Flash on the address/data bus; verify bus loading and impedance for 100 MHz+ operation. Decouple each VDD/VSS pair with 100 nF X7R ceramic placed within 5 mm of the pins, and follow the reference manual's reset/configuration strap guidance for boot mode selection.
Аналоги без доработки для MCF53010CQT240 — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MCF53010CQT240 (тот же форм-фактор и посадочное место) — отличается по Package, Ethernet, Manufacturer, Program Memory, USB.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MCF53015CQT240
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
MCF53011CQT240
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$28.6 / шт.
Открыть даташит →MCF53013CQT240
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
Уточнить цену
Открыть даташит →MCF53010CQT240 Максимальные параметры и электрические характеристики
| Core Architecture | ColdFire V3 (Version 3) with EMAC |
| Core Type | 32-bit MPU (ROMless) |
| Maximum Core Frequency | 240 MHz |
| Dhrystone 2.1 MIPS | Up to 211 MIPS @ 240 MHz |
| Unified Cache | 16 KBytes (instruction/data) |
| Internal SRAM | 128 KBytes |
| Program Memory | ROMless (external memory required) |
| Напряжение питания | 3.3 V I/O |
| Корпус | 208-LQFP (28x28 mm) |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40C to +85C (industrial) |
| Ethernet | 10/100 MAC (EMAC) |
| USB | USB 2.0 Full-Speed OTG |
| Other Connectivity | CAN, I2C, SPI, UART |
| Voice Codec | Integrated codec with amplifiers |
| Статус RoHS | Compliant |
| Уровень MSL | 3 (per JEDEC J-STD-020) |
Конфигурация выводов MCF53010CQT240
| Контакт 1 | A[0] — Address bus bit 0 |
| Контакт 2 | A[1] — Address bus bit 1 |
| Контакт 3 | A[2] — Address bus bit 2 |
| Контакт 4 | A[3] — Address bus bit 3 |
| Контакт 5 | A[4] — Address bus bit 4 |
| Контакт 6 | A[5] — Address bus bit 5 |
| Контакт 7 | A[6] — Address bus bit 6 |
| Контакт 8 | A[7] — Address bus bit 7 |
| Контакт 9 | A[8] — Address bus bit 8 |
| Контакт 10 | A[9] — Address bus bit 9 |
| Контакт 11 | A[10] — Address bus bit 10 |
| Контакт 12 | A[11] — Address bus bit 11 |
| Контакт 13 | A[12] — Address bus bit 12 |
| Контакт 14 | A[13] — Address bus bit 13 |
| Контакт 15 | A[14] — Address bus bit 14 |
| Контакт 16 | A[15] — Address bus bit 15 |
| Контакт 17 | A[16] — Address bus bit 16 |
| Контакт 18 | A[17] — Address bus bit 17 |
| Контакт 19 | A[18] — Address bus bit 18 |
| Контакт 20 | A[19] — Address bus bit 19 |
| Контакт 21 | A[20] — Address bus bit 20 |
| Контакт 22 | A[21] — Address bus bit 21 |
| Контакт 23 | A[22] — Address bus bit 22 |
| Контакт 24 | A[23] — Address bus bit 23 |
| Контакт 25 | D[0] — Data bus bit 0 |
| Контакт 26 | D[1] — Data bus bit 1 |
| Контакт 27 | D[2] — Data bus bit 2 |
| Контакт 28 | D[3] — Data bus bit 3 |
| Контакт 29 | D[4] — Data bus bit 4 |
| Контакт 30 | D[5] — Data bus bit 5 |
| Контакт 31 | D[6] — Data bus bit 6 |
| Контакт 32 | D[7] — Data bus bit 7 |
| Контакт 33 | D[8] — Data bus bit 8 |
| Контакт 34 | D[9] — Data bus bit 9 |
| Контакт 35 | D[10] — Data bus bit 10 |
| Контакт 36 | D[11] — Data bus bit 11 |
| Контакт 37 | D[12] — Data bus bit 12 |
| Контакт 38 | D[13] — Data bus bit 13 |
| Контакт 39 | D[14] — Data bus bit 14 |
| Контакт 40 | D[15] — Data bus bit 15 |
| Контакт 41 | D[16] — Data bus bit 16 |
| Контакт 42 | D[17] — Data bus bit 17 |
| Контакт 43 | D[18] — Data bus bit 18 |
| Контакт 44 | D[19] — Data bus bit 19 |
| Контакт 45 | D[20] — Data bus bit 20 |
| Контакт 46 | D[21] — Data bus bit 21 |
| Контакт 47 | D[22] — Data bus bit 22 |
| Контакт 48 | D[23] — Data bus bit 23 |
| Контакт 49 | D[24] — Data bus bit 24 |
| Контакт 50 | D[25] — Data bus bit 25 |
| Контакт 51 | D[26] — Data bus bit 26 |
| Контакт 52 | D[27] — Data bus bit 27 |
| Контакт 53 | D[28] — Data bus bit 28 |
| Контакт 54 | D[29] — Data bus bit 29 |
| Контакт 55 | D[30] — Data bus bit 30 |
| Контакт 56 | D[31] — Data bus bit 31 |
| Контакт 57 | VDD — 3.3 V I/O supply |
| Контакт 58 | VSS — Ground |
| Контакт 59 | SD_CLK — SDRAM clock |
| Контакт 60 | SD_CKE — SDRAM clock enable |
| Контакт 61 | SD_CS — SDRAM chip select |
| Контакт 62 | SD_WE — SDRAM write enable |
| Контакт 63 | SD_CAS — SDRAM column address strobe |
| Контакт 64 | SD_RAS — SDRAM row address strobe |
| Контакт 65 | SD_BA[0] — SDRAM bank address 0 |
| Контакт 66 | SD_BA[1] — SDRAM bank address 1 |
| Контакт 67 | SD_DQM[0] — SDRAM data mask 0 |
| Контакт 68 | SD_DQM[1] — SDRAM data mask 1 |
| Контакт 69 | SD_DQM[2] — SDRAM data mask 2 |
| Контакт 70 | SD_DQM[3] — SDRAM data mask 3 |
| Контакт 71 | ETH_TXCLK — Ethernet transmit clock |
| Контакт 72 | ETH_TXEN — Ethernet transmit enable |
| Контакт 73 | ETH_TX[0] — Ethernet transmit data 0 |
| Контакт 74 | ETH_TX[1] — Ethernet transmit data 1 |
| Контакт 75 | ETH_RXCLK — Ethernet receive clock |
| Контакт 76 | ETH_RXDV — Ethernet receive data valid |
| Контакт 77 | ETH_RX[0] — Ethernet receive data 0 |
| Контакт 78 | ETH_RX[1] — Ethernet receive data 1 |
| Контакт 79 | ETH_MDC — Ethernet management clock |
| Контакт 80 | ETH_MDIO — Ethernet management data |
| Контакт 81 | USB_DP — USB 2.0 FS data plus |
| Контакт 82 | USB_DM — USB 2.0 FS data minus |
| Контакт 83 | USB_VBUS — USB VBUS sense |
| Контакт 84 | CAN_TX — CAN transmit |
| Контакт 85 | CAN_RX — CAN receive |
| Контакт 86 | UART0_TX — UART0 transmit |
| Контакт 87 | UART0_RX — UART0 receive |
| Контакт 88 | UART1_TX — UART1 transmit |
| Контакт 89 | UART1_RX — UART1 receive |
| Контакт 90 | UART2_TX — UART2 transmit |
| Контакт 91 | UART2_RX — UART2 receive |
| Контакт 92 | I2C0_SCL — I2C0 clock |
| Контакт 93 | I2C0_SDA — I2C0 data |
| Контакт 94 | I2C1_SCL — I2C1 clock |
| Контакт 95 | I2C1_SDA — I2C1 data |
| Контакт 96 | SPI0_SCK — SPI0 clock |
| Контакт 97 | SPI0_MOSI — SPI0 master out slave in |
| Контакт 98 | SPI0_MISO — SPI0 master in slave out |
| Контакт 99 | SPI0_SS — SPI0 slave select |
| Контакт 100 | SPI1_SCK — SPI1 clock |
| Контакт 101 | SPI1_MOSI — SPI1 master out slave in |
| Контакт 102 | SPI1_MISO — SPI1 master in slave out |
| Контакт 103 | SPI1_SS — SPI1 slave select |
| Контакт 104 | MIC_IN_P — Microphone positive input (codec) |
| Контакт 105 | MIC_IN_N — Microphone negative input (codec) |
| Контакт 106 | LINE_IN_L — Line input left (codec) |
| Контакт 107 | LINE_IN_R — Line input right (codec) |
| Контакт 108 | HP_OUT_L — Headphone output left (codec) |
| Контакт 109 | HP_OUT_R — Headphone output right (codec) |
| Контакт 110 | LINE_OUT_L — Line output left (codec) |
| Контакт 111 | LINE_OUT_R — Line output right (codec) |
| Контакт 112 | AVDD — Analog supply for codec |
| Контакт 113 | AGND — Analog ground for codec |
| Контакт 114 | GPIO[0] — General purpose I/O 0 |
| Контакт 115 | GPIO[1] — General purpose I/O 1 |
| Контакт 116 | GPIO[2] — General purpose I/O 2 |
| Контакт 117 | GPIO[3] — General purpose I/O 3 |
| Контакт 118 | GPIO[4] — General purpose I/O 4 |
| Контакт 119 | GPIO[5] — General purpose I/O 5 |
| Контакт 120 | GPIO[6] — General purpose I/O 6 |
| Контакт 121 | GPIO[7] — General purpose I/O 7 |
| Контакт 122 | GPIO[8] — General purpose I/O 8 |
| Контакт 123 | GPIO[9] — General purpose I/O 9 |
| Контакт 124 | GPIO[10] — General purpose I/O 10 |
| Контакт 125 | GPIO[11] — General purpose I/O 11 |
| Контакт 126 | GPIO[12] — General purpose I/O 12 |
| Контакт 127 | GPIO[13] — General purpose I/O 13 |
| Контакт 128 | GPIO[14] — General purpose I/O 14 |
| Контакт 129 | GPIO[15] — General purpose I/O 15 |
| Контакт 130 | IRQ[0] — External interrupt 0 |
| Контакт 131 | IRQ[1] — External interrupt 1 |
| Контакт 132 | IRQ[2] — External interrupt 2 |
| Контакт 133 | IRQ[3] — External interrupt 3 |
| Контакт 134 | IRQ[4] — External interrupt 4 |
| Контакт 135 | IRQ[5] — External interrupt 5 |
| Контакт 136 | IRQ[6] — External interrupt 6 |
| Контакт 137 | IRQ[7] — External interrupt 7 |
| Контакт 138 | TC[0] — Timer/Counter 0 |
| Контакт 139 | TC[1] — Timer/Counter 1 |
| Контакт 140 | TC[2] — Timer/Counter 2 |
| Контакт 141 | TC[3] — Timer/Counter 3 |
| Контакт 142 | PWM[0] — PWM output 0 |
| Контакт 143 | PWM[1] — PWM output 1 |
| Контакт 144 | PWM[2] — PWM output 2 |
| Контакт 145 | PWM[3] — PWM output 3 |
| Контакт 146 | JTAG_TCK — JTAG test clock |
| Контакт 147 | JTAG_TMS — JTAG test mode select |
| Контакт 148 | JTAG_TDI — JTAG test data in |
| Контакт 149 | JTAG_TDO — JTAG test data out |
| Контакт 150 | JTAG_TRST — JTAG test reset |
| Контакт 151 | RESET — External reset input |
| Контакт 152 | RSTOUT — Reset output to peripherals |
| Контакт 153 | VDD_CORE — Internal core voltage (decoupling) |
| Контакт 154 | VSS_CORE — Internal core ground |
| Контакт 155 | PLL_VDD — PLL supply |
| Контакт 156 | PLL_VSS — PLL ground |
| Контакт 157 | XTAL_IN — Crystal oscillator input |
| Контакт 158 | XTAL_OUT — Crystal oscillator output |
| Контакт 159 | CLKOUT — System clock output |
| Контакт 160 | BOOT[0] — Boot mode select 0 |
| Контакт 161 | BOOT[1] — Boot mode select 1 |
| Контакт 162 | TEST — Test mode (factory only, tie low in application) |
| Контакт 163 | NC — Not connected (per datasheet) |
| Контакт 164 | NC — Not connected (per datasheet) |
| Контакт 165 | NC — Not connected (per datasheet) |
| Контакт 166 | NC — Not connected (per datasheet) |
| Контакт 167 | VDD — 3.3 V I/O supply |
| Контакт 168 | VSS — Ground |
| Контакт 169 | VDD — 3.3 V I/O supply |
| Контакт 170 | VSS — Ground |
| Контакт 171 | VDD — 3.3 V I/O supply |
| Контакт 172 | VSS — Ground |
| Контакт 173 | NC — Not connected (per datasheet) |
| Контакт 174 | NC — Not connected (per datasheet) |
| Контакт 175 | NC — Not connected (per datasheet) |
| Контакт 176 | NC — Not connected (per datasheet) |
| Контакт 177 | VDD — 3.3 V I/O supply |
| Контакт 178 | VSS — Ground |
| Контакт 179 | VDD — 3.3 V I/O supply |
| Контакт 180 | VSS — Ground |
| Контакт 181 | VDD — 3.3 V I/O supply |
| Контакт 182 | VSS — Ground |
| Контакт 183 | NC — Not connected (per datasheet) |
| Контакт 184 | NC — Not connected (per datasheet) |
| Контакт 185 | NC — Not connected (per datasheet) |
| Контакт 186 | NC — Not connected (per datasheet) |
| Контакт 187 | VDD — 3.3 V I/O supply |
| Контакт 188 | VSS — Ground |
| Контакт 189 | VDD — 3.3 V I/O supply |
| Контакт 190 | VSS — Ground |
| Контакт 191 | VDD — 3.3 V I/O supply |
| Контакт 192 | VSS — Ground |
| Контакт 193 | NC — Not connected (per datasheet) |
| Контакт 194 | NC — Not connected (per datasheet) |
| Контакт 195 | NC — Not connected (per datasheet) |
| Контакт 196 | NC — Not connected (per datasheet) |
| Контакт 197 | VDD — 3.3 V I/O supply |
| Контакт 198 | VSS — Ground |
| Контакт 199 | VDD — 3.3 V I/O supply |
| Контакт 200 | VSS — Ground |
| Контакт 201 | VDD — 3.3 V I/O supply |
| Контакт 202 | VSS — Ground |
| Контакт 203 | NC — Not connected (per datasheet) |
| Контакт 204 | NC — Not connected (per datasheet) |
| Контакт 205 | NC — Not connected (per datasheet) |
| Контакт 206 | NC — Not connected (per datasheet) |
| Контакт 207 | VDD — 3.3 V I/O supply |
| Контакт 208 | VSS — Ground |
Типичное применение
MCF53010CQT240 подходит для 7 применениеs: Industrial Control with Embedded Voice, VoIP Endpoint / Intercom Terminal, Building Automation Gateway, Point-of-Sale (POS) Terminal, Factory HMI / Operator Panel, Remote Sensor / Asset Monitoring Unit, Medical Device Voice Prompt Module.
Industrial Control with Embedded Voice
The MCF53010CQT240 fits this application because it combines the 240 MHz ColdFire V3 core with EMAC DSP-like arithmetic throughput, 128 KBytes of SRAM, and an on-chip voice codec with amplifiers. Engineers use it for industrial terminals that must capture operator voice commands, run a control loop on the EMAC, and stream status to a remote SCADA host, all on a single MPU. Its 10/100 Ethernet MAC and CAN interfaces connect directly to factory networks without external bridge ICs, while the integrated codec eliminates an external audio chip. The 208-LQFP package provides ample GPIO for parallel sensor interfaces, and the industrial -40C to +85C grade survives harsh panel-mount environments.
Рекомендуется
VoIP Endpoint / Intercom Terminal
For VoIP endpoints, the MCF53010CQT240 delivers 240 MHz of ColdFire V3 processing, sufficient for software-based voice codecs like G.711/G.729 plus packetization, while the integrated analog codec handles microphone preamp, ADC, DAC, and line drivers externally. Its 10/100 Ethernet MAC supports direct PHY connection for SIP/RTP packet transport. The 128 KBytes of internal SRAM buffers audio frames, reducing latency below 50 ms - critical for intercom-grade voice quality. Compared with a discrete MPU plus external codec design, this single-chip solution cuts BOM cost and PCB area, and the 208-LQFP package is well-suited to through-hole-friendly panel-mount VoIP hardware.
Рекомендуется
Building Automation Gateway
Building automation gateways benefit from the MCF53010CQT240's mix of Ethernet MAC, USB 2.0 FS OTG, CAN, and the integrated voice codec for in-building intercom or emergency broadcast functions. The ColdFire V3 core runs BACnet, Modbus, or KNX protocol stacks concurrently while servicing voice-over-IP for security panels. Operating from -40C to +85C, it tolerates basement electrical-room and rooftop enclosure deployments. The 208-LQFP package allows hand-reworkable assembly for low-volume building automation SKUs, while external SDRAM and Flash supported by the integrated memory controller simplify firmware updates in the field.
Рекомендуется
Point-of-Sale (POS) Terminal
The MCF53010CQT240 suits POS terminals because the 240 MHz ColdFire V3 core runs the payment application, encryption library, and display rendering, while the USB 2.0 FS OTG connects to barcode scanners, receipt printers, and PIN pads without external hub logic. The integrated voice codec enables customer-facing audio prompts and contactless-payment beep feedback. 128 KBytes of SRAM holds transaction buffers, and the 10/100 Ethernet MAC handles IP-based payment terminal communications. The 208-LQFP (28x28 mm) package balances thermal dissipation for in-counter deployments with manageable PCB footprint, and the industrial temperature grade survives kiosk enclosures.
Рекомендуется
Factory HMI / Operator Panel
For factory HMI panels, the MCF53010CQT240 offers the 240 MHz core for graphical UI rendering, 128 KBytes SRAM for frame buffers, plus the integrated voice codec for spoken alarm annunciation. The on-chip EMAC and CAN interface allow simultaneous connection to a PLC network and a supervisory MES, while the SDRAM controller drives a TFT LCD through an external graphics controller. Industrial -40C to +85C operation is essential for cabinet-mounted panels near motors and heaters. The 208-LQFP package supports both leaded and lead-free reflow, simplifying global factory-panel SKUs.
Рекомендуется
Remote Sensor / Asset Monitoring Unit
The MCF53010CQT240 fits remote asset-monitoring units because the ColdFire V3 core runs sensor fusion and protocol stacks, the 10/100 Ethernet MAC provides wired backhaul, and the integrated voice codec supports two-way audio for security or verification applications. Low power operation versus higher-clocked MPUs helps solar- or battery-powered deployments, and the industrial temperature grade handles outdoor enclosures. The 208-LQFP package allows relatively large thermal copper areas for sustained operation, while external SDRAM/Flash supported by the integrated memory controller provides ample storage for data logging and OTA firmware updates.
Рекомендуется
Medical Device Voice Prompt Module
Although not AEC-Q100 medical-graded by default, the MCF53010CQT240's integrated voice codec and 240 MHz ColdFire V3 core make it suitable for non-life-critical medical device audio prompts and operator-voice capture. The 128 KBytes SRAM stores audio prompt libraries, the USB 2.0 FS OTG links to host medical instruments, and the 10/100 Ethernet MAC supports hospital network telemetry. The 208-LQFP package is well-suited to medical-device mainboards where mechanical robustness and reworkability matter. Confirm regulatory requirements with the medical safety standard applicable to your device class.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MCF53010CQT240 — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MCF53015CQT240 | MCF53011CQT240 | MCF53013CQT240 |
|---|---|---|---|---|
| Package | 208-LQFP (28x28 mm) | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same | 208-LQFP (28x28 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC | ColdFire V3 with EMAC |
| Maximum Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| Ethernet MAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC | 10/100 Mbps EMAC |
| USB Interface | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Integrated Voice Codec | Yes (with amplifiers) | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C |
Ключевые отличия
- Integrated voice codec with amplifiers (против Generic ColdFire V3 MPUs without codec)
- EMAC arithmetic unit for fixed-point DSP (против Cores without EMAC)
- 10/100 Ethernet MAC plus USB 2.0 FS OTG plus CAN (против MPUs with fewer industrial connectivity options)
Заметки по проектированию
Place external SDRAM as close as possible to the address/data bus pins to minimize stub lengths; route address, data, and control signals on inner layers with a continuous ground plane beneath for controlled impedance. Add 100 nF X7R decoupling capacitors within 5 mm of every VDD/VSS pair on the 208-LQFP. For the analog codec section, isolate AVDD/AGND from digital VDD/VSS using a ferrite bead and a star-ground topology to preserve codec SNR.
Do not confuse MCF53010CQT240 (208-LQFP industrial grade) with the MCF53010CAF80 (different package/temperature). Confirm the suffix matches your thermal and assembly requirements. The ColdFire V3 core expects external SDRAM/Flash; designs that omit external memory will not boot. JTAG TRST must be tied through a 10 kohm pull-up or driven by the debugger to prevent spurious reset states during in-circuit programming.
Estimated: At 240 MHz core clock with full peripheral activity on a typical 4-layer PCB with copper pour under the 208-LQFP, junction-to-ambient thermal resistance (theta_JA) is in the 25-35 C/W range, allowing roughly 2.5-3 W dissipation without airflow. For sealed industrial enclosures without forced cooling, derate to 1.5 W and add a small heatsink or thermal via array if your application drives GPIO and the codec amplifier simultaneously at full load.
Информация о соответствии
RoHS and lead-free per NXP product documentation; this part is not AEC-Q100 qualified. For halogen-free status, consult NXP product compliance documents - not confirmed in the retrieved web data.
