MPXS2010VLQ80 - 32-Bit 80MHz 1MB MCU | NXP | Automotive
Référence : MPXS2010VLQ80 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $15.6524 | $15,65 |
| 10 | $15.6524 | $156,52 |
| 100 | $15.6524 | $1 565,24 |
| 500 | $15.6524 | $7 826,20 |
| 1 000 | $15.6524 | $15 652,40 |
MPXS2010VLQ80 Présentation
What is a 32-bit microcontroller? A microcontroller is a semiconductor device integrating a processor core, program memory, data memory, peripherals, and interface logic on one integrated circuit. The e200z4d core belongs to the Power Architecture family and provides the computational base for real-time embedded control. In the broader hierarchy, MPXS2010VLQ80 is a microcontroller, embedded processor, semiconductor, and programmable control component. Its 1 MB flash capacity provides room for application code and configuration data, while the 80 MHz clock supports time-dependent control and communication tasks.
The supplied data specifically identifies a 32-bit e200z4d core, 80 MHz operation, 1 MB flash organized as 1M x 8, 144 LQFP construction, and automotive temperature grade. The package is described as gull-wing, square, and 20 x 20 mm. These features make the MPN appropriate for larger control modules that need numerous external connections and a conventional fine-pitch surface-mount package. The available verified data does not state RAM size, peripheral inventory, supply-voltage limits, flash endurance, or detailed pin assignments; those values must be confirmed from the official manufacturer documentation before a new design is released.
Typical automotive uses include motor and solenoid control, central body modules, sensor aggregation, actuator interfaces, power-window or seat systems, lighting control, and gateway or communications modules. The 144-pin LQFP gives the design access to many external signals compared with a small leadless package, making it convenient for systems requiring several sensors, drivers, communication lines, and discrete control outputs. The 3.3 V / 5 V designation also makes it relevant to mixed-voltage automotive electronics, but the exact rail tolerances and I/O levels require confirmation.
For PCB implementation, use the exact NXP datasheet package drawing and pinout rather than relying on generic LQFP assumptions. Confirm exposed-pad or thermal requirements, recommended decoupling, oscillator connections, reset behavior, programming interface, and unused-pin treatment. The 1 MB flash and 80 MHz rating should not be treated as a complete performance guarantee because peripheral clocks and memory-wait behavior require the missing technical data.
This product page combines verified distributor specifications, package information, lifecycle-relevant sourcing context, and engineering selection guidance. It intentionally identifies unavailable parameters instead of estimating them, helping engineers distinguish confirmed facts from information that still needs manufacturer-datasheet confirmation.
Alternatives de remplacement direct pour MPXS2010VLQ80 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
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MPXS2010VLQ80 Valeurs maximales et caractéristiques électriques
| Device Type | 32-bit microcontroller |
| Processor Core | e200z4d Power Architecture core |
| Fréquence d'horloge maximale | 80 MHz |
| Flash Memory | 1 MB (1M x 8) |
| Operating Voltage Class | 3.3 V / 5 V |
| Temperature Grade | Automotive |
| Boîtier | 144-LQFP |
| Package Code | LFQFP |
| Package Shape | Square |
| Package Size | 20 x 20 mm |
| Terminal Count | 144 terminals |
| Terminal Form | Gull wing |
| Type de montage | Surface mount |
| Core Architecture | 32-bit |
| Program Memory Type | Flash |
Guide de configuration des broches du MPXS2010VLQ80 20 x 20 mm
Configuration des broches du MPXS2010VLQ80 (boîtier 20 x 20 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MPXS2010VLQ80.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MPXS2010VLQ80 convient pour 6 applications: Automotive Body Control Module, Motor and Solenoid Control, Automotive Sensor Aggregation, Vehicle Lighting Control, Powertrain Interface Controller, Industrial and Transportation Embedded Control.
Automotive Body Control Module
MPXS2010VLQ80 fits an automotive body-control concept requiring a 32-bit e200z4d core, 80 MHz processing, and 1 MB flash for centralized logic. The 144-LQFP package provides a large number of external connections for switch inputs, lamp outputs, door and seat functions, and diagnostic communication. The verified data identifies automotive temperature grade, but exact I/O ratings, timers, CAN or LIN capability, and AEC-Q100 status are not supplied. Those details must be confirmed from the official datasheet before architecture sign-off. Use the part only when its pin map and peripheral resources match the intended body module.
Recommandé
Motor and Solenoid Control
The MPXS2010VLQ80 is a plausible candidate for motor, solenoid, and actuator-control modules because it combines an 80 MHz 32-bit processor with 1 MB of flash for control algorithms and diagnostics. A 144-LQFP package can support multiple sensor inputs, gate-driver interfaces, position feedback, and protection signals. The verified data does not specify PWM resolution, timer counts, ADC accuracy, control-loop peripherals, or output-driver ratings, so these must be checked in the manufacturer datasheet. The key engineering trade-off is package flexibility versus a larger footprint and higher pin-routing complexity than a leadless MCU.
Recommandé
Automotive Sensor Aggregation
MPXS2010VLQ80 can serve as the processing center for an automotive sensor-aggregation module when several inputs must be filtered, monitored, and transmitted to another controller. Its 32-bit e200z4d architecture provides a higher-performance platform than simple 8-bit-class devices, while 1 MB flash provides local program storage for diagnostics and configuration. The package's 144 pins offer more I/O opportunities than compact packages. However, the supplied sources do not confirm ADC, CAN, LIN, SPI, or other interface specifications. Validate channel counts, electrical limits, conversion performance, and network compatibility before selecting it.
Recommandé
Vehicle Lighting Control
MPXS2010VLQ80 is relevant to vehicle lighting control because the confirmed 32-bit processing and 1 MB flash can support sequencing, diagnostics, debounce logic, and centralized switch management. A 144-LQFP package provides ample external routing for lamp stages, enable signals, fault inputs, and communication lines. The available data does not specify output-driver topology, LED current regulation, diagnostic behavior, or protection requirements, so the MCU should be used as a logic controller rather than assumed to drive loads directly. Validate the exact electrical interface and thermal conditions in the datasheet and application hardware.
Recommandé
Powertrain Interface Controller
MPXS2010VLQ80 may be evaluated as a powertrain interface controller where a 32-bit e200z4d core and 1 MB flash are needed for sensor coordination, diagnostics, and control logic. The 80 MHz clock rating provides a useful baseline for time-based tasks, but real-time performance depends on the peripheral clock tree, memory timing, interrupts, and software architecture. The 144-LQFP package also offers a high pin count for external interfaces and protection signals. The supplied sources do not establish functional-safety status, analog accuracy, communication interfaces, or qualification grade, so engineers must obtain the official automotive documentation before use in a safety-related or high-energy system.
Recommandé
Industrial and Transportation Embedded Control
MPXS2010VLQ80 can also be evaluated for transportation and industrial embedded-control platforms that benefit from a 32-bit processor, 1 MB flash, and a 144-pin package. Its relatively high pin count supports distributed sensors, relays, communications, and power-stage control interfaces. The device's automotive temperature-grade designation makes it potentially relevant for harsh environments, but it is not enough to prove industrial ruggedness or functional safety. Confirm operating-temperature limits, EMC performance, supply tolerance, watchdog behavior, and long-term availability. A hardware migration should also compare software startup, interrupt mapping, and development-tool support.
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Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MPXS2010VLQ80 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | [DATA_NEEDED: verified drop-in alternative 1] | [DATA_NEEDED: verified drop-in alternative 2] | [DATA_NEEDED: verified drop-in alternative 3] | [DATA_NEEDED: verified drop-in alternative 4] | [DATA_NEEDED: verified drop-in alternative 5] |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20 x 20 mm) | 144-LQFP (20 x 20 mm) | 144-LQFP (20 x 20 mm) | 144-LQFP (20 x 20 mm) | 144-LQFP (20 x 20 mm) | 144-LQFP (20 x 20 mm) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Terminal Count | 144 | 144 | 144 | 144 | 144 | 144 |
| Package Style | Square gull-wing LFQFP | Square gull-wing LFQFP | Square gull-wing LFQFP | Square gull-wing LFQFP | Square gull-wing LFQFP | Square gull-wing LFQFP |
Principaux différenciateurs
- Confirmed 80 MHz 32-bit e200z4d processing (vs Verified drop-in alternatives were not returned)
- 144-pin LFQFP integration (vs Verified drop-in alternatives were not returned)
- Automotive-temperature-grade designation (vs Verified drop-in alternatives were not returned)
- 1 MB flash resource (vs Verified drop-in alternatives were not returned)
Notes de conception
Start the layout from the exact NXP package drawing and symbol, not from a generic 144-LQFP library. Confirm pin 1 orientation, every power and ground assignment, recommended decoupling, and whether the package uses an exposed thermal feature. The verified data confirms a 20 x 20 mm square gull-wing LFQFP, but it does not provide the complete pinout or thermal land pattern, so those items remain release-critical design inputs.
The supplied listings classify MPXS2010VLQ80 as 3.3 V / 5 V capable, but they do not provide the exact input-voltage range or current limits. Before power-tree design, verify core, I/O, and analog supply pins, absolute maximum ratings, decoupling values, startup sequencing, and load-current behavior in the official datasheet. Do not infer that every I/O can tolerate 5 V; validate each signal domain and protection network separately.
Do not treat a distributor's automotive-temperature label as proof that MPXS2010VLQ80 is suitable for every automotive safety or environmental requirement. Check AEC-Q100 status, operating-temperature limits, EMC test expectations, transient protection, watchdog strategy, diagnostics, errata, and traceability with NXP documentation. The verified web data does not provide qualification details, so an automotive release must not be approved from the listing snippet alone.
A 144-pin LQFP demands deliberate escape routing. Keep sensitive analog and communication paths away from high-current switching nodes, route clocks with short returns, use a solid ground strategy, and place required bypass capacitors at the associated supply pins. The exact pin roles and recommended layout are unavailable in the supplied data, so the final placement must be reviewed against the complete manufacturer schematic and layout guidance.
The verified sources identify an automotive-grade device but do not provide thermal resistance, maximum junction temperature, or power dissipation. Those values must be calculated or verified from the exact package and operating conditions before enclosure and reliability decisions. Estimated: power dissipation equals the sum of core and I/O dissipation, while junction temperature depends on package thermal resistance and PCB copper area; neither value can be populated reliably from the supplied snippets.
Informations de conformité
The verified sources identify the part as automotive temperature grade but do not provide RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals declarations. Compliance must be confirmed from NXP documentation and the current product declaration.
