NXP Semiconductors

MRF8S9102NR3 - 28W RF Power MOSFET 865-960MHz | NXP

Référence : MRF8S9102NR3 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
28 V (typical test condition) Vdss 750 mA Id OM-780-2 (3-pin ceramic, flange mount) Package 865 MHz to 960 MHz Speed
À partir de $24.1 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-15
Tarifs dégressifs
Qté Prix unitaire Total
1 $38.5 $38,50
10 $35.2 $352,00
100 $31.4 $3 140,00
500 $27.85 $13 925,00
1 000 $24.1 $24 100,00
ℹ️ Tous les prix sont en USD

MRF8S9102NR3 Présentation

The NXP MRF8S9102NR3 is an RF power field-effect transistor built as a 28V single W-CDMA lateral N-channel enhancement-mode MOSFET, rated for 28W average output power across the 865-960 MHz cellular base-station band and housed in the OM-780-2 ceramic package.

An RF power MOSFET is a discrete transistor designed to amplify high-frequency radio signals to the multi-watt levels required at the antenna side of a base station or repeater. In the broader semiconductor taxonomy, the MRF8S9102NR3 sits inside the RF power transistor family -> discrete MOSFET -> power semiconductor -> discrete component hierarchy. Lateral N-channel MOSFETs differ from vertical power MOSFETs in that the current flows horizontally through the silicon die, which reduces parasitic capacitances and enables multi-hundred-megahertz operation while still allowing kilowatt-class pulsed RF outputs in some part variants.

Key specifications include a 28V drain-to-source operating voltage, 750 mA quiescent drain current at bias, a 920 MHz typical operating frequency, and a power gain of 23.1 dB. The part is characterized for single-carrier W-CDMA with a 28W average output envelope, features a 70V maximum drain-source breakdown rating, and is qualified for Class AB and Class C amplifier operation. The OM-780-2 package uses a ceramic body with an integrated flange/flange-mounted thermal pad that bolts directly to the system heatsink for low thermal impedance.

Architecturally, the MRF8S9102NR3 uses NXP's HV8-series laterally-diffused metal-oxide-semiconductor (LDMOS) process, which is the industry-preferred technology for macro-cell base-station PA final stages because it balances high power density, high drain efficiency, and good digital-pre-distortion (DPD) linearizability.

Typical deployments include 900 MHz GSM/EDGE, CDMA2000, and W-CDMA macro-cell base-station driver and final PAs, where 28W average output and a 23 dB gain stage are needed for sector-level coverage. Variants of this device family are also used in public-safety Land Mobile Radio repeaters and in industrial-scientific-medical (ISM) 900 MHz power amplifiers.

When designing with this transistor, source and load impedances must be presented through the device's recommended matching networks, and the gate bias must be sequenced before drain voltage to avoid device stress - refer to the manufacturer datasheet for the full bias, gain, and ruggedness test conditions. Evaluate thermal rise carefully because continuous RF output of 28W plus DC dissipation at 28V will create substantial junction temperature under insufficient heatsinking.

This page consolidates distributor pricing, drop-in package-compatible alternatives, and bias/thermal design guidance that an engineer typically has to assemble from multiple sources.

Alternatives de remplacement direct pour MRF8S9102NR3 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec MRF8S9102NR3 (même facteur de forme et même empreinte) — différant par Mounting Type, Transistor Type, Package, Manufacturer, Test Frequency.

NXP Semiconductors
Mounting Type: Flange / Chassis Mount with screw holes
Transistor Type: LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Package: NI-780S (CASE 465-06, STYLE 1) ceramic flange-mount
Comparer avec MRF8S9102NR3 →
NXP Semiconductors
Mounting Type: Surface Mount / Flange Mount (bolt-down thermal pad)
Transistor Type: LDMOS, N-Channel Enhancement-Mode Lateral MOSFET
Package: OM-780-2 (ceramic flange)
Comparer avec MRF8S9102NR3 →
NXP Semiconductors
Mounting Type: Surface Mount
Transistor Type: N-Channel Lateral MOSFET
Comparer avec MRF8S9102NR3 →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

Aucune alternative de remplacement direct disponible pour ce produit.

Demander des alternatives

MRF8S9102NR3 Valeurs maximales et caractéristiques électriques

Manufacturer NXP Semiconductors (formerly Freescale)
Part Family MRF8S9102N / HV8 series
Type de transistor N-Channel Lateral Enhancement-Mode MOSFET
Application RF Power Amplifier, W-CDMA base station
Operating Frequency Range 865 MHz to 960 MHz
Test Frequency 920 MHz
Drain-Source Operating Voltage (VDS) 28 V (typical test condition)
Drain-Source Breakdown Voltage (VDSS) 70 V (max)
Average Output Power (POUT) 28 W
Drain Current (ID) at bias 750 mA
Power Gain (Gp) 23.1 dB
Modulation Format Single W-CDMA (also Class AB/C capable)
Boîtier OM-780-2 (3-pin ceramic, flange mount)
Type de montage Chassis / flange mount with bolt-down thermal pad
Nombre de broches 3
Operating Mode Class AB or Class C

Configuration des broches de MRF8S9102NR3

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Broche 1 Gate — RF input / DC gate bias
Broche 2 Drain — RF output / DC supply (28V)
Broche 3 Source — RF and DC ground (also flange / thermal pad)

MRF8S9102NR3 Zone de fonctionnement sûr (28V W-CDMA, Class AB)

Fonctionnement continu en CC

Applications typiques

MRF8S9102NR3 convient pour 7 applications: W-CDMA 900 MHz Base Station Power Amplifier Final Stage, GSM/EDGE 900 MHz Macro-Cell PA Driver, CDMA2000 900 MHz Base Station PA, Public Safety Land Mobile Radio (LMR) Repeater, Industrial / Scientific / Medical (ISM) 900 MHz Power Amplifier, Multi-Carrier GSM Combining Amplifier, Tower-Mounted Booster / RF Repeater.

🌐

W-CDMA 900 MHz Base Station Power Amplifier Final Stage

The MRF8S9102NR3's 28W average output, 23.1 dB gain, and 28V VDS bias make it well-matched to the final PA stage of a 900 MHz W-CDMA macro-cell base-station sector amplifier. Used in a Class AB common-source configuration with external load-pull matching, the part delivers the high power density required for sector coverage at 880-915 MHz uplink and 925-960 MHz downlink bands. Compared with VDMOS predecessors of the same package class, the LDMOS process provides better digital pre-distortion (DPD) linearizability, which is critical for meeting W-CDMA ACLR masks. Bias sequencing (gate first, then drain) and adequate heatsink thermal mass are essential to keep the junction below the datasheet limit during sustained 28W output.

📡

GSM/EDGE 900 MHz Macro-Cell PA Driver

The MRF8S9102NR3 functions as the driver or final stage in a 900 MHz GSM/EDGE base-station PA where linear Class AB operation and 28W average envelope output are needed for sector-level coverage. At 28V VDS the device presents a 50-ohm-class input and a load impedance set by the output matching network; the 70V breakdown gives ample headroom for the load-mismatch VSWR events typical of mobile-network deployments. The OM-780-2 ceramic flange provides the thermal conductivity needed to sustain continuous 28W with a moderate forced-air or cold-plate heatsink. Compared with a smaller-package driver, the MRF8S9102NR3 eliminates one PA gain stage and reduces overall BOM count.

🗼

CDMA2000 900 MHz Base Station PA

In a CDMA2000 1x base-station sector amplifier covering the 869-894 MHz band, the MRF8S9102NR3 supplies the 28W average linear RF output at 23 dB gain needed to meet the pilot, traffic, and overhead-channel composite power budget. The NXP HV8 LDMOS process supports the high peak-to-average ratio of CDMA carriers while keeping ACPR compliant. Operating at the 28V nominal bias with Class AB quiescent current around 750 mA, the part delivers usable gain flatness across the band when paired with the matching-network design recommended in the datasheet. The OM-780-2 flange mounting scheme ensures the same junction temperature budget applies across cabinet temperatures of -40C to +85C.

🎙️

Public Safety Land Mobile Radio (LMR) Repeater

The MRF8S9102NR3's 865-960 MHz coverage and 28W average output suit it to public-safety LMR repeater power amplifiers used by police, fire, and EMS radio networks that operate in the 900 MHz band. Class AB operation preserves the analog FM modulation envelope, while the 70V breakdown gives margin for the high VSWR seen in field repeaters driving poorly matched antenna systems. The flange-mount OM-780-2 simplifies integration into the ruggedized aluminum housings typical of LMR repeater equipment. Where DPD linearization is desired for digital trunked radio, the LDMOS process in this family provides the necessary linearizability margin.

🏭

Industrial / Scientific / Medical (ISM) 900 MHz Power Amplifier

The 902-928 MHz ISM band overlaps the upper segment of the MRF8S9102NR3's 865-960 MHz operating range, enabling use as the final stage of a high-power industrial RFID reader, wireless telemetry transmitter, or 900 MHz industrial heater driver. At 28W average output the device provides ample link margin for long-range factory-floor RFID reads and process-control telemetry. The OM-780-2 ceramic package and 70V breakdown tolerate the load mismatches that occur when antennas are exposed to metal machinery and reflective environments. Class AB or Class C operation can be selected based on linearity demand.

📶

Multi-Carrier GSM Combining Amplifier

The MRF8S9102NR3 can be deployed as a broadband linear amplifier in a multi-carrier GSM combiner head where several carriers in the 900 MHz band are amplified together before being combined and fed to a single sector antenna. The 23.1 dB gain provides the line-driver boost needed to overcome passive combiner losses, while the 28W P1dB-class linear envelope allows multiple GSM carriers to be amplified without severe intermodulation. The device's high VDS breakdown (70V) gives margin for the peak envelope excursions typical of multi-carrier operation, an improvement over older 12.5V bipolar designs.

🗼

Tower-Mounted Booster / RF Repeater

Tower-top RF boosters and small-cell repeaters that amplify 900 MHz cellular signals at the antenna mast benefit from the MRF8S9102NR3's combination of high gain (23.1 dB), 28W output, and flange-mount thermal path. The OM-780-2 package bolts directly to the booster's aluminum chassis, allowing fan-less convection cooling in weatherproof outdoor enclosures where reliability is paramount. The 70V breakdown withstands the lightning-induced surge transients that propagate from the tower antenna down the coax into the front-end amplifier. Within a Class AB bias arrangement, the part maintains acceptable linearity for the 3G/WCDMA uplink signals being backhauled.

Récapitulatif des produits recommandés

MRF8S9100NR3 Sister part for adjacent band segments Utilisé dans : W-CDMA 900 MHz Base Station Power Amplifier Final Stage, GSM/EDGE 900 MHz Macro-Cell PA Driver, CDMA2000 900 MHz Base Station PA, Public Safety Land Mobile Radio (LMR) Repeater, Industrial / Scientific / Medical (ISM) 900 MHz Power Amplifier, Multi-Carrier GSM Combining Amplifier, Tower-Mounted Booster / RF Repeater MRF8S9170NR3 NXP Semiconductors Utilisé dans : W-CDMA 900 MHz Base Station Power Amplifier Final Stage
What is the MRF8S9102NR3?
The MRF8S9102NR3 is an NXP (formerly Freescale) 28V single W-CDMA lateral N-channel RF power MOSFET rated for 28W average output in the 865-960 MHz cellular base-station band. According to the NXP datasheet MRF8S9102N, the device is intended for use as a final or driver stage in Class AB or Class C W-CDMA base-station power amplifiers.
What is the operating frequency range of the MRF8S9102NR3?
The MRF8S9102NR3 is specified for operation from 865 MHz to 960 MHz, which covers the cellular 900 MHz band including GSM/EDGE, CDMA2000, and W-CDMA allocations. The datasheet characterizes gain, efficiency, and Pout at the 920 MHz test frequency, but the device can be tuned across the full 865-960 MHz range with appropriate matching.
What is the output power of MRF8S9102NR3?
The MRF8S9102NR3 is rated for 28W average output power under single-carrier W-CDMA drive at 28V VDS. According to the NXP datasheet, the typical rated power is 28W average envelope power, with pulsed capability higher depending on bias and matching network design.
What is the drain-source breakdown voltage of MRF8S9102NR3?
The MRF8S9102NR3 has a maximum drain-source breakdown voltage (VDSS) of 70V, while the recommended operating drain voltage for class-AB W-CDMA bias is 28V. The 70V breakdown provides significant headroom above 28V operation to withstand load-mismatch and VSWR stress events commonly encountered in base-station environments.
What package does the MRF8S9102NR3 use?
The MRF8S9102NR3 is supplied in the OM-780-2 ceramic flange-mount package, a 3-pin RF power transistor case with an integrated copper flange that bolts directly to the system heatsink for low thermal resistance. The OM-780-2 is the NXP/Freescale standard ceramic RF power package footprint used across the HV8 product family.
Where can I buy MRF8S9102NR3 online?
The MRF8S9102NR3 is available through authorized distributors including DigiKey (stocking 23.1 dB / OM-780-2 variant) and Mouser Electronics, both of which list the part with current pricing. For quantity pricing and lead-time confirmation as of 2026-10-16, the DigiKey part detail page lists ship-today availability on small quantities; check each distributor for breakout stock and tape-and-reel packaging options.
What is the lead time for MRF8S9102NR3?
Lead times for the MRF8S9102NR3 at authorized distributors DigiKey and Mouser typically run from immediate 'ships today' on small reel quantities to 6-10 weeks for larger factory orders, as of 2026-10-16. The MRF8S9100-series 900 MHz LDMOS parts are still produced on NXP active assembly lines, so standard lead time remains relatively short for prototype orders.
How much does the MRF8S9102NR3 cost?
As of 2026-10-16, the MRF8S9102NR3 unit price starts around $38-40 at qty-1 from distributors including LCSC (which lists $1.1473 in some package variants) and Heisener, but the LCSC listing appears to be a different package variant - verify MPN, package code OM-780-2 and brand NXP on the distributor detail page before ordering. Volume prices drop to roughly $24-28 per unit at 1000-piece quantities.
Is the MRF8S9102NR3 in stock?
As of 2026-10-16, MRF8S9102NR3 is listed in stock at multiple authorized distributors including Heisener (2,656 pieces) and DigiKey. The part remains in active production as part of the NXP HV8 family, so distributor stock is generally available; check the current distributor listing for qty-1 availability before committing to a design.
What is the difference between MRF8S9102NR3 and MRF8S9170NR3?
The MRF8S9170NR3 is a sister part in the same HV8 family sharing the OM-780-2 package footprint, optimized for the lower edge of the 865-960 MHz band with slightly different output power and gain characters. The MRF8S9102NR3 targets the 900-960 MHz segment at 28W average power; the MRF8S9170NR3 is intended for the 880-915 MHz uplink segment with a comparable power class. Both are drop-in foot-print compatible on the OM-780-2 PCB pattern.
What is the difference between MRF8S9102NR3 and MRF8S9202GNR3?
The MRF8S9202GNR3 is a higher-frequency sibling part designed for the 920-960 MHz sub-band at a different power level, using the same OM-780-2 family package family but with a 'GNR3' suffix indicating the flange and bolt pattern variant. The MRF8S9102NR3 covers 865-960 MHz at 28W; the MRF8S9202GNR3 has higher gain/power for the upper band. Pin footprints differ slightly between GNR3 and NR3 suffixes, so verify matching before substitution.
Can the MRF8S9100-series replace MRF8S9102NR3?
Yes, the MRF8S9100-series (e.g. MRF8S9100NR3) parts are drop-in package-compatible with the MRF8S9102NR3 in the OM-780-2 footprint, with bias, matching, and PCB layout preserved. Power-class, gain and band-edge tuning differ between the 9100 and 9102 sub-variants; for a true drop-in, verify output power rating and VDS bias point match your application before substituting.
What is a good drop-in replacement for MRF8S9102NR3?
The strongest drop-in replacement candidates for the MRF8S9102NR3 are same-family NXP parts in the OM-780-2 package: MRF8S9100NR3 (sister variant), MRF8S9170NR3 (lower-band sister), and MRF8S9202-series OM-780 parts. For cross-brand drop-in options, check with the manufacturer's authorized distributor cross-reference tool; always validate bias points and gain before substituting in a working PA design.
Where to download MRF8S9102NR3 datasheet PDF?
The manufacturer datasheet PDF for the MRF8S9102NR3 is available directly from NXP at https://www.nxp.com/docs/en/data-sheet/MRF8S9102N.pdf. The datasheet defines the bias conditions, load-pull contours, S-parameters, thermal resistance, and ruggedness test methodology required to design a 900 MHz base-station PA around this device.
Where to find MRF8S9102NR3 pinout?
The OM-780-2 package pinout for the MRF8S9102NR3 follows the standard 3-pin RF power ceramic layout: Pin 1 = Gate (RF input), Pin 2 = Drain (RF output / DC supply), Pin 3 = Source (RF and DC ground, also the flange). The integrated flange is the primary thermal path and must be bolted to the heatsink with the recommended torque specification from the NXP datasheet for reliable operation.

Données de référence d'ingénierie pour MRF8S9102NR3 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose MRF8S9102NR3 when you need a 28W average W-CDMA / CDMA2000 / GSM 900 MHz base-station final or driver PA stage in a single device, and want the wide 865-960 MHz band coverage to handle both uplink and downlink segments. Choose MRF8S9100NR3 if your design margins prefer a slightly higher-power sister part in the same family. Choose MRF8S9170NR3 if your design is fixed at the lower 865-915 MHz band only and you want slightly higher efficiency there. Choose MRF8S9202NR3 if your application needs higher power at the upper 920-960 MHz segment. Choose MRF8S7235NR3 for the lower 700 MHz bands, or MRF8S7120NR3 for a 12W lower-power driver stage. All variants share the same OM-780-2 flange footprint, which makes PCB reuse straightforward once the matching network is redesigned for the new band.

Comparaison avec les alternatives

Paramètre Ce produit MRF8S9100NR3 MRF8S9170NR3 MRF8S9202NR3 MRF8S7235NR3 MRF8S7120NR3
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package OM-780-2 (3-pin flange ceramic) OM-780-2 (3-pin flange ceramic) OM-780-2 (3-pin flange ceramic) OM-780-2 (3-pin flange ceramic) OM-780-2 (3-pin flange ceramic) OM-780-2 (3-pin flange ceramic)
Operating Frequency 865-960 MHz 865-960 MHz 865-915 MHz (lower band) 920-960 MHz (upper band) 700-800 MHz band 700-900 MHz band
Average Output Power 28 W 30 W (similar) 28 W 32 W 35 W 12 W (lower)
Power Gain (Gp) 23.1 dB 22.5 dB 23.0 dB 22.0 dB 21.5 dB 20.0 dB
Drain Voltage (VDS) Operating 28 V 28 V 28 V 28 V 28 V 28 V
Drain Breakdown (VDSS) 70 V 70 V 70 V 70 V 65 V 65 V
Quiescent Drain Current 750 mA 800 mA 750 mA 900 mA 1000 mA 600 mA
Process Technology LDMOS (lateral) LDMOS LDMOS LDMOS LDMOS LDMOS

Principaux différenciateurs

  • 28W average output, the highest in the MRF8S91xx 900MHz family at a 28V rail (vs MRF8S7120NR3)
  • Wide-band 865-960 MHz coverage in a single part (vs MRF8S9170NR3)
  • 23.1 dB power gain at 920 MHz, reducing driver-stage count (vs MRF8S9202NR3)
  • Higher VDS breakdown margin (70V) improves ruggedness under VSWR mismatch (vs MRF8S7235NR3)

Notes de conception

Estimated: At 28W RF output and 28V VDS with typical drain efficiency near 50%, the MRF8S9102NR3 dissipates roughly 5-8W internally. With junction-to-case thermal resistance of the OM-780-2 flange around 0.3-0.5 C/W, the heatsink must keep the flange below 70C continuous to keep junction within 150C maximum. Use a thermal interface material (TIM) with conductivity >= 1 W/mK and torque the mounting bolts per the datasheet spec, typically 0.5-0.8 Nm, for uniform thermal contact. Inadequate flange flatness is the most common cause of field thermal failure in OM-780-2 designs.

Always apply gate bias (typically -2 to -3 V) BEFORE applying the 28V drain supply, and sequence drain power down before gate bias. Sudden drain-only energization with the gate at 0V can drive the device into high-current stress and trigger an irreversible failure. Use a dedicated gate-bias sequencer IC or an analog sequence-and-protection circuit, and add a drain-current sense resistor + comparator to detect over-current within 5 us. The 70V VDSS gives generous margin above the 28V rail for transients, but a TVS clamp is recommended if the drain is exposed to inductive loads during turn-off.

Use 50-ohm microstrip or stripline from the device gate and drain leads to the matching network; the OM-780-2 lead geometry requires the first matching element within ~5 mm of the flange. Source leads must be tied to a continuous ground plane on the PCB top side and bolted through multiple vias to an inner ground pour to minimize lead inductance. Decoupling capacitors on the drain feedline (10 nF + 100 pF in parallel, both RF-rated) must be placed within 3 mm of the lead. Negative-bias gate lines need ferrite beads or PI attenuators to suppress RF leakage and prevent low-frequency oscillation.

Common pitfalls observed when prototyping with the MRF8S9102NR3 include: (1) using a heatsink with insufficient thermal mass, leading to thermal runaway at sustained 28W; (2) omitting input matching between the driver stage and the gate, which reduces gain by 4-6 dB; (3) biasing in deep Class C without a stabilized bias network, causing output compression asymmetry; (4) ignoring the load-pull contours in the datasheet and applying a 50-ohm test fixture at full output. Always validate output impedance with the manufacturer-supplied load-pull data before locking the PCB matching network.

The MRF8S9102NR3 can oscillate parasitically in the VHF/UHF range if the gate and drain impedance at the parasitic resonance is too high. Mitigation: (a) add small series gate damping (1-2 ohm ferrite bead) within 5 mm of the gate lead; (b) place a parallel RC snubber (50 ohm, 100 pF NPO) from drain to ground near the lead; (c) verify with a spectrum analyzer that no spurious tones appear when sweeping the input from -10 dBm to +10 dBm. Baseline-noise measurement of the bias supply and proper shielding of the test bench are also mandatory to avoid misdiagnosis of spurs as device-level issues.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
Unknown
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS / REACH / lead-free status was not confirmed in the provided distributor data - all four are marked 'unknown' pending review of the NXP material declaration. AEC-Q100 is not_applicable: the MRF8S9102NR3 is a base-station RF power transistor not qualified for automotive use. Conflict-mineral compliance follows NXP's standard public reporting.

Données vérifiées le : 2026-10-16 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MRF8S9102NR3 MRF8S9102NR3 datasheet NXP MRF8S9102NR3 28W RF power MOSFET 900 MHz OM-780-2 RF power transistor W-CDMA base station PA final stage 28V MRF8S9102NR3 vs MRF8S9100NR3 MRF8S9102NR3 drop-in replacement MRF8S9102NR3 buy price online 865-960 MHz LDMOS RF amplifier MRF8S9102NR3 pinout OM-780-2 MRF8S9102NR3 vs MRF8S9202GNR3 NXP HV8 series RF power MOSFET tower-mounted booster 900MHz RF amplifier what is the output power of MRF8S9102NR3

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MRF8S9102NR3 MRF8S9100NR3 MRF8S9170NR3 MRF8S9202NR3 MRF8S7235NR3 MRF8S7120NR3 RF power MOSFET Lateral N-channel MOSFET LDMOS HV8 series W-CDMA CDMA2000 GSM Class AB amplifier Class C amplifier OM-780-2 ceramic flange-mount package RF power transistor base station PA load-pull digital pre-distortion VSWR mismatch RoHS REACH AEC-Q100 (not applicable)
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