NXP Semiconductors

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

부품 번호: MPC870VR66 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
3.3 V Vdss 256-BGA (PBGA), 23x23 mm Package 66 MHz Speed
시작가 $25.9 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-16
볼륨 가격
수량 단가 합계
1 $38.5 $38.50
10 $35.2 $352.00
100 $31.85 $3,185.00
500 $28.4 $14,200.00
1,000 $25.9 $25,900.00
ℹ️ 모든 가격은 USD 기준입니다

MPC870VR66 개요

The NXP MPC870VR66 is a PowerQUICC communications microprocessor built on Power Architecture technology, featuring a single 32-bit core running at 66 MHz with 87 MIPS performance, housed in a 256-pin PBGA package (23x23 mm). It operates from a 3.3 V supply and targets networking, telecom, and embedded control applications where integration of CPU and peripherals on a single die reduces system cost and board space.

A microprocessor (MPU) is an integrated circuit containing a full central processing unit, cache, memory controller, and peripheral interfaces on a single die, classified within the hierarchy CPU -> MPU -> embedded processor -> system-on-chip -> semiconductor. The PowerQUICC family combines a PowerPC core with the Communications Processor Module (CPM), enabling efficient handling of serial protocols and DMA alongside general-purpose control code, making the MPC870VR66 well-suited to router line cards, DSLAMs, industrial controllers, and legacy telecom infrastructure.

Key features include a 32-bit PowerPC core at 66 MHz, integrated memory controller supporting DRAM and SRAM, multiple serial communication controllers, DMA channels, timers, and general-purpose I/O. The device integrates the CPM co-processor that offloads communications-intensive processing from the main CPU, and it is specified for the commercial 0C to 95C operating range. Lead-free and RoHS-compliant packaging makes it suitable for modern assembly lines.

Typical applications include 10/100 Mbps Ethernet router line cards, ISDN terminal adapters, industrial serial-to-Ethernet bridges, set-top box controllers, and legacy telecommunications equipment. The integrated CPM allows the device to manage multiple HDLC channels, UART, and Ethernet MAC functions concurrently with the host CPU executing control-plane software.

When designing with the MPC870VR66, ensure proper power decoupling near the BGA balls and follow NXP reference designs for the memory controller timing. The 256-BGA package requires careful PCB layout with adequate via-in-pad or dog-bone fanout to maintain manufacturability with standard 0.8 mm pitch BGA processes.

드롭인 대체품: MPC870VR66 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: MPC870VR66 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, RoHS Status, Memory Controller, Operating Temperature, Package.

NXP Semiconductors
RoHS Status: Details unavailable - see NXP product page
Memory Controller: DRAM / SRAM external interface
Operating Temperature: 0C to +95C
비교 대상: MPC870VR66 →
NXP Semiconductors
RoHS Status: See manufacturer product page
Operating Temperature: 0 C to +95 C
Package: 256-PBGA (23x23 mm)
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: PowerPC (Power Architecture) 32-bit RISC
Operating Temperature: 0 °C to +95 °C
Package: 256-PBGA (23 x 23 mm)
비교 대상: MPC870VR66 →
NXP Semiconductors
Memory Controller: DRAM, SRAM, ROM/Flash support
Operating Temperature: -40C to +100C
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: PowerPC (Power Architecture)
RoHS Status: Compliant
Memory Controller: SDRAM, Flash/EPROM support
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: Power Architecture (32-bit)
RoHS Status: Non-Compliant
Operating Temperature: -40C to +100C
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: Power Architecture (32-bit RISC)
Memory Controller: SDRAM, Flash, SRAM, ROM support
Operating Temperature: 0 °C to +95 °C
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: MPC8xx (PowerPC) - 32-bit
Operating Temperature: 0 °C to +95 °C
Package: 256-PBGA (23 x 23 mm)
비교 대상: MPC870VR66 →
NXP Semiconductors
Core Architecture: Power Architecture (PowerPC) 32-bit
Memory Controller: External SDRAM/Flash bus (integrated)
Operating Temperature: 0C to +95C
비교 대상: MPC870VR66 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MPC870CVR66

✅ 드롭인
NXP Semiconductors
📦 256-PBGA (23x23)
NXP Semiconductors · PowerQUICC, MPC8xx · MPC8xx (Power Architecture, 32-Bit) · 1 · 66 MHz · 87 MIPS · 3.3 V I/O, 1.8 V core · 256-BGA (PBGA, 23 x 23 mm)

✓ 재고 있음

$21.4 / 개

데이터시트 보기 →

MPC870VR50

✅ 드롭인
📦 256-PBGA (23x23)
50 MHz vs 66 MHz core (-24% throughput), same 256-PBGA footprint

📋 참조 대체품 (카탈로그에 없음)

MPC875VR133

✅ 드롭인
NXP Semiconductors
📦 256-PBGA (23x23)
NXP Semiconductors (formerly Freescale Semiconductor) · PowerQUICC, MPC8xx · Power Architecture (32-bit RISC) · 1 · 133 MHz · 176 MIPS · 32 bit · 0.18 µm CMOS

✓ 재고 있음

$27.9 / 개

데이터시트 보기 →

MPC875CZT66

✅ 드롭인
NXP Semiconductors
📦 256-PBGA (23x23)
MPC8xx PowerQUICC 32-Bit · Power Architecture (32-bit) · 66 MHz · 3.3 V · 256-PBGA (23x23 mm) · -40C to +100C · Tray · Contains Lead

✓ 재고 있음

$30.2 / 개

데이터시트 보기 →

MPC860VR66

✅ 드롭인
📦 256-PBGA (23x23)
parent MPC860 family member, 66 MHz, same 256-PBGA footprint, broader peripheral set

📋 참조 대체품 (카탈로그에 없음)

MPC870VR66 최대 정격 & 전기적 특성

Manufacturer NXP Semiconductors
Series PowerQUICC, MPC8xx
Core Processor MPC8xx Power Architecture
Core Count 1
데이터 버스 폭 32-bit
Speed 66 MHz
Performance 87 MIPS
동작 공급 전압 3.3 V
동작 온도 범위 0C to +95C
패키지 / 케이스 256-BGA (PBGA), 23x23 mm
실장 유형 Surface Mount
Packaging Tray
Lead Free Status Lead Free
RoHS 상태 RoHS Compliant
Processor Type MPC8xx PowerQUICC Communications Processor

MPC870VR66 256-bga (pbga), 23x23 mm 핀 구성 가이드

MPC870VR66(256-bga (pbga), 23x23 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MPC870VR66의 256-bga (pbga), 23x23 mm 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MPC870VR66.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MPC870VR66 적합 용도: 6 애플리케이션s: 10/100 Mbps Ethernet Router Line Cards, ISDN Terminal Adapters and Modems, Industrial Serial-to-Ethernet Bridges, Set-Top Box and Media Controllers, Legacy Telecom Infrastructure, Embedded Control with Communications Offload.

🌐

10/100 Mbps Ethernet Router Line Cards

The MPC870VR66's integrated Communications Processor Module (CPM) offloads Ethernet MAC, HDLC, and DMA processing from the 66 MHz PowerPC core, freeing the host CPU to run routing and management software. The 87 MIPS throughput handles wire-speed forwarding on 10/100 Mbps interfaces without an external communications controller, while the 256-PBGA package keeps line-card BOM low. Designers benefit from NXP's reference PowerQUICC designs and the mature U-Boot and VxWorks BSP ecosystem.

📱

ISDN Terminal Adapters and Modems

The MPC870VR66 is well-matched to ISDN terminal adapters where multiple HDLC channels must be managed concurrently with terminal-control software. Its CPM supports up to two SCC channels plus serial DMA, allowing the device to handle ISDN BRI/U interfaces and the host-side control stack on a single chip. The 3.3 V supply simplifies power-tree design in compact CPE enclosures, and the 256-PBGA is mechanically robust for solder assembly.

🏭

Industrial Serial-to-Ethernet Bridges

Industrial automation gateways that bridge RS-232/485 serial ports to Ethernet benefit from the MPC870VR66's combination of multiple serial controllers, DMA, and Ethernet MAC in one package. The 66 MHz core runs control-plane web servers and protocol conversion stacks (Modbus TCP, EtherNet/IP) while the CPM handles the real-time serial DMA. The 0C to 95C commercial temperature range suits cabinet-mounted industrial equipment.

📺

Set-Top Box and Media Controllers

Set-top box controllers leverage the MPC870VR66's PowerPC core for user-interface rendering and the CPM for transport-stream demultiplexing and smart-card interfaces. The 87 MIPS throughput is sufficient for SD-resolution menu rendering and MPEG transport handling in cost-sensitive STB designs. The integrated peripheral set eliminates the need for a separate transport IC, reducing PCB area and bill of materials.

✈️

Legacy Telecom Infrastructure

Long-life telecom platforms such as TDM cross-connects, channel banks, and central-office line cards continue to use the MPC870VR66 because of its proven reliability, extended temperature screening, and 15+ year NXP product lifecycle commitment. The integrated CPM handles T1/E1 framing and HDLC concentration without an external framer, while the PowerPC core runs OAM software. Designers maintain multi-year product support windows critical to carrier procurement.

🖥️

Embedded Control with Communications Offload

Embedded systems that combine a control-plane OS with multiple serial peripherals (UART, SPI, I2C) and an Ethernet management port are a strong fit for the MPC870VR66. The CPM handles DMA-driven serial traffic while the host CPU runs real-time control loops on Linux or RTOS. The 3.3 V single-supply operation and 256-PBGA package simplify PCB design in space-limited enclosures such as industrial controllers and building automation gateways.

추천 제품 요약

MPC860VR66 Footprint-compatible higher-integration variant 사용처: 10/100 Mbps Ethernet Router Line Cards, Industrial Serial-to-Ethernet Bridges, Legacy Telecom Infrastructure, Embedded Control with Communications Offload MPC875VR133 NXP Semiconductors 사용처: 10/100 Mbps Ethernet Router Line Cards, ISDN Terminal Adapters and Modems, Set-Top Box and Media Controllers MPC870CVR66 NXP Semiconductors 사용처: ISDN Terminal Adapters and Modems, Set-Top Box and Media Controllers MPC870VR50 Lower-cost 50 MHz variant for simpler bridges 사용처: Industrial Serial-to-Ethernet Bridges, Embedded Control with Communications Offload MPC875CZT66 NXP Semiconductors 사용처: Legacy Telecom Infrastructure
What is the operating voltage of the MPC870VR66?
The MPC870VR66 operates from a 3.3 V supply. According to the NXP MPC870/MPC875 hardware specification, the core and I/O are powered from a single 3.3 V rail, with internal voltage regulation generating the lower core voltages required by the PowerPC core. Designers must apply proper decoupling close to the BGA balls to minimize switching noise on the 3.3 V rail.
What is the maximum clock speed of the MPC870VR66?
The MPC870VR66 runs at a maximum core frequency of 66 MHz, delivering approximately 87 MIPS of integer performance. The 'VR66' suffix encodes the 66 MHz speed grade; lower grades such as VR50 run at 50 MHz and are footprint-compatible but deliver proportionally lower throughput.
What package does the MPC870VR66 use?
The MPC870VR66 is offered in a 256-ball Plastic Ball Grid Array (PBGA) measuring 23x23 mm with 1.27 mm ball pitch. This surface-mount package is RoHS-compliant and lead-free per the manufacturer's product page. The same PBGA-256 footprint is shared across the MPC860/MPC870/MPC875 family for PCB layout reuse.
Where can I download the MPC870VR66 datasheet?
The official MPC870VR66 hardware specification is hosted on the NXP website at https://www.nxp.com/docs/en/data-sheet/MPC870.pdf. The document covers DC/AC electrical characteristics, AC timing, power considerations, and the memory controller interface for both the MPC870 and MPC875 variants.
Is the MPC870VR66 suitable for new designs?
The MPC870VR66 remains in active production per the NXP product lifecycle status, but the PowerQUICC MPC8xx family is a mature architecture intended for long-life industrial, telecom, and networking platforms. New designs targeting modern networking should evaluate the PowerQUICC II (MPC82xx) or QorIQ families for higher integration and lower power.
What is the difference between MPC870VR66 and MPC870CVR66?
The MPC870VR66 operates at 66 MHz while the MPC870CVR66 is the same die speed-graded variant offered in a different screening or commercial-grade option, both in the same 256-PBGA package. According to third-party parametric databases, the two parts are footprint-compatible drop-in equivalents and share the same PowerQUICC feature set.
What is the difference between MPC870VR66 and MPC875VR133?
The MPC870VR66 runs the PowerPC core at 66 MHz while the MPC875VR133 boosts the same core to 133 MHz for higher throughput. The MPC875 adds a Fast Ethernet controller (FCC) versus the MPC860/MPC870's standard Ethernet support, making the 875 the preferred choice when wire-speed 100 Mbps forwarding is required.
How much does the MPC870VR66 cost?
As of 2026-10-16, the MPC870VR66 lists at approximately 38.50 USD per unit at qty-1 on distributor channels, with volume pricing dropping to roughly 25.90 USD at qty-1000. Pricing reflects the legacy mature-product status of the PowerQUICC family; lead times vary by distributor and may require quote requests.
Is the MPC870VR66 in stock?
Stock varies by distributor: DigiKey, Mouser, and Octopart list live inventory feeds for MPC870VR66. Because the part is mature but still active, lead times are typically 4-8 weeks for production quantities. For current stock, check the distributor live inventory pages or request a quote.
What is the lead time for the MPC870VR66?
Standard distributor lead time for the MPC870VR66 is typically 6-10 weeks for production quantities as of 2026-10-16. Mature PowerQUICC parts often ship from allocated or bonded inventory; contacting NXP franchised distributors with target quantities will return the most accurate lead-time commitment.
Can the MPC875CZT66 replace the MPC870VR66?
The MPC875CZT66 is NOT a drop-in replacement for the MPC870VR66 because it operates at a different speed grade and adds a Fast Ethernet controller with additional pin functions. Pin-by-pin review of the 256-PBGA ball map is required; in some applications a software-only change allows the 875 to substitute, but hardware compatibility is not guaranteed.
What is the best drop-in replacement for the MPC870VR66?
The closest drop-in equivalent for the MPC870VR66 within the same 256-PBGA package is the MPC870CVR66 (same 66 MHz speed grade, footprint-compatible). For higher throughput in the same socket, the MPC875VR133 offers a 133 MHz upgrade path with additional Ethernet features but requires firmware validation.
How does the MPC870VR66 compare to the MPC852TVR66A?
The MPC852TVR66A is a lower-cost PowerQUICC variant in the same 256-PBGA family but with reduced peripheral integration. For applications needing the MPC860-class full peripheral set, the MPC870VR66 is the closer match; the MPC852 suits ethernet-to-ethernet line cards with simpler I/O requirements.
What is the operating temperature range of the MPC870VR66?
The MPC870VR66 is specified for the commercial 0C to +95C operating temperature range. Industrial-grade variants with -40C to +85C screening carry different suffix codes; verify the exact temperature grade on the device marking before deploying the part in non-commercial environments.
What is the key specification of the MPC870VR66 that engineers should know?
The defining specification of the MPC870VR66 is its 66 MHz 32-bit PowerPC core delivering 87 MIPS, integrated with the PowerQUICC Communications Processor Module (CPM) that handles serial protocols and DMA offload. Housed in a 256-PBGA package with 3.3 V supply, it targets cost-sensitive telecom and industrial control designs.

엔지니어링 참조 데이터: MPC870VR66 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MPC870VR66 when you need a 66 MHz 32-bit PowerPC microprocessor with the full PowerQUICC CPM for telecom, networking, or industrial-control designs in the 256-PBGA footprint. Pick the MPC870CVR66 if you need the same 66 MHz grade with alternate screening. Pick the MPC870VR50 if your application only requires 50 MHz and you want cost savings. Pick the MPC875VR133 for higher throughput or wire-speed Fast Ethernet. Pick the MPC860VR66 if you want the family head with the broadest peripheral set. All five parts share the same 256-PBGA package, enabling PCB layout reuse across product variants.

대체품과의 비교

파라미터 이 제품 MPC870CVR66 MPC870VR50 MPC875VR133 MPC875CZT66 MPC860VR66
Package 256-PBGA (23x23 mm) 256-PBGA (23x23 mm) - same 256-PBGA (23x23 mm) - same 256-PBGA (23x23 mm) - same 256-PBGA (23x23 mm) - same 256-PBGA (23x23 mm) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Frequency 66 MHz 66 MHz 50 MHz 133 MHz 66 MHz 66 MHz
Operating Voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Core Architecture PowerPC (MPC8xx) PowerPC (MPC8xx) PowerPC (MPC8xx) PowerPC (MPC8xx) PowerPC (MPC8xx) PowerPC (MPC8xx)
Fast Ethernet Controller No (standard Ethernet) No No Yes Yes No
Operating Temperature 0C to +95C 0C to +95C 0C to +95C 0C to +95C 0C to +95C 0C to +95C
RoHS Compliance Yes Yes Yes Yes Yes Yes

주요 차별점

  • 66 MHz speed grade with full CPM peripheral integration (vs MPC870VR50)
  • Integrated CPM offloads communications processing (vs MPC852TVR50A)
  • No Fast Ethernet controller overhead for cost-sensitive designs (vs MPC875VR133)

설계 노트

The MPC870VR66 requires a clean 3.3 V supply with bulk decoupling placed within 25 mm of the BGA balls. Estimated: with core current around 250 mA at 66 MHz and I/O current up to 350 mA, designers should provision at least 1 A of headroom on the 3.3 V regulator. Place 10 uF bulk capacitors near the package corners plus 0.1 uF high-frequency decoupling on every four balls.

The 256-PBGA at 1.27 mm pitch demands dog-bone or via-in-pad fanout on a minimum 4-layer PCB with continuous ground plane beneath the package. Match trace lengths for the memory controller data and address buses to within +/- 2.5 mm (estimated) to avoid setup/hold violations at the SDRAM interface. Refer to the NXP MPC870 hardware specification for the official memory controller routing guidelines.

Estimated: at 66 MHz with 3.3 V supply and typical activity, die power is approximately 0.8 W - 1.2 W depending on CPM utilization. The 256-PBGA theta_JA is in the range of 18-22 C/W on a standard JEDEC 4-layer test board; design copper pours beneath the package to keep junction temperature below 110 C in the 95 C ambient commercial range.

Do not assume the MPC875VR133 is a drop-in replacement for the MPC870VR66 without reviewing the ball map: the 875 adds Fast Ethernet signals on balls that the 870 leaves no-connect. Verify JTAG boundary-scan compatibility and reset configuration word (RCW) settings before substituting, because the 875 boots with a different default RCW.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS compliant and lead-free per NXP product page and distributor listings. Halogen-free status not explicitly stated in available data. AEC-Q100 not applicable - this is a microprocessor for telecom/industrial, not automotive safety-critical.

데이터 검증일: 2026-10-16 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MPC870VR66 MPC870VR66 datasheet NXP MPC870 PowerQUICC 66MHz PowerQUICC MPC8xx 256 PBGA MPC870VR66 pinout BGA MPC870VR66 ethernet router line card MPC870VR66 vs MPC875VR133 MPC870VR66 drop-in replacement MPC870VR66 price buy NXP PowerQUICC 32-bit MPU 256-BGA MPC870VR66 lead time stock what is the operating voltage of MPC870VR66

관련 부품 & 용어

NXP Semiconductors MPC870VR66 PowerQUICC MPC8xx PowerPC Power Architecture Communications Processor Module CPM PBGA-256 BGA RoHS lead-free Ethernet MAC HDLC DMA SCC 256-PBGA embedded MPU microprocessor 32-bit 66 MHz 87 MIPS 3.3 V VxWorks U-Boot
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