MT47H64M16HR-3:G - 1Gb DDR2 SDRAM 333MHz | Micron | 84-FBGA
Référence : MT47H64M16HR-3:G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.56 | $13,56 |
| 10 | $12.2 | $122,00 |
| 100 | $10.85 | $1 085,00 |
| 500 | $9.75 | $4 875,00 |
| 1 000 | $8.9 | $8 900,00 |
MT47H64M16HR-3:G Présentation
DDR2 SDRAM (Double Data Rate 2 Synchronous Dynamic Random-Access Memory) is a volatile memory technology that transfers data on both the rising and falling edges of the clock, doubling throughput versus single-data-rate SDRAM. DDR2 builds on DDR1 with a 4n-bit prefetch architecture, on-die termination (ODT), and a lower 1.8 V core and I/O voltage, which reduces power versus 2.5 V DDR1. In the memory hierarchy, DDR2 SDRAM sits between the memory controller and the DRAM array, providing the working memory for embedded processors, networking equipment, and legacy computing platforms.
Key features of the MT47H64M16HR-3:G include a 1 Gbit density in a 64M x 16 configuration, 333 MHz clock (667 MT/s data rate), 450 ps access time, 1.7 V to 1.9 V supply voltage, and an 84-FBGA (8 x 12.5 mm) package. The device supports programmable CAS latency (CL=3 for the -3 speed grade), burst lengths of 4 or 8, and sequential or interleaved burst types. The differential data strobe (DQS/DQS#) improves signal integrity at high data rates, while the 4n-bit prefetch architecture enables high bandwidth with a modest internal clock.
The MT47H64M16HR-3:G uses Micron's DDR2 process technology with an on-chip DLL for clock synchronization and ODT for impedance matching. The 8-bank architecture allows concurrent operations across banks, improving effective bandwidth. The 1.8 V SSTL_18 I/O interface is compatible with JEDEC-standard DDR2 memory controllers, and the 84-FBGA package provides a compact footprint for space-constrained embedded designs.
Typical applications include embedded computing platforms, industrial control systems, networking and telecom equipment, legacy computing and server memory upgrades, and test and measurement instrumentation. The 1 Gbit density and 333 MHz speed make it suitable for designs requiring moderate memory capacity with DDR2-era memory controllers.
When designing with this device, ensure proper termination and impedance matching on the DDR2 bus, and verify that the memory controller supports the -3 speed grade (CL=3, 333 MHz). The 1.8 V supply must be well-regulated and decoupled to maintain signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing engineers with a single reference for the MT47H64M16HR-3:G DDR2 SDRAM.
Alternatives de remplacement direct pour MT47H64M16HR-3:G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MT47H64M16HR-3 IT:G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT47H64M16HR-3:H
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT47H64M16HR-25E:H
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT47H64M16HR-3 L:G
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
K4T1G164QF-BCF7
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT47H64M16HR-3:G Valeurs maximales et caractéristiques électriques
| Type de mémoire | DDR2 SDRAM |
| Taille de mémoire | 1 Gbit |
| Organisation de la mémoire | 64M x 16 (8 Meg x 16 x 8 banks) |
| Clock Frequency | 333 MHz |
| Débit de données | 667 MT/s (DDR2-667) |
| Access Time | 450 ps |
| Tension d'alimentation | 1.7 V to 1.9 V |
| I/O Voltage | 1.8 V (SSTL_18-compatible) |
| Interface | Parallel |
| Boîtier | 84-FBGA (8 x 12.5 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0C to +85C (commercial) |
| Latence CAS | CL=3 (-3 speed grade) |
| Burst Length | 4 or 8 |
| Data Strobe | Differential (DQS, DQS#) |
| Prefetch Architecture | 4n-bit |
| Statut RoHS | Compliant |
Configuration des broches de MT47H64M16HR-3:G
| Broche A1 | VDD — Power supply 1.8 V |
| Broche A2 | VSSQ — I/O ground |
| Broche A3 | DQ0 — Data input/output |
| Broche A4 | VDDQ — I/O power supply 1.8 V |
| Broche A5 | DQ2 — Data input/output |
| Broche A6 | VSSQ — I/O ground |
| Broche A7 | DQ4 — Data input/output |
| Broche A8 | VDDQ — I/O power supply 1.8 V |
| Broche A9 | DQ6 — Data input/output |
| Broche B1 | VSS — Ground |
| Broche B2 | DQ1 — Data input/output |
| Broche B3 | VSSQ — I/O ground |
| Broche B4 | DQ3 — Data input/output |
| Broche B5 | VSSQ — I/O ground |
| Broche B6 | DQ5 — Data input/output |
| Broche B7 | VSSQ — I/O ground |
| Broche B8 | DQ7 — Data input/output |
| Broche B9 | VSSQ — I/O ground |
| Broche C1 | VDDQ — I/O power supply 1.8 V |
| Broche C2 | DQS — Data strobe |
| Broche C3 | VSSQ — I/O ground |
| Broche C4 | DQ8 — Data input/output |
| Broche C5 | VDDQ — I/O power supply 1.8 V |
| Broche C6 | DQ10 — Data input/output |
| Broche C7 | VSSQ — I/O ground |
| Broche C8 | DQ12 — Data input/output |
| Broche C9 | VDDQ — I/O power supply 1.8 V |
| Broche D1 | DQS# — Differential data strobe |
| Broche D2 | VSSQ — I/O ground |
| Broche D3 | DQ9 — Data input/output |
| Broche D4 | VSSQ — I/O ground |
| Broche D5 | DQ11 — Data input/output |
| Broche D6 | VSSQ — I/O ground |
| Broche D7 | DQ13 — Data input/output |
| Broche D8 | VSSQ — I/O ground |
| Broche D9 | DQ15 — Data input/output |
| Broche E1 | VDD — Power supply 1.8 V |
| Broche E2 | DQ14 — Data input/output |
| Broche E3 | VDDQ — I/O power supply 1.8 V |
| Broche E4 | LDQS — Lower data strobe |
| Broche E5 | VDDQ — I/O power supply 1.8 V |
| Broche E6 | UDQS — Upper data strobe |
| Broche E7 | VDDQ — I/O power supply 1.8 V |
| Broche E8 | LDQS# — Lower differential data strobe |
| Broche E9 | VDDQ — I/O power supply 1.8 V |
| Broche F1 | VSS — Ground |
| Broche F2 | UDQS# — Upper differential data strobe |
| Broche F3 | VSSQ — I/O ground |
| Broche F4 | VREF — Reference voltage |
| Broche F5 | VSSQ — I/O ground |
| Broche F6 | CK — Clock input |
| Broche F7 | VSSQ — I/O ground |
| Broche F8 | CK# — Differential clock input |
| Broche F9 | VSSQ — I/O ground |
| Broche G1 | VDDQ — I/O power supply 1.8 V |
| Broche G2 | CKE — Clock enable |
| Broche G3 | VDDQ — I/O power supply 1.8 V |
| Broche G4 | A0 — Address input |
| Broche G5 | VDDQ — I/O power supply 1.8 V |
| Broche G6 | A2 — Address input |
| Broche G7 | VDDQ — I/O power supply 1.8 V |
| Broche G8 | A4 — Address input |
| Broche G9 | VDDQ — I/O power supply 1.8 V |
| Broche H1 | VSS — Ground |
| Broche H2 | A1 — Address input |
| Broche H3 | VSSQ — I/O ground |
| Broche H4 | A3 — Address input |
| Broche H5 | VSSQ — I/O ground |
| Broche H6 | A5 — Address input |
| Broche H7 | VSSQ — I/O ground |
| Broche H8 | A6 — Address input |
| Broche H9 | VSSQ — I/O ground |
| Broche J1 | VDD — Power supply 1.8 V |
| Broche J2 | A7 — Address input |
| Broche J3 | VDDQ — I/O power supply 1.8 V |
| Broche J4 | A8 — Address input |
| Broche J5 | VDDQ — I/O power supply 1.8 V |
| Broche J6 | A9 — Address input |
| Broche J7 | VDDQ — I/O power supply 1.8 V |
| Broche J8 | A10 — Address input |
| Broche J9 | VDDQ — I/O power supply 1.8 V |
| Broche K1 | VSS — Ground |
| Broche K2 | BA0 — Bank address input |
| Broche K3 | VSSQ — I/O ground |
| Broche K4 | BA1 — Bank address input |
| Broche K5 | VSSQ — I/O ground |
| Broche K6 | BA2 — Bank address input |
| Broche K7 | VSSQ — I/O ground |
| Broche K8 | A11 — Address input |
| Broche K9 | VSSQ — I/O ground |
| Broche L1 | VDDQ — I/O power supply 1.8 V |
| Broche L2 | A12 — Address input |
| Broche L3 | VDDQ — I/O power supply 1.8 V |
| Broche L4 | CS# — Chip select |
| Broche L5 | VDDQ — I/O power supply 1.8 V |
| Broche L6 | RAS# — Row address strobe |
| Broche L7 | VDDQ — I/O power supply 1.8 V |
| Broche L8 | CAS# — Column address strobe |
| Broche L9 | VDDQ — I/O power supply 1.8 V |
| Broche M1 | VSS — Ground |
| Broche M2 | WE# — Write enable |
| Broche M3 | VSSQ — I/O ground |
| Broche M4 | ODT — On-die termination |
| Broche M5 | VSSQ — I/O ground |
| Broche M6 | NC — Not connected (per datasheet) |
| Broche M7 | VSSQ — I/O ground |
| Broche M8 | NC — Not connected (per datasheet) |
| Broche M9 | VSSQ — I/O ground |
| Broche N1 | VDD — Power supply 1.8 V |
| Broche N2 | VSS — Ground |
| Broche N3 | VDD — Power supply 1.8 V |
| Broche N4 | VSS — Ground |
| Broche N5 | VDD — Power supply 1.8 V |
| Broche N6 | VSS — Ground |
| Broche N7 | VDD — Power supply 1.8 V |
| Broche N8 | VSS — Ground |
| Broche N9 | VDD — Power supply 1.8 V |
Applications typiques
MT47H64M16HR-3:G convient pour 6 applications: Embedded Computing Platforms, Industrial Control Systems, Networking and Telecom Equipment, Legacy Computing and Server Memory Upgrades, Test and Measurement Instrumentation, Consumer Electronics and Set-Top Boxes.
Embedded Computing Platforms
The MT47H64M16HR-3:G provides 1 Gbit of DDR2 working memory for embedded processors and SoCs that use DDR2 memory controllers. Its 333 MHz clock and 667 MT/s data rate deliver sufficient bandwidth for embedded operating systems, while the 64M x 16 organization matches the 16-bit data bus common on embedded memory controllers. The 1.8 V SSTL_18 interface is directly compatible with JEDEC-standard DDR2 PHYs, and the 84-FBGA package saves board space. Designers should verify that the SoC memory controller supports the -3 speed grade (CL=3) and provide proper ODT and termination on the DDR2 bus to maintain signal integrity at 667 MT/s.
Recommandé
Industrial Control Systems
The MT47H64M16HR-3:G is used in industrial control and automation equipment that requires reliable DDR2 memory for program and data storage. Its 1 Gbit density supports control algorithms, data logging, and HMI buffers, while the 333 MHz speed provides adequate bandwidth for real-time control loops. The commercial temperature grade (0C to +85C) suits controlled factory environments; for extended-temperature installations, the MT47H64M16HR-3 IT:G variant is recommended. The 84-FBGA package and 1.8 V supply simplify integration into existing DDR2-based industrial boards, and the JEDEC-standard interface ensures compatibility with common industrial memory controllers.
Recommandé
Networking and Telecom Equipment
The MT47H64M16HR-3:G provides packet buffer and routing-table memory for networking and telecom equipment such as routers, switches, and gateways. The 667 MT/s data rate supports line-rate packet processing at moderate throughputs, while the 1 Gbit density accommodates forwarding tables and queue buffers. The differential DQS/DQS# strobes improve signal integrity on the DDR2 bus, which is critical in dense networking PCBs with multiple memory devices. The 1.8 V supply and 84-FBGA package align with standard networking board designs. Designers should ensure adequate decoupling and controlled-impedance routing to meet DDR2 timing margins at 333 MHz.
Recommandé
Legacy Computing and Server Memory Upgrades
The MT47H64M16HR-3:G serves as a replacement or upgrade memory device for legacy computing platforms and servers that use DDR2 SDRAM. Its 1 Gbit density and 333 MHz speed match the requirements of DDR2-era memory controllers, enabling repair and maintenance of existing systems. The 64M x 16 organization is compatible with standard DDR2 DIMM and SO-DIMM architectures, and the 84-FBGA package is the industry-standard footprint for DDR2 components. As DDR2 is a legacy technology, availability may be limited; designers should verify stock and consider the MT47H64M16HR-3 IT:G for extended-temperature server environments.
Recommandé
Test and Measurement Instrumentation
The MT47H64M16HR-3:G is used in test and measurement instruments for waveform capture, data buffering, and analysis. The 1 Gbit density provides sufficient storage for high-sample-rate acquisition buffers, while the 667 MT/s data rate supports fast data transfer to the instrument processor. The 1.8 V SSTL_18 interface and differential DQS/DQS# strobes maintain signal integrity in mixed-signal instrument designs. The 84-FBGA package allows compact layouts. Designers should pay attention to power supply decoupling and ground plane integrity to minimize noise coupling into sensitive analog measurement circuits.
Recommandé
Consumer Electronics and Set-Top Boxes
The MT47H64M16HR-3:G provides system memory for consumer electronics such as set-top boxes, digital TVs, and media players that use DDR2 memory. The 1 Gbit density supports operating systems, video buffers, and application data, while the 333 MHz speed handles standard-definition and moderate high-definition video processing. The 1.8 V supply reduces power versus DDR1, and the 84-FBGA package fits compact consumer PCBs. The commercial temperature grade suits indoor consumer environments. Designers should verify the SoC memory controller compatibility and provide adequate thermal relief for the FBGA package in enclosed consumer devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MT47H64M16HR-3:G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MT47H64M16HR-3 IT:G | MT47H64M16HR-3:H | MT47H64M16HR-25E:H | K4T1G164QF-BCF7 |
|---|---|---|---|---|---|
| Package | 84-FBGA (8 x 12.5 mm) | 84-FBGA (8 x 12.5 mm) - same | 84-FBGA (8 x 12.5 mm) - same | 84-FBGA (8 x 12.5 mm) - same | FBGA-84 - same |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Memory Size | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit | 1 Gbit |
| Organization | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 | 64M x 16 |
| Clock Frequency | 333 MHz | 333 MHz | 333 MHz | 400 MHz | 333 MHz |
| Supply Voltage | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V | 1.7 V to 1.9 V |
| Operating Temperature | 0C to +85C (commercial) | -40C to +85C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| CAS Latency | CL=3 | CL=3 | CL=3 | CL=4 | CL=3 |
| Access Time | 450 ps | 450 ps | 450 ps | 400 ps | 450 ps |
| Data Rate | 667 MT/s | 667 MT/s | 667 MT/s | 800 MT/s | 667 MT/s |
Principaux différenciateurs
- Commercial temperature grade at lower cost (vs MT47H64M16HR-3 IT:G)
- Standard 333 MHz DDR2-667 speed grade (vs MT47H64M16HR-25E:H)
- Micron DDR2 reliability and JEDEC compliance (vs K4T1G164QF-BCF7)
Notes de conception
Route DDR2 data and strobe traces with controlled 50 ohm single-ended impedance and match trace lengths within each byte lane to within +/- 5 mm. The differential DQS/DQS# pairs should be routed as 100 ohm differential pairs with matched intra-pair skew. Keep the DDR2 bus away from sensitive analog or RF traces to avoid coupling. Use a solid ground plane under the DDR2 bus for return current control.
Decouple the 1.8 V VDD and VDDQ supplies with 0.1 uF ceramic capacitors placed as close as possible to each power ball, plus bulk 10 uF capacitors per device. The VREF pin requires a stable reference, typically generated by a resistor divider from VDDQ with a 0.1 uF bypass capacitor. Estimated: at 667 MT/s, the device draws approximately 200-300 mA depending on access patterns; size the regulator accordingly.
Do not exceed the 1.9 V maximum supply voltage, as this can damage the DDR2 SDRAM. Verify that the memory controller supports the -3 speed grade (CL=3, 333 MHz) before designing in this part. The ODT (on-die termination) pin must be properly controlled by the memory controller; incorrect ODT settings cause signal integrity failures at 667 MT/s. For extended-temperature applications, use the MT47H64M16HR-3 IT:G variant.
Informations de conformité
RoHS compliant per distributor data. Not AEC-Q100 qualified; commercial and industrial temperature grades available. Halogen-free status not confirmed in provided data.
